Cooling plate with fin group
Through the structural design of the substrate, fin assembly, and cover plate, the fin assembly is brazed to the substrate, and the fin assembly and substrate are manufactured separately, which solves the problems of complex and high cost of existing cooling plates and achieves simple, low-cost, and efficient heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MILLI ELECTROMECHANICAL (SUZHOU) CO LTD
- Filing Date
- 2025-05-28
- Publication Date
- 2026-05-05
AI Technical Summary
The existing cooling plates have a complicated manufacturing process, and damage to the fins or needles leads to a high scrap rate and high cost.
The structure adopts a substrate, fin assembly and cover plate. The fin assembly is connected to the substrate by brazing. The fin assembly and the substrate are manufactured separately. The fins are formed in a wavy shape to increase the heat dissipation area. Copper components are used to improve thermal conductivity.
It reduces the difficulty of manufacturing cooling plates and the scrap rate, improves operational efficiency and production capacity, enhances heat dissipation efficiency and uniformity, and reduces costs.
Smart Images
Figure CN224205639U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip heat dissipation, and in particular to a cooling plate with fins. Background Technology
[0002] Chips generate heat during operation, and cooling plates can dissipate heat from the chips to maintain stable operation.
[0003] To increase the heat dissipation area, existing cooling plates are usually machined to form fins or forged into needle fins.
[0004] However, the manufacturing process of cooling plates is complicated. During processing, damage to even one fin or needle fin can render the cooling plate unusable, resulting in high costs. Utility Model Content
[0005] To address the aforementioned problems in the prior art, the purpose of this utility model is to provide a cooling plate with finned assembly that is simple to manufacture and low in cost.
[0006] To address the aforementioned problems, this utility model provides a cooling plate with a finned assembly, the cooling plate with the finned assembly comprising:
[0007] A substrate, wherein a groove for supplying coolant flow is formed on the upper surface of the substrate, and an inlet hole and an outlet hole communicating with the groove are provided.
[0008] A fin assembly comprising a plurality of fins arranged sequentially along the coolant flow direction, adjacent fins in the fin assembly being interconnected, the fins extending in a direction perpendicular to the coolant flow, and the fins having perforations formed on them for supplying coolant flow.
[0009] A first solder plate is disposed between the groove and the fin assembly, and the fin assembly is brazed to the substrate through the first solder plate;
[0010] A cover plate, the lower surface of which covers the upper surface of the substrate, and the upper surface of the cover plate having a plurality of mounting areas for connecting chips, the positions of which correspond to the positions of the fin assembly.
[0011] Furthermore, the fins are formed in a wavy shape.
[0012] Furthermore, the fins include a plurality of fin segments connected sequentially along the longitudinal direction, and the coolant passes laterally through each of the fins. Each fin segment includes:
[0013] The first plate is arranged longitudinally, and its upper surface is flush with the upper surface of the substrate;
[0014] The second plate is arranged vertically, and its top end is connected to one longitudinal end of the first plate;
[0015] The third plate is arranged longitudinally, with its first longitudinal end connected to the bottom end of the second plate, and the bottom of the third plate connected to the bottom of the groove;
[0016] The fourth plate is vertically arranged, with its bottom end connected to the second longitudinal end of the third plate and its top end connected to the first longitudinal end of the next fin segment.
[0017] Furthermore, the fin includes a first fin and a second fin, which are arranged alternately in sequence, and the second plate of the first fin and the first plate of the second fin are connected longitudinally at their middle portions.
[0018] Furthermore, the mounting area includes multiple units, and the fin group also includes multiple units. Each of the multiple fin groups corresponds to one of the multiple mounting areas, and coolant flows into each of the fin groups in sequence.
[0019] Furthermore, the number of fin groups is four.
[0020] Furthermore, the cooling plate also includes:
[0021] The second solder plate has its lower surface connected to the upper surface of the fin assembly and the upper surface of the substrate, and its upper surface connected to the lower surface of the cover plate. The substrate is brazed to the cover plate through the second solder plate.
[0022] Furthermore, the fins are made of copper.
[0023] Furthermore, the cover plate is made of copper.
