Circuit board assembly, branch module and power distribution equipment

Abstract

The utility model provides a circuit board assembly, a branch module and power distribution equipment. The safety distance requirement when a conducting bar is assembled to a thin and narrow circuit board and the strength requirement of the circuit board can be met. The circuit board assembly is applied to power distribution equipment. The power distribution equipment comprises a plurality of conducting bars. The circuit board assembly comprises a substrate and an insulating strip. The substrate is provided with a plurality of first assembling areas, a second assembling area and a plurality of through grooves corresponding to the first assembling areas. The multiple first assembling areas are sequentially arranged in the first direction. At least one conducting bar is assembled in each first assembling area. A second assembling area is arranged between every two adjacent first assembling areas. Each first assembly area is provided with a first side and a second side in the second direction and is connected with the second assembly area through the first side or the second side. The other sides in the first direction and the second direction are provided with through grooves in a surrounding mode and are separated from the second assembling area through the through grooves. The adjacent through grooves are arranged close to each other in the first direction. The insulating strips are fixed in the second assembling area and located between the adjacent through grooves.

Description

Technical Field

[0001] This application relates to the field of power distribution equipment technology, and in particular to a circuit board assembly, branch module and power distribution equipment. Background Technology

[0002] The power distribution equipment includes branch modules to distribute power output to different branch circuits. Typically, a branch module has multiple conductor bars for connection to multiple branch circuits. Related technologies consider mounting the conductor bars on narrow circuit boards to achieve miniaturization of the power distribution equipment; however, narrow circuit boards are weak and prone to deformation or breakage, and also easily lead to insufficient safety clearance between conductor bars. Utility Model Content

[0003] In view of this, this application provides a circuit board assembly, a branch module, and a power distribution device that can meet the safety distance requirements and the strength requirements of the circuit board when the busbar is assembled onto a narrow circuit board.

[0004] One embodiment of this application provides a circuit board assembly for use in power distribution equipment. The power distribution equipment includes multiple conductive busbars. The circuit board assembly includes a substrate and an insulating strip. The substrate has multiple first assembly areas, at least one second assembly area, and multiple through slots corresponding one-to-one with the multiple first assembly areas. The multiple first assembly areas are arranged sequentially along a first direction. Each first assembly area is configured to assemble at least one conductive busbar. A second assembly area is located between two adjacent first assembly areas. Each first assembly area has a first side and a second side opposite to each other along a second direction. Each first assembly area is connected to the second assembly area through the first side or the second side, and the other sides in the first and second directions are surrounded by the through slots and separated from the second assembly areas by the through slots. The first direction is perpendicular to the second direction. Two adjacent through slots are arranged close together in the first direction. The insulating strip is fixed to the second assembly area and located between adjacent through slots.

[0005] Each through-slot can surround the corresponding first assembly area, forming a structure similar to a semi-enclosed first assembly area. It can extend from the first or second side to the space between two adjacent first assembly areas, requiring current to avoid the through-slots when flowing between the conductive bars of adjacent first assembly areas. This shortens the distance between adjacent first assembly areas while increasing the path for current flow between the conductive bars, thus ensuring the creepage distance between the conductive bars of adjacent first assembly areas meets safety regulations. Simultaneously, by placing the insulating strip in the second assembly area close to the through-slots and extending it along the second direction, electrical safety requirements between the conductive bars of adjacent first assembly areas are maintained. Furthermore, the through-slots create a narrow substrate structure in the second assembly area between adjacent through-slots. The insulating strip in the second assembly area enhances the structural strength of the substrate, providing support for the narrow second assembly area and preventing warping caused by bending. This maintains the substrate's shape, eliminating the need to increase the substrate area to maintain strength, thus facilitating miniaturization of branch modules and power distribution equipment.

[0006] In some embodiments of this application, along the first direction, the width of the portion of the insulating strip between two adjacent through slots is substantially equal to the distance between the two adjacent through slots.

[0007] The insulating strip is basically attached to the through grooves on both sides in the first direction to increase the width of the insulating strip and enhance its own structural strength, thereby improving the support effect on the second assembly area and making it easier to maintain the shape of the substrate.

