Circuit module, electric control box and heating and ventilation equipment

Abstract

The utility model discloses a circuit module, an electric control box and heating and ventilation equipment, and relates to the technical field of heating and ventilation equipment. The circuit module comprises a heat dissipation structure, a circuit board and an inductance device; the circuit board and the inductance device are arranged on the heat dissipation structure, and the inductance device is electrically connected with the circuit board; the inductor device comprises a glue pouring shell, an inductor body and heat-conducting glue; the glue pouring shell is fixed to the heat dissipation structure and matched with the heat dissipation structure to form a glue pouring cavity, and a glue pouring opening communicated with the glue pouring cavity is formed in the glue pouring shell. The inductor body is arranged in the glue pouring cavity; and the heat-conducting glue is filled in the glue filling cavity and at least filled between the inductor body and the heat dissipation structure. According to the technical scheme, the heat dissipation efficiency of the inductance device in the electric control box can be improved.

Description

Technical Field

[0001] This application relates to the field of heating, ventilation and air conditioning (HVAC) equipment technology, and in particular to a circuit module, an electrical control box, and HVAC equipment. Background Technology

[0002] Heating, ventilation, and air conditioning (HVAC) systems are an important component of building environmental control, encompassing multiple systems such as heating, ventilation, and air conditioning. They are widely used in residential, commercial, and industrial buildings. Their main function is to create a comfortable and healthy living and working environment by regulating parameters such as indoor temperature, humidity, and airflow.

[0003] As a key component of HVAC equipment, the control board is used to control the operation of devices such as compressors and fans. To protect it, the control board is usually housed in a box, called a control box. In related technologies, the control board includes an inductor to suppress electromagnetic interference. During operation, the inductor generates heat due to various losses; excessively high temperatures can affect the performance of the inductor itself and the normal operation of the control board. Utility Model Content

[0004] This application provides a circuit module, an electrical control box, and a heating and ventilation device, which can improve the heat dissipation efficiency of the inductor in the circuit module.

[0005] In a first aspect, embodiments of this application provide a circuit module, including:

[0006] Heat dissipation structure;

[0007] Circuit board, disposed in the heat dissipation structure; and

[0008] An inductor is disposed in the heat dissipation structure and electrically connected to the circuit board;

[0009] The inductor includes:

[0010] A potting shell is fixed to the heat dissipation structure and forms a potting cavity with the heat dissipation structure. The potting shell is provided with a potting port that communicates with the potting cavity.

[0011] The inductor body is disposed within the potting cavity; and

[0012] Thermally conductive adhesive is filled into the potting cavity, and at least between the inductor body and the heat dissipation structure.

[0013] In one embodiment, a plurality of support ribs are provided at intervals along the circumference of the inductor on the inner wall of the potting shell. The support ribs have overlapping portions, and the inductor body overlaps the overlapping portions of the plurality of support ribs so that the inductor body is suspended in the potting cavity, and the thermally conductive adhesive wraps the inductor body.

[0014] In one embodiment, the heat dissipation structure is disposed in the thickness direction of the inductor, and the potting port is disposed at one end of the potting shell away from the heat dissipation structure.

[0015] In one embodiment, the inductor body includes:

[0016] Magnetic core assembly; and

[0017] A coil assembly, insulated and wound on the magnetic core assembly, with pins formed at the ends of the coil assembly;

[0018] The potting shell has a first mounting port, and the pin passes through the first mounting port and is electrically connected to the circuit board.

[0019] In one embodiment, the coil assembly includes a plurality of coil windings spaced apart;

[0020] The inductor body further includes an insulating pad, the insulating pad comprising:

[0021] A spacer body is disposed on the magnetic core assembly and located between two adjacent coil windings; and

[0022] A foot, connected to the pad body and extending away from the magnetic core assembly;

[0023] The glue-filled shell is provided with a second mounting port, and the pad is inserted through the second mounting port.

[0024] In one embodiment, the magnetic core assembly is arranged in a ring and includes a first magnetic core segment and a second magnetic core segment connected to each other, and a plurality of coil windings are disposed on the first magnetic core segment; the potting cavity includes a first accommodating cavity for accommodating the first magnetic core segment and the plurality of coil windings, and a second accommodating cavity for accommodating the second magnetic core segment; the inner contour of the potting shell forming the first accommodating cavity is adapted to the outer contour of the plurality of coil windings, and the inner contour of the potting shell forming the second accommodating cavity is adapted to the outer contour of the second magnetic core segment.

[0025] In one embodiment, the first mounting port, the second mounting port, and the potting port are located on the same side of the potting shell, the circuit board abuts against the end of the potting shell where the potting port is located, and the potting shell is located between the heat dissipation structure and the circuit board.

[0026] In one embodiment, the end of the potting shell with the potting port is also provided with a heat-conducting port, the circuit board covers the heat-conducting port, the circuit board is provided with a communication port communicating with the potting port, and the area of ​​the circuit board corresponding to the heat-conducting port is covered with the heat-conducting adhesive.

[0027] In one embodiment, the potting shell includes;

[0028] Base; and

[0029] The cover is detachably connected to the base and forms an open glue-filling groove on the base;

[0030] The heat dissipation structure covers the opening of the glue-filling groove to form the glue-filling cavity.

[0031] In one embodiment, the outer periphery of the base is provided with a skirt groove, the outer periphery of the cover is provided with a skirt protrusion, the skirt protrusion overlaps in the skirt groove, and the inner sidewall of the cover is flush with the inner sidewall of the base.

[0032] In one embodiment, a plurality of buckles are provided on the outer side wall of one of the base and the cover along the circumferential direction of the inductor, and a plurality of retaining rings corresponding to the plurality of buckles are provided on the outer side wall of the other.

[0033] The buckle extends toward the retaining ring, and the end of the buckle is provided with an anti-detachment part; the retaining ring is provided with a retaining interface, the buckle passes through the retaining interface, and the retaining ring prevents the anti-detachment part from disengaging from the retaining interface in the opposite direction of passing through.

[0034] In one embodiment, the outer side wall of the cover is provided with a connecting lug, and the connecting lug is provided with a first connecting hole; the heat dissipation structure is provided with a connecting post, and the circuit board is provided with a second connecting hole, and the connecting post is connected to the first connecting hole and the second connecting hole.

[0035] Secondly, embodiments of this application provide an electronic control box, characterized in that it includes:

[0036] Box lid; and

[0037] The circuit module as described above;

[0038] The heat dissipation structure and the cover are connected and cooperate to form a receiving cavity, and the circuit board and the inductor are disposed in the receiving cavity.

[0039] In one embodiment, the lid includes a first lid and a second lid, and the receiving cavity includes a first cavity formed by the first lid and the heat dissipation structure, and a second cavity formed by the second lid and the heat dissipation structure; the first cavity and the second cavity are respectively located on both sides of the heat dissipation structure, and the heat dissipation structure is provided with a first opening communicating with the first cavity and the second cavity;

[0040] The circuit board includes a driver board and a filter board. The driver board is disposed in the first cavity, and the inductor and the filter board are disposed in the second cavity. The inductor is electrically connected to the filter board.

[0041] The electrical control box also includes a power connection structure, which is disposed through the first opening, and the two ends of the power connection structure are electrically connected to the drive board and the filter board, respectively.

[0042] In one embodiment, the power connection structure includes:

[0043] An insulating base is installed at the first opening; and

[0044] A power connection post is disposed on the insulating base and passes through the first opening, with its two ends connected to the drive board and the filter board respectively.

