Integrated chip and intelligent wearable device

Abstract

The utility model discloses an integrated chip and an intelligent wearable device, and relates to the technical field of integration, the integrated chip comprises a substrate, a light-emitting chip and a temperature sensor, the substrate is provided with a device side, and the light-emitting chip is arranged on the device side of the substrate; the temperature sensor is arranged on the device side of the substrate; wherein a heat conduction piece is arranged between the light-emitting chip and the temperature sensor. The utility model aims to meet the miniaturization requirement, realize the accurate measurement of the working temperature of the light-emitting chip, improve the output quality of light, and further improve the performance of the intelligent wearable equipment and the user experience feeling.

Description

Technical Field

[0001] This utility model relates to the field of integrated technology, and in particular to an integrated chip and a smart wearable device. Background Technology

[0002] Given the growing demand for miniaturization in smart wearable devices, optimizing the layout of internal components to achieve a more compact design has become a significant technical challenge. This is particularly true in augmented reality (AR) devices, where the increasing demands for display quality have led to the widespread use of LEDs. As the primary light source, the performance of LEDs is significantly affected by temperature. For example, increased temperature leads to a decrease in LED brightness, and different LEDs exhibit varying degrees of sensitivity to temperature changes. This not only affects the quality of light output but can also cause variations in color coordinates and color temperature. Therefore, accurately measuring and compensating for the operating temperature of LEDs is crucial for improving display quality and user experience. Utility Model Content

[0003] The main purpose of this invention is to propose an integrated chip and a smart wearable device that aims to meet the requirements of miniaturization while achieving accurate measurement of the operating temperature of the light-emitting chip, improving the output quality of light, and thus enhancing the performance of the smart wearable device and the user experience.

[0004] To achieve the above objectives, this utility model proposes an integrated chip, the integrated chip comprising:

[0005] A substrate having a device side;

[0006] A light-emitting chip, wherein the light-emitting chip is disposed on the device side of the substrate;

[0007] A temperature sensor, wherein the temperature sensor is disposed on the device side of the substrate;

[0008] A heat-conducting component is provided between the light-emitting chip and the temperature sensor.

[0009] In one embodiment, the heat-conducting element is disposed on the substrate, and the light-emitting chip and the temperature sensor are disposed on the heat-conducting element at intervals.

[0010] In one embodiment, the thermally conductive element includes a thermally conductive pad.

[0011] In one embodiment, the substrate has a bottom side facing away from the device side, and a heat dissipation pad is provided on the bottom side;

[0012] The heat-conducting component and the heat-dissipating pad are connected through vias provided on the substrate.

[0013] In one embodiment, the integrated chip further includes:

[0014] A communication connection terminal is provided for connecting to an external circuit, and the communication connection terminal is electrically connected to the communication terminal of the temperature sensor.

[0015] A power connection terminal is provided for connecting to an external power supply circuit and is electrically connected to the power supply terminal of the temperature sensor.

[0016] In one embodiment, the communication connection terminal and the power connection terminal include gold-plated pads; and / or,

[0017] The communication connection terminal and the communication terminal of the temperature sensor are connected by a gold wire;

[0018] The power supply terminal and the power supply terminal of the temperature sensor are connected by a gold wire.

[0019] In one embodiment, the communication connection terminal includes an I2C signal connection terminal for connecting to an I2C signal line.

[0020] In one embodiment, the communication connection terminal includes two communication connection pads, the power connection terminal includes a positive power connection pad and a negative power connection pad, and the integrated chip further includes an anode connection pad and a cathode connection pad. The anode connection pad is electrically connected to the positive terminal of the light-emitting chip, and the cathode connection pad is electrically connected to the negative terminal of the light-emitting chip.

[0021] When a heat dissipation pad is provided on the bottom side of the substrate, the communication connection pad, the positive power connection pad, the negative power connection pad, the anode connection pad, and the cathode connection pad are arranged around the periphery of the heat dissipation pad.

