Combined stamping radiating fin

Abstract

The utility model provides a combined stamping radiating fin, a PCB (Printed Circuit Board) comprises a circuit board body and a plurality of chips arranged above the body, the radiating fin comprises a radiating panel and a plurality of supporting columns which are arranged on the radiating panel and abut against the circuit board body, the radiating panel is provided with a plurality of stamping parts which are in contact with the chips, and the circuit board body is arranged on the radiating panel. The stamping part extends towards one side close to the circuit board body, any extension part is provided with a heat dissipation plate, the heat dissipation plate comprises a positioning plate in contact with the upper end surface of the stamping part and a plurality of extension plates extending towards one side opposite to the stamping part, and the extension plates are arranged along the length direction of the positioning plate. According to the combined stamping cooling fin, the cooling effect can be accurately improved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for PCB boards, and specifically to a combined stamped heat sink. Background Technology

[0002] The function of a PCB board is to provide mechanical support and electrical connection for electronic components, enabling stable transmission of circuit signals and functional integration. During use, the PCB board needs to utilize heat sinks to dissipate heat generated by electronic components during operation, preventing overheating that could lead to performance degradation or damage, and ensuring stable and reliable circuit operation. In the prior art, a utility model patent with publication number CN218830767U discloses a PCB board heat dissipation structure, which includes a circuit board and a cover disposed on the circuit board. The cover is used to assist the heat sink in heat dissipation. However, in actual use, the power of the components on the PCB board varies. For some high-power components, the heat generated will be greater. Traditional stamped heat sinks are not effective in heat dissipation, making the PCB board prone to damage due to overheating. Utility Model Content

[0003] Therefore, the technical problem to be solved by this utility model is to overcome the defect that the heat sink in the prior art cannot meet the needs of high-power components, thus causing damage to the PCB board, and to provide a combined stamped heat sink with good heat dissipation effect.

[0004] Therefore, this utility model provides a combined stamped heat sink. The PCB board includes a circuit board body and a plurality of chips disposed on the upper part of the body. The heat sink includes a heat dissipation panel and a plurality of support columns disposed on the heat dissipation panel and abutting against the circuit board body. The heat dissipation panel is provided with a plurality of stamped parts that contact the chips. The stamped parts extend toward the side closer to the circuit board body. A heat dissipation plate is disposed on any extension part. The heat dissipation plate includes a positioning plate that contacts the upper surface of the stamped part and a plurality of extension plates that extend toward the side away from the stamped part. The extension plates are arranged along the length direction of the positioning plate.

[0005] Furthermore, a positioning structure is provided between the circuit board body and the heat dissipation panel.

[0006] Furthermore, the positioning structure includes a positioning post disposed on one side of the circuit board body or the heat dissipation panel, and a positioning groove disposed on the other side and adapted to the positioning post.

[0007] Furthermore: an extension block is provided at the positioning groove, and an "L"-shaped structure is formed between the extension block and the positioning groove. The positioning post includes an extension post that can be adapted to the positioning groove, and an insert plate that can be inserted into the extension block is provided at the extension post.

[0008] Furthermore: the support column is disposed on the upper and / or lower end face of the heat dissipation panel, and a PCB board can be mounted on both the upper and lower end face of the heat dissipation panel.

[0009] The technical solution of this utility model has the following advantages:

[0010] 1. This utility model provides a combined stamped heat sink. A support column is provided on the heat sink panel, abutting against the heat sink panel, leaving a heat dissipation space between the circuit board body and the heat sink panel to ensure heat dissipation. A stamping part is provided on the heat sink panel, and thermally conductive adhesive is applied between the stamping part and the chip for heat conduction. However, different components on the circuit board body have different power ratings, resulting in varying amounts of heat generated. For some high-power components, the heat generated is also greater. The heat dissipation speed of the heat sink panel is limited. When the generated heat is not dissipated, the circuit board body is prone to damage due to overheating. Compared to existing technologies, this model adds a heat sink to the stamping part. The heat sink can be positioned above the circuit board body where the power is highest and the heat generated is greatest, thus precisely increasing the heat dissipation effect. Furthermore, after the heat from the circuit board body is conducted to the heat sink panel, it can continue to be conducted to the extension plate for further heat dissipation. Therefore, the heat dissipation effect can be effectively improved while controlling costs. Attached Figure Description

[0011] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0012] Figure 1 This is a diagram showing the connection structure between the circuit board body and the heat dissipation panel.

[0013] Figure 2 This is another connection structure diagram between the circuit board body and the heat dissipation panel;

[0014] Figure 3 This is a front view of the circuit board body and the heat sink panel.

[0015] Figure 4 This is a cross-sectional view of the structure between the circuit board body and the heat dissipation panel.

[0016] Figure 5 for Figure 4 Enlarged view of part A in the middle.