[0008] In some embodiments of this application, the first assembly area has a third side and a fourth side along a first direction. Corresponding through slots cover portions of the third side and the fourth side. In two adjacent first assembly areas, the first side of one first assembly area is connected to the second assembly area, and the second side of the other first assembly area is connected to the second assembly area. An insulating strip is located between the through slots of the adjacent third and fourth sides. Furthermore, both ends of the insulating strip along the second direction extend beyond the ends of the through slots located on the third and fourth sides, respectively.

[0009] In two adjacent first assembly areas, viewed along the first direction, the through slots on the third side and the through slots on the fourth side at least partially overlap. The structural strength of the second assembly area in the overlapping area is lower than that of the structure not in the overlapping area. Both ends of the insulating strip are located outside the overlapping area. If the part of the second assembly area in the overlapping area is bent, it can be stopped by the insulating strip to obtain sufficient support, thereby maintaining the shape of the substrate.

[0010] In some embodiments of this application, the insulating strip is fixed to the substrate by welding.

[0011] By fixing the insulating strip by welding, the insulating strip can be stably fixed on the substrate. On the other hand, the SMT (Surface Mount Technology) process can be used to fix the insulating strip, thereby reducing labor input and improving production efficiency.

[0012] In some embodiments of this application, the solder joints formed by welding the insulating strip and the substrate are located at both ends of the insulating strip along the second direction.

[0013] By placing solder joints at both ends of the insulating strip, the insulating strip can still provide support to the substrate even if the structure of the second assembly area bends. Furthermore, solder joints at both ends of the insulating strip allow it to be fixed to the substrate, reducing the manufacturing process required to secure the insulating strip, thereby improving production efficiency and lowering production costs.

[0014] In some embodiments of this application, the portion of the insulating strip corresponding to the solder joint protrudes in a direction away from the solder joint.

[0015] The portion of the insulating strip with solder joints protrudes, thereby increasing the contact area between the insulating strip and the solder joints, improving the stability of the connection between the insulating strip and the solder joints, and increasing the fixing strength between the insulating strip and the substrate.

[0016] In some embodiments of this application, two solder joints of the same insulating strip are defined as a first sub-point and a second sub-point, respectively. The distance between the first sub-point and the area of ​​the conductive bar closest to the first sub-point in the first assembly area on one side is defined as D1. The distance between the second sub-point and the area of ​​the conductive bar closest to the second sub-point in the first assembly area on the other side is defined as D2. The distance between the first sub-point and the second sub-point is defined as D3. Wherein, D1 + D2 + D3 ≥ 31.8 mm.

[0017] By limiting the ranges of D1, D2, and D3, the conductive busbars assembled in two adjacent first assembly areas are made to meet safety requirements.

[0018] In some embodiments of this application, the through-slot extends through both opposite sides of the substrate along a third direction. Insulating strips are provided on the portions of the substrate corresponding to the second assembly area on both opposite sides along the third direction. The first direction, the second direction, and the third direction are mutually perpendicular.

[0019] Insulating strips are provided on both opposite sides of the substrate to enhance the support effect on the substrate and help maintain the shape of the substrate.

[0020] One embodiment of this application provides a branch module. The branch module includes a busbar and a circuit board assembly as described in any of the above embodiments. The busbar is mounted in a first assembly area.

[0021] By configuring this circuit board assembly, the branch module can reduce the spacing of the first assembly area while maintaining the structural shape of the second assembly area, thereby facilitating the miniaturization design of the branch module.

[0022] One embodiment of this application provides a power distribution device. The power distribution device includes a housing, a main wiring module, and branch modules as described in any of the above embodiments. Both the main wiring module and the branch modules are housed within the housing. The main wiring module and the branch modules are electrically connected.

[0023] Branch modules are electrically connected to the main wiring module to access input sources of different polarities. By incorporating branch modules, power distribution equipment can be miniaturized, reducing production costs. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation on the scope.

