Cooling device based on phase change heat dissipation
By using a phase change-based cooling device, which utilizes the phase change process of fluorides and the channel design of the cooling plate, the problem of low water cooling efficiency of vacuum pumps is solved, achieving rapid heat dissipation and resource conservation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SICHUAN LAISINUO INTELLIGENT EQUIPMENT TECHNOLOGY CO LTD
- Filing Date
- 2025-08-12
- Publication Date
- 2026-05-08
AI Technical Summary
Existing vacuum pumps have low water cooling efficiency, making it difficult to meet the need for rapid heat dissipation.
A phase change-based cooling device is used, in which fluoride absorbs heat and vaporizes within the heat dissipation column and releases heat and liquefies at the heat dissipation end. Combined with a cooling plate with S-shaped and straight channel design, the utilization rate of the coolant is enhanced, and heat dissipation is accelerated by a cooling fan.
It achieves rapid and effective heat dissipation, saves resources, improves the utilization rate of coolant, and reduces additional drive energy consumption.
Smart Images

Figure CN224214328U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the technical field of heat exchange devices, and in particular relates to a cooling device based on phase change heat dissipation. Background Technology
[0002] Vacuum pumps generate a significant amount of heat during operation, especially under high loads or continuous operation. Therefore, existing vacuum pumps all incorporate corresponding heat dissipation designs. Except for some very low-power pumps, most employ water cooling. However, water cooling is inefficient and cannot meet the demands of rapid heat dissipation. Therefore, phase change cooling can be considered to achieve faster heat dissipation. Utility Model Content
[0003] The purpose of this invention is to provide a cooling device based on phase change heat dissipation to solve the problems existing in the prior art. To achieve the above-mentioned objective, the technical solution adopted by this invention is as follows:
[0004] A cooling device based on phase change heat dissipation includes a heat dissipation base, heat dissipation columns, cooling plates, and a heat dissipation fan; the top of the heat dissipation base is uniformly provided with several groups of heat dissipation columns along the length direction, each group of heat dissipation columns includes several heat dissipation columns uniformly and vertically arranged along the width direction of the heat dissipation base, and several cooling plates are uniformly provided on the heat dissipation columns along the height direction.
[0005] Furthermore, the cooling plate is provided with a cooling cavity, and the cooling plate has symmetrical liquid inlets and liquid outlets on the middle parts of its two opposite sides. The liquid inlets and liquid outlets are connected to the cooling cavity. The top of the cooling cavity is provided with a detachable cover plate. The cooling cavity is provided with a heat dissipation channel adapted to the number of heat dissipation columns. The liquid inlet is connected to the input end of the heat dissipation channel, and the liquid outlet is connected to the output end of the heat dissipation channel.
[0006] Furthermore, the heat dissipation channel includes an S-shaped channel and a straight channel. The straight channel is symmetrically arranged on both sides of each heat dissipation column group, and the S-shaped channel is arranged on the side of the straight channel away from the heat dissipation column group.
[0007] Furthermore, the inner wall of the heat dissipation column is uniformly provided with multiple grooves along the height direction of the heat dissipation column.
[0008] Furthermore, the top of the heat sink base, located within the heat sink column, is uniformly provided with multiple recesses.
[0009] Furthermore, several cooling fans are arranged between the cooling plates.
[0010] This invention offers the following advantages: By incorporating a heat dissipation column filled with fluoride, the fluoride rapidly absorbs heat and vaporizes at the heat source end of the pump body, and releases heat and liquefies at the heat dissipation end, achieving rapid heat dissipation for the pump body. To further accelerate heat dissipation, a cooling plate and fan are installed at the heat dissipation end. The cooling plate contains S-shaped and straight channels. The coolant in the straight channels directly contacts the heat dissipation column, quickly carrying away heat and accelerating the phase change process. Meanwhile, residual heat continues to dissipate through the S-shaped channels, which improve coolant utilization and conserve resources. Furthermore, the circulation of the fluoride is achieved through its own liquefaction, gravity dripping, and vaporization, requiring no additional drive and indirectly saving resources. Attached Figure Description
[0011] Figure 1 This is an exploded view of the device;
[0012] Figure 2 This is a cross-sectional view of the heat sink base and heat sink pillars;
[0013] Component designations: 1. Heat sink base, 101. Heat sink column, 2. Groove, 201. Cooling plate, 3. Liquid inlet, 301. Liquid outlet, 302. Cover plate, 303. Heat dissipation channel, 4. S-shaped channel, 401. Straight channel, 402. Cooling fan, 5. Detailed Implementation
[0014] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Unless otherwise specified, the technical means used in the embodiments are conventional means well known to those skilled in the art.
[0015] In the description of this utility model, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0016] like Figure 1-2As shown, a cooling device based on phase change heat dissipation includes a heat dissipation base 1, heat dissipation columns 2, and cooling plates 3. The top of the heat dissipation base 1 is uniformly provided with several groups of heat dissipation columns along its length. Each group of heat dissipation columns includes several heat dissipation columns 2 uniformly and vertically arranged along the width of the heat dissipation base 1. Several cooling plates 3 are uniformly provided on the heat dissipation columns 2 along their height. The heat dissipation columns 2 penetrate the cooling plates 3, and the cooling plates 3 are relatively fixed to the heat dissipation columns 2. The heat dissipation base 1 is in close contact with the heat source part of the vacuum pump (generally the lower end). The heat dissipation columns 2 are filled with fluoride. The fluoride at the bottom exchanges heat with the heat source and vaporizes, rising upwards. After being cooled by the cooling plates 3 and the cooling fan 5, it liquefies and falls back to the bottom of the heat dissipation columns 2 due to gravity. The number and diameter of the heat dissipation columns 2 are determined according to specific requirements.