[0024] Furthermore, the liquid inlet and the liquid outlet are disposed on the side of the substrate.
[0025] Due to the above technical solution, this utility model has the following beneficial effects:
[0026] According to this utility model, a cooling plate with finned assemblies has a substrate with grooves, inlet holes, and outlet holes for coolant flow. The finned assemblies are disposed within the grooves, and the finned assemblies and the substrate are formed separately. Compared to machining fins or needle fins on the substrate, this reduces the difficulty of cooling plate manufacturing. Furthermore, even if an abnormality occurs during fin machining, only one fin is scrapped, without affecting the substrate, thus reducing scrap rate and costs. Moreover, the substrate and finned assemblies can be manufactured simultaneously, increasing work efficiency and production capacity. Attached Figure Description
[0027] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.
[0028] Figure 1 This is a finned cooling plate according to one embodiment of the present invention;
[0029] Figure 2 yes Figure 1 Structural diagram of the cooling plate without the cover plate in the embodiment;
[0030] Figure 3 This is a structural diagram of a fin assembly according to an embodiment of the present invention;
[0031] Figure 4 This is a structural diagram of a fin according to an embodiment of the present invention.
[0032] Figure label:
[0033] 100, cover plate; 200, substrate; 210, liquid inlet; 220, liquid outlet; 230, groove; 300, fin assembly; 301, first plate; 302, second plate; 303, third plate; 304, fourth plate; 310, first fin; 320, second fin. Detailed Implementation
[0034] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.
[0035] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.
[0036] The following describes a cooling plate with finned assembly 300 according to an embodiment of the present invention.
[0037] like Figure 1 As shown in the figure, the cooling plate with fin assembly 300 in this embodiment of the present invention includes a substrate 200, fin assembly 300, a first solder plate and a cover plate 100.
[0038] First, let’s describe the substrate 200. The upper surface of the substrate 200 has a groove 230 for supplying coolant flow, and has an inlet hole 210 and an outlet hole 220 communicating with the groove 230.
[0039] like Figure 1 and Figure 2 As shown, the coolant enters the groove 230 from the inlet hole 210, then enters the outlet hole 220 from the groove 230, and finally flows out from the outlet hole 220.
[0040] Optionally, the liquid inlet 210 and the liquid outlet 220 are disposed on the side of the substrate 200.
[0041] Next, the fin assembly 300 and the first solder plate will be described. The fin assembly 300 includes a plurality of fins arranged sequentially along the coolant flow direction. Adjacent fins in the fin assembly 300 are interconnected, and the fins extend in a direction perpendicular to the cooling flow. The fins have perforations formed on them to supply coolant flow. The first solder plate is disposed between the groove 230 and the fin assembly 300, and the fin assembly 300 is brazed to the substrate 200 via the first solder plate. The perforations can be either the hollow portions of the wavy fins (described below) or holes.
[0042] like Figure 3 As shown, the fin assembly 300 includes 12 fins spaced apart laterally (in the direction of coolant flow). The fins have multiple longitudinally arranged perforations; coolant flows through these perforations, increasing the heat dissipation area and thus improving heat dissipation efficiency.
[0043] like Figure 2 As shown, the fin assembly 300 is connected to the groove 230 via a first solder plate. The first solder plate can be placed between the fin assembly 300 and the substrate 200 in the groove 230. The substrate 200, the first solder plate, and the fin assembly 300 are placed in a brazing furnace to achieve a brazing connection, thereby reducing the contact thermal resistance between the fin assembly 300 and the substrate 200 and improving heat dissipation efficiency.
[0044] Finally, the cover plate 100 will be described. The lower surface of the cover plate 100 covers the upper surface of the substrate 200. The upper surface of the cover plate 100 has multiple mounting areas for connecting chips, and the positions of the mounting areas correspond to the positions of the fin assembly 300. That is, the fin assembly 300 is located directly below the mounting areas.
[0045] The cover plate 100 can seal the groove 230, thereby forming a flow channel for supplying coolant. The mounting area on the upper surface of the cover plate 100 can mount chips, thereby enabling efficient cooling of the chips.
