Resin array feeding structure for semiconductor packaging equipment

Abstract

The utility model discloses a resin array feeding structure for semiconductor packaging equipment, and relates to the technical field of semiconductor packaging, the resin array feeding structure comprises a vibration disc, an array table, a taking manipulator and a lifting part, the output end of the vibration disc is provided with a U-shaped conveying groove, one side of the U-shaped conveying groove is provided with a baffle plate and is also provided with a stop lever, and the U-shaped conveying groove is provided with a baffle plate. The stop lever is located above the U-shaped conveying groove. A first transverse displacement mechanism is installed on the alignment table, a movable plate is installed on the first transverse displacement mechanism, a plurality of containing openings are formed in the movable plate in rows, a feeding opening is formed in the alignment table, a turnover cavity of a rectangular structure is formed in the direction of the feeding opening, and the turnover cavity is located below the containing openings. According to the resin whole-column feeding structure, resin vertical discharging is adopted, a manipulator does not need to be taken for overturning operation, and the feeding efficiency of resin materials can be effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a resin alignment and feeding structure for semiconductor packaging equipment. Background Technology

[0002] Semiconductor packaging refers to the process of processing tested wafers into individual chips according to product model and functional requirements. Semiconductor packaging is a crucial step in semiconductor device manufacturing, aiming to protect the chip from external environmental influences while enabling the chip to connect to external circuits. Specifically, the packaging process includes dicing the wafer into small wafers, then fixing these wafers to a substrate using specific methods (such as adhesive bonding), and connecting the wafer's bonding pads to the corresponding pins on the substrate using metal wires or conductive resin to form the required circuit. Finally, the individual wafers are encapsulated and protected with a plastic shell or other materials to achieve physical protection, electrical connection, and thermal management. The resin alignment structure is a key structure for arranging and transporting resin in an automated semiconductor packaging system. It mainly includes feeding, orderly arrangement, loading, and transporting, ultimately delivering the resin to the mold for hot melting. Existing resin alignment structures mainly include a vibrating disc, an alignment table, a robotic arm, and a lifting unit. Because the existing vibrating disc loads the cylindrical resin material onto the alignment table in a flat manner, the robotic arm needs to flip the resin material after picking it up before placing it on the lifting unit, which prolongs the resin loading time and reduces the overall work efficiency. Therefore, this application provides a resin alignment and loading structure for semiconductor packaging equipment to meet the requirements. Utility Model Content

[0003] The purpose of this application is to provide a resin feeding structure for semiconductor packaging equipment, which solves the technical problem of long resin feeding time in the prior art.

[0004] To achieve the above objectives, this application provides the following technical solution: a resin aligning and feeding structure for semiconductor packaging equipment, including a vibrating disc, an aligning table, a picking robot, and a lifting unit. The output end of the vibrating disc is provided with a U-shaped conveying groove, and a baffle is provided on one side of the U-shaped conveying groove. A stop bar is also provided, and the stop bar is located above the U-shaped conveying groove.

[0005] The alignment platform is equipped with a first lateral displacement mechanism, and a movable plate is installed on the first lateral displacement mechanism. Multiple receiving openings are arranged in a row on the movable plate. The alignment platform is provided with a feeding opening, and a rectangular flipping cavity is provided with a wheel connected to the feeding opening. The flipping cavity is located below the receiving opening.

[0006] In a preferred embodiment of this invention, the picking robot includes a second lateral displacement mechanism mounted on a frame, a longitudinal displacement mechanism mounted on the second lateral displacement mechanism, a telescopic cylinder mounted on the longitudinal displacement mechanism, and a pneumatic chuck mounted at the lower end of the telescopic cylinder, with multiple pneumatic grippers mounted on the pneumatic chuck.

[0007] In a preferred embodiment of this invention, the lifting unit includes a mounting frame on which a lifting frame is movably mounted. A belt driven by a motor is mounted on the mounting frame, and the side end of the mounting frame is fixed to the belt. The mounting frame is provided with a plurality of placement holes adapted to cylindrical resin materials.

[0008] As a preferred embodiment of this invention, a top-feeding mechanism is also included, which is used to lift the resin material in the placement hole to a certain height.

[0009] In a preferred embodiment of this invention, the material ejection mechanism includes a lifting cylinder mounted on the mounting frame. A movable frame is mounted on the output end of the lifting cylinder, and multiple lifting rods are arranged in a row on the movable frame. Each of the multiple lifting rods corresponds to a multiple placement hole. The bottom of the inner cavity of each of the multiple placement holes is provided with a through hole of the same size as the lifting rod, and the diameter of the through hole is smaller than the diameter of the resin material.

