Semiconductor power device testing device

Abstract

The utility model belongs to the field of photoelectric testing, and particularly discloses a semiconductor power device testing device which comprises a base body, a device body containing mechanism and a pin inserting module, the device body containing mechanism and the pin inserting module are both arranged on the base body, and when the device body is tested, the pin inserting module is arranged on the base body. The main body part of the device body is located in the device body accommodating mechanism, and the pin part of the device body is connected with the pin plugging module; the device body containing mechanism comprises a temperature control assembly used for heating the device body. Through the structural design of the testing device, the temperature of the device during testing can be monitored, temperature regulation and control can be carried out according to testing requirements, and the accuracy of the testing result of the device body is improved.

Description

Technical Field

[0001] This application belongs to the field of optoelectronic testing, and more specifically, relates to a semiconductor power device testing device. Background Technology

[0002] High-temperature and high-pressure testing of third-generation semiconductor material silicon carbide power devices (TO, a type of semiconductor packaging) requires high-temperature heating of individual packages, with temperature controlled by sensor feedback. However, existing test fixtures typically lack heating devices, necessitating the placement of the fixture into a high-temperature furnace for overall heating during testing. When testing multiple devices simultaneously, it is impossible to individually control the temperature of any single device, leading to inaccurate test results. Utility Model Content

[0003] To address the shortcomings of existing technologies, this application provides a semiconductor power device testing apparatus, which aims to solve the problem that when multiple test fixtures are simultaneously placed in a high-temperature furnace for overall heating, the temperature of the device in one of the test fixtures cannot be controlled individually, resulting in inaccurate test results.

[0004] This application provides a semiconductor power device testing apparatus, specifically including a base body, a device body housing mechanism, and a pin insertion module. The device body housing mechanism and the pin insertion module are both disposed on the base body. During device body testing, the main body of the device body is located in the device body housing mechanism, and the pin portion of the device body is connected to the pin insertion module. The device body housing mechanism includes a temperature control component for heating the device body.

[0005] Compared with the prior art, when testing the device body using the testing device of this application, the main body of the device body is located in the device body housing mechanism, the pin part of the device body is connected to the pin insertion module, the device body can be heated by the temperature control component, and the test temperature of the device body can be changed by adjusting the temperature. When multiple device bodies need to be tested, multiple devices can be used simultaneously, and the device body in each device can be heated to different test temperatures as needed, which can achieve the beneficial effect of improving the accuracy of device body test results.

[0006] As a further preferred embodiment, the device body housing mechanism further includes a fixture base and a cover plate that are configured to cooperate, and the temperature control component is disposed on the fixture base and / or the cover plate.

[0007] As a further preferred embodiment, when the fixture is in the engaged state, the cover plate and the fixture base are fixed together by a snap-fit ​​mechanism.

[0008] As a further preferred embodiment, the temperature control component includes a heating element and a temperature sensor, wherein the heating element is used to heat the device under test, and the temperature sensor is used for temperature measurement and feedback.

[0009] As a further preferred embodiment, the heating element is made of ceramic and has an internal heating wire.

[0010] As a further preferred embodiment, the device body receiving mechanism further includes a clamping component disposed on the side of the cover plate facing the fixture base.

[0011] As a further preferred embodiment, the clamping assembly includes a spring and a pressure head, with the spring fixedly connected between the pressure head and the cover plate.

[0012] As a further preferred embodiment, the fixture base and pressure head are made of synthetic stone, polyphenylene sulfide, or polyetheretherketone.

[0013] As a further preferred embodiment, the pin connector module includes at least a three-pin socket and a four-pin socket fixedly connected to the base body.

[0014] As a further preferred embodiment, the fixture base is fixedly connected to the base body via a fixture bracket, and the position of the fixture base is adjusted to make the device body compatible with a three-pin socket or a four-pin socket.