[0025] Figure 1 This is a schematic diagram of the structure of an energy storage device provided in an embodiment of this application;

[0026] Figure 2 for Figure 1 Explosion diagram of a medium-sized energy storage device;

[0027] Figure 3 This is a schematic diagram of the structure of a circuit board assembly provided in one embodiment of this application;

[0028] Figure 4 for Figure 3 Exploded view of the circuit board assembly;

[0029] Figure 5 for Figure 3 A structural schematic diagram of the circuit board assembly from another perspective.

[0030] Explanation of main component symbols

[0031] 100 - Circuit board assembly; 200 - Branch module; 300 - Power distribution equipment;

[0032] 10-Substrate; 11-First assembly area; 12-Second assembly area; 13-Through groove; 20-Insulating strip; 30-Solder joint; 31-First sub-joint; 32-Second sub-joint;

[0033] 111-First side; 112-Second side; 113-Third side; 114-Fourth side; 201-Conducting busbar; 301-Housing; 302-Main wiring module;

[0034] X - First direction; Y - Second direction; Z - Third direction. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0037] The terms “first,” “second,” “third,” etc., are used for descriptive purposes only and should not be interpreted as indicating or implying relative importance.

[0038] The power distribution equipment includes branch modules to distribute power output to different branch circuits. Typically, a branch module has multiple conductor bars for connection to multiple branch circuits. Related technologies consider mounting the conductor bars on narrow circuit boards to achieve miniaturization of the power distribution equipment; however, narrow circuit boards are weak and prone to deformation or breakage, and also easily lead to insufficient safety clearance between conductor bars.

[0039] This application provides a circuit board assembly for use in power distribution equipment. The power distribution equipment includes multiple conductive busbars. The circuit board assembly includes a substrate and an insulating strip. The substrate has multiple first assembly areas, at least one second assembly area, and multiple through slots corresponding one-to-one with the multiple first assembly areas. The multiple first assembly areas are arranged sequentially along a first direction. Each first assembly area is configured to assemble at least one conductive busbar. A second assembly area is located between two adjacent first assembly areas. Each first assembly area has a first side and a second side opposite to each other along a second direction. Each first assembly area is connected to the second assembly area through the first side or the second side, and the other sides in the first and second directions are surrounded by the through slots and separated from the second assembly areas by the through slots. The first direction is perpendicular to the second direction. Two adjacent through slots are arranged close together in the first direction. The insulating strip is fixed to the second assembly area and located between adjacent through slots.

[0040] Each through-slot can surround the corresponding first assembly area, forming a structure similar to a semi-enclosed first assembly area. It can extend from the first or second side to the space between two adjacent first assembly areas, requiring current to avoid the through-slots when flowing between the conductive bars of adjacent first assembly areas. This shortens the distance between adjacent first assembly areas while increasing the path for current flow between the conductive bars, thus ensuring the creepage distance between the conductive bars of adjacent first assembly areas meets safety regulations. Simultaneously, by placing the insulating strip in the second assembly area close to the through-slots and extending it along the second direction, electrical safety requirements between the conductive bars of adjacent first assembly areas are maintained. Furthermore, the through-slots create a narrow substrate structure in the second assembly area between adjacent through-slots. The insulating strip in the second assembly area enhances the structural strength of the substrate, providing support for the narrow second assembly area and preventing warping caused by bending. This maintains the substrate's shape, eliminating the need to increase the substrate area to maintain strength, thus facilitating miniaturization of branch modules and power distribution equipment.

[0041] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0042] See Figures 1 to 3 One embodiment of this application provides a circuit board assembly 100, a branch module 200, and a power distribution device 300. The power distribution device 300 can connect to input sources such as the power grid, energy storage devices, and solar energy systems, and can also connect to household power systems, factory power systems, etc., to supply power to electrical loads. Electrical loads can be air conditioners, refrigerators, production machines, etc. The circuit board assembly 100 is disposed in the branch module 200 and used together with it in the power distribution device 300 to connect input sources of different polarities and to connect multiple electrical loads.

[0043] See Figure 1 and Figure 2 In some embodiments, the power distribution equipment 300 includes a housing 301, a main wiring module 302, and a branch module 200. Both the main wiring module 302 and the branch module 200 are housed within the housing 301. The main wiring module 302 and the branch module 200 are electrically connected.

