Blowing mechanism for wafer and wafer testing equipment

Abstract

The utility model provides a blowing mechanism for a wafer and wafer testing equipment, and relates to the technical field of wafer testing. The support is provided with a plurality of first installation parts, and the first installation parts are arranged around the axis of the support in the circumferential direction. The plurality of blowing parts are mounted at the first mounting part, each blowing part is internally provided with a blowing channel, the end part of each blowing part is provided with a blowing port communicated with the corresponding blowing channel, and blowing is carried out on the front surface of the wafer through the blowing ports of the blowing parts, so that the warped wafer is blown to be flat and is attached to the heat sink, the wafer adsorption firmness can be improved, and the service life of the wafer is prolonged. And the contact accuracy of the test probe and the wafer can be improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer testing technology, and in particular to a blowing mechanism and wafer testing equipment for wafers. Background Technology

[0002] During wafer testing, wafers are typically placed on a heat sink for transport. The heat sink usually has suction holes to hold the wafer in place, preventing movement during transport. Wafers that have undergone thinning processes are quite thin and often have some warpage. Warpage can cause abnormal vacuum levels during suction, affecting the adhesion strength and the accuracy of wafer mounting. Therefore, there is a pressing need to design a mechanism that can smoothly attach the wafer to the heat sink. Utility Model Content

[0003] One objective of this invention is to provide a blowing mechanism for wafers, thereby solving the technical problem in the prior art where wafer warping affects the wafer adsorption effect.

[0004] A further objective of this invention is to improve the compatibility of the blowing mechanism with wafers of different sizes.

[0005] Another objective of this invention is to provide a wafer testing device having the aforementioned blowing mechanism.

[0006] Specifically, this invention provides a blowing mechanism for wafers, wherein the wafers are adsorbed onto a heat sink, comprising:

[0007] The bracket has a plurality of first mounting portions arranged circumferentially around the axis of the bracket;

[0008] Multiple air blowing components are installed at the first mounting part. Each air blowing component has an air blowing channel inside and an air blowing port at its end that communicates with the air blowing channel. The air blowing channel is connected to an air supply device and is configured to controllably deliver gas to the air blowing port to blow air onto the front side of the wafer, thereby flattening the warped wafer and attaching it to the heat sink.

[0009] Optionally, the bracket has a plurality of outwardly extending mounting plates, each of which is provided with a first mounting portion extending along the length direction of the mounting plate.

[0010] Optionally, the included angle between two adjacent mounting plates in the plurality of mounting plates is any value in the range of 30° to 120°.

[0011] Optionally, the included angle between any two adjacent mounting plates in the plurality of mounting plates is the same.

[0012] Optionally, one of the air-blowing elements is installed at each of the first mounting portions. The air-blowing element passes through the corresponding first mounting portion and is configured to move in a controlled manner along the first mounting portion and be installed at any position of the first mounting portion.

[0013] Optionally, each of the first mounting portions has the same extension length, and the plurality of first mounting portions are arranged in a circumferential array;

[0014] The plurality of air-blowing components installed at the first mounting portion are arranged in a circular pattern.

[0015] Optionally, the bracket has at least one second mounting portion at its center, and one of the air-blowing components is mounted at each of the second mounting portions.

[0016] Optionally, it also includes:

[0017] An air intake manifold is mounted on the bracket. The air intake manifold has an air inlet and multiple air outlets. The air inlet is connected to the air supply device. The air blowing channel of each air blowing component is connected to one of the air outlets.

[0018] Optionally, it also includes:

[0019] A first driving member is connected to the support, and the first driving member is configured to controllably drive the support to move vertically to adjust the distance between the air blowing member and the wafer;

[0020] A second driving member is connected to each of the air blowing members. The second driving member is configured to controllably drive at least one of the air blowing members to move horizontally along the extension direction of the first mounting portion, so as to adjust the blowing position of the air blowing members on the wafer.

[0021] In particular, this utility model also provides a wafer testing device, including the aforementioned blowing mechanism.

[0022] In this invention, the support has multiple first mounting parts arranged circumferentially around the axis of the support. Multiple air blowing components are installed at the first mounting parts. Each air blowing component has an internal air blowing channel, and its end has an air blowing port communicating with the air blowing channel. Air is blown onto the front side of the wafer through the air blowing port, thereby flattening the warped wafer and attaching it to the heat sink. This improves the firmness of wafer adhesion and enhances the accuracy of the contact between the test probe and the wafer.