[0015] In summary, compared with the prior art, the technical solutions conceived in this application have the following main technical advantages:

[0016] 1. In this application, the device body is installed in the device body mounting area and connected to the test socket during testing. The heating element in the device body mounting area can heat the device body. The test temperature of the device body can be changed by adjusting the temperature of the heating element. When multiple device bodies need to be tested, multiple devices can be used simultaneously. The device body in each device can be heated to a different test temperature as needed, thereby improving the accuracy of the device body test results.

[0017] 2. This application allows for adjustments to the positions of the fixture bracket and fixture base based on the different models and specifications of the device to be tested, enabling the device to be plugged into a compatible test socket, thereby improving the applicability of the device and reducing costs.

[0018] 3. The pin connector module of this application adopts a clip-on spring socket, which can ensure good contact between the pins and the device body, with a large contact area and stable testing. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the testing device provided in this application embodiment for testing a four-pin device body;

[0020] Figure 2 This is a schematic diagram of the overall structure of the testing device provided in this application embodiment for testing the body of a three-pin device;

[0021] Figure 3 This is an overall structural schematic diagram illustrating the relative positional relationship between the clamping assembly, the device body, and the temperature control assembly, provided in an embodiment of this application.

[0022] Figure 4 This is a schematic diagram of the overall structure of the three-pin device and the four-pin device provided in the embodiments of this application.

[0023] In all the accompanying drawings, the same reference numerals are used to denote the same elements or structures, wherein:

[0024] 1. Base body; 11. Fixture bracket; 12. Support column; 13. Mounting plate; 2. Component body housing mechanism; 21. Temperature control component; 211. Heating element; 212. Temperature sensor; 22. Fixture base; 221. Component mounting area; 23. Cover plate; 231. Ball buckle; 24. Clamping component; 241. Spring; 242. Clamping head; 3. Pin insertion module; 31. Three-pin socket; 32. Four-pin socket; 41. Three-pin component; 42. Four-pin component. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0026] Reference Figures 1-4 This application discloses a semiconductor power device testing apparatus. When multiple devices need to be tested simultaneously, multiple testing devices are used to test each device separately. The temperature of each device can be monitored and controlled individually, and the position of the test fixture can be adjusted to accommodate the testing of various devices. The testing apparatus includes a base body 1, a device body housing mechanism 2, and a pin insertion module 3. The device body housing mechanism 2 and the pin insertion module 3 are both fixedly mounted on the base body 1. During device body testing, the main body of the device body is located in the device body housing mechanism 2, and the pin portion of the device body is connected to the pin insertion module 3. The base body 1 is a PCB board, the device body housing mechanism 2 is located above the pin insertion module 3, and the pin insertion module 3 is electrically connected to the PCB board.

[0027] Specifically, the pin-connect module 3 includes at least a three-pin socket 31 and a four-pin socket 32 ​​fixedly connected to the base body 1. In this embodiment, the device body includes a commonly used three-pin device 41 and a four-pin device 42. The three-pin device 41 is connected to the three-pin socket 31, and the four-pin device 42 is connected to the four-pin socket 32.

[0028] In this embodiment, the device body housing mechanism 2 includes a temperature control component 21 for heating the device body, and also includes a fixture base 22 and a cover plate 23 that are configured to cooperate. When the fixture is in a snap-fit ​​state, the cover plate 23 is fixed to the fixture base 2 by a snap-fit ​​mechanism. Specifically, one end of the cover plate 23 is hinged to the fixture base 22, and the other end is snap-fitted to the fixture base 22. One end of the cover plate 23 is fixedly connected to a ball buckle 231, and the fixture base 22 has a slot that is adapted to snap-fit ​​the ball buckle 231. In another feasible embodiment, both sides of the cover plate 23 are snap-fitted to the fixture base 2 by snap-fit. The temperature control component 21 is disposed on the fixture base 22 and / or the cover plate 23. In this embodiment, the temperature control component 21 is disposed on the fixture base 22. In another feasible embodiment, the temperature control component 21 can be disposed on the cover plate 23.

