TO-220 packaging triode die bonding and wire welding combined feeding device

Abstract

The utility model discloses a TO-220 packaging triode die bonding wire combining and feeding device, and relates to the technical field of semiconductor packaging. Comprising a first track conveyor belt and a second track conveyor belt which are connected in parallel and receive box-packed materials of two die bonders through a first pushing mechanism and a second pushing mechanism respectively; a third pushing mechanism at the tail end of the second track conveying belt transfers the materials to the first track conveying belt; a flow control mechanism is arranged in the middle of the first track conveying belt, and baffles are driven by a servo motor to alternately conduct double-track materials; and the fourth pushing mechanism at the tail end pushes the gathered materials to the wire welding machine. According to the scheme, the problem of empty running of material waiting of the wire bonder is solved, the capacity dynamic matching of two die bonders and a single wire bonder is realized, the equipment utilization rate is improved, and the occupied space of a production line is reduced.

Description

Technical Field

[0001] This utility model relates to the field of transistor manufacturing technology, and in particular to a combined feeding device for die bonding and wire bonding of TO-220 packaged transistors. Background Technology

[0002] In the production process of TO-220 packaged transistors, the front end consists of two processes: die bonding and wire bonding. The wire bonding machine is usually about twice the speed of the die bonding machine. Under normal circumstances, two die bonding machines feed materials to one wire bonding machine. During the production process, there is a risk of waiting for materials, which can lead to the wire bonding machine running empty during production.

[0003] To address this issue, this application presents a combined die bonding and wire feeding device for TO-220 packaged transistors. Summary of the Invention

[0004] To overcome the shortcomings of the prior art, this utility model provides a combined feeding device for die bonding and wire bonding of TO-220 packaged transistors.

[0005] A combined feeding device for die bonding and wire bonding of TO-220 packaged transistors, comprising a first parallel conveyor belt and a second parallel conveyor belt, characterized in that:

[0006] One end of the first track conveyor belt is adjacent to the feed port of the wire bonding machine, and the other end is close to the interface of the first die bonder. A first pushing mechanism is provided on the interface side of the first die bonder to push the boxed material produced by the first die bonder to the first track conveyor belt. One end of the second track conveyor belt is close to the interface of the second die bonder, and a second pushing mechanism is provided on its side to push the boxed material to the second track conveyor belt. A third pushing mechanism is provided at the other end of the second track conveyor belt to transfer the boxed material from the second track conveyor belt to the first track conveyor belt. A flow control mechanism is provided in the middle of the first track conveyor belt to alternately release the boxed material from the two tracks. A fourth pushing mechanism is provided at the feed port to push the boxed material into the wire bonding machine.

[0007] Furthermore, in order to better realize this utility model, the first pushing mechanism, the second pushing mechanism, the third pushing mechanism and the fourth pushing mechanism all include an air pump and a push plate; the length of the air pump piston rod of the third pushing mechanism is greater than that of the other pushing mechanisms.

[0008] Furthermore, in order to better realize this utility model, the flow control mechanism includes a bracket mounted above the first track conveyor belt, a rotating shaft rotatably connected to the bracket, a baffle fixed below the rotating shaft, and a servo motor driving the rotating shaft.

[0009] Furthermore, in order to better realize this utility model, a transition conveyor belt connecting the two conveyor belts is provided between the third pushing mechanism and the first track conveyor belt.

[0010] The beneficial effects of this utility model are as follows:

[0011] This invention achieves dynamic matching between two die bonders and one wire bonder through a dual-track conveyor design and flow control mechanism, significantly solving the problem of wire bonders running idle while waiting for materials in existing technologies. Specific benefits include:

[0012] Eliminate production gaps: The gate-type design of the flow control mechanism alternately releases materials along the dual tracks, ensuring continuous operation of the wire bonding machine and improving equipment utilization.

[0013] Reduce equipment costs: A single wire bonder can be matched with two die bonders, reducing the number of wire bonders required.

[0014] Space efficiency optimization: Parallel track layout saves production line floor space;

[0015] Enhanced fault tolerance: When one die bonder stops, the other can still maintain the minimum capacity of the wire bonder through full-flow mode. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model.