[0017] Explanation of reference numerals in the attached figures:

[0018] 1. Circuit board body; 2. Heat dissipation panel; 3. Positioning post; 4. Stamping part; 5. Heat dissipation plate; 51. Positioning plate; 52. Extension plate; 6. Positioning structure; 61. Positioning post; 62. Positioning groove; 63. Extension post; 64. Insert plate; 7. Extension block. Detailed Implementation

[0019] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0020] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0023] Example

[0024] This embodiment provides a combined stamped heat sink. The PCB board includes a circuit board body 1 and a plurality of chips disposed on the upper part of the body. The heat sink includes a heat dissipation panel 2 and a plurality of support columns 3 disposed on the heat dissipation panel 2 and abutting against the circuit board body 1. The heat dissipation panel 2 is provided with a plurality of stamped parts 4 that contact the chips. The stamped parts 4 extend toward the side closer to the circuit board body 1. A heat dissipation plate 5 is disposed on any extension part. The heat dissipation plate 5 includes a positioning plate 51 that contacts the upper surface of the stamped part 4 and a plurality of extension plates 52 that extend toward the side away from the stamped part 4. The extension plates 52 are arranged along the length direction of the positioning plate 51.

[0025] The specific improvements mentioned above are as follows: Figures 1-3 As shown, a support column is provided on the heat dissipation panel 2, which abuts against the heat dissipation panel 2, leaving a heat dissipation space between the circuit board body 1 and the heat dissipation panel 2 to ensure heat dissipation effect. A stamping part 4 is provided on the heat dissipation panel 2, and thermal conductive adhesive is applied between the stamping part 4 and the chip for heat conduction. However, different components on the circuit board body 1 have different power, so the heat they generate is also different. For some high-power components, the heat generated is also more. The heat dissipation speed of the heat dissipation panel 2 is limited. When the generated heat is not dissipated, the circuit board body 1 is prone to damage due to overheating. Compared with the prior art, a heat dissipation plate 5 is provided on the stamping part 4. The heat dissipation plate 5 can be set at the top position of the circuit board body 1 where the power is the highest and the heat generated is the most. In this way, the heat dissipation effect can be precisely increased. After the heat on the circuit board body 1 is conducted to the heat dissipation panel 2, it can continue to be conducted to the extension plate 52 for heat dissipation. In this way, the heat dissipation effect can be effectively improved while controlling costs.

[0026] Based on the above embodiments: a positioning structure 6 is provided between the circuit board body 1 and the heat dissipation panel 2.

[0027] Based on the above embodiments: the positioning structure 6 includes a positioning post 61 disposed on one side of the circuit board body 1 or the heat dissipation panel 2, and a positioning groove 62 disposed on the other side and adapted to the positioning post 61.

[0028] Based on the above embodiments: an extension block 7 is provided at the positioning groove 62, and the extension block 7 and the positioning groove 62 form an "L" shaped structure. The positioning post 61 includes an extension post 63 that can be adapted to the positioning groove 62, and an insert plate 64 that can be inserted into the extension block 7 is provided at the extension post 63.

[0029] Based on the above embodiments: the support column 3 is disposed on the upper end surface and / or lower end surface of the heat dissipation panel 2, and a PCB board can be installed on both the upper end surface and the lower end surface of the heat dissipation panel 2.

[0030] The specific improvements mentioned above are as follows: Figure 4 and Figure 5 As shown, the positioning structure 6 includes a positioning post 613 on the circuit board body 1 and a positioning groove 62 on the heat dissipation panel 2. During installation, the extension post 63 is first passed through the positioning groove 62, and then the extension post 63 is pushed towards one side of the extension block 7 so that the insert plate 64 is inserted into the upper end of the extension block 7. The extension post 63 can be locked in the groove between the extension block 7 and the positioning groove 62 to ensure that the circuit board body 1 and the heat dissipation panel 2 can be fixed to each other. Support posts are provided on the upper and lower ends of the heat dissipation panel 2. The upper and lower ends of the heat dissipation panel 2 can be connected to the circuit board body 1. During use, the two circuit board bodies 1 share one heat dissipation panel 2, which can effectively save installation space and reduce production costs.

[0031] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A combined stamped heat sink, the PCB board comprising a circuit board body (1) and a plurality of chips disposed on the body, characterized in that: The heat sink includes a heat sink panel (2) and a plurality of support columns (3) disposed on the heat sink panel (2) and abutting against the circuit board body (1). The heat sink panel (2) is provided with a plurality of stamped portions (4) that contact the chip. The stamped portions (4) extend toward the side closer to the circuit board body (1). A heat sink plate (5) is provided on any extension portion. The heat sink plate (5) includes a positioning plate (51) that contacts the upper surface of the stamped portion (4) and a plurality of extension plates (52) that extend toward the side away from the stamped portion (4). The extension plates (52) are arranged along the length direction of the positioning plate (51).

2. The combined stamped heat sink according to claim 1, characterized in that: A positioning structure (6) is provided between the circuit board body (1) and the heat dissipation panel (2).

3. The combined stamped heat sink according to claim 2, characterized in that: The positioning structure (6) includes a positioning post (61) disposed on one side of the circuit board body (1) or the heat dissipation panel (2) and a positioning groove (62) disposed on the other side and adapted to the positioning post (61).

4. A combined stamped heat sink according to claim 3, characterized in that: An extension block (7) is provided at the positioning groove (62), and an "L"-shaped structure is formed between the extension block (7) and the positioning groove (62). The positioning post (61) includes an extension post (63) that can be adapted to the positioning groove (62), and an insert plate (64) that can be inserted into the extension block (7) is provided at the extension post (63).

5. A combined stamped heat sink according to any one of claims 1-4, characterized in that: The support column (3) is located on the upper and / or lower end face of the heat dissipation panel (2), and a PCB board can be installed on both the upper and lower end face of the heat dissipation panel (2).

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