High and low temperature aging test device for EC fan mainboard

Abstract

The utility model discloses a high and low temperature aging test device of an EC fan mainboard. The high and low temperature aging test device comprises a test host, an air conditioning host and an ultrasonic host. A vibration chamber, a heating chamber and a freezing chamber are arranged in the testing host from top to bottom, three-mode testing of a low-temperature state, a high-temperature state and a vibration state is achieved respectively, stability of extreme temperature conditions is ensured, and simulation of real working conditions is more accurate. According to the test fixture, a plurality of layers of clamping column assemblies are adopted to vertically clamp the PCB mainboard in a suspended mode, the PCB mainboard is densely clamped in the vertical direction, and the single-time test capacity is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of quality inspection equipment technology, and in particular to a high and low temperature aging test device for EC fan motherboards. Background Technology

[0002] Aging tests refer to the process of conducting experiments that simulate the aging effects of various factors encountered by a product under real-world usage conditions.

[0003] Commonly used EC fan motherboard quality inspection equipment generally includes a freezer chamber, a heating chamber, and a vibration chamber. These chambers are used to subject the target EC fan motherboard to fixed-cycle freezing, heating, and vibration treatments to simulate the actual application environment of the product. After undergoing these enhanced tests, the motherboard is then functionally tested to ensure that its anti-aging performance meets quality requirements.

[0004] Because EC fan motherboards are circular in shape, existing EC fan motherboard quality inspection equipment mostly uses flat-layout fixtures for anti-aging tests. This has the following disadvantages: 1. The flat-layout fixture only exposes the top surface to alternating hot and cold temperatures, which differs from the actual working environment and makes the experiment less rigorous; 2. The flat-layout fixture can only perform a limited number of tests per cycle, making it difficult to meet the aging test requirements of large batches of EC fan motherboards; 3. When removing the flat-layout fixture, the EC fan motherboards need to be manually removed one by one, which is very time-consuming and labor-intensive. Utility Model Content

[0005] To address the shortcomings of existing technologies, the purpose of this utility model is to provide a high and low temperature aging test device for EC fan motherboards, which improves the simulation degree of EC fan motherboards in high and low temperature aging tests, makes the test results more accurate and reliable, increases the tooling speed and tooling quantity of the test fixture, and greatly improves the test efficiency.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a high and low temperature aging test device for an EC fan motherboard, comprising a test host, wherein the interior of the test host is provided with a vibration chamber, a heating chamber, and a freezing chamber arranged sequentially from top to bottom. Test fixtures are interactively assembled inside the vibration chamber, heating chamber, and freezing chamber, and each test fixture is sequentially tested in the freezing chamber, heating chamber, and vibration chamber. An ultrasonic base is provided at the bottom of the vibration chamber, and multiple suspended support rods are connected between the ultrasonic base and the bottom surface of the vibration chamber, forming a suspended space between the ultrasonic base and the bottom surface of the vibration chamber. At least one ultrasonic transducer is installed at the bottom of the ultrasonic base; the heating chamber... The heating chamber has an air inlet on its side, equipped with a fan and a condenser on its outer side to heat the interior of the heating chamber. The freezing chamber has another air inlet on its side, equipped with a different fan and an evaporator on its outer side to cool the interior of the freezing chamber. The testing unit has an air conditioning unit on its side, containing a compressor and an expansion valve. The condenser, expansion valve, evaporator, and compressor are sequentially connected via copper tubing. The top of the air conditioning unit has an ultrasonic unit, containing an ultrasonic generator connected to each ultrasonic transducer.

[0007] In a further technical solution, a metal heat-conducting partition is provided between the vibration chamber and the heating chamber, and the two chambers are separated by the heat-conducting partition. The heat-conducting partition has multiple heat-conducting holes that run vertically through it. A heat insulation board is provided between the heating chamber and the freezing chamber, and the two chambers are separated by the heat insulation board. The heat insulation board is made of rigid polyurethane or rock wool insulation board.