[0017] In the picture,

[0018] 1. No. 1 die bonder interface; 2. No. 2 die bonder interface; 3. First pushing mechanism; 4. Second pushing mechanism; 5. First track conveyor belt; 6. Second track conveyor belt; 7. Third pushing mechanism; 8. Fourth pushing mechanism; 9. Flow control mechanism; 10. Feed port; 301. Air pump; 302. Push plate; 901. Support; 902. Rotary shaft; 903. Baffle; 904. Servo motor. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0021] Figure 1This is a specific embodiment of the present invention, which is a combined feeding device for die bonding and wire bonding of TO-220 packaged transistors. It includes two parallel conveyor belts, a first conveyor belt 5 and a second conveyor belt 6. One end of the first conveyor belt 5 is provided with a feeding port 10 adjacent to a wire bonding machine, and the other end of the first conveyor belt 5 is close to the interface 1 of the first die bonder. A first pushing mechanism 3 is provided on one side of the interface 1 of the first die bonder, pushing the boxed material produced by the first die bonder onto the first conveyor belt 5. One end of the second conveyor belt 6 is close to the interface 2 of the second die bonder, and a second pushing mechanism 4 is provided on one side of the interface 2 of the second die bonder, pushing the boxed material produced by the second die bonder onto the second conveyor belt 6. A third pushing mechanism 7 is provided at the other end of the second conveyor belt 6, pushing the boxed material from the second conveyor belt 6 onto the first conveyor belt 5.

[0022] A flow control mechanism 9, similar to a gate structure, is set in the middle of the first track conveyor belt 5 to control the flow of boxed materials, so that the other side passes through after one side has finished, in order to avoid the situation of waiting for materials.

[0023] A four-push mechanism 8 is set at the feeding port 10 of the first track conveyor belt 5 to push the collected boxed materials into the wire bonding machine in sequence.

[0024] The four pushing mechanisms have the same structure, each consisting of an air pump 301 and a pusher plate 302. The piston rod of the air pump in the third pushing mechanism 7 is lengthened to facilitate the direct pushing of boxed materials on the second track conveyor belt 6 onto the first track conveyor belt 5, or a separate conveyor belt can be set up here to connect the first track conveyor belt 5 and the second track conveyor belt 6.

[0025] The specific structure of the flow control mechanism 9 is as follows: a support 901 is erected above the first track conveyor belt 5, a rotating shaft 902 is rotatably connected to the support 901, a baffle 903 is fixedly connected below the rotating shaft 902, and a servo motor 904 is connected to one end of the rotating shaft 902.

[0026] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Any other modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model, as long as they do not depart from the spirit and scope of the technical solution of this utility model, should be covered within the scope of the claims of this utility model.

Claims

1. A combined feeding device for die bonding and wire bonding of TO-220 packaged transistors, comprising a first parallel conveyor belt (5) and a second parallel conveyor belt (6), characterized in that: One end of the first track conveyor belt (5) is adjacent to the feeding port (10) of the wire bonding machine, and the other end is close to the interface (1) of the first die bonder. The interface (1) of the first die bonder is provided with a first pushing mechanism (3) for pushing the boxed material produced by the first die bonder to the first track conveyor belt (5). One end of the second track conveyor belt (6) is close to the interface (2) of the second die bonder, and the other end of the second track conveyor belt (6) is provided with a second pushing mechanism (4) for pushing the boxed material to the second track conveyor belt (6). The other end of the second track conveyor belt (6) is provided with a third pushing mechanism (7) for transferring the boxed material from the second track conveyor belt (6) to the first track conveyor belt (5). The middle of the first track conveyor belt (5) is provided with a flow control mechanism (9) for alternately releasing the boxed material of the two tracks. The feeding port (10) is provided with a fourth pushing mechanism (8) for pushing the boxed material into the wire bonding machine.

2. The TO-220 packaged transistor die bonding wire feeding device according to claim 1, characterized in that: The first pushing mechanism (3), the second pushing mechanism (4), the third pushing mechanism (7) and the fourth pushing mechanism (8) all include an air pump (301) and a push plate (302); the length of the air pump piston rod of the third pushing mechanism (7) is greater than that of the other pushing mechanisms.

3. The TO-220 packaged transistor die bonding wire feeding device according to claim 1, characterized in that: The flow control mechanism (9) includes a bracket (901) mounted above the first track conveyor belt (5), a rotating shaft (902) rotatably connected to the bracket (901), a baffle (903) fixed below the rotating shaft, and a servo motor (904) driving the rotating shaft (902).

4. The TO-220 packaged transistor die bonding wire feeding device according to claim 1, characterized in that: A transition conveyor belt connecting the two conveyor belts is provided between the third pushing mechanism (7) and the first track conveyor belt (5).

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