[0029] More specifically, the fixture base 22 is fixedly connected to the base body 1 via the fixture bracket 11. The fixture base 22 is located above the three-pin socket 31 or the four-pin socket 32. By adjusting the position of the fixture base 22, the device body can be plugged into and adapted to the three-pin socket 31 or the four-pin socket 32, thereby enabling the testing of the three-pin device 41 and the four-pin device 42. Specifically, two horizontally parallel support columns 12 are fixedly connected to the base body 1 by welding. Each support column 12 is fixedly connected to a mounting plate 13 by screws, so that the support column 12 and the mounting plate 13 form an L-shaped structure. The two mounting plates 13 are fixedly connected to the fixture bracket 11 by screws. The fixture base 22 is fixedly connected to the fixture bracket 11 by screws. The mounting plate 13 has several waist-shaped mounting holes, and the arrangement direction of the several waist-shaped mounting holes is the same as the arrangement direction of the support column 12. The fixture bracket 11 is fixedly connected to the mounting plate 13 through the waist-shaped mounting holes. The fixture bracket 11 can adjust its position by connecting to different waist-shaped mounting holes, thereby changing the position of the fixture base 22. The layout direction of the three-pin socket 31 and the four-pin socket 32 ​​is the same as the layout direction of the mounting holes. Depending on the model and specifications of the device to be tested, the fixture bracket 11 and the fixture base 22 can be installed on top of the corresponding three-pin socket 31 or four-pin socket 32. By quickly switching the test position, it can adapt to the testing of different devices. The material cost is low and the applicability is better.

[0030] Furthermore, the fixture base 22 has a device mounting area 221 for accommodating the main body of the device. When the device is being tested, its pins are inserted into the three-pin socket 31 or the four-pin socket 32. The main body of the device is located in the device mounting area 221, which can improve the testing stability of the device. Specifically, the fixture base 22 has a through groove in the vertical direction on the side facing the cover plate 23 as the device mounting area 221. The through groove is adapted to the device body, and the device body can slide up and down in the through groove. After the device body is installed in the through groove, it is slid downward against the heating plate 211 so that the pins extend from below the through groove and are inserted into the test socket. The device body is manually installed and slid downward to achieve pin insertion.

[0031] To achieve heating and temperature control of the device body, the temperature control component 21 includes a heating element 211 and a temperature sensor 212. The heating element 211 is used to heat the device under test, and the temperature sensor 212 is used for temperature measurement and feedback. The heating element 211 is made of ceramic and has an electric heating wire inside. In this embodiment, alumina ceramic is used, but it can also be replaced with aluminum nitride ceramic. In this embodiment, the temperature sensor 212 is preferably a patch thermocouple. The heating element 211 is fixedly connected in the device mounting area 221 and can be attached to the device body under test. The temperature sensor 212 is fixedly connected to the side of the heating element 211 facing the fixture base 22. The temperature sensor 212 can monitor the temperature of the heating element 211 so as to adjust the temperature in a timely manner. It is a common device in the art and will not be described in detail here. The temperature sensor 212 adjusts the temperature of the heating element 211 to change the heating temperature of the device body.

[0032] Furthermore, to improve the temperature conduction of the heating element 211 to the device, the device body housing mechanism 2 also includes a clamping assembly 24. The clamping assembly 24 is disposed on the side of the cover plate 23 facing the fixture base 22 so that the device body to be tested abuts against the heating element 211. When the cover plate 23 is closed, the clamping assembly 24 clamps the device body. The clamping assembly 24 includes a spring 241 and a pressure head 242. The spring 241 is fixedly connected between the pressure head 242 and the cover plate 23. The pressure head 242 corresponds to the position of the device mounting area 221. The spring 241 pushes the pressure head 242 to abut against the device body. In this embodiment, the fixture base 22 and the pressure head 242 are made of synthetic stone, polyphenylene sulfide, or polyetheretherketone. After the cover plate 23 is rotated and closed, the spring 241 pushes the pressure head 242 to make the contact between the device body and the heating element 211 tighter. The pressure head 242 presses the device body against the surface of the ceramic heating element 211. The spring 241 ensures good contact between the device body and the ceramic heating element 211. The cover plate 23 is locked to the fixture base 22 by the ball buckle 231. The entire fixture device is made of high-temperature resistant non-metallic material. During operation, power is supplied to the ceramic heating element 211, and the high temperature generated directly heats the device body. The temperature sensor 212 reads the temperature on the back of the ceramic heating element 211 in real time, thereby controlling the test temperature of the device body. Heating and temperature feedback are integrated on the cover plate 23, and each fixture can be individually temperature controlled, making temperature control more convenient and intuitive.