[0044] The main wiring module 302 connects to input sources of different polarities. The branch module 200 is electrically connected to the main wiring module 302 to connect to input sources of different polarities. The branch module 200 can transmit electrical energy to various electrical loads. By incorporating the branch module 200, the power distribution equipment 300 can achieve a more compact design and reduce production costs.

[0045] See Figure 2 and Figure 3 In some embodiments, the branch module 200 includes a busbar 201 and a circuit board assembly 100. The busbar 201 is mounted on the circuit board assembly 100.

[0046] By configuring the circuit board assembly 100, the branch module 200 can reduce the size of the circuit board assembly 100 while maintaining its structural shape, thereby facilitating the miniaturization design of the branch module 200.

[0047] As an example, the busbar 201 can be a copper busbar. Furthermore, the busbar 201 can be used to assemble relays or circuit breakers, etc.

[0048] In some embodiments, the circuit board assembly 100 includes a substrate 10. The substrate 10 is provided with a plurality of first mounting areas 11. Each first mounting area 11 is configured to mount at least one conductive bus 201. Different conductive buses 201 can be configured to connect to input sources of different polarities. As an exemplary example, typically conductive buses 201 in the same first mounting area 11 are configured to connect to input sources of the same polarity, and conductive buses 201 in two adjacent first mounting areas 11 are configured to connect to input sources of different polarities.

[0049] In some embodiments, a plurality of first assembly areas 11 are arranged sequentially. A first direction is defined to be parallel to the distribution direction of the plurality of first assembly areas 11. The first direction, the second direction, and the third direction are defined to be mutually perpendicular. The first direction is... Figures 2 to 4 The direction parallel to X is shown in the diagram, and the second direction is... Figures 2 to 4 As shown, the direction parallel to Y is the third direction. Figures 2 to 4 The direction shown is parallel to the direction indicated by Z. For ease of reference, the first direction will be referred to as "first direction X" in the following text, the second direction as "second direction Y" and the third direction as "third direction Z".

[0050] It is understood that in some embodiments, the substrate 10 extends not only in the first direction X but also in the second direction Y, and each first assembly area 11 extends in the second direction Y, so as to arrange multiple conductive busbars 201 in the same first assembly area 11.

[0051] It is understood that in some embodiments, the extension length of the substrate 10 in the second direction Y is greater than the extension length in the first direction X, so as to facilitate the arrangement of other electrical components of the circuit board assembly 100 on both sides of the first assembly area 11 in the second direction Y, thereby avoiding affecting the circuit connection and mating relationship between the conductive bars 201 of the adjacent first assembly areas 11.

[0052] In some embodiments, the substrate 10 further comprises at least one second assembly area 12 and a plurality of through slots 13 corresponding one-to-one with the plurality of first assembly areas 11. A second assembly area 12 is provided between two adjacent first assembly areas 11. Each first assembly area 11 has a first side 111 and a second side 112 along the second direction Y. Each first assembly area 11 is connected to the second assembly area 12 via the first side 111 or the second side 112, and the other sides in the first direction X and the second direction Y are surrounded by the through slots 13 and separated from the second assembly area 12 by the corresponding through slots 13. Two adjacent through slots 13 are positioned close together in the first direction X. The through slots 13 may extend from the first side 111 of the corresponding first assembly area 11 along the second direction Y to the second side 112, or they may extend along the second direction Y to the midpoint or two-thirds of the distance between the first side 111 and the second side 112 of the corresponding first assembly area 11, forming a structure similar to a semi-enclosing first assembly area 11.

[0053] Each through slot 13 can surround the corresponding first assembly area 11, forming a structure similar to a semi-enclosed first assembly area 11, and can extend from the first side 111 or the second side 112 to the space between two adjacent first assembly areas 11. This allows the current to avoid the through slot 13 when flowing between the conductive bars 201 of two adjacent first assembly areas 11. This can shorten the distance between two adjacent first assembly areas 11 while increasing the path of the current flowing between the conductive bars 201 of two adjacent first assembly areas 11, so that the creepage distance between the conductive bars 201 of two adjacent first assembly areas 11 meets the safety requirements.