[0045] In one embodiment, the heat dissipation structure includes a cold plate body and a first enclosure plate that are integrally formed. The cold plate body is plate-shaped and has heat dissipation channels.

[0046] The first lid is sealed to the side of the first enclosure away from the cold plate body to form the first cavity, and the second lid is sealed to the side of the cold plate body opposite to the first enclosure to form the second cavity.

[0047] Thirdly, embodiments of this application provide a heating, ventilation, and air conditioning (HVAC) device, including a housing and an electrical control box as described above, wherein the electrical control box is disposed within the housing.

[0048] In one embodiment, the housing is provided with an access port; the electrical control box is located at the access port, wherein the first cavity of the receiving cavity faces the access port.

[0049] Based on the circuit module of this application embodiment, by setting a heat dissipation structure and a potting shell that cooperates with the heat dissipation structure to form a potting cavity, the inductor body can be housed within the potting cavity. Thermally conductive adhesive is then injected into the potting cavity through a potting port communicating with the cavity, ensuring that at least the space between the inductor body and the heat dissipation structure is filled with thermally conductive adhesive. The thermally conductive adhesive can conduct heat from the inductor body to the heat dissipation structure, and the heat is then carried away by the heat dissipation structure, thereby reducing the temperature of the inductor body and ensuring the performance of the inductor body and the stability of the circuit on the circuit board. Attached Figure Description

[0050] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0051] Figure 1 This is a schematic diagram of the exposed access panel of a heating, ventilation, and air conditioning (HVAC) device according to an embodiment of this application.

[0052] Figure 2 for Figure 1 A structural diagram from another angle of the structure;

[0053] Figure 3 This is a schematic diagram of the structure of an electrical control box according to an embodiment of this application;

[0054] Figure 4 This is a schematic diagram of the electrical control box from another angle according to an embodiment of this application;

[0055] Figure 5 This is a schematic diagram of the structure of the electrical control box after the cover is disassembled according to an embodiment of this application;

[0056] Figure 6 This is a schematic diagram of the structure of the electrical control box after the second cover is hidden, according to an embodiment of this application;

[0057] Figure 7 This is a schematic diagram of the partial structure of the electrical control box after the cover is hidden, according to an embodiment of this application.

[0058] Figure 8 This is a schematic diagram of the mounting structure of the inductor and heat dissipation structure of a circuit module according to an embodiment of this application;

[0059] Figure 9 This is an exploded view of the inductor of an electrical control box according to an embodiment of this application;

[0060] Figure 10 This is a cross-sectional view of the potting shell and heat dissipation structure of a circuit module according to an embodiment of this application.

[0061] Figure 11 This is a schematic diagram of the structure of the inductor device in a circuit module according to an embodiment of this application;

[0062] Figure 12 for Figure 9 A structural schematic diagram of the middle cover from another perspective;

[0063] Figure 13 This is a schematic diagram of a heat dissipation structure according to an embodiment of this application;

[0064] Figure 14 for Figure 13 A magnified view of a section at point A in the middle;

[0065] Figure 15 This is a schematic diagram of the power connection structure according to an embodiment of this application;

[0066] Figure 16 This is an exploded view of a portion of the structure of the electrical control box according to an embodiment of this application;

[0067] Figure 17 for Figure 16 A schematic diagram of the structure from another perspective.

[0068] Explanation of icon numbers:

[0069] 100. Electrical control box; 10. Main box body; 10a. Receiving cavity; 10a1. First cavity; 10a2. Second cavity; 10d. First opening; 10d1. Snap-in groove; 11. Heat dissipation structure; 110. Connecting post; 111. Cold plate body; 1111. Cold plate substrate; 1112. Flow channel; 112. First enclosure plate; 120. Flow channel connector; 12. Box cover; 121. First box cover; 122. Second box cover; 20. Circuit module; 21. Circuit board; 22. Driver board; 23. Filter board; 24. Inductor; 241. Potting shell; 2411. Potting cavity; 2411a. First receiving cavity; 2411b. Second receiving cavity; 2412. Potting port; 2413. Support rib; 2413a. Overlapping part; 2414. First mounting plate. 2415. Second mounting port; 2416. Base; 2416a. Skirt groove; 2416b. Snap fastener; 2416c. Anti-detachment part; 2417. Cover; 2417a. Skirt protrusion; 2417b. Snap ring; 2417c. Snap interface; 2417d. Connecting lug; 2417e. First connecting hole; 2418. Potting groove; 242. Inductor body; 2421. Magnetic core assembly; 2421a. First magnetic core segment; 2421b. Second magnetic core segment; 2422. Coil assembly; 2422a. Coil winding; 2422b. Pin; 2423. Insulating pad; 2423a. Pad body; 2423b. Foot; 30. Power connection structure; 31. Insulating base; 311. Snap fastener; 32. Power connection post; 33. Reactor;

[0070] 2. Outdoor unit; 200. Casing; 200a. Inspection port; 300. Air supply fan.

[0071] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0072] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0073] Where the following description relates to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0074] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. Furthermore, in the description of this application, unless otherwise stated, "multiple" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.

[0075] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0076] Heating, ventilation, and air conditioning (HVAC) systems are used to regulate the indoor environment, including functions such as heating, ventilation, and air conditioning. Their main purpose is to provide users with a comfortable and healthy indoor environment by controlling parameters such as temperature, humidity, and airflow. Common HVAC equipment includes air conditioners, radiators, and ventilation systems. These devices are widely used in residential, commercial buildings, and industrial settings.

[0077] Taking HVAC equipment as an example, an air conditioning system can be a multi-split system for buildings, which means that one or more outdoor units are connected in parallel to multiple indoor units to form a refrigerant circuit so that the refrigerant can circulate. Figure 1 and Figure 2 The diagram shows the outdoor unit 2 of the air conditioning system. The outdoor unit 2 has a casing 200, inside which are housed a compressor, reversing valve, outdoor heat exchanger, outdoor expansion valve, and oil separator, etc. These components are connected by refrigerant piping. Additionally, the outdoor unit 2 includes a blower fan 300.

[0078] Furthermore, the outdoor unit 2 also includes an electrical control box 100. The housing 200 is the external structure of the HVAC equipment, protecting internal components, providing a mounting base, and optimizing airflow. The housing 200 can be made of metal or high-strength plastic, possessing good structural strength and corrosion resistance. The housing 200 can be rectangular and placed on the roof or ground. The housing 200 isolates internal live components from the outside environment, preventing direct contact by users and reducing the occurrence of electric shock and other safety accidents. The electrical control box 100 is the core control component in the HVAC equipment. Installed inside the housing 200, the housing 200 protects the electrical control box 100. The electrical control box 100 is responsible for precisely controlling the operation of the HVAC equipment. It contains various control circuits, using various electronic components and wiring to control the HVAC equipment's start-up, stop, temperature adjustment, and mode switching.

[0079] The housing 200 provides protection for the electronic components inside the control box 100, preventing dust, moisture, oil, and other external impurities from entering. It also protects the control box 100 from extreme environmental conditions (such as temperature, humidity, and chemical corrosion), ensuring normal operation in various environments and extending the lifespan of the control box 100. The control box 100 contains high-voltage circuits and live components; housing them within the housing 200 prevents accidental contact by users, reducing the risk of electric shock and improving safety. Furthermore, the housing 200 also acts as shielding, reducing the impact of external electromagnetic interference on the electronic components inside the control box 100, ensuring the stability and reliability of the control system.