[0010] In summary, the technical effects and advantages of this utility model are as follows:

[0011] This utility model has a reasonable structure. The resin feeding structure adopts a vertical resin discharge, which eliminates the need for a robotic arm to perform a flipping operation, thus effectively improving the feeding efficiency of resin material. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2 for Figure 1 Schematic diagram of the medium-vibration disc structure;

[0015] Figure 3 for Figure 1 Schematic diagram of the central alignment platform structure;

[0016] Figure 4 for Figure 1 schematic diagram of the robotic arm structure

[0017] Figure 5 for Figure 1 Schematic diagram of the middle lifting section.

[0018] In the diagram: 1. Vibrating disc; 101. U-shaped conveyor trough; 102. Baffle; 103. Baffle bar; 2. Alignment table; 201. First lateral displacement mechanism; 202. Movable plate; 203. Feed opening; 204. Receiving opening; 205. Tilting chamber; 3. Picking robot; 31. Second lateral displacement mechanism; 32. Longitudinal displacement mechanism; 33. Telescopic cylinder; 34. Pneumatic chuck; 35. Pneumatic gripper; 4. Lifting unit; 41. Mounting frame; 42. Placement hole; 43. Belt; 44. Lifting frame; 45. Lifting cylinder; 46. Movable frame; 47. Lifting rod; 5. Photoelectric sensor. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example: Reference Figure 1-3 The resin aligning and feeding structure for semiconductor packaging equipment shown includes a vibrating disc 1, an aligning table 2, a picking robot 3 and a lifting unit 4. The output end of the vibrating disc 1 is provided with a U-shaped conveying trough 101, and a baffle 102 is provided on one side of the U-shaped conveying trough 101. A stop bar 103 is also provided, and the stop bar 103 is located above the U-shaped conveying trough 101.

[0021] The aligning table 2 is equipped with a first lateral displacement mechanism 201, and a movable plate 202 is installed on the first lateral displacement mechanism 201. Multiple receiving openings 204 are arranged in a row on the movable plate 202. The aligning table 2 is provided with a feeding opening 203, and a rectangular tilting cavity 205 is provided with a wheel connected to the feeding opening 203. The tilting cavity 205 is located below the receiving opening 204.

[0022] When feeding using the vibrating disc 1, some resin material may be in an upright state. The baffle 103 contacts the upper part of the resin material, which is in a vertically moving state on the U-shaped conveyor trough 101, causing the resin material to tilt and lie flat in the U-shaped conveyor trough 100 for transport. The flat resin material enters the inner cavity of the receiving opening 204 through the feed opening 203. When the weight of the suspended part of the resin material (i.e., the part above the tilting chamber 205) is greater than the weight of the part of the resin material in contact with the aligning table 2, the resin material will automatically tilt, causing the lower end of the material to enter the tilting chamber 205, while the upper end remains in the receiving opening 204. When one of the receiving openings... After the opening 204 accommodates a piece of resin, the first lateral displacement mechanism 201 drives the movable plate 202 to move so that the next accommodating opening 204 aligns with the corresponding feeding opening 203, and the next piece of resin is fed. When all the accommodating openings 204 on the movable plate 202 are filled with resin, the picking robot 3 will directly pick up the resin on the movable plate 202 and place it on the lifting part 4. Since the resin is vertical at this time, the picking robot 3 does not need to perform a flipping operation and can directly place the material on the lifting part 4, which shortens the resin feeding time and improves the resin feeding efficiency.

[0023] It should be noted that: First, all the above-mentioned electrical equipment is electrically connected to the PLC controller; Second, a photoelectric sensor 5 is installed on the row table 2 above the feed opening 203 to determine whether the resin material is in place.

[0024] As a preferred embodiment of this example, Figure 4 As shown, the picking robot 3 includes a second lateral displacement mechanism 31 mounted on the frame, a longitudinal displacement mechanism 32 mounted on the second lateral displacement mechanism 31, a telescopic cylinder 33 mounted on the longitudinal displacement mechanism 32, and a pneumatic chuck 34 mounted on the lower end of the telescopic cylinder 33. Multiple pneumatic grippers 35 are mounted on the pneumatic chuck 34.

[0025] During operation, the open pneumatic grippers are transported to the material grabbing position through the cooperation of the second lateral displacement mechanism 31, the longitudinal displacement mechanism 32 and the telescopic cylinder 33. The resin material is clamped by the relative movement of the two pneumatic grippers 35 (which can be set to a V-shaped structure to adapt to the gripping of resin materials of different diameters) and moved to the lifting part 4 and then placed on the lifting part 4.