[0017] like Figure 1 As shown, the cooling plate 3 has a cooling cavity. On the two sides of the cooling plate 3, which are far apart from each other, there are symmetrically arranged liquid inlets 301 and outlets 302. The liquid inlets 301 and 302 are connected to an external cooling circulation system. The liquid inlets 301 and 302 are connected to the cooling cavity. The external cooling circulation system injects coolant into the cooling cavity through the liquid inlets 301. After absorbing heat, the coolant returns to the external cooling circulation system through the outlets 302. The top of the cooling cavity has a removable cover plate 303, which facilitates maintenance inside the cooling cavity. The cooling cavity has a heat dissipation channel 4 adapted to the number of heat dissipation column groups. The liquid inlet 301 is connected to the input end of the heat dissipation channel 4, and the liquid outlet 302 is connected to the output end of the heat dissipation channel 4. The heat dissipation channel 4 includes an S-shaped channel 401 and a straight channel 402. The straight channel 402 is symmetrically arranged on both sides of each heat dissipation column group, and the S-shaped channel 401 is located on the side of the straight channel 402 furthest from the heat dissipation column group. The straight channel 402 is a straight channel separated by multiple linear baffles, allowing coolant to quickly enter from the input end and exit from the output end, rapidly carrying away a large amount of heat. However, the coolant utilization rate is not high, and the heat absorbed per unit volume of coolant is relatively small. The S-shaped channel 401, by lengthening the coolant's path, increases the coolant's residence time in the cooling chamber, thereby increasing its utilization rate. To enable the fluoride in the heat dissipation column 2 to quickly complete its phase change, rapid heat dissipation from the top is required. The straight channel 402 is in direct contact with the heat dissipation column 2, thus quickly carrying away some of the heat within the heat dissipation column 2. The remaining heat diffuses from the contact area between the cooling plate 3 and the heat dissipation column 2 to other parts of the cooling plate 3. Relatively speaking, this portion of heat does not require rapid heat dissipation; therefore, the S-shaped channel 401 is used for its dissipation.
[0018] like Figure 2As shown, the inner wall of the heat dissipation column 2 is uniformly provided with multiple grooves 201 arranged along the height direction of the heat dissipation column 2. The top of the heat dissipation base 1, located inside the heat dissipation column 2, is uniformly provided with multiple recesses 101. The grooves 201 are vertically arranged, which can increase the heat exchange area and facilitate the reflux of fluoride. The liquid fluoride in the recesses 101 is relatively independent and can reach a higher temperature instantly when heated, thereby increasing the superheat of the fluoride and accelerating the phase change, thus enhancing the phase change effect.
[0019] In addition, several cooling fans 5 are arranged between the cooling plates 3. The cooling fans 5 can increase or decrease the airflow over the surface of the cooling plates 3, thereby enabling more rapid heat exchange with the air.
[0020] The embodiments described above are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Any modifications, alterations, alterations, or substitutions made by those skilled in the art to the technical solutions of the present utility model without departing from the spirit of the present utility model shall fall within the protection scope defined by the claims of the present utility model.
Claims
1. A cooling device based on phase change heat dissipation, characterized in that: It includes a heat dissipation base (1), heat dissipation columns (2) and cooling plates (3); the top of the heat dissipation base (1) is uniformly provided with several groups of heat dissipation columns along the length direction, each group of heat dissipation columns includes several heat dissipation columns (2) uniformly and vertically arranged along the width direction of the heat dissipation base (1), and several cooling plates (3) are uniformly provided on the heat dissipation columns (2) along the height direction, and the cooling plates (3) are provided with heat dissipation channels (4).
2. The cooling device based on phase change heat dissipation according to claim 1, characterized in that: The cooling plate (3) is provided with a cooling cavity. The cooling plate (3) is provided with an inlet (301) and an outlet (302) symmetrically in the middle of the two sides away from each other. The inlet (301) and the outlet (302) are connected to the cooling cavity. The top of the cooling cavity is provided with a detachable cover plate (303). The cooling cavity is provided with a heat dissipation channel (4) adapted to the number of heat dissipation columns. The inlet (301) is connected to the input end of the heat dissipation channel (4), and the outlet (302) is connected to the output end of the heat dissipation channel (4).
3. A cooling device based on phase change heat dissipation according to claim 1, characterized in that: The heat dissipation channel (4) includes an S-shaped channel (401) and a straight channel (402). The straight channel (402) is symmetrically arranged on both sides of each heat dissipation column group, and the S-shaped channel (401) is arranged on the side of the straight channel (402) away from the heat dissipation column group.
4. A cooling device based on phase change heat dissipation according to claim 1, characterized in that: The inner wall of the heat dissipation column (2) is uniformly provided with multiple grooves (201) arranged along the height direction of the heat dissipation column (2) in the circumferential direction.
5. A cooling device based on phase change heat dissipation according to claim 1, characterized in that: The top of the heat sink (1) located inside the heat sink column (2) is provided with a plurality of recesses (101) evenly distributed.
6. A cooling device based on phase change heat dissipation according to claim 1, characterized in that: Several cooling fans (5) are arranged between the cooling plates (3).