[0080] Please see Figure 1 and Figure 2 In this embodiment, the housing 200 is rectangular, while the electrical control box 100 has a length direction, which is arranged along the height direction (i.e., vertical direction) of the housing 200. Therefore, the internal structure of the electrical control box 100 has a vertical arrangement. This vertical length arrangement can better meet the overall structural layout requirements of the equipment when the housing 200 has a large height and limited horizontal space, and is also conducive to heat dissipation and maintenance operations.

[0081] It should be noted that this application is not limited to the above embodiment in which the length of the control box 100 is arranged along the height of the housing 200. In other embodiments, the length of the control box 100 may also be arranged along the length of the housing 200, or the length of the control box 100 may also be arranged along the width of the housing 200. Furthermore, the control box 100 may not be a single form extending along the length direction; it may also vary according to the internal space of the housing 200, for example, it may be formed into an approximate "L" shape, "T" shape, etc.

[0082] In some embodiments, an air duct is formed within the housing 200. This air duct guides air to flow along a predetermined path, preventing disordered airflow within the housing 200 and thus improving heat dissipation efficiency. Specifically, as exemplarily shown in the figure, the air supply fan 300 is located at the top of the housing 200, i.e., at the top of the air duct, and blows air upwards. Furthermore, the electrical control box 100 is located within the air duct, thus utilizing the airflow within the air duct to remove the heat generated by the electrical control box 100, ensuring effective heat dissipation of the electrical control box 100.

[0083] Please continue reading. Figure 1 and Figure 2 In some embodiments, the housing 200 is provided with an access port 200a. In one configuration, the housing 200 includes a housing body and an access door rotatably connected to the housing body, allowing maintenance personnel to expose the access port 200a by opening the access door. In another configuration, the housing 200 includes a housing body and a front panel connected to the housing body. The front panel is fixedly connected to the housing body by screws, allowing maintenance personnel to separate the front panel from the housing body by removing the screws to expose the access port 200a. This application does not impose specific limitations on the manner in which the access port 200a is exposed.

[0084] The electrical control box 100 is located at the access port 200a, allowing maintenance personnel to quickly access the electrical control box 100 without having to extend excessively into the casing 200, which greatly improves the efficiency of maintenance and repair.

[0085] Please see Figure 3 , Figure 4 , Figure 5 and Figure 6 In some embodiments, the control box 100 includes a cover and a circuit module 20. The circuit module 20 includes a heat dissipation structure 11, a circuit board 21, and an inductor 24. The cover 12 and the heat dissipation structure 11 are connected to form a main box 10 with a receiving cavity 10a. The main box 10 is the main structure of the control box 100. The circuit board 21 and the inductor 24 are disposed in the receiving cavity 10a. That is, the main box 10 serves to support and protect the internal circuit board 21 and inductor 24, preventing them from shifting or being damaged due to external vibration or collision during use. By setting the cover 12 and the heat dissipation structure 11, components such as the circuit board 21 and the inductor 24 are integrated into a unified structure, which is conducive to the overall design and assembly of the control box 100, and facilitates production and maintenance.

[0086] Please see Figures 7 to 10In this embodiment, the circuit module 20 includes a heat dissipation structure 11, a circuit board 21, and an inductor 24. The circuit board 21 and the inductor 24 are both disposed on the heat dissipation structure 11, and the inductor 24 is electrically connected to the circuit board 21. The inductor 24 includes a potting shell 241, an inductor body 242, and thermally conductive adhesive (not shown). The potting shell 241 is fixed to the heat dissipation structure 11 and forms a potting cavity 2411 with the heat dissipation structure 11. The potting shell 241 is provided with a potting port 2412 communicating with the potting cavity 2411. The inductor body 242 is disposed in the potting cavity 2411, and the thermally conductive adhesive fills the potting cavity 2411, and at least fills the space between the inductor body 242 and the heat dissipation structure 11.

[0087] It should be noted that the inductor body 242 can be a differential-mode inductor, which refers to an inductor used to suppress differential-mode interference. Differential-mode interference refers to interference signals of equal magnitude and opposite direction that exist between two signal lines (such as the positive and negative terminals of a power supply line) in a circuit. The differential-mode inductor, connected in series in the power supply line, impedes the change in this differential-mode interference current, reducing the rate of change of current and thus acting as a filter to reduce differential-mode interference. The inductor device 24 can also be a common-mode inductor, both of which can be used to suppress electromagnetic interference. Common-mode inductors are mainly used to suppress common-mode interference; common-mode interference refers to interference signals of equal magnitude and same direction that exist between two signal lines relative to ground in a circuit. When normal operating current flows through the common-mode inductor, the common-mode inductor has almost no obstruction effect on normal signals, but for common-mode interference current, the impedance of the common-mode inductor increases, thus suppressing common-mode interference. Inductors are prone to heat generation during operation due to hysteresis loss, eddy current loss, or parasitic effects. If the heat cannot be dissipated, it will reduce the inductor's performance and affect the stability of the circuit.

[0088] By setting up a heat dissipation structure and a potting shell 241 that cooperates with the heat dissipation structure 11 to form a potting cavity 2411, the inductor body 242 can be housed within the potting cavity 2411. Thermally conductive adhesive is then injected into the potting cavity 2411 through a potting port 2412 that communicates with it, ensuring that at least the space between the inductor body 242 and the heat dissipation structure 11 is filled with thermally conductive adhesive. This adhesive conducts heat from the inductor body 242 to the heat dissipation structure 11, which then carries the heat away, thereby reducing the temperature of the inductor body 242 and ensuring the performance of the inductor body 242 and the stability of the circuitry on the circuit board 21.

[0089] It should be noted that after the thermally conductive adhesive is completely filled in the potting cavity 2411, it also serves to fix the inductor body 242 and absorb and buffer external impacts, so as to prevent the inductor body 242 from being affected by external vibrations and shaking and other external forces.

[0090] This application does not limit the type of thermally conductive adhesive, and those skilled in the art can flexibly adjust it according to the actual product situation. In some embodiments, the thermally conductive adhesive is in a solid state at room temperature and becomes a fluid state when heated to a certain temperature. The thermally conductive adhesive can be filled into the filling cavity 2411 through the filling port 2412 in a fluid state. In other embodiments, the thermally conductive adhesive can also be a soft gel, which can be placed into the filling cavity 2411 through the filling port 2412. Among them, the thermally conductive adhesive includes, but is not limited to, silicone thermally conductive adhesive, epoxy resin AB glue, acrylic thermally conductive adhesive, polyurethane thermally conductive adhesive, or thermally conductive silicone grease, etc.

[0091] Please see Figure 10 and Figure 12 In some embodiments, a plurality of support ribs 2413 are provided at intervals along the circumference of the inductor 24 on the inner wall of the potting shell 241. The support ribs 2413 have overlapping portions 2413a. The inductor body 242 overlaps on the overlapping portions 2413a of the plurality of support ribs 2413, so that the inductor body 242 is suspended in the potting cavity 2411, and the thermally conductive adhesive wraps the inductor body 242.

[0092] On the one hand, the support ribs 2413 can improve the structural strength of the potting shell 241 and increase the overall service life of the inductor device 24. On the other hand, by having the inductor body 242 overlap the overlapping portions 2413a of the multiple support ribs 2413, the inductor body 242 can be suspended in the potting cavity 2411. That is, a gap is maintained between the outer surface of the inductor body 242 and the inner wall of the potting shell 241 and the heat dissipation structure 11. After the thermally conductive adhesive is poured in through the potting port 2412, the thermally conductive adhesive can completely wrap the inductor body 242, increasing the contact area between the inductor body 242 and the thermally conductive adhesive, and improving the heat dissipation effect of the thermally conductive adhesive and the heat dissipation structure 11 on the inductor body 242.