[0008] In a further technical solution, guide rails are provided on both sides of the bottom of the heating chamber and the freezing chamber for sliding insertion of the test fixture.

[0009] In a further technical solution, the top of the ultrasonic base is provided with multiple positioning pins; the bottom of the test fixture is provided with multiple positioning holes, the test fixture is placed on the top surface of the ultrasonic base, and each positioning hole is respectively fitted with the corresponding positioning pin.

[0010] In a further technical solution, the operating frequency of the ultrasonic transducer is 100kHz to 500kHz.

[0011] In a further technical solution, the test fixture includes a fixture base plate and multiple clamping column assemblies. The fixture base plate is rectangular. Each clamping column assembly is arranged in an array on the upper surface of the fixture base plate. Each clamping column assembly has multiple telescopic partition brackets spaced vertically on its surface to support the target PCB motherboard. Each PCB motherboard is placed vertically on the corresponding partition bracket during tooling.

[0012] In a further technical solution, the clamping column assembly includes an external clamping sleeve and a delayed linkage assembly. The clamping sleeve has multiple sets of insertion holes spaced vertically along its wall. Each set of insertion holes includes three circumferentially spaced, through-hole telescopic insertion holes that extend radially along the clamping sleeve. The separating bracket includes three circumferentially spaced telescopic support rods, which are slidably inserted into their respective telescopic insertion holes. The inner end of each telescopic support rod has a linkage rod that is vertically positioned. The delayed linkage assembly includes multiple vertically connected linkage components. The interiors of the three telescopic support rods of the same separating bracket are connected to the corresponding linkage components. The linkage components are rotatably installed in the inner cavity of the clamping sleeve. The bottom of each linkage component has three circumferentially spaced arc-shaped linkage grooves. The inner ends of the arc-shaped linkage grooves gradually converge toward the center of the linkage component. The linkage rods of each telescopic support rod are slidably fitted into their respective arc-shaped linkage grooves. When the linkage component rotates around its axis, it drives the telescopic support rods to extend or retract radially.

[0013] In a further technical solution, a linkage rod connects two adjacent linkage components. An upper interface is located at the center of the top surface of the linkage component, and a baffle is located on each side of the inner wall of the upper interface. A lower interface and a lower cover plate are located at the center of the bottom surface of the linkage component. A shaped insertion hole is located at the center of the lower cover plate, and a linkage slot is located on each side of the shaped insertion hole. The lower cover plate is fixed to the bottom of the linkage component and covers the arc-shaped linkage groove. The upper part of the linkage rod has upper protrusions on both sides, and the lower part has lower protrusions on both sides. The upper part of the linkage rod is inserted into the shaped insertion hole and lower interface of the upper linkage component and fixed to the lower interface by a locking screw. The upper protrusions on both sides are engaged with the corresponding linkage slots. The lower part of the linkage rod is inserted into the upper interface of the lower linkage component, and the lower protrusions on both sides are connected and engaged with the corresponding baffles to achieve delayed rotation linkage between the upper and lower linkage components.

[0014] In a further technical solution, a limiting ring is fixed at the top of the linkage component. The limiting ring is sleeved on the corresponding linkage rod and cooperates with the upper protrusion limiting ring.

[0015] In a further technical solution, a hexagonal nut is provided on the top of the linkage component located at the top.

[0016] The advantages of this invention compared to the prior art after adopting the above structure are:

[0017] 1. The test host features a three-dimensional, layered design. Through the vertical distribution of the vibration chamber, heating chamber, and freezing chamber, it achieves three-mode testing under low temperature, high temperature, and vibration conditions, ensuring stability under extreme temperature conditions and simulating real working conditions more accurately.