[0054] Understandably, in some embodiments, two adjacent through slots 13 are arranged close together in the first direction X to reduce the extension length of the substrate 10 in the first direction X, facilitating the miniaturization design of the branch module 200 and the power distribution equipment 300. Here, "close together" means that the extension length of the second assembly area 12 between two adjacent through slots 13 in the second direction Y is much greater than its extension length in the first direction X, for example, more than 5 times, so as to shorten the distance between two adjacent first assembly areas 11 while ensuring that the creepage distance between the conductive bars 201 of the two adjacent first assembly areas 11 meets safety requirements.

[0055] It is understood that in some embodiments, when the extension length of the substrate 10 in the second direction Y is greater than the extension length in the first direction X, it is easier to make the substrate 10 bend in the second direction Y by providing the through groove 13, and the structure of the second assembly area 12 can be supported by providing the insulating strip 20, which helps to avoid bending of the substrate 10.

[0056] In some embodiments, the circuit board assembly 100 further includes an insulating strip 20. The insulating strip 20 is fixed to the second assembly area 12 and is located between adjacent through slots 13.

[0057] By placing the insulating strip 20 in the second assembly area 12 between the through slots 13 and extending it in the second direction Y, on the one hand, the electrical safety requirements between the conductive bars 201 of the two adjacent first assembly areas 11 can be maintained; on the other hand, the through slots 13 make the substrate 10 in the second assembly area 12 between the adjacent through slots 13 have a narrow structure. The insulating strip 20 placed in the second assembly area 12 can enhance the structural strength of the substrate 10 and provide support for the narrow second assembly area 12. This helps to prevent the second assembly area 12 from bending and causing the substrate 10 to warp, thus maintaining the shape of the substrate 10. Therefore, it is not necessary to increase the area of ​​the substrate 10 in order to maintain strength, which facilitates the miniaturization design of the branch module 200 and the power distribution equipment 300.

[0058] It is understood that in some embodiments, the insulating strip 20 is made of the same material as the substrate 10, so as to utilize the leftover material from the preparation of the substrate 10 to prepare the insulating strip 20, which helps to reduce production costs. In other embodiments, the insulating strip 20 may also be other plastic parts not made of the substrate 10, or a metal part covered with a plastic layer for insulation, etc.

[0059] See Figures 3 to 5 In some embodiments, along the first direction X, the width of the portion of the insulating strip 20 between two adjacent through slots 13 is substantially equal to the distance between the two adjacent through slots 13. The insulating strip 20 is substantially abutted against the through slots 13 on both sides along the first direction X to increase the width of the insulating strip 20, enhance its structural strength, and thus improve its support effect on the second assembly area 12, facilitating the maintenance of the shape of the substrate 10. Here, "substantially" can be understood as allowing a gap of up to 0.5 mm between the insulating strip 20 and the adjacent through slot 13; or adaptively adjusting the gap width on substrates 10 of different sizes; the intention is that the insulating strip 20 covers the second assembly area 12 as much as possible along the first direction X and avoids obstructing the through slots 13.

[0060] See Figure 3In some embodiments, the first assembly area 11 has a third side 113 and a fourth side 114 along the first direction X. Corresponding through-slots 13 cover portions of the third side 113 and the fourth side 114. In two adjacent first assembly areas 11, the first side 111 of one first assembly area 11 is connected to the second assembly area 12, and the second side 112 of the other first assembly area 11 is connected to the second assembly area 12. In two adjacent first assembly areas 11, the second assembly area 12 is located between the third side 113 of one first assembly area 11 and the fourth side 114 of the other first assembly area 11. An insulating strip 20 is located between the through-slots 13 of the adjacent third side 113 and the through-slots 13 of the fourth side 114. The two ends of the insulating strip 20 along the second direction Y extend beyond the ends of the through-slots 13 located on the third side 113 and the fourth side 114, respectively.

[0061] In the two adjacent first assembly areas 11, when viewed along the first direction X, the through groove 13 located on the third side 113 and the through groove 13 located on the fourth side 114 at least partially overlap. The structural strength of the second assembly area 12 located in the overlapping area is lower than that of the structure not located in the overlapping area. Both ends of the insulating strip 20 are located outside the overlapping area. If the part of the second assembly area 12 located in the overlapping area is bent, it can be stopped by the insulating strip 20 to obtain sufficient support, thereby maintaining the shape of the substrate 10.