[0093] Furthermore, the heat dissipation structure 11 is located along the thickness direction of the inductor 24, and the potting port 2412 is located at the end of the potting shell 241 opposite to the heat dissipation structure 11. For example, the inductor 24 is placed vertically along its thickness direction before potting. At this time, the heat dissipation structure 11 is located at the bottom of the potting shell 241, and the potting port 2412 is located at the top of the potting shell 241. When thermally conductive adhesive is poured into the potting cavity 2411 through the potting port 2412, due to gravity, the thermally conductive adhesive first accumulates on the bottom heat dissipation structure 11, ensuring complete filling and maximizing the coverage of the heat dissipation structure 11, thus reducing the possibility of dead zones between the thermally conductive adhesive and the heat dissipation structure 11. This increases the contact area between the thermally conductive adhesive and the heat dissipation structure 11, improving the heat dissipation effect of the thermally conductive adhesive and the heat dissipation structure 11 on the inductor body 242.

[0094] Please see Figure 7 , Figure 8 and Figure 9Specifically, in some embodiments, the inductor body 242 includes a magnetic core assembly 2421 and a coil assembly 2422; the coil assembly 2422 is insulatedly wound on the magnetic core assembly 2421, and the ends of the coil assembly 2422 are formed with pins 2422b; wherein, the potting shell 241 is provided with a first mounting port 2414, and the pins 2422b of the coil assembly 2422 pass through the first mounting port 2414 and are electrically connected to the circuit board 21.

[0095] It should be noted that pin 2422b passes through the first mounting port 2414 and extends out of the potting shell 241. The end extending out of the potting shell 241 is electrically connected to the circuit board 21, thereby suppressing differential-mode or common-mode interference in the circuit on the circuit board 21. After the thermally conductive adhesive is completely filled in the potting cavity 2411, the outer surface of the portion of pin 2422b located inside the potting cavity 2411 is covered with thermally conductive adhesive. After the thermally conductive adhesive cures, it fixes pin 2422b in place, preventing pin 2422b from detaching from the circuit board 21 due to shaking or other reasons.

[0096] Please see Figure 9 and Figure 12 In some embodiments, the magnetic core assembly 2421 is arranged in a ring and includes a first magnetic core segment 2421a and a second magnetic core segment 2421b connected to each other. A plurality of coil windings 2422a are disposed on the first magnetic core segment 2421a. The potting cavity 2411 includes a first accommodating cavity 2411a for accommodating the first magnetic core segment 2421a and the plurality of coil windings 2422a, and a second accommodating cavity 2411b for accommodating the second magnetic core segment 2421b. The inner contour of the portion of the potting shell 241 forming the first accommodating cavity 2411a is adapted to the outer contour of the plurality of coil windings 2422a, and the inner contour of the portion of the potting shell 241 forming the second accommodating cavity 2411b is adapted to the outer contour of the second magnetic core segment 2421b.

[0097] It is understandable that after the core assembly 2421 is wound with the coil winding 2422a, the coil winding 2422a protrudes relative to the core assembly 2421, and the height of the inductor body 242 where the coil winding 2422a is wound is obviously higher than the height where the coil winding 2422a is not wound. By concentrating multiple coil windings 2422a in the first magnetic core segment 2421a, and dividing the potting cavity 2411 into a first accommodating cavity 2411a for accommodating the first magnetic core segment 2421a and multiple coil windings 2422a, and a second accommodating cavity 2411b for accommodating the second magnetic core segment 2421b, the height of the second accommodating cavity 2411b in the axial direction of the magnetic core assembly 2421 can be set lower than the height of the first accommodating cavity 2411a; and the distance between the inner wall of the second accommodating cavity 2411b and the magnetic core assembly 2421 in the radial direction of the magnetic core assembly 2421 can be set closer than the distance between the inner wall of the first accommodating cavity 2411a and the magnetic core assembly 2421. That is, the potting cavity 2411 can be roughly divided into two parts with different heights and shapes. On the one hand, it can reduce the overall volume of the potting shell 241 and reduce the space occupied by the inductor 24 in the control box 100; on the other hand, it reduces the amount of thermally conductive adhesive injected, reduces production costs, and also reduces the distance between the empty part 2421b and the inner wall of the potting shell 241, making it easier to conduct internal heat through the potting shell 241.

[0098] Please see Figure 8 and Figure 9 In some embodiments, the coil assembly 2422 includes a plurality of coil windings 2422a spaced apart; the inductor body 242 also includes an insulating pad 2423, the insulating pad 2423 including a pad body 2423a and a pad foot 2423b; the pad body 2423a is disposed on the magnetic core assembly 2421 and is located between two adjacent coil windings 2422a; the pad foot 2423b is connected to the pad body 2423a and extends in a direction away from the magnetic core assembly 2421; wherein, the potting shell 241 is provided with a second mounting port 2415, and the pad foot 2423b passes through the second mounting port 2415.

[0099] By placing an insulating pad 2423 between two adjacent coil windings 2422a, the insulation design between adjacent coil windings 2422a is maintained, short circuits between coil windings 2422a are prevented, and the inductance function is maintained; at the same time, the eddy current path generated by magnetic field changes between conductors can be blocked, thereby reducing energy loss.

[0100] Optionally, the first mounting port 2414, the second mounting port 2415, and the potting port 2412 are located on the same side of the potting shell 241, and the circuit board 21 abuts against the end of the potting shell 241 where the potting port 2412 is located. The potting shell 241 is located between the heat dissipation structure 11 and the circuit board 21.

[0101] By placing the first mounting port 2414, the second mounting port 2415, and the potting port 2412 on the same side of the potting shell 241, the thermally conductive adhesive is poured through the potting port 2412, and then the first mounting port 2414 and the second mounting port 2415 are sealed with adhesive at the end, preventing the thermally conductive adhesive from overflowing from the first mounting port 2414 and the second mounting port 2415 during the potting process. The potting shell 241 is located between the heat dissipation structure 11 and the circuit board 21. The potting shell 241 serves to support the circuit board 21, maintaining an appropriate distance between the circuit board 21 and the heat dissipation structure 11, increasing the airflow space between the circuit board 21 and the heat dissipation structure 11, and helping to improve heat dissipation efficiency.

[0102] Furthermore, in some embodiments, the end of the potting shell 241 with the potting port 2412 is also provided with a heat conduction port, the circuit board 21 covers the heat conduction port, the circuit board 21 is provided with a communication port communicating with the potting port 2412, and the area of ​​the circuit board 21 corresponding to the heat conduction port is covered with heat conduction adhesive.

[0103] By setting a heat-conducting port on the potting shell 241, the heat-conducting adhesive is completely filled in the potting cavity 2411 and covers the area of ​​the heat-conducting port corresponding to the circuit board 21. The heat generated by the circuit board 21 can be conducted to the heat dissipation structure 11 through the heat-conducting adhesive, and then the heat dissipation structure 11 carries away the heat, thereby improving the heat dissipation effect of the circuit board 21 and preventing the circuit board 21 from reducing its performance or affecting normal operation due to excessive temperature.

[0104] Optionally, the circuit board 21 can be connected and fixed to the potting shell 241 after the inductor device 24 is potted, or it can be connected and fixed to the potting shell 241 first, and then the thermally conductive adhesive in the potting cavity 2411 can be potted through the communication port. After the potting is completed, the thermally conductive adhesive is connected to the circuit board 21 through the thermally conductive port.