[0033] In this application, both the three-pin socket 31 and the four-pin socket 32 ​​are clip-on spring sockets, which ensure good contact between the device body's pins, a large contact area, and stable testing. During testing, the device body's pins are directly inserted into the socket, the device body is pressed tightly against the ceramic heating element 211, the cover 23 is closed, and the device is pressed firmly by the pressure head 242 to ensure sufficient contact between the device body and the ceramic heating element 211. During heating, the temperature of the temperature sensor 212 is read in real time for temperature control.

[0034] It should be understood that expressions such as "comprising" and "may include" as used in this application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In this application, terms such as "comprising" and / or "having" may be interpreted as indicating a specific characteristic, number, operation, constituent element, component, or combination thereof, but should not be interpreted as excluding the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.

[0035] It should be understood that the terms “center,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0037] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0038] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A semiconductor power device testing apparatus, characterized in that, The device includes a base body (1), a device body housing mechanism (2), and a pin insertion module (3). The device body housing mechanism (2) and the pin insertion module (3) are both disposed on the base body (1). When the device body is tested, the main body of the device body is located in the device body housing mechanism (2), and the pin part of the device body is connected to the pin insertion module (3). The device body housing mechanism (2) includes a temperature control component (21) for heating the device body.

2. The semiconductor power device testing apparatus as described in claim 1, characterized in that, The device body housing mechanism (2) also includes a fixture base (22) and a cover plate (23) that are configured to cooperate, and the temperature control component (21) is disposed on the fixture base (22) and / or the cover plate (23).

3. The semiconductor power device testing apparatus as described in claim 2, characterized in that, When the fixture is in the snap-fit ​​state, the cover plate (23) and the fixture base (22) are fixed together by a snap-fit ​​mechanism.

4. The semiconductor power device testing apparatus as described in claim 3, characterized in that, The temperature control component (21) includes a heating element (211) and a temperature sensor (212). The heating element (211) is used to heat the device under test, and the temperature sensor (212) is used for temperature measurement and feedback.

5. The semiconductor power device testing apparatus as described in claim 4, characterized in that, The heating element (211) is made of ceramic and has an internal heating wire.

6. The semiconductor power device testing apparatus as described in claim 3, characterized in that, The device body housing mechanism (2) further includes a clamping assembly (24), which is disposed on the side of the cover plate (23) facing the fixture base (22).

7. The semiconductor power device testing apparatus as described in claim 6, characterized in that, The clamping assembly (24) includes a spring (241) and a pressure head (242), wherein the spring (241) is fixedly connected between the pressure head (242) and the cover plate (23).

8. The semiconductor power device testing apparatus as described in claim 7, characterized in that, The fixture base (22) and pressure head (242) are made of synthetic stone, polyphenylene sulfide, or polyether ether ketone.

9. A semiconductor power device testing apparatus as described in claim 2, characterized in that, The pin connector module (3) includes at least a three-pin socket (31) and a four-pin socket (32) fixedly connected to the base body (1).

10. A semiconductor power device testing apparatus as described in claim 9, characterized in that, The fixture base (22) is fixedly connected to the base body (1) via the fixture bracket (11). The position of the fixture base (22) is adjusted so that the device body can be plugged into and adapted to the three-pin socket (31) or the four-pin socket (32).

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