[0018] 2. The ultrasonic transducer drives the base to generate high-frequency micro-amplitude vibration. Compared with traditional mechanical vibration, it can uniformly transmit stress to multiple PCB motherboards, avoid local overload damage, and trigger fine structural defects, thereby improving the effectiveness of the test.

[0019] 3. The test fixture features a telescopic bracket design for the clamping column assembly, supporting multi-layer vertical stacking and improving space utilization, doubling the single-test capacity. The mechanical structure of the linkage and delay linkage rod allows for simultaneous control of all layered bracket extensions and retractions simply by rotating the top nut, achieving "one-click" quick loading and unloading, reducing operation time by 70%.

[0020] 4. The vertically designed test fixture makes the target PCB motherboard a suspended fixture, with both its bottom and top surfaces subjected to heat, further improving the rigor of high and low temperature test simulation. Attached Figure Description

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0022] Figure 1 This is a schematic diagram of the structure of this utility model.

[0023] Figure 2 This is a schematic diagram of the test fixture in this utility model.

[0024] Figure 3 This is a structural schematic diagram of the clamping column assembly in this utility model.

[0025] Figure 4 This is a schematic diagram showing the connection between the linkage rod and the upper interface in this utility model.

[0026] Figure 5 This is a schematic diagram of the arc-shaped linkage groove of the linkage component in this utility model. Detailed Implementation

[0027] The following are merely preferred embodiments of the present invention and do not limit the scope of protection of the present invention.

[0028] like Figures 1 to 5As shown, a high and low temperature aging test device for an EC fan motherboard includes a test host 1. Inside the test host 1, from top to bottom, are arranged a vibration chamber 13, a heating chamber 12, and a freezing chamber 11. Test fixtures 4 are interactively assembled inside the vibration chamber 13, heating chamber 12, and freezing chamber 11. Each test fixture 4 is sequentially connected to the freezing chamber 11, heating chamber 12, and vibration chamber 13 for testing. An ultrasonic base 131 is provided at the bottom of the vibration chamber 13. Multiple suspended support rods 1310 connect the ultrasonic base 131 to the bottom surface of the vibration chamber 13, forming a suspended space between the ultrasonic base 131 and the bottom surface of the vibration chamber 13. At least one ultrasonic transducer 1312 is installed at the bottom of the ultrasonic base 131. The heating chamber 12 has a side... The heating chamber 12 has an air inlet with a fan and a condenser 22 on its outer side to heat the interior of the heating chamber 12. The freezing chamber 11 has another air inlet on its side with a fan and an evaporator 21 on its outer side to cool the interior of the freezing chamber 11. The test host 1 has an air conditioning host 2 on its side with a compressor 23 and an expansion valve 24 inside. The condenser 22, expansion valve 24, evaporator 21 and compressor 23 are connected in sequence through copper pipes. The top of the air conditioning host 2 has an ultrasonic host 3 with an ultrasonic generator 31 inside. The ultrasonic generator 31 is connected to each ultrasonic transducer 1312.

[0029] The test host 1, with its three-dimensional layered design, achieves three-mode testing under low temperature, high temperature and vibration conditions through the vertical distribution of the vibration chamber 13, heating chamber 12 and freezing chamber 11, ensuring stability under extreme temperature conditions and simulating real working conditions more accurately.

[0030] The prepared test fixture 4 is placed into the freezing chamber 11, heating chamber 12 and vibration chamber 13 in sequence, and three-mode tests are performed in low temperature, high temperature and vibration states respectively.

[0031] The ultrasonic transducer 1312 is used to drive the base to generate high-frequency micro-amplitude vibration. Compared with traditional mechanical vibration, it can uniformly transmit stress to multiple PCB motherboards 99, avoid local overload damage, and trigger fine structural defects, thereby improving the effectiveness of testing.