[0105] Please continue reading. Figure 9 , Figure 10 and Figure 11 In some embodiments, the potting shell 241 includes a base 2416 and a cover 2417; the cover 2417 is detachably connected to the base 2416 and surrounds the base 2416 to form an open potting groove 2418 on the base 2416; wherein, the heat dissipation structure 11 covers the open of the potting groove 2418 to form a potting cavity 2411.

[0106] Specifically, one of the base 2416 and the cover 2417 has multiple buckles 2416b spaced around the circumference of the inductor 24 on its outer side wall, and the other has multiple retaining rings 2417b corresponding to the buckles 2416b. The buckles 2416b extend toward the retaining rings 2417b, and the ends of the buckles 2416b have anti-detachment parts 2416c. The retaining rings 2417b have a retaining interface 2417c, the buckles 2416b pass through the retaining interface 2417c, and the retaining rings 2417b stop the anti-detachment parts 2416c from disengaging from the retaining interface 2417c in the opposite direction of passing through. For example, when the base 2416 is placed at the bottom, the buckle 2416b is provided on the outer side wall of the base 2416 and extends upward. After the buckle 2416b is aligned with the retaining ring 2417b provided on the outer side wall of the cover 2417, the cover 2417 is moved toward the base 2416. As the anti-detachment part 2416c passes through the retaining interface 2417c, the buckle 2416b tilts toward the center of the potting shell 241. The anti-detachment part 2416c and the outer side of the cover 2417... The distance between the walls decreases; after the anti-detachment part 2416c completely passes through the card interface 2417c, the buckle 2416b returns to its original state, the distance between the anti-detachment part 2416c and the outer wall of the cover 2417 increases, and the retaining ring 2417b stops the anti-detachment part 2416c from disengaging from the card interface 2417c in the opposite direction of the insertion, so that the anti-detachment part 2416c is limited to the side of the retaining ring 2417b facing away from the base 2416, thereby realizing the connection between the base 2416 and the cover 2417.

[0107] Of course, there are no restrictions on the connection method between the base 2416 and the cover 2417. The base 2416 and the cover 2417 can also be connected and fixed by bolts. The above is only a specific description of some embodiments.

[0108] Please see Figure 9 and Figure 12 Optionally, in some embodiments, the outer periphery of the base 2416 is provided with a skirt groove 2416a, and the outer periphery of the cover 2417 is provided with a skirt protrusion 2417a. The skirt protrusion 2417a overlaps in the skirt groove 2416a, and the inner sidewall of the cover 2417 is flush with the inner sidewall of the base 2416.

[0109] Understandably, the skirt groove 2416a is located on the end face of the base 2416 facing the cover 2417, and the skirt protrusion 2417a is located on the end face of the cover 2417 facing the base 2416. By setting the skirt groove 2416a and the skirt protrusion 2417a, after the base 2416 is connected to the cover 2417, the skirt protrusion 2417a overlaps in the skirt groove 2416a, which enhances the sealing between the base 2416 and the cover 2417. After the base 2416 is connected to the cover 2417, the inner wall of the cover 2417 is flush with the inner wall of the base 2416, and a filling dead corner is formed between the cover 2417 and the base 2416, which can also reduce the risk of thermal conductive adhesive leaking from the gap between the cover 2417 and the base 2416.

[0110] Please see Figure 8 , Figure 9 and Figure 10 In some embodiments, the outer side wall of the cover 2417 is provided with a connecting lug 2417d, and the connecting lug 2417d is provided with a first connecting hole 2417e; the heat dissipation structure 11 is provided with a connecting post 110, and the circuit board 21 is provided with a second connecting hole (not shown), and the connecting post 110 is connected to the first connecting hole 2417e and the second connecting hole.

[0111] By providing a connecting post 110 on the heat dissipation structure 11, a connecting lug 2417d on the outer side wall of the cover 2417, and a second connecting hole on the circuit board 21, the connection between the heat dissipation structure 11, the potting shell 241, and the circuit board 21 is achieved. Bolts or screws can be passed sequentially through the second connecting hole and the first connecting hole 2417e before being connected to the connecting post 110, thus achieving a fixed connection between the heat dissipation structure 11, the potting shell 241, and the circuit board 21. Alternatively, the connecting post 110 can be passed sequentially through the first connecting hole 2417e and the second connecting hole, and the fixed connection between the heat dissipation structure 11, the potting shell 241, and the circuit board 21 can be achieved through an interference fit between the connecting post 110 and the first connecting hole 2417e and the second connecting hole. It is understandable that there are multiple connecting posts 110 and connecting lugs 2417d, with multiple connecting posts 110 and multiple connecting lugs corresponding one-to-one and spaced apart along the circumference of the potting shell 241, in order to improve the stability of the connection between the heat dissipation structure 11, the potting shell 241 and the circuit board 21.

[0112] Please continue reading. Figure 3 , Figure 4 , Figure 5 and Figure 6In some embodiments, the circuit board 21 includes a driver board 22 and a filter board 23, and the receiving cavity 10a includes a first cavity 10a1 and a second cavity 10a2. Understandably, the main housing 10 is a shell structure with a certain thickness. The first cavity 10a1 and the second cavity 10a2 are arranged at intervals relative to each other in the thickness direction of the main housing 10, that is, a portion of the main housing 10 separates the first cavity 10a1 and the second cavity 10a2. By setting the first cavity 10a1 and the second cavity 10a2, a partitioned layout of different functional modules is achieved. For example, circuit boards with different functions can be arranged within the first cavity 10a1 and the second cavity 10a2. In this embodiment, the drive board 22 is disposed within the first cavity 10a1, and the inductor and filter board 23 are disposed within the second cavity 10a2. The inductor is electrically connected to the filter board 23. The thickness direction of the drive board 22 and the filter board 23 is consistent with the thickness direction of the main housing 10. When viewed from the thickness direction of the main housing 10 (i.e., from one side to the other), the drive board 22 and the filter board 23 are arranged sequentially along the thickness direction of the main housing 10, rather than being placed horizontally or diagonally. This layout allows the drive board 22 and the filter board 23 to fully utilize the space of the main housing 10 in the thickness direction, making reasonable use of the internal space of the control box 100 and resulting in a more compact overall structure. This design can achieve more functions within a limited space and is suitable for applications with high space requirements.

[0113] Please see Figure 3 , Figure 4 and Figure 5 In some embodiments, specifically, the cover 12 includes a first cover 121 and a second cover 122, and the heat dissipation structure 11 is the main body of the main box 10. A portion of the heat dissipation structure 11 can be made of a material with good thermal conductivity, such as aluminum alloy. The heat dissipation structure 11 can be designed with internal heat dissipation channels. These channels can be straight or curved, used to guide the flow of the heat exchange medium, such as air or liquid, i.e., to remove heat through air cooling or water cooling. The first cover 121 and the second cover 122 are both cover-shaped structures with an opening on one side. The first cover 121 and the second cover 122 can be respectively set on the front and rear sides of the heat dissipation structure 11, that is, along the thickness direction of the main body 10. The first cover 121 covers the heat dissipation structure 11 and cooperates with the heat dissipation structure 11 to form a first cavity 10a1. The first cavity 10a1 is used to install and accommodate the drive board 22. The second cover 122 covers the heat dissipation structure 11 and cooperates with the heat dissipation structure 11 to form a second cavity 10a2. The second cavity 10a2 is used to install and accommodate the filter board 23. The first cover 121 and the second cover 122, through their tight cooperation with the heat dissipation structure 11, can effectively prevent external pollutants such as dust and water vapor from entering the interior of the first cavity 10a1 and the second cavity 10a2.