[0023] Furthermore, in this invention, the air-blowing component is inserted into the corresponding first mounting portion and is configured to move in a controlled manner along the first mounting portion, and can be installed at any position within the first mounting portion. It can be understood that the position of the air-blowing component in the above technical solution is adjustable, which can meet the needs of wafers of different sizes, thereby improving the adaptability of the blowing mechanism to wafers of different sizes.

[0024] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0025] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0026] Figure 1 This is a schematic structural diagram of a wafer blowing mechanism according to an embodiment of the present invention;

[0027] Figure 2 yes Figure 1 A schematic installation diagram of the support and air blowing components in the blowing mechanism shown;

[0028] Figure 3 yes Figure 1 A schematic structural diagram of the support frame in the blowing mechanism shown;

[0029] Figure 4 yes Figure 1 A schematic cross-sectional view of the air blowing component in the blowing mechanism shown;

[0030] Figure 5 yes Figure 1 A schematic structural diagram of the air intake manifold in the blowing mechanism shown.

[0031] Figure label:

[0032] 100-blowing mechanism, 10-bracket, 20-blowing component, 30-inlet manifold, 40-first drive component, 50-first reinforcing plate, 60-second reinforcing plate, 70-connecting plate, 11-mounting plate, 111-first mounting part, 12-second mounting part, 21-blowing channel, 22-blowing port, 23-nozzle connector, 31-inlet, 32-outlet. Detailed Implementation

[0033] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0034] In the description of this utility model, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0035] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0036] Unless otherwise expressly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0037] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0038] During wafer testing, the wafer is adsorbed onto a heat sink. Specifically, the heat sink has adsorption holes through which the wafer is adsorbed, allowing the wafer and heat sink to be transported as a single unit. Due to the wafer thinning process, 8-inch wafers exhibit approximately 6mm of warpage, while 6-inch wafers exhibit approximately 3mm of warpage. This warpage affects the vacuum level of the heat sink, thus impacting the strength of the wafer's adsorption.

[0039] Figure 1 This is a schematic structural diagram of a wafer blowing mechanism 100 according to an embodiment of the present invention. Figure 2 yes Figure 1 The diagram shows a schematic installation of the support 10 and the air blowing component 20 in the blowing mechanism 100. Figure 3 yes Figure 1 This is a schematic structural diagram of the support 10 in the blowing mechanism 100. Figure 4 yes Figure 1 A schematic cross-sectional view of the air blowing element 20 in the blowing mechanism 100 shown.

[0040] like Figures 1 to 4 As shown, in one specific embodiment, the wafer blowing mechanism 100 includes a support 10 and a plurality of air blowing elements 20. The support 10 has a plurality of first mounting portions 111, which are arranged circumferentially around the axis of the support 10. Each air blowing element 20 is mounted at a first mounting portion 111. Each air blowing element 20 has an internal air blowing channel 21 and an air blowing port 22 communicating with the air blowing channel 21 at its end. The air blowing channel 21 is connected to an air supply device and is configured to controllably supply gas to the air blowing port 22 to blow air onto the front side of the wafer, thereby flattening the warped wafer and attaching it to the heat sink. Here, the blowing mechanism 100 is mounted above the wafer, and the air blowing port 22 of the air blowing element 20 faces the front side of the wafer, thereby blowing air onto the front side of the wafer.

[0041] This embodiment utilizes the air blowing component 20 to blow air onto the front side of the wafer, thereby flattening the warped wafer and attaching it to the heat sink. This can improve the firmness of wafer adhesion and enhance the accuracy of the contact between the test probe and the wafer.

[0042] Specifically, the first mounting portion 111 is hole-shaped, and the air blowing element 20 is rod-shaped. In other embodiments, the shapes of the first mounting portion 111 and the air blowing element 20 can be determined according to specific design requirements.

[0043] Specifically, when the wafer moves to the underside of the blowing mechanism 100, the blowing mechanism 100 blows air onto the front side of the wafer for a preset duration, and then detects the vacuum level between the wafer and the heat sink. If the vacuum level meets the requirements, the wafer and the heat sink are transferred to the next station. If the vacuum level does not meet the requirements, an alarm is triggered.

[0044] In some embodiments, the air blowing element 20 is arranged perpendicularly to the wafer, blowing air directly onto the front side of the wafer. In other embodiments, the air blowing element 20 may also be arranged at an angle, forming a preset angle with the wafer. This can be understood as the air outlet 22 forming a preset angle with the wafer. Here, the preset angle can be 30°, 40°, 50°, or 60°, etc.