[0022] In one embodiment, a cover adhesive is provided on the substrate at the position corresponding to the temperature sensor, and the height of the cover adhesive is less than or equal to the height of the light-emitting chip.

[0023] This utility model also proposes a smart wearable device, which includes the integrated chip described in any of the above claims.

[0024] In practical applications, by placing a heat-conducting component between the light-emitting chip and the temperature sensor, the heat generated by the light-emitting chip can be transferred to the temperature sensor more quickly and directly, thereby improving the accuracy of temperature measurement and ensuring the effectiveness of temperature compensation measures. Furthermore, the presence of the heat-conducting component not only helps the temperature sensor obtain accurate temperature data but also aids in the heat dissipation process of the light-emitting chip, reducing the occurrence of localized overheating and extending the lifespan of smart wearable devices. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of an embodiment of the integrated chip of this utility model;

[0027] Figure 2 This is a schematic diagram of the structure of an embodiment of the related technology;

[0028] Figure 3 This is a schematic diagram of another embodiment of the related technology;

[0029] Figure 4 This is a schematic diagram of the structure of an embodiment of the integrated chip of this utility model;

[0030] Figure 5 This is a structural schematic diagram of yet another embodiment of the related technology;

[0031] Figure 6 This is a cross-sectional schematic diagram of an embodiment of the integrated chip of this utility model;

[0032] Figure 7 This is a schematic diagram of the structure of another embodiment of the integrated chip of this utility model;

[0033] Figure 8 This is a schematic diagram of another embodiment of the integrated chip of this utility model.

[0034] Explanation of icon numbers:

[0035] 10. Substrate; 20. Light-emitting chip; 30. Temperature sensor; 40. Thermal conductive component; 50. Heat dissipation pad; 60. Via; 70. Communication connector; 71. Communication terminal; 80. Power connector; 81. Power terminal; 90. Gold wire; 100. Cover adhesive; 200. Light guide; 300. Bonding area.

[0036] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0038] Given the growing demand for miniaturization in smart wearable devices, optimizing the layout of internal components to achieve a more compact design has become a significant technical challenge. This is particularly true in augmented reality (AR) devices, where the increasing demands for display quality have led to the widespread use of LEDs. As the primary light source, the performance of LEDs is significantly affected by temperature. For example, increased temperature leads to a decrease in LED brightness, and different LEDs exhibit varying degrees of sensitivity to temperature changes. This not only affects the quality of light output but can also cause variations in color coordinates and color temperature. Therefore, accurately measuring and compensating for the operating temperature of LEDs is crucial for improving display quality and user experience.

[0039] refer to Figure 2 In traditional LED module designs, the LED and temperature sensor 30 are typically arranged separately. A is the connector, B is the temperature sensor chip 30, and C is the LED chip. A, B, and C are distributed on the same circuit board, usually implemented using a Flexible Printed Circuit Board Assembly (FPCBA) to accommodate the limited space of smart wearable devices. This independent arrangement of the LED and temperature sensor 30 occupies a significant amount of FPCBA board space, hindering the miniaturization design of smart wearable devices. Furthermore, the distance between the heat source (LED) and the temperature sensor 30 leads to inaccurate junction temperature measurements. The junction temperature is the operating temperature of the PED chip during operation. (Reference) Figure 3 and Figure 5 , Figure 3 This is a schematic diagram of the TOP surface structure in related technologies. Figure 5 This is a schematic diagram of the structure after removing the 100mm capping area in the relevant technology. Currently, most LEDs on FPCBA use a single-unit design. As can be seen on its TOP (Top Layer) surface, there is a capping area on the upper layer, and the LED die is the light-emitting area. (Reference) Figure 5 After removing the capping adhesive in area 100, you can see that there is an LED die emitting light on the substrate 10, and the bottom of the LED die is a thermal pad.

[0040] This utility model proposes an integrated chip, with reference to... Figure 1The integrated chip includes:

[0041] Substrate 10, the substrate 10 having a device side;

[0042] A light-emitting chip 20 is disposed on the device side of the substrate 10;

[0043] Temperature sensor 30, the temperature sensor 30 is disposed on the device side of the substrate 10;

[0044] A heat-conducting component 40 is provided between the light-emitting chip 20 and the temperature sensor 30.