[0046] The cooling plate with fin assembly 300 described above has a substrate 200 with grooves 230, liquid inlet holes 210, and liquid outlet holes 220 for coolant flow. The fin assembly 300 is disposed within the grooves 230, and the fin assembly 300 and substrate 200 are formed separately. Compared to machining fins or needle fins on the substrate 200, this reduces the difficulty of cooling plate manufacturing. Furthermore, even if an abnormality occurs during fin machining, only one fin is scrapped, without affecting the substrate 200, thus reducing scrap rate and costs. Moreover, the substrate 200 and fin assembly 300 can be manufactured simultaneously, increasing work efficiency and production capacity.
[0047] In some embodiments of this invention, the fins are formed in a wavy shape. The wavy shape can be wave-like, square-wave-like, triangular-wave-like, etc.
[0048] The wavy shape of the fins increases the contact area between the coolant and the fins, thus improving heat dissipation efficiency.
[0049] Furthermore, the fins include multiple fin segments connected sequentially along the longitudinal direction. Coolant passes laterally through each fin. Each fin segment includes: a first plate 301, which is longitudinally arranged and has its upper surface flush with the upper surface of the substrate 200; a second plate 302, which is vertically arranged and has its top end connected to one longitudinal end of the first plate 301; a third plate 303, which is longitudinally arranged and has its first longitudinal end connected to the bottom end of the second plate 302, and its bottom end connected to the bottom of the groove 230; and a fourth plate 304, which is vertically arranged and has its bottom end connected to the second longitudinal end of the third plate 303, and its top end connected to one longitudinal end of the first plate 301 of the next fin segment. The transverse and longitudinal directions are as follows: Figures 2 to 4 As shown.
[0050] like Figure 4As shown, the fins are formed in a square wave shape. The fins include multiple fin segments connected in sequence, each segment comprising a first plate 301, a second plate 302, a third plate 303, and a fourth plate 304 connected longitudinally in sequence. The bottom of the third plate 303 is connected to the bottom of the groove 230, and the top of the first plate 301 is connected to the lower surface of the cover plate 100, resulting in a relatively large contact area and reduced thermal resistance. Coolant flowing through the second plate 302 and the fourth plate 304 increases the contact area with the coolant, improving heat dissipation efficiency. The second plate 302, third plate 303, and fourth plate 304 can form pores, as can the fourth plate 304, the first plate 302 of adjacent fin segments, and the second plate 302 of adjacent fin segments, to allow coolant flow.
[0051] Alternatively, the fins can be formed by stamping long strips of metal, with each fin having the same thickness. This method is relatively simple and has high work efficiency.
[0052] Furthermore, the fins include a first fin 310 and a second fin 320, which are arranged alternately in sequence, and the second plate 302 of the first fin 310 and the first plate 301 of the second fin 320 are connected longitudinally at the middle.
[0053] like Figure 3 As shown, the first fin 310 and the second fin 320 are arranged alternately and interleaved (the second plate 302 of the first fin 310 and the first plate 301 of the second fin 320 are connected longitudinally at the middle). The coolant flows through the first channel of the first fin 310 (composed of the second plate 302, the third plate 303, and the fourth plate 304) and encounters the second fin 320, where it splits into two streams (the first stream and the second stream). The coolant then flows through the second channel of the first fin 310 (composed of the fourth plate 304, the first plate 301, and the second plate 302), where it encounters the second fin 320 and the fourth plate 304, where it splits into two streams (the third stream and the fourth stream). These streams merge and then flow through the first fin 310 again, resulting in continuous splitting and merging of the coolant as it passes through each fin. This process ensures more efficient heat exchange between the coolant and the fin assembly 300, improving the chip's heat dissipation efficiency. Furthermore, it makes the coolant temperature more uniform, improving the uniformity of heat dissipation to the chip.
[0054] In some embodiments of this utility model, the mounting area includes multiple fin groups 300, and the multiple fin groups 300 correspond one-to-one with the multiple mounting areas, and the coolant flows into each fin group 300 in sequence.
[0055] like Figure 2As shown, the four fin groups 300 are arranged horizontally at intervals, corresponding one-to-one with the four mounting areas, so that the four chips can be cooled simultaneously.