[0114] The heat dissipation structure 11 can serve as part of the cavity wall that forms the first cavity 10a1 and the second cavity 10a2, thereby more effectively conducting the heat dissipated by the drive plate 22 and the filter plate 23 installed in the first cavity 10a1 and the second cavity 10a2, increasing the heat exchange area, improving heat dissipation efficiency, and ensuring that the drive plate 22 and the filter plate 23 remain stable under high load operation.

[0115] Furthermore, the heat dissipation structure 11 is used as the outer shell of the main box 10. In this way, when the control box 100 is located in the air duct, the airflow in the air duct can quickly flow through the outer wall of the control box 100, thereby fully exchanging heat and releasing the heat generated by the control box 100 more quickly.

[0116] Please continue reading. Figure 3 , Figure 4 and Figure 5 Understandably, the drive board 22 and filter board 23 generate heat during operation. At least one side of the drive board 22 and filter board 23 faces the heat dissipation structure 11. Since the thickness direction of the drive board 22 and filter board 23 is consistent with the thickness direction of the main housing 10, the side facing the heat dissipation structure 11 is usually the larger side of the drive board 22 and filter board 23. The heat from these sides is mainly transferred to the heat dissipation structure 11 through thermal conduction, and then dissipated to the external environment through the heat dissipation function of the heat dissipation structure 11. Through the thermal conduction and convection heat dissipation function of the heat dissipation structure 11, the heat generated by the drive board 22 and filter board 23 can be quickly removed, maintaining the internal temperature of the control box 100 within a reasonable range. The sides of the drive board 22 and filter board 23 facing away from the heat dissipation structure 11 face the first cover 121 and the second cover 122, respectively. These sides can dissipate heat to the surrounding environment through radiation. This comprehensive heat dissipation strategy not only improves the efficiency of heat transfer but also ensures the stability and reliability of the equipment during long-term operation.

[0117] The heat dissipation structure 11 has a first side and a second side, namely the front and rear sides of the heat dissipation structure 11 along the thickness direction of the main box 10. The first cavity 10a1 and the second cavity 10a2 are located on the first side and the second side of the heat dissipation structure 11, respectively. The first cover 121 and the second cover 122 can be tightly fitted with the heat dissipation structure 11 by screws, clips or other fixing devices to form two relatively independent first cavities 10a1 and second cavities 10a2. The heat generation and heat dissipation requirements of the drive board 22 and the filter board 23 may be different. By placing them in independent cavities, customized designs can be made according to the specific heat dissipation requirements of the drive board 22 and the filter board 23. This also effectively avoids heat cross-interference between the drive board 22 and the filter board 23, ensuring that the drive board 22 and the filter board 23 each have a better matching heat dissipation setting, thereby improving the heat dissipation efficiency of the entire electrical control box 100.

[0118] Please see Figure 5 , Figure 6 , Figure 13 and Figure 14 The heat dissipation structure 11 has a first opening 10d connecting the first cavity 10a1 and the second cavity 10a2. The electrical control box 100 also includes a power connection structure 30, which can be a conductive post, wire, or other conductive connector. The power connection structure 30 passes through the first opening 10d and connects to the drive board 22 and the filter board 23 at both ends, respectively, to electrically connect the drive board 22 and the filter board 23. The first opening 10d and the power connection structure 30 simplify the connection between circuits and reduce the complexity and length of internal wiring. Although the drive board 22 and the filter board 23 are electrically connected through the power connection structure 30, they still maintain a certain degree of physical isolation, which helps to maintain their respective working environments, such as temperature, vibration, and contamination.

[0119] By setting the first opening 10d and the power connection structure 30, the connection between the drive board 22 and the filter board 23 can be completed inside the main housing 10 without the need for external wiring. This reduces the need for external wiring between the drive board 22 and the filter board 23, making the overall layout of the control box 100 simpler. Furthermore, due to the reduction in external wiring, the number and size of the wiring holes in the main housing 10 can be reduced accordingly, which helps improve the sealing of the main housing 10, thereby better protecting the internal circuit modules from the intrusion of dust, moisture, and other contaminants.

[0120] Since the drive board 22 in the first cavity 10a1 and the filter board 23 in the second cavity 10a2 are functionally independent and connected by the power connection structure 30, this compartmentalized design makes the internal functional division of the control box 100 clearer, facilitating management and maintenance. When maintenance or repair of a certain circuit module is required, the problem can be located more quickly, reducing the impact on other circuit modules and improving maintenance efficiency. Furthermore, the drive board 22 and the filter board 23 are located in independent cavities and electrically connected by the power connection structure 30. Their main bodies are isolated by the main box 10. This layout effectively reduces signal interference between the drive board 22 and the filter board 23. In the control box 100, signal interference is one of the important causes of equipment instability and malfunction. The compartmentalized design can significantly reduce this interference and improve the reliability of the control box 100.

[0121] Please continue reading. Figure 5 , Figure 6 , Figure 13 and Figure 14The first opening 10d is located in the middle of the heat dissipation structure 11, allowing the power connection structure 30 to pass directly through the heat dissipation structure 11 via a shorter path, connecting the drive board 22 in the first cavity 10a1 and the filter board 23 in the second cavity 10a2. This design not only reduces the length of the power connection structure 30 and lowers material costs, but also reduces signal transmission losses and improves the efficiency and stability of the electrical connection. Because the power connection structure 30 has the shortest path, the internal space of the control box 100 can be utilized more efficiently, reserving more space for other electronic components or functional modules.

[0122] Please see Figure 13 , Figure 14 and Figure 15 In some embodiments, the power-connecting structure 30 includes an insulating base 31 and a power-connecting post 32. The insulating base 31 is installed at the first opening 10d. Multiple latching slots 10d1 are spaced apart on the inner wall of the first opening 10d. The insulating base 31 includes a latching part 311 adapted to the latching slot. By latching the latching part 311 into the latching slot 10d1, the insulating base 31 is securely installed at the first opening 10d of the heat dissipation structure 11. In other embodiments, the insulating base 31 can also be installed at the first opening 10d by riveting, bonding, or other methods. The insulating base 31 serves as insulation, preventing current leakage or short circuits and ensuring electrical safety. The power-connecting post 32 is disposed on the insulating base 31. The power-connecting post 32 can be fixed to the insulating base 31 by crimping, or it can be connected to the insulating base 31 by welding. Alternatively, the power-connecting post 32 can be pre-embedded in the cavity by injection molding, so that it is connected to the insulating base 31 as a whole during the molding process. The insulating base 31 also provides fixation and support for the grounding post 32, maintaining the connection stability of the grounding post 32 and preventing loosening of the connection due to vibration or other reasons. The grounding post 32 extends axially along the thickness direction of the main housing 10, passes through the first opening 10d, and is connected at both ends to the drive plate 22 and the filter plate 23 respectively. The grounding post 32 is usually made of conductive material, such as copper or copper alloy, which can effectively conduct current, realize the transmission of electrical signals, and ensure the normal operation of the circuit.

[0123] Multiple electrical terminals 32 are provided, arranged side by side along the left and right direction of the main box 10. All electrical terminals 32 are mounted on the insulating base 31. Multiple electrical terminals 32 can distribute the current and prevent a single electrical terminal 32 from overheating or being damaged due to excessive current, thereby extending the service life of the electrical terminals 32.