[0045] In some embodiments, nitrogen gas is supplied to the blowing channel 21 of the blowing element 20, which can blow away the warped wafer without affecting wafer testing. In other embodiments, other gases, such as inert gases, can be supplied to the blowing channel 21 of the blowing element 20, as long as it does not affect wafer testing. This embodiment can also adjust the blowing force by adjusting the gas flow rate.

[0046] In some embodiments, the bracket 10 has a plurality of outwardly extending mounting plates 11, each mounting plate 11 having a first mounting portion 111 extending along the length direction of the mounting plate 11. Compared to the technical solution of directly using a circular bracket 10, this embodiment, by providing a plurality of outwardly extending mounting plates 11, can reduce the weight of the bracket 10.

[0047] In this embodiment, the position of the air blowing component 20 is adjustable, which can meet the needs of wafers of different sizes and improve the compatibility of the blowing mechanism 100 with wafers of different sizes.

[0048] In some embodiments, the included angle between two adjacent mounting plates 11 in the plurality of mounting plates 11 is any value in the range of 30° to 120°, for example, it can be 30°, 40°, 50°, 60°, 70°, 80°, 90°, 100°, 110° or 120°.

[0049] In some embodiments, the included angle between any two adjacent mounting plates 11 is the same, which can achieve a uniform arrangement of the air blowing elements 20. In other embodiments, the included angle between any two adjacent mounting plates 11 can be set to be different, depending on the design requirements.

[0050] In this embodiment, the number of mounting plates 11 is eight. In other embodiments, the number of mounting plates 11 can also be designed to be three, four, five, six, etc., depending on the design requirements.

[0051] In some embodiments, an air blowing element 20 is installed at each first mounting portion 111. The air blowing element 20 passes through the corresponding first mounting portion 111 and is configured to move in a controlled manner along the first mounting portion 111 and be installed at any position on the first mounting portion 111. Here, the air blowing element 20 is fixed at any position on the first mounting portion 111 by tightening a nut. When it is necessary to adjust the position of the air blowing element 20, the nut can be loosened.

[0052] In this embodiment, the position of the air blowing element 20 is adjustable to meet the needs of wafers of different sizes.

[0053] In some embodiments, each first mounting portion 111 has the same extension length, and the plurality of first mounting portions 111 are arranged in a circumferential array. A plurality of air blowing elements 20 mounted at the first mounting portions 111 are arranged in a circular arrangement. Here, the extension length of the first mounting portion 111 is determined by the different sizes of the wafer, and the air blowing elements 20 can be mounted for wafers of different sizes. This embodiment arranges the plurality of air blowing elements 20 in a circular arrangement, which allows for better air blowing on the front side of the wafer; see [link to documentation]. Figure 2 .

[0054] In other embodiments, a plurality of air blowing elements 20 may also be installed in each first mounting portion 111. The plurality of air blowing elements 20 are arranged at intervals along the extension direction of the first mounting portion 111, and the distance between two adjacent air blowing elements 20 in each first mounting portion 111 is determined according to specific design requirements.

[0055] In some embodiments, at least one second mounting portion 12 is provided at the center of the support 10, and an air blowing element 20 is mounted at each second mounting portion 12. That is, this embodiment not only blows air around the circumference of the wafer, but also blows air around the center of the wafer, enabling uniform air blowing. Here, there is one second mounting portion 12; in other embodiments, the number of second mounting portions 12 may be multiple, depending on the design requirements. The second mounting portion 12 is in the form of a hole.

[0056] In this embodiment, there are nine air blowing elements 20. Eight of the air blowing elements 20 are arranged in a circular pattern within the first mounting portions 111 of the eight mounting plates 11. The remaining air blowing element 20 is installed in the second mounting portion 12, which is located at the center of the eight air blowing elements 20, thereby achieving uniform air blowing on the front side of the wafer.

[0057] Figure 5 yes Figure 1 A schematic structural diagram of the air intake manifold in the blowing mechanism shown. Figure 5 As shown, and see Figure 1 In some embodiments, the blowing mechanism 100 further includes an air inlet manifold 30 mounted on the bracket 10. The air inlet manifold 30 has an air inlet 31 and multiple air outlets 32. The air inlet 31 is connected to an air supply device, and the air blowing channel 21 of each blowing element 20 is connected to an air outlet 32. Here, each blowing element 20 has a nozzle connector 23 at its top, which is connected to the air outlet 32 ​​of the air inlet manifold 30.

