High-adhesion low-thermal-resistance heat-conducting gel

Abstract

The utility model discloses a heat-conducting gel with high adhesive force and low thermal resistance. The heat-conducting gel comprises a heat conductor, a lug boss, a substrate, a heat-conducting fin, an inner cavity and a heat-conducting base body, according to the utility model, the heat conductor is pressed between the heat radiator and the chip, and when the heat conductor is pressed, the convex parts can be pressed to deform so as to generate elastic force, under the action of the elastic force, the convex parts can be better attached to the surface of the chip and the surface of the heat radiator, and the elastic convex parts can be better attached, so that the heat conductor has high adhesive force; the substrate can improve the compression capacity of the heat conductor, the heat conduction base body is reserved between the heat conduction pieces, the heat conduction pieces are fixed in the substrate in a penetrating mode, the heat conduction base body has high heat conduction performance, then heat conduction channels in the vertical direction are formed through the heat conduction pieces, heat resistance is reduced, and the beneficial effects that the heat conductor has low heat resistance and high heat conduction performance are achieved.

Description

Technical Field

[0001] This utility model relates to the field of thermally conductive gel technology, specifically a thermally conductive gel with high adhesion and low thermal resistance. Background Technology

[0002] Thermal conductive gel sheets are a type of high-performance thermal interface material (TIM) primarily used for heat transfer between heat-generating components (such as CPUs, GPUs, and power chips) and heat sinks in electronic devices.

[0003] Existing patent: CN212603858U, discloses a thermally conductive gel sheet, including a first thermally conductive gel layer, a second thermally conductive gel layer and a boron nitride layer, wherein the boron nitride layer is sandwiched between the first thermally conductive gel layer and the second thermally conductive gel layer.

[0004] The aforementioned patents or existing thermal conductive gel sheets have the following problems:

[0005] Existing thermal conductive gel sheets have a simple structure and relatively poor adhesion. They only adhere well under tight pressure, but this tight pressure can easily cause the thermal conductive gel sheets to break. Utility Model Content

[0006] The purpose of this invention is to provide a thermally conductive gel with high adhesion and low thermal resistance to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a high-adhesion, low-thermal-resistance thermally conductive gel, comprising a thermally conductive body, wherein a protrusion is provided on the surface of the thermally conductive body, a substrate is provided in the thermally conductive body, and a thermally conductive sheet is provided on the substrate.

[0008] Preferably, there are two protrusions, located at the upper and lower ends of the heat conductor, respectively, and the surface of the protrusions is planar.

[0009] Preferably, the heat-conducting sheet is sheet-shaped and extends through the substrate.

[0010] Preferably, the heat-conducting sheets are arranged in an array with staggered spacing on the substrate.

[0011] Preferably, the heat conductor has an inner cavity filled with a heat-conducting matrix.

[0012] Preferably, the thermally conductive substrate is filled in the thermally conductive sheet.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] The heat conductor is pressed between the heat sink and the chip. When pressed, the protrusion deforms, generating elasticity. Under the action of elasticity, the protrusion adheres better to the chip surface and the heat sink surface. Moreover, the elastic protrusion has better adhesion, giving the heat conductor high adhesion. The substrate can enhance the heat conductor's pressure resistance. The heat-conducting substrate remains between the heat-conducting sheets, which are fixed in the substrate in a through-type manner. The heat-conducting substrate has high thermal conductivity and then forms a vertical heat conduction channel through the heat-conducting sheets, reducing thermal resistance and achieving the beneficial effect of low thermal resistance and high thermal conductivity in the heat conductor. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a frontal cross-sectional view of the present invention.

[0017] Figure 3 This is a schematic diagram of the substrate structure of this utility model.

[0018] In the diagram: Heat conductor-1, protrusion-2, substrate-3, heat-conducting sheet-4, inner cavity-5, heat-conducting base-6. Detailed Implementation

[0019] To further explain the technical solution of this utility model, a detailed description is provided below through specific embodiments.

[0020] Please see Figure 1 , Figure 2 and Figure 3 This utility model provides a high-adhesion, low-thermal-resistance thermally conductive gel, including a thermally conductive body 1. The lower end face and the lower end face of the thermally conductive body 1 are integrally formed with a protrusion 2, and the top of the protrusion 2 is flat. A substrate 3 is fixed in the thermally conductive body 1. A thermally conductive sheet 4 passes through the substrate 3. The thermally conductive sheet 4 passes through the substrate 3 and protrudes from the upper and lower end surfaces of the substrate 3. The thermally conductive sheets 4 are arranged in an array and staggered on the substrate 3.

[0021] The heat conductor 1 has an inner cavity 5, which is filled with a heat-conducting substrate 6, which is filled in the heat-conducting sheet 4.

[0022] Specifically, the heat conductor 1 is pressed between the heat sink and the chip. When pressed, the protrusion 2 deforms under pressure, generating elasticity. Under the action of elasticity, the protrusion 2 will better fit the chip surface and the heat sink surface. Moreover, the elastic protrusion 2 will adhere better, giving the heat conductor 1 high adhesion. The substrate 3 can improve the pressure resistance of the heat conductor 1. The thermal conductive matrix 6 is made of a high thermal conductivity polymer matrix, such as siloxane-modified epoxy resin or with added thermal conductivity enhancers, which is not limited. The thermal conductive matrix 6 is left between the thermal conductive sheets 4, and the thermal conductive sheets 4 are fixed in the substrate 3 in a through-type manner. The thermal conductive matrix 6 has high thermal conductivity and will form a vertical thermal conduction channel through the thermal conductive sheets 4 to reduce thermal resistance, so as to achieve the beneficial effect of the heat conductor 1 having low thermal resistance and high thermal conductivity.

[0023] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-adhesion, low-thermal-resistance thermally conductive gel, characterized in that: It includes a heat conductor (1), the surface of which is provided with a protrusion (2), a substrate (3) is provided in the heat conductor (1), and a heat-conducting sheet (4) is provided on the substrate (3).

2. The high-adhesion, low-thermal-resistance thermally conductive gel according to claim 1, characterized in that: The protrusion (2) is provided in two parts, located at the upper and lower ends of the heat conductor (1) respectively, and the surface of the protrusion (2) is flat.

3. The high-adhesion, low-thermal-resistance thermally conductive gel according to claim 1, characterized in that: The heat-conducting sheet (4) is sheet-shaped and extends through the substrate (3).

4. The high-adhesion, low-thermal-resistance thermally conductive gel according to claim 3, characterized in that: The heat-conducting sheets (4) are arranged in an array and staggered on the substrate (3).

5. The high-adhesion, low-thermal-resistance thermally conductive gel according to claim 1, characterized in that: The heat conductor (1) has an inner cavity (5) and the inner cavity (5) is filled with a heat-conducting substrate (6).

6. The high-adhesion, low-thermal-resistance thermally conductive gel according to claim 5, characterized in that: The thermally conductive substrate (6) is filled in the thermally conductive sheet (4).

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