[0124] Please see Figure 16 and Figure 17In some embodiments, the drive board 22 and the filter board 23 are respectively mounted on the first and second sides of the heat dissipation structure 11. Their thickness direction is consistent with the thickness direction of the main housing 10, that is, arranged along the thickness direction of the main housing 10. This layout allows the larger surfaces of the drive board 22 and the filter board 23 to be close to the heat dissipation structure 11, ensuring that heat can be efficiently conducted from the drive board 22 and the filter board 23 to the heat dissipation structure 11. It also makes the internal structure of the control box 100 more compact and saves space.

[0125] Please see Figure 1 , Figure 2 and Figure 5 The first cavity 10a1 is positioned facing the access port 200a of the housing 200, meaning the first cover 121 faces the access port 200a. In this application, the side of the first cover 121 facing the maintenance personnel is defined as the front side of the electrical control box 100, while the side facing away from the first cover 121 and having the second cover 122 is defined as the rear side of the electrical control box 100. The electrical control box 100 can be vertically hung inside the housing 200 via a mounting plate on its back; alternatively, the housing 200 has connecting ribs extending vertically, and the electrical control box 100 has a length direction arranged along the extension direction of the connecting ribs, and is connected to the connecting ribs by screws.

[0126] The access port 200a of the first cavity 10a1 facing the housing 200 allows maintenance personnel to quickly access the drive board 22 of the first cavity 10a1, improving maintenance and repair efficiency and reducing workload. To facilitate opening the first cover 121, the first cover 121 is configured such that its upper end is rotatably connected to the heat dissipation structure 11, and its lower end is secured to the heat dissipation structure 11 by screws. This allows the first cover 121 to be flipped to a suitable angle simply by loosening the screws during maintenance or inspection, without completely disassembling it.

[0127] Please see Figure 5 , Figure 6 , Figure 16 and Figure 17In some embodiments, the filter board 23 is used to filter high-frequency noise in the power supply, smooth DC voltage, and suppress electromagnetic interference, that is, to filter the electrical signal, remove noise and interference, and ensure the purity of the electrical signal. In this embodiment, the filter board is located inside the second cavity 10a2. Continuing from the above, the drive board 22 is located on the side facing the access port 200a, and the filter board is located on the side away from the access port 200a. The drive board 22 typically integrates multiple functional circuits. For example, the insulated gate bipolar transistor (IGBT) commonly found in the drive board 22 is a device with a high failure rate. Due to the complexity and high failure rate of the drive board 22, it requires more frequent maintenance. Therefore, placing it on the side facing the access port 200a makes it easier for maintenance personnel to maintain. Compared to the drive board 22, the filter board has a relatively low failure rate. Common problems are mostly related to electrical parameter adjustment or mechanical connection issues, which are relatively easy to solve, thus requiring less frequent maintenance. Furthermore, the heat generated by the filter board 23 is higher than that of the drive board 22. Therefore, when the filter board 23 is located on the back side, it can more effectively utilize the airflow of the air duct to remove the heat it generates, resulting in better heat dissipation efficiency.

[0128] From a heat dissipation perspective, the drive board 22 is located within the first cavity 10a1, while the filter board 23 is located within the second cavity 10a2. This compartmentalized design avoids heat accumulation within a single cavity. A portion of the heat dissipation structure 11 forms a shared cavity wall between the first and second cavities 10a1 and 10a2. This cavity wall not only serves as a physical separator but also acts as a heat conduction channel. Specifically, the material and structural design of the cavity wall allow heat to be efficiently conducted from higher-temperature components (such as the drive board) to the heat dissipation structure 11, thereby achieving rapid heat dissipation. This design not only effectively avoids localized overheating caused by heat accumulation but also further optimizes the overall heat dissipation performance of the control box 100 by rationally distributing heat, ensuring the stability and reliability of the drive board 22 and filter board 23 during long-term operation.

[0129] Please see Figure 13 In some embodiments, the heat dissipation structure 11 further includes an integrated cold plate body 111 and a first enclosure plate 112. The integrated heat dissipation structure 11 enhances the overall strength and durability, reducing the risk of damage due to vibration or impact. The cold plate body 111 is plate-shaped and is typically made of a material with good thermal conductivity (such as aluminum alloy or copper alloy) to ensure efficient heat conduction. The heat dissipation structure 11 has heat dissipation channels for the flow of heat exchange medium. These channels are mainly formed on the cold plate body 111 and can remove heat through coolant or airflow. The design of the heat dissipation channels can effectively absorb the heat generated by electronic components and conduct and dissipate it through the channels, keeping the internal temperature of the control box 100 within a reasonable range.

[0130] In this embodiment, the heat dissipation channel includes multiple straight segments and multiple curved segments, which are connected in an alternating manner to increase the contact area between the cooling medium (such as air or coolant) and the heat dissipation surface, thereby improving the heat dissipation efficiency.

[0131] By using die casting, the cold plate body 111 and the first enclosure plate 112 can be integrally formed, reducing assembly steps and improving production efficiency. It also allows for precise control of the shape and size of the heat dissipation channels, thereby optimizing heat dissipation performance. Specifically, the cold plate body 111 includes a cold plate substrate 1111 and a channel portion 1112. Along the thickness direction of the cold plate substrate 1111, the channel portion 1112 protrudes from at least one side relative to the cold plate substrate 1111, forming the aforementioned heat dissipation channels within the channel portion 1112. In this embodiment, the channel portion 1112 protrudes from the side facing the first cavity 10a1, meaning the heat dissipation channels are mainly arranged in the portion of the cold plate body 111 that forms the first cavity 10a1, and this portion also forms the portion that forms the second cavity 10a2. Furthermore, the heat dissipation channels can also be arranged circumferentially around the first enclosure plate 112, effectively guiding heat dissipation from all directions of the first enclosure plate 112 and reducing heat accumulation in localized areas. Since the driver board 22 typically contains high-power electronic components, such as power conversion modules and driver modules, these components generate a large amount of heat during operation. The second cavity 10a2 and the first cavity 10a1 share a heat dissipation channel, which can effectively utilize heat dissipation resources.

[0132] Please see Figure 5 and Figure 6 Furthermore, the heat dissipation structure 11 also includes a flow channel connector 120, which communicates with the heat dissipation flow channel. The flow channel connector 120 can guide the cooling medium (such as coolant or air) to enter and exit the heat dissipation flow channel more efficiently. The flow channel connector 120 is arranged circumferentially along the first enclosure plate 112, and the flow channel structure and the first enclosure plate 112 are an integral structure, making the heat dissipation structure 11 more compact, reducing external connecting parts, and lowering installation difficulty and maintenance costs.

[0133] In some embodiments, the heat dissipation structure 11 further includes a second enclosure (not shown), which is also integrally formed with the cold plate body 111, significantly enhancing the integrity and stability of the heat dissipation structure 11. This design makes the heat dissipation structure 11 more robust and better able to withstand the heat generated by the internal circuit modules and external mechanical pressure. The second enclosure is connected to the side of the cold plate body 111 facing away from the first enclosure 112, and the second cover 122 is sealed to the side of the second enclosure away from the cold plate body 111 to form a second cavity 10a2, which can better seal the second cavity 10a2, preventing external impurities such as dust and moisture from entering and improving the protection level of the electrical control box 100.

[0134] In another configuration, the second cover 122 seals the side of the cold plate body 111 facing away from the first enclosure 112 to form the second cavity 10a2. Since the second cover 122 seals the side of the cold plate body 111 facing away from the first enclosure 112 directly, there is no need to set up an additional enclosure. The process is simpler, which can improve production efficiency and reduce manufacturing costs.