[0045] In this embodiment, the substrate 10 is the basic structure of the circuit board, providing physical support and electrical connections. The substrate 10 can be implemented using PCB (Printed Circuit Board), FPC (Flexible Printed Circuit), Rigid-Flex PCB, etc. The light-emitting chip 20 can be implemented using LED chips, OLED (Organic Light Emitting Diode), etc. The temperature sensor 30 can be implemented using thermocouples, thermistors, infrared temperature sensors, etc. The heat-conducting component 40 can be implemented using ceramic thermal pads composed of ceramic materials such as metal sheets, metal foils, graphene sheets, alumina, and aluminum nitride.

[0046] Understandably, given the limitations of process capabilities and layout, the temperature sensor 30 is placed as close as possible to the individual LED die (light-emitting chip 20) to minimize the distance between them and reduce heat loss in the heat transfer path. That is, when the temperature sensor 30 and the light-emitting chip 20 are located on the same plane on the substrate 10 and are close together, the heat conduction path is shorter, reducing the temperature difference caused by thermal resistance and thus improving the accuracy of temperature measurement.

[0047] In practical applications, by placing a heat-conducting component 40 between the light-emitting chip 20 and the temperature sensor 30, the heat generated by the light-emitting chip 20 can be conducted to the temperature sensor 30 more quickly and directly, thereby improving the accuracy of temperature measurement and ensuring the effectiveness of temperature compensation measures. Furthermore, the presence of the heat-conducting component 40 not only helps the temperature sensor 30 obtain accurate temperature data but also aids in the heat dissipation process of the light-emitting chip 20, reducing the occurrence of localized overheating and extending the lifespan of the smart wearable device.

[0048] Optionally, the heat-conducting element 40 is disposed on the substrate 10, and the light-emitting chip 20 and the temperature sensor 30 are disposed on the heat-conducting element 40 at intervals.

[0049] In this embodiment, both the light-emitting chip 20 (such as an LED die) and the temperature sensor 30 can be connected to the heat-conducting component 40 by soldering or other fixing methods. Thermally conductive material can be applied between the light-emitting chip 20 and the heat-conducting component 40, and between the temperature sensor 30 and the heat-conducting component 40, to reduce thermal resistance and improve heat conduction efficiency. When the light-emitting chip 20 operates, it generates heat, which is uniformly conducted to the temperature sensor 30 through the heat-conducting component 40, enabling the temperature sensor 30 to more accurately measure the actual operating temperature of the light-emitting chip 20. Furthermore, the heat-conducting component 40 not only transfers heat from the light-emitting chip 20 to the temperature sensor 30, but also disperses heat over a larger area of ​​the substrate 10, preventing localized overheating. In other words, by dispersing heat, the operating temperature of the light-emitting chip 20 can be reduced, its lifespan extended, and the overall reliability of the smart wearable device improved.

[0050] Optionally, the heat-conducting component 40 includes a heat-conducting pad. In conjunction with the above embodiments, the light-emitting chip 20 and the temperature sensor 30 are spaced apart on the heat-conducting pad.

[0051] In this embodiment, the thermally conductive pads are typically made of highly thermally conductive materials (such as copper or aluminum), which not only have good thermal conductivity but also high mechanical strength. Therefore, using thermally conductive pads can provide a stable foundation for the light-emitting chip 20 and the temperature sensor 30, reducing the risk of component loosening or damage due to vibration or impact.