[0026] As a preferred embodiment of this example, Figure 5 As shown, the lifting unit 4 includes a mounting frame 41 on which a lifting frame 44 is movably mounted. A belt 43 driven by a motor is mounted on the mounting frame 41. The side end of the mounting frame 41 is fixed to the belt 43. The mounting frame 41 is provided with a plurality of placement holes 42 adapted to cylindrical resin materials.

[0027] When the resin material is placed on the lifting part 4, its lower end is inserted into the placement hole 42, and the motor drives the belt 43 to run, thereby realizing the lifting of the lifting frame 44.

[0028] As a preferred embodiment of this invention, a top-feeding mechanism is also included, which is used to lift the resin material in the placement hole 42 to a certain height.

[0029] The ejector mechanism can push out a portion of the resin from the top, making it easier for the robotic arm to pick it up and deliver it to the mold for hot melting, reducing the risk of collision or falling.

[0030] As a preferred embodiment of this example, Figure 5 As shown, the material lifting mechanism includes a lifting cylinder 45 mounted on the mounting frame 41. A movable frame 46 is mounted on the output end of the lifting cylinder 45, and multiple lifting rods 47 are arranged in a row on the movable frame 46. Each of the multiple lifting rods 47 corresponds to a multiple placement hole 42. The bottom of the inner cavity of each of the multiple placement holes 42 is provided with a through hole of the same size as the lifting rod 47. The diameter of the through hole is smaller than the diameter of the resin material.

[0031] After the movable frame 46 rises to a specific position, the lifting cylinder 45 is controlled to lift the resin material in the placement hole 42 to a certain height to facilitate subsequent gripping by the mechanical gripper. After gripping is completed, the movable frame 46 and the lifting cylinder 47 return to their original positions.

[0032] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A resin aligning and feeding structure for a semiconductor packaging equipment, comprising a vibrating disc (1), an aligning table (2), a picking robot (3), and a lifting unit (4), wherein the output end of the vibrating disc (1) is provided with a U-shaped conveying groove (101), and a baffle (102) is provided on one side of the U-shaped conveying groove (101), characterized in that: A stop bar (103) is also provided, which is located above the U-shaped conveying trough (101); The alignment table (2) is equipped with a first lateral displacement mechanism (201), and a movable plate (202) is installed on the first lateral displacement mechanism (201). The movable plate (202) has multiple receiving openings (204) arranged in a row. The alignment table (2) is provided with a feeding opening (203), and a rectangular rotating cavity (205) is provided with the feeding opening (203) and the wheel. The rotating cavity (205) is located below the receiving opening (204).

2. The resin alignment and feeding structure for semiconductor packaging equipment according to claim 1, characterized in that: The picking robot (3) includes a second lateral displacement mechanism (31) mounted on the frame. A longitudinal displacement mechanism (32) is mounted on the second lateral displacement mechanism (31). A telescopic cylinder (33) is mounted on the longitudinal displacement mechanism (32). A pneumatic chuck (34) is mounted on the lower end of the telescopic cylinder (33). A plurality of pneumatic grippers (35) are mounted on the pneumatic chuck (34).

3. The resin alignment and feeding structure for semiconductor packaging equipment according to claim 1, characterized in that: The lifting unit (4) includes a mounting frame (41) on which a lifting frame (44) is movably mounted. A belt (43) driven by a motor is mounted on the mounting frame (41). The side end of the mounting frame (41) is fixed on the belt (43). The mounting frame (41) is provided with a plurality of placement holes (42) adapted to cylindrical resin materials.

4. The resin alignment and feeding structure for semiconductor packaging equipment according to claim 3, characterized in that: It also includes a material lifting mechanism for lifting the resin material in the placement hole (42) to a certain height.

5. The resin alignment and feeding structure for semiconductor packaging equipment according to claim 4, characterized in that: The material lifting mechanism includes a lifting cylinder (45) mounted on the mounting frame (41). A movable frame (46) is mounted on the output end of the lifting cylinder (45), and multiple lifting rods (47) are arranged in a row on the movable frame (46). Each of the multiple lifting rods (47) corresponds to a multiple placement hole (42). The bottom of the inner cavity of each of the multiple placement holes (42) is provided with a through hole of the same size as the lifting rod (47), and the diameter of the through hole is smaller than the diameter of the resin material.

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