[0058] In some embodiments, the blowing mechanism 100 further includes a first drive member 40 connected to the support 10. The first drive member 40 is configured to controllably drive the support 10 to move vertically to adjust the distance between the blowing member 20 and the wafer. Here, the first drive member 40 is a cylinder and is arranged vertically.

[0059] The blowing mechanism 100 also includes a second drive member connected to each blowing element 20. The second drive member is configured to controllably drive at least one blowing element 20 to move horizontally along the extension direction of the first mounting portion 111, thereby adjusting the blowing position of the blowing element 20 on the wafer. It can be understood that the position of the blowing element 20 can be adjusted manually or automatically, depending on the design requirements.

[0060] In some embodiments, the blowing mechanism 100 further includes a connecting plate 70, which is arranged horizontally and has one end connected to the bracket 10 and the other end connected to the first drive member 40. An air intake manifold 30 is mounted on the connecting plate 70.

[0061] In a preferred embodiment, the blowing mechanism 100 further includes a first reinforcing plate 50 and a second reinforcing plate 60. The first reinforcing plate 50 is arranged horizontally and is located above the connecting plate 70. One end of the first reinforcing plate 50 is connected to the first driving member 40, and the other end is connected to the second reinforcing plate 60. The second reinforcing plate 60 is arranged vertically and is located at the top of the bracket 10.

[0062] This embodiment improves the stability of the bracket 10 installation by adding a first reinforcing plate 50 and a second reinforcing plate 60, thus preventing the bracket 10 from shaking while moving with the first driving member 40.

[0063] This embodiment also provides a wafer testing apparatus, which includes the blowing mechanism 100 of any of the above embodiments. Details regarding the blowing mechanism 100 are not provided here.

[0064] Therefore, those skilled in the art should recognize that although many exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A blowing mechanism for a wafer, the wafer being adsorbed onto a heat sink, characterized in that, include: The bracket has a plurality of first mounting portions arranged circumferentially around the axis of the bracket; Multiple air blowing components are installed at the first mounting part. Each air blowing component has an air blowing channel inside and an air blowing port at its end that communicates with the air blowing channel. The air blowing channel is connected to an air supply device and is configured to controllably deliver gas to the air blowing port to blow air onto the front side of the wafer, thereby flattening the warped wafer and attaching it to the heat sink.

2. The blowing mechanism according to claim 1, characterized in that, The bracket has multiple outwardly extending mounting plates, each of which is provided with a first mounting portion extending along the length direction of the mounting plate.

3. The blowing mechanism according to claim 2, characterized in that, The included angle between any two adjacent mounting plates in the plurality of mounting plates is any value in the range of 30° to 120°.

4. The blowing mechanism according to claim 3, characterized in that, The included angle between any two adjacent mounting plates in the plurality of mounting plates is the same.

5. The blowing mechanism according to claim 4, characterized in that, One of the air-blowing elements is installed at each of the first mounting portions, the air-blowing element passing through the corresponding first mounting portion and configured to move in a controlled manner along the first mounting portion and be installed at any position of the first mounting portion.

6. The blowing mechanism according to claim 5, characterized in that, Each of the first mounting parts has the same extension length, and the plurality of the first mounting parts are arranged in a circumferential array. The plurality of air-blowing components installed at the first mounting portion are arranged in a circular pattern.

7. The blowing mechanism according to any one of claims 1-6, characterized in that, The bracket has at least one second mounting part at its center, and one of the air blowing components is installed at each of the second mounting parts.

8. The blowing mechanism according to any one of claims 1-6, characterized in that, Also includes: An air intake manifold is mounted on the bracket. The air intake manifold has an air inlet and multiple air outlets. The air inlet is connected to the air supply device. The air blowing channel of each air blowing component is connected to one of the air outlets.

9. The blowing mechanism according to any one of claims 1-6, characterized in that, Also includes: A first driving member is connected to the support, and the first driving member is configured to controllably drive the support to move vertically to adjust the distance between the air blowing member and the wafer; A second driving member is connected to each of the air blowing members. The second driving member is configured to controllably drive at least one of the air blowing members to move horizontally along the extension direction of the first mounting portion, so as to adjust the blowing position of the air blowing members on the wafer.

10. A wafer testing device, characterized in that, Includes the blowing mechanism as described in any one of claims 1-9.

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