[0052] refer to Figure 6 , Figure 6 for Figure 4In the AA cross-sectional view, in this embodiment, wafer thinning techniques (such as grinding or chemical mechanical polishing, CMP) can be used to thin the substrate material of the temperature sensor 30. After thinning, the back side of the substrate is polished to ensure a smooth and flat surface, reducing thermal resistance and providing a good foundation for subsequent metal layer deposition. Thus, thinning the substrate material of the temperature sensor 30 significantly reduces thermal resistance, allowing heat to be transferred more quickly and directly to the back side of the temperature sensor 30 near the substrate 10, improving its response speed to temperature changes. Then, a layer of highly thermally conductive metal (such as gold (Au) or silver (Ag) needs to be deposited on the back side of the temperature sensor 30 to further enhance its thermal conductivity. The deposited metal layer, as a highly efficient heat conduction medium, significantly improves the thermal conductivity of the temperature sensor 30, providing a stable heat conduction path and ensuring that the temperature sensor 30 can accurately measure the temperature changes of the LED chip on the thermally conductive pad connected to it. Furthermore, metal bonding or soldering techniques can be used to connect and fix the temperature sensor 30 to the thermally conductive pad on the substrate 10. This ensures good contact between the Sensor Die (temperature sensor 30) and the thermal pad, reduces contact thermal resistance, and provides mechanical stability, preventing the Sensor Die from loosening or falling off due to vibration or impact.

[0053] In one embodiment, reference Figure 6 The substrate 10 has a bottom side facing away from the device, and a heat dissipation pad 50 is provided on the bottom side;

[0054] The heat-conducting component 40 and the heat-dissipating pad 50 are connected through a via 60 provided on the substrate 10.

[0055] In this embodiment, the heat dissipation pad 50 is disposed on the bottom side of the substrate 10, covering a large area to increase heat dissipation efficiency. The heat dissipation pad 50 can use a high thermal conductivity material, such as copper, aluminum, or graphene, to enhance heat dissipation performance. The heat dissipation pad 50 can be directly exposed to facilitate connection with external heat dissipation structures (such as external heat sinks or cooling systems) to improve heat dissipation effect, or a coating can be provided on the heat dissipation pad 50 for protection. In addition, by providing metal vias 60 on the substrate 10 as heat conduction channels, heat is quickly conducted from the thermally conductive pad to the heat dissipation pad 50 on the bottom side, forming a complete heat conduction path and improving heat conduction. For example, metallized vias can be used to connect the thermally conductive pad and the heat dissipation pad 50. The vias 60 can be filled with electroplated copper or other high thermal conductivity metals to ensure good thermal conductivity and electrical isolation.

[0056] It should be noted that the number of vias 60 can be set according to actual needs. More vias 60 can provide more heat conduction paths, thereby reducing thermal resistance and increasing heat conduction efficiency. Reducing the number of vias 60 can save manufacturing costs and process flow. In this embodiment, multiple metallized vias can be uniformly distributed between the thermally conductive pad and the heat dissipation pad 50, such as... Figure 6 As shown, it not only improves heat transfer efficiency and achieves a more uniform temperature distribution, but also enhances mechanical strength and simplifies the manufacturing process.

[0057] In another embodiment, reference Figure 1 The integrated chip also includes:

[0058] A communication connection terminal 70 is used to access an external circuit, and the communication connection terminal 70 is electrically connected to the communication terminal 71 of the temperature sensor 30.

[0059] The power connection terminal 80 is used to connect to an external power supply circuit, and the power connection terminal 80 is electrically connected to the power supply terminal 81 of the temperature sensor 30.

[0060] In this embodiment, the communication connection terminal 70 and the communication terminal 71 of the temperature sensor 30 are electrically connected via a wire for transmitting temperature data. The communication connection terminal 70 is used to access an external circuit, which may include, but is not limited to, a control circuit. The control circuit receives the temperature data output by the temperature sensor 30 via the communication terminal 71 through the communication connection terminal 70 and performs corresponding operations based on this temperature data, such as displaying the temperature, controlling the operation of the heating or cooling system, or uploading the temperature data to the cloud. The power connection terminal 80 and the power terminal 81 of the temperature sensor 30 are electrically connected via a wire to provide a stable power supply to the temperature sensor 30, ensuring the reliability of the temperature sensor 30 in detecting the operating temperature of the LED chip.

[0061] Optionally, the communication connection terminal 70 and the power connection terminal 80 include gold-plated pads; and / or,

[0062] The communication connection terminal 70 and the communication terminal 71 of the temperature sensor 30 are connected by a gold wire 90.