[0135] Please see Figure 6 and Figure 7 In some embodiments, the inductor 24 is a common-mode inductor, and the control box 100 also includes a reactance 33. Both the common-mode inductor and the reactance 33 are disposed within the second cavity 10a2. The common-mode inductor is used to suppress common-mode noise in the circuit, ensuring the stability and reliability of signal transmission, while the reactance 33 is used to adjust the impedance characteristics of the circuit and optimize its performance. The reactance 33 is mounted on the cold plate body 111 and located outside the filter plate 23, spaced apart from it. Since the reactance 33 generates a magnetic field during operation, placing it outside the filter plate 23 prevents the magnetic field generated by the reactance 33 from interfering with the normal operation of the filter plate 23.

[0136] In this embodiment, two reactors 33 are provided. One reactor 33 is located on one side of the filter plate 23 in the left-right direction, and the other reactor 33 is located on one side of the filter plate 23 in the up-down direction. Both reactors 33 are connected to the cold plate body 111, which can increase the contact area between the reactor 33 and the cold plate body 111, thereby more effectively conducting heat to the cold plate body 111.

[0137] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0138] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A circuit module, characterized in that, include: Heat dissipation structure; The circuit board is located within the heat dissipation structure; as well as An inductor is disposed in the heat dissipation structure and electrically connected to the circuit board; The inductor includes: A potting shell is fixed to the heat dissipation structure and forms a potting cavity with the heat dissipation structure. The potting shell is provided with a potting port that communicates with the potting cavity. The inductor body is disposed within the potting cavity; and Thermally conductive adhesive is filled into the potting cavity, and at least between the inductor body and the heat dissipation structure.

2. The circuit module as described in claim 1, characterized in that, Multiple support ribs are spaced apart along the circumference of the inductor on the inner wall of the potting shell. The support ribs have overlapping portions. The inductor body overlaps the overlapping portions of the multiple support ribs so that the inductor body is suspended in the potting cavity. The thermally conductive adhesive wraps around the inductor body.

3. The circuit module as described in claim 2, characterized in that, The heat dissipation structure is located in the thickness direction of the inductor, and the potting port is located at the end of the potting shell away from the heat dissipation structure.

4. The circuit module as described in claim 1, characterized in that, The inductor body includes: Magnetic core assembly; and A coil assembly, insulated and wound on the magnetic core assembly, with pins formed at the ends of the coil assembly; The potting shell has a first mounting port, and the pin passes through the first mounting port and is electrically connected to the circuit board.

5. The circuit module as described in claim 4, characterized in that, The coil assembly includes multiple coil windings spaced apart; The inductor body further includes an insulating pad, the insulating pad comprising: A spacer body is disposed on the magnetic core assembly and located between two adjacent coil windings; and A foot, connected to the pad body and extending away from the magnetic core assembly; The glue-filled shell is provided with a second mounting port, and the pad is inserted through the second mounting port.

6. The circuit module as described in claim 5, characterized in that, The magnetic core assembly is arranged in a ring and includes a first magnetic core segment and a second magnetic core segment connected to each other. A plurality of coil windings are disposed on the first magnetic core segment. The potting cavity includes a first accommodating cavity for accommodating the first magnetic core segment and the plurality of coil windings, and a second accommodating cavity for accommodating the second magnetic core segment. The inner contour of the portion of the potting shell forming the first accommodating cavity is adapted to the outer contour of the plurality of coil windings, and the inner contour of the portion of the potting shell forming the second accommodating cavity is adapted to the outer contour of the second magnetic core segment.

7. The circuit module as described in claim 5, characterized in that, The first mounting port, the second mounting port, and the potting port are located on the same side of the potting shell. The circuit board abuts against the end of the potting shell where the potting port is located. The potting shell is located between the heat dissipation structure and the circuit board.

8. The circuit module as described in claim 7, characterized in that, The potting shell has a heat-conducting port at one end where the potting port is located. The circuit board covers the heat-conducting port. The circuit board has a connecting port that communicates with the potting port. The area of ​​the circuit board corresponding to the heat-conducting port is covered with the heat-conducting adhesive.

9. The circuit module as described in claim 1, characterized in that, The potting shell includes; Base; as well as The cover is detachably connected to the base and forms an open glue-filling groove on the base; The heat dissipation structure covers the opening of the glue-filling groove to form the glue-filling cavity.

10. The circuit module as described in claim 9, characterized in that, The base has a skirt groove on its outer periphery, and the cover has a skirt protrusion on its outer periphery. The skirt protrusion overlaps the skirt groove, and the inner wall of the cover is flush with the inner wall of the base.

11. The circuit module as described in claim 9, characterized in that, The outer wall of one of the base and the cover is provided with a plurality of buckles spaced apart along the circumference of the inductor, and the outer wall of the other is provided with a plurality of retaining rings corresponding to the plurality of buckles. The buckle extends toward the retaining ring, and the end of the buckle is provided with an anti-detachment part; the retaining ring is provided with a retaining interface, the buckle passes through the retaining interface, and the retaining ring prevents the anti-detachment part from disengaging from the retaining interface in the opposite direction of passing through.

12. The circuit module as described in claim 9, characterized in that, The outer wall of the cover is provided with a connecting lug, and the connecting lug is provided with a first connecting hole; the heat dissipation structure is provided with a connecting post, and the circuit board is provided with a second connecting hole, and the connecting post is connected to the first connecting hole and the second connecting hole.

13. An electrical control box, characterized in that, include: Box lid; as well as The circuit module as described in any one of claims 1 to 12; The heat dissipation structure and the cover are connected and cooperate to form a receiving cavity, and the circuit board and the inductor are disposed in the receiving cavity.

14. The electrical control box as described in claim 13, characterized in that, The box cover includes a first box cover and a second box cover, and the receiving cavity includes a first cavity formed by the first box cover and the heat dissipation structure, and a second cavity formed by the second box cover and the heat dissipation structure; the first cavity and the second cavity are respectively located on both sides of the heat dissipation structure, and the heat dissipation structure is provided with a first opening communicating with the first cavity and the second cavity; The circuit board includes a driver board and a filter board. The driver board is disposed in the first cavity, and the inductor and the filter board are disposed in the second cavity. The inductor is electrically connected to the filter board. The electrical control box also includes a power connection structure, which is disposed through the first opening, and the two ends of the power connection structure are electrically connected to the drive board and the filter board, respectively.

15. The electrical control box as described in claim 14, characterized in that, The power connection structure includes: An insulating base is installed at the first opening; and A power connection post is disposed on the insulating base and passes through the first opening, with its two ends connected to the drive board and the filter board respectively.

16. The electrical control box as described in claim 14, characterized in that, The heat dissipation structure includes an integrally formed cold plate body and a first enclosure plate. The cold plate body is plate-shaped and has heat dissipation channels. The first lid is sealed to the side of the first enclosure away from the cold plate body to form the first cavity, and the second lid is sealed to the side of the cold plate body opposite to the first enclosure to form the second cavity.

17. A heating, ventilation, and air conditioning (HVAC) device, characterized in that, It includes a housing and an electrical control box as described in any one of claims 13 to 16, wherein the electrical control box is disposed within the housing.

18. The HVAC equipment as described in claim 17, characterized in that, The housing is provided with an inspection port; the electrical control box is located at the inspection port, wherein the first cavity of the receiving cavity is arranged facing the inspection port.

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