[0062] It is understood that in some embodiments, the two outermost first assembly areas 11 along the first direction X are connected to the edge of the substrate 10; when cutting the substrate 10, the portion of the through groove 13 on the third side 113 of one of the first assembly areas 11 can be cut together, and the portion of the through groove 13 on the fourth side 114 of the other first assembly area 11 can be cut together. For example, in the two outermost first assembly areas 11 along the first direction X, the through groove 13 of one first assembly area 11 is provided on its first side 111 and third side 113, and the through groove 13 on its fourth side 114 is cut off; the through groove 13 of the other first assembly area 11 is provided on its second side 112 and fourth side 114, and the through groove 13 on its third side 113 is cut off.

[0063] In some embodiments, the insulating strip 20 is heat-fused to the substrate 10. The insulating strip 20 can be integrated with the substrate 10 by heat fusion, thereby improving the stability of the fixed connection.

[0064] See Figure 3 and Figure 4In some embodiments, the insulating strip 20 is fixed to the substrate 10 by welding. Fixing the insulating strip 20 by welding not only ensures that the insulating strip 20 is stably fixed on the substrate 10, but also allows the use of SMT (Surface Mount Technology) surface mount technology to fix the insulating strip 20, thereby reducing manpower input and improving production efficiency.

[0065] In some embodiments, the solder joints 30 formed by welding the insulating strip 20 and the substrate 10 are located at both ends of the insulating strip 20 along the second direction Y.

[0066] By placing solder joints 30 at both ends of the insulating strip 20, the insulating strip 20 can still provide support for the substrate 10 even if the structure of the second assembly area 12 bends. If the solder joints 30 are located at the middle of the insulating strip 20 along the second direction Y, the two ends may separate from the substrate 10 when the second assembly area 12 bends, thus failing to adequately support the substrate 10. Furthermore, by placing solder joints 30 at both ends of the insulating strip 20, the insulating strip 20 can be fixed to the substrate 10, which helps to reduce the manufacturing process of fixing the insulating strip 20, thereby improving production efficiency and reducing production costs.

[0067] In some embodiments, the portion of the insulating strip 20 corresponding to the solder joint 30 protrudes in a direction away from the solder joint 30. The protruding direction can be any direction, such as a first direction X, a second direction Y, or a third direction Z. The protruding portion of the insulating strip 20 relative to the solder joint 30 increases the contact area between the insulating strip 20 and the solder joint 30, improving the stability of the connection between the insulating strip 20 and the solder joint 30, thereby increasing the fixing strength between the insulating strip 20 and the substrate 10.

[0068] It is understood that in some embodiments, metal sheets can be provided at the positions of the insulating strip 20 and the substrate 10 corresponding to the solder joints 30 to facilitate soldering. For example, the metal sheets of the insulating strip 20 and the metal sheets of the substrate 10 are connected by soldering.

[0069] See Figure 2 and Figure 3In some embodiments, the two solder joints 30 of the same insulating strip 20 are defined as a first sub-point 31 and a second sub-point 32, respectively. The distance between the first sub-point 31 and the area in one side of the first assembly area 11 where the conductive bar 201 closest to the first sub-point 31 is assembled is defined as D1. The distance between the second sub-point 32 and the area in the other side of the first assembly area 11 where the conductive bar 201 closest to the second sub-point 32 is closest is defined as D2. The distance between the first sub-point 31 and the second sub-point 32 is defined as D3. Here, "the conductive bar 201 closest to the first sub-point 31" refers to the conductive bar 201 whose current flow distance along the surface of the substrate 10 is the shortest from the first sub-point 31, and "the conductive bar 201 closest to the second sub-point 32" refers to the conductive bar 201 whose current flow distance along the surface of the substrate 10 is the shortest from the second sub-point 32.

[0070] Wherein, D1+D2+D3≥31.8mm. By limiting the ranges of D1, D2 and D3, the conductive busbars 201 assembled in the two adjacent first assembly areas 11 meet the safety requirements.