[0063] The power connection terminal 80 and the power terminal 81 of the temperature sensor 30 are connected by a gold wire 90.

[0064] In this embodiment, reference Figure 1 , Figure 1This is a schematic diagram of the integrated chip structure after removing the cover adhesive area 100. The temperature sensor 30 has four gold wire pads 90, which can be soldered to the gold-plated pads of the substrate 10 using a wire bonding (WB) process, providing a reliable electrical connection.

[0065] The communication connection terminal 70 and power connection terminal 80 can be configured to correspond to the communication terminal 71 and power terminal 81 of the temperature sensor 30 to reduce crossover and prevent signal interference. Due to the low resistivity of gold, efficient transmission of electrical signals is ensured. Therefore, using gold-plated pads and gold wire 90 can reduce communication and power signal losses, thereby improving communication and power supply efficiency. Simultaneously, gold has strong corrosion resistance. This allows the gold-plated pads and gold wire 90 to operate stably in various environments, unaffected by environmental factors such as humidity and contaminants, thus ensuring long-term stable electrical connection performance. Furthermore, the gold wire 90 has good ductility and strength, allowing for a certain degree of bending and stretching without compromising its performance, adapting to various complex wiring requirements and suitable for miniaturized smart wearable devices. It also provides good mechanical support, preventing open circuits caused by vibration or other physical interference, further improving the reliability and accuracy of temperature detection.

[0066] In one embodiment, the communication connection terminal 70 includes an I2C signal connection terminal for connecting to an I2C signal line.

[0067] It should be noted that when the temperature sensor 30 uses the I2C protocol, only two I2C signal lines (such as the SDA data line and the SCL clock line) are needed to complete data transmission, simplifying the hardware wiring and reducing the number of interface pins. When using a single-bus protocol, only one signal line is needed for communication. Furthermore, the I2C protocol supports multiple master devices and multiple slave devices operating on the same bus. Therefore, multiple sensors or other types of devices can be connected through the same I2C interface, reducing the number of required physical interfaces (communication connection terminal 70) and saving design costs. In addition, the I2C signal connection terminal typically operates at a lower voltage, and its data transmission rate is slower compared to other high-speed interfaces. This means that compared to faster communication protocols, I2C communication generates less heat, helping to reduce additional heat generated during data transmission. Since I2C only requires two wires for communication, it can reduce the complexity of the circuit board, potentially reducing the resistive heating effect caused by excessive lines or complex wiring.

[0068] In one embodiment, the communication connection terminal 70 includes two communication connection pads, the power connection terminal 80 includes a positive power connection pad and a negative power connection pad, and the integrated chip further includes an anode connection pad and a cathode connection pad. The anode connection pad is electrically connected to the positive terminal of the light-emitting chip 20, and the cathode connection pad is electrically connected to the negative terminal of the light-emitting chip 20.

[0069] When a heat dissipation pad 50 is provided on the bottom side of the substrate 10, the communication connection pad, the positive power connection pad, the negative power connection pad, the anode connection pad, and the cathode connection pad are arranged around the periphery of the heat dissipation pad 50.

[0070] In this embodiment, the specific positions of the communication connection pad and the power connection pad, as well as the anode connection pad and the cathode connection pad, can be set according to actual needs. Optionally, refer to... Figure 7 Multiple pads (communication connection pads, power connection pads, anode connection pads, and cathode connection pads) can be arranged around the sides or perimeter of the heat dissipation pad 50 on the same horizontal plane of the substrate 10. Points a, b, c, d, e, and f are designated as areas for multiple pads. In this embodiment, the six pads are evenly distributed on both sides of the same horizontal plane of the heat dissipation pad 50, exhibiting a certain degree of symmetry and balanced weight distribution, which helps maintain the mechanical stability of the entire module.