[0056] It should be noted that the above are just optional examples. The fin group 300 can also have three, five, six, etc., and these should all be understood within the scope of this utility model.
[0057] In some embodiments of this utility model, the cooling plate further includes a second solder plate. The lower surface of the second solder plate is connected to the upper surface of the fin assembly 300 and the upper surface of the substrate 200, and its upper surface is connected to the lower surface of the cover plate 100. The substrate 200 is brazed to the cover plate 100 through the second solder plate.
[0058] The second brazing plate enables brazing connections to be formed between the fin assembly 300 and the cover plate 100, as well as between the substrate 200 and the cover plate 100. These connections are relatively tight, which reduces contact thermal resistance and improves heat dissipation efficiency.
[0059] In some embodiments of this utility model, the fins are made of copper.
[0060] Copper has a high thermal conductivity, which can improve the heat dissipation efficiency of the chip and transfer the chip's heat to the coolant more efficiently.
[0061] Furthermore, the cover plate 100 is made of copper.
[0062] The chip is mounted on a copper cover plate 100, resulting in higher heat dissipation efficiency. Furthermore, the copper cover plate 100 and the copper fins can be better connected. For example, the copper cover plate 100 is brazed to the copper fins via a second copper solder plate, resulting in low contact thermal resistance and high thermal conductivity, further improving the chip's heat dissipation efficiency.
[0063] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A cooling plate with a finned assembly, characterized in that, The cooling plate includes: A substrate, wherein a groove for supplying coolant flow is formed on the upper surface of the substrate, and an inlet hole and an outlet hole communicating with the groove are provided. A fin assembly comprising a plurality of fins arranged sequentially along the coolant flow direction, adjacent fins in the fin assembly being interconnected, the fins extending in a direction perpendicular to the coolant flow direction, and the fins having perforations formed on them for supplying coolant flow. A first solder plate is disposed between the groove and the fin assembly, and the fin assembly is brazed to the substrate through the first solder plate; A cover plate, the lower surface of which covers the upper surface of the substrate, and the upper surface of the cover plate having a plurality of mounting areas for connecting chips, the positions of which correspond to the positions of the fin assembly.
2. The cooling plate with finned assembly according to claim 1, characterized in that, The fins are formed in a wavy shape.
3. The cooling plate with finned assembly according to claim 2, characterized in that, The fins comprise multiple fin segments connected sequentially along a longitudinal direction, with coolant flowing laterally through each fin. Each fin segment includes: The first plate is arranged longitudinally, and its upper surface is flush with the upper surface of the substrate; The second plate is arranged vertically, and its top end is connected to one longitudinal end of the first plate; The third plate is arranged longitudinally, with its first longitudinal end connected to the bottom end of the second plate, and the bottom of the third plate connected to the bottom of the groove; The fourth plate is vertically arranged, with its bottom end connected to the second longitudinal end of the third plate and its top end connected to the first longitudinal end of the next fin segment.
4. The cooling plate with finned assembly according to claim 3, characterized in that, The fin includes a first fin and a second fin, which are arranged alternately in sequence, and the second plate of the first fin and the first plate of the second fin are connected longitudinally at their middle portions.
5. The cooling plate with finned assembly according to claim 1, characterized in that, The installation area includes multiple units, and the fin group also includes multiple units. Each of the multiple fin groups corresponds to one of the multiple installation areas, and the coolant flows into each of the fin groups in sequence.
6. The cooling plate with finned assembly according to claim 5, characterized in that, The number of fin groups is four.
7. The cooling plate with finned assembly according to claim 1, characterized in that, The cooling plate also includes: The second solder plate has its lower surface connected to the upper surface of the fin assembly and the upper surface of the substrate, and its upper surface connected to the lower surface of the cover plate. The substrate is brazed to the cover plate through the second solder plate.
8. The cooling plate with finned assembly according to claim 1, characterized in that, The fins are made of copper.
9. The cooling plate with finned assembly according to claim 8, characterized in that, The cover plate is made of copper.
10. The cooling plate with finned assembly according to claim 1, characterized in that, The liquid inlet and the liquid outlet are located on the side of the substrate.