[0071] For example, D1+D2+D3≥31.8mm can meet the safety requirements under an alternating voltage of 120V. It can be understood that if the system is under other operating conditions, such as an alternating voltage of 220V or 110V, the values ​​of D1, D2, and D3 can be adjusted accordingly.

[0072] It is understood that, in some embodiments, when measuring the distances of D1, D2, and D3, they are the distances between the edges of the two corresponding conductive structures, respectively.

[0073] See Figure 4 and Figure 5 In some embodiments, the through groove 13 extends through both opposite sides of the substrate 10 along the third direction Z. Insulating strips 20 are provided on the portions of the substrate 10 corresponding to the second assembly area 12 along both opposite sides of the substrate 10 along the third direction Z.

[0074] Insulating strips 20 are provided on both opposite sides of the substrate 10 to enhance the support effect on the substrate 10 and help maintain the shape of the substrate 10.

[0075] Furthermore, those skilled in the art should recognize that the above embodiments are merely illustrative of this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of this application's disclosure.

Claims

1. A circuit board assembly for use in power distribution equipment, the power distribution equipment comprising a plurality of conductive bars, characterized in that, The circuit board assembly includes: The substrate has multiple first assembly areas, at least one second assembly area, and multiple through slots corresponding to the multiple first assembly areas. The multiple first assembly areas are arranged sequentially along a first direction. Each first assembly area is configured to assemble at least one of the conductive bars. A second assembly area is provided between two adjacent first assembly areas. Each first assembly area has a first side and a second side opposite to each other along a second direction. Each first assembly area is connected to the second assembly area through the first side or the second side. The through slots are arranged around the other sides in the first direction and the second direction and are separated from the second assembly areas by the through slots. The first direction is perpendicular to the second direction, and two adjacent through slots are arranged close to each other in the first direction. An insulating strip is fixed to the second assembly area and located between adjacent through slots.

2. The circuit board assembly according to claim 1, characterized in that, Along the first direction, the width of the portion of the insulating strip between two adjacent through slots is substantially equal to the distance between the two adjacent through slots.

3. The circuit board assembly according to claim 1, characterized in that, The first assembly area has a third side and a fourth side along the first direction, and the corresponding through groove covers a portion of the third side and a portion of the fourth side. In two adjacent first assembly areas, the first side of one first assembly area is connected to the second assembly area, and the second side of the other first assembly area is connected to the second assembly area. The insulating strip is located between the through groove on the adjacent third side and the through groove on the adjacent fourth side, and the two ends of the insulating strip along the second direction extend beyond the end of the through groove on the third side and the end of the through groove on the fourth side, respectively.

4. The circuit board assembly according to claim 1, characterized in that, The insulating strip is fixed to the substrate by welding.

5. The circuit board assembly according to claim 4, characterized in that, The solder joints formed by welding the insulating strip and the substrate are located at both ends of the insulating strip along the second direction.

6. The circuit board assembly according to claim 5, characterized in that, The portion of the insulating strip corresponding to the solder joint protrudes in a direction away from the solder joint.

7. The circuit board assembly according to claim 5, characterized in that, The two solder joints of the same insulating strip are defined as a first sub-point and a second sub-point, respectively. The distance between the first sub-point and the area of ​​the conductive bar closest to the first sub-point in the first assembly area on one side is defined as D1. The distance between the second sub-point and the area of ​​the conductive bar closest to the second sub-point in the first assembly area on the other side is defined as D2. The distance between the first sub-point and the second sub-point is defined as D3. Wherein, D1+D2+D3≥31.8mm.

8. The circuit board assembly according to claim 1, characterized in that, The through groove extends through both sides of the substrate along a third direction. The insulating strip is provided on the portion of the substrate corresponding to the second assembly area on both sides of the substrate along the third direction. The first direction, the second direction, and the third direction are perpendicular to each other.

9. A branch module, characterized in that, It includes a busbar and a circuit board assembly as described in any one of claims 1 to 8, wherein the busbar is assembled in the first assembly area.

10. A power distribution device, characterized in that, The power distribution equipment includes a housing, a main wiring module, and a branch module as described in claim 9. The main wiring module and the branch module are both located inside the housing and are electrically connected.

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