[0071] Optionally, multiple pads can be partially located on the side of the substrate 10 and partially located on the horizontal plane of the substrate 10. For example, considering the sensitivity of signal lines, the I2C communication connection pads can be located on the side of the substrate 10. When these pads are connected to the interface of external circuits, the connection distance can be shortened and interference reduced. The positive power connection pads and negative power connection pads can be placed on the horizontal plane of the substrate 10 as needed, close to the temperature sensor 30. In addition, to facilitate wiring and reduce impedance, the positive power connection pads can be located on the side edge of the substrate 10, while the negative power connection pads can be located on the opposite side or on the horizontal plane of the substrate 10. This can avoid voltage drop problems caused by excessively long current paths.

[0072] It should be noted that the specific locations of the two communication connection pads, the positive power connection pad, the negative power connection pad, the anode connection pad, and the cathode connection pad need to consider reducing signal interference, ensuring sufficient space between each pad to facilitate soldering operations and prevent short circuits, and ensuring that the arrangement of all pads does not affect the overall mechanical stability of the substrate 10. In particular, when placing pads on the sides of the substrate 10, care must be taken not to weaken the structural strength of the substrate 10.

[0073] It is understandable that the temperature sensor 30 in the relevant technology usually uses a miniaturized glass chip, which is prone to cracking or chipping during the assembly process, resulting in damage to the temperature sensor 30 and failure of function.

[0074] Therefore, in another embodiment, reference Figure 6 A cover adhesive 100 is provided on the substrate 10 at the position corresponding to the temperature sensor 30, and the height of the cover adhesive 100 is less than or equal to the height of the light-emitting chip 20.

[0075] In this embodiment, the cover adhesive 100 material can be made of silicone or epoxy resin to reduce the impact on light. The shape of the cover adhesive 100 can be adjusted according to the actual size of the temperature sensor 30 and completely cover the top surface of the temperature sensor 30 and its surrounding area, thereby achieving complete sealing and effectively preventing the temperature sensor 30 from cracking or chipping due to the influence of the external environment (such as dust, moisture or mechanical damage), thus improving the reliability and service life of the temperature sensor 30.

[0076] To reduce the impact of the cover adhesive 100 on the optical performance of the LED chip, in this embodiment, the height of the cover adhesive 100 is less than or equal to the height of the light-emitting chip 20, ensuring that the light emitted by the LED chip will not be reflected or refracted on the surface of the cover adhesive 100, thereby avoiding changes in the light transmission path and ensuring that the light can be evenly distributed to the display area as designed.

[0077] It should be noted that the integrated chip also includes a light guide 200, which is configured corresponding to the light-emitting chip 20. The light guide 200 can convert the point light source emitted by the LED chip into a surface light source or a line light source, guiding the light from one position to another through internal reflection. By rationally designing the structure of the light guide 200, the light can be more evenly distributed on the target area, avoiding hot spots (i.e., some areas being too bright while other areas are dark), thereby achieving a uniform and consistent lighting effect. (Reference) Figure 6 The height of the cover adhesive 100 needs to be less than or equal to the sum of the heights of the light guide 200 and the light-emitting chip 20 to reduce interference with the light. In addition, the height of the entire module should be kept consistent to facilitate subsequent assembly or packaging.

[0078] In this embodiment, the capping adhesive 100 can be applied individually (partial coverage) or completely encapsulated. Individual capping adhesive 100 can cover the top surface of the temperature sensor 30 with a layer of capping adhesive 100 material to provide localized protection for the temperature sensor 30. Alternatively, the capping adhesive 100 can be used to form a housing, that is, the temperature sensor 30 and the LED chip can be completely encapsulated using the capping adhesive 100 material, providing overall protection for the integrated chip.

[0079] refer to Figure 8 , Figure 8 The image shows the overall effect of the integrated chip of this invention; only connector A and the LED are visible, while the temperature sensor 30 is completely integrated into the LED module B1. This achieves improved performance under the same single-LED space conditions. Compared to... Figure 2 The related technologies reduce the space occupied by the circuit board, providing more space for other designs.

[0080] With the above configuration, the temperature sensor 30 is placed inside the LED package, meeting the miniaturization requirements. The temperature sensor 30 adopts a flip-chip design, and after the back side is thinned and metallized, it is fixed to the substrate 10 using metal bonding technology. Simultaneously, the temperature sensor 30 employs a top cover adhesive 100 design, the height of which is no higher than the upper surface of the LED, thus not affecting the light angle and reducing the risk of cracking or chipping. Furthermore, the temperature sensor 30 is designed close to the light-emitting chip 20 and shares the same thermal pad with the light-emitting chip 20, achieving rapid heat conduction.

[0081] It should be noted that the temperature sensor in this invention can be replaced by an EEPROM (Electrically Erasable Programmable Read-Only Memory) or a PD (Photodiode). In addition to the temperature sensor 30, the design layout of an EEPROM or PD device can also be added, depending on space and interface limitations, which will not be elaborated here.

[0082] This utility model also proposes a smart wearable device, which includes the integrated chip described in any of the above claims.

[0083] In this embodiment, smart wearable devices include, but are not limited to, electronic devices with display functions such as smart handles, AR glasses, and smart bracelets.

[0084] It is worth noting that since the smart wearable device of this utility model includes the aforementioned integrated chip, the embodiments of the smart wearable device of this utility model include all the technical solutions of all the embodiments of the aforementioned integrated chip, and the technical effects achieved are exactly the same, so they will not be repeated here.

[0085] The above description is only an optional embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the technical concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. An integrated chip, characterized in that, The integrated chip includes: A substrate having a device side; A light-emitting chip, wherein the light-emitting chip is disposed on the device side of the substrate; A temperature sensor, wherein the temperature sensor is disposed on the device side of the substrate; A heat-conducting component is provided between the light-emitting chip and the temperature sensor.

2. The integrated chip as described in claim 1, characterized in that, The heat-conducting component is disposed on the substrate, and the light-emitting chip and the temperature sensor are disposed alternately on the heat-conducting component.

3. The integrated chip as described in claim 2, characterized in that, The thermally conductive component includes thermally conductive pads.

4. The integrated chip as described in claim 2, characterized in that, The substrate has a bottom side facing away from the device, and a heat dissipation pad is provided on the bottom side; The heat-conducting component and the heat-dissipating pad are connected through vias provided on the substrate.

5. The integrated chip as described in any one of claims 1-4, characterized in that, The integrated chip also includes: A communication connection terminal is provided for connecting to an external circuit, and the communication connection terminal is electrically connected to the communication terminal of the temperature sensor. A power connection terminal is provided for connecting to an external power supply circuit and is electrically connected to the power supply terminal of the temperature sensor.

6. The integrated chip as described in claim 5, characterized in that, The communication connection terminal and the power connection terminal include gold-plated pads; and / or, The communication connection terminal and the communication terminal of the temperature sensor are connected by a gold wire; The power supply terminal and the power supply terminal of the temperature sensor are connected by a gold wire.

7. The integrated chip as described in claim 5, characterized in that, The communication connection terminal includes an I2C signal connection terminal for connecting to an I2C signal line.

8. The integrated chip as described in claim 5, characterized in that, The communication connection terminal includes two communication connection pads, the power connection terminal includes a positive power connection pad and a negative power connection pad, and the integrated chip also includes an anode connection pad and a cathode connection pad. The anode connection pad is electrically connected to the positive terminal of the light-emitting chip, and the cathode connection pad is electrically connected to the negative terminal of the light-emitting chip. When a heat dissipation pad is provided on the bottom side of the substrate, the communication connection pad, the positive power connection pad, the negative power connection pad, the anode connection pad, and the cathode connection pad are arranged around the periphery of the heat dissipation pad.

9. The integrated chip as described in any one of claims 1-4, characterized in that, A cover adhesive is provided on the substrate at the position corresponding to the temperature sensor, and the height of the cover adhesive is less than or equal to the height of the light-emitting chip.

10. A smart wearable device, characterized in that, The smart wearable device includes an integrated chip as described in any one of claims 1-9.

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