[0032] Specifically, a metal heat-conducting partition 130 is provided between the vibration chamber 13 and the heating chamber 12, separating them from each other. The heat-conducting partition 130 has multiple through-holes 1301. A heat insulation plate 110 is provided between the heating chamber 12 and the freezing chamber 11, separating them from each other. The heat insulation plate 110 is made of rigid polyurethane or rock wool insulation board. This makes the internal temperature of the vibration chamber 13 similar to that during actual operation, and with ultrasonic vibration, further improves the simulation realism of the actual application scenario.

[0033] Specifically, guide rails 10 are provided on both sides of the bottom of the heating chamber 12 and the freezing chamber 11 for sliding and inserting the test fixture 4.

[0034] Specifically, the top of the ultrasonic base 131 is provided with multiple positioning pins 1311; the bottom of the test fixture 4 is provided with multiple positioning holes 40. The test fixture 4 is placed on the top surface of the ultrasonic base 131, and each positioning hole 40 is respectively fitted into the corresponding positioning pin 1311.

[0035] Specifically, the ultrasonic transducer 1312 operates at a frequency of 100kHz to 500kHz.

[0036] Specifically, this embodiment provides a test fixture 4, which includes a fixture base plate and multiple clamping column assemblies 41. The fixture base plate is rectangular. Each clamping column assembly 41 is arranged in an array on the upper surface of the fixture base plate. Each clamping column assembly 41 has multiple telescopic partition brackets spaced along the vertical direction on its surface for supporting the target PCB motherboard 9. Each PCB motherboard 9 is placed on the corresponding partition brackets spaced along the vertical direction during tooling.

[0037] Specifically, the clamping column assembly 41 includes an external clamping sleeve 411 and a delayed linkage assembly. The wall of the clamping sleeve 411 is provided with multiple insertion hole groups spaced vertically. Each insertion hole group includes three circumferentially spaced, through-hole telescopic insertion holes 410, which extend radially along the clamping sleeve 411. The separating bracket includes three circumferentially spaced telescopic support rods 412, which are slidably inserted into the corresponding telescopic insertion holes 410. The inner end of each telescopic support rod 412 is provided with a linkage rod 4121, which is vertically arranged. The delayed linkage assembly... The assembly includes multiple linkage components 43 connected vertically. The interiors of the three telescopic support rods 412 of the same partition bracket are respectively connected to the corresponding linkage components 43. The linkage components 43 are rotatably installed in the inner cavity of the clamping sleeve 411. The bottom of the linkage component 43 is provided with three circumferentially spaced arc-shaped linkage grooves 430. The inner ends of the arc-shaped linkage grooves 430 gradually move towards the center of the linkage component 43. The linkage round rods 4121 of each telescopic support rod 412 are slidably assembled in the corresponding arc-shaped linkage grooves 430. When the linkage component 43 rotates around its axis, it drives the telescopic support rods 412 to extend or retract radially.

[0038] The test fixture 4, through the telescopic bracket design of the clamping column assembly 41, supports vertical multi-layer stacking, improving space utilization and doubling the single-test capacity. The mechanical structure of the linkage component 43 and the linkage rod 44 allows for simultaneous control of the extension and retraction of all layered brackets simply by rotating the top nut, achieving "one-click" quick loading and unloading, reducing operation time by 70%.

[0039] The vertically designed test fixture 4 makes the target PCB motherboard 9 a suspended fixture, with both its bottom and top surfaces subjected to heat, further improving the rigor of high and low temperature test simulation.

[0040] Specifically, a linkage rod 44 connects two adjacent linkage components 43. An upper interface 433 is located at the center of the top surface of the linkage component 43, and a baffle 434 is provided on each side of the inner wall of the upper interface 433. A lower interface 432 and a lower cover plate 4321 are located at the center of the bottom surface of the linkage component 43. An irregularly shaped insertion hole is located at the center of the lower cover plate 4321, and a linkage slot 4320 is located on each side of the irregularly shaped insertion hole. The lower cover plate 4321 is fixed to the bottom of the linkage component 43 and covers the arc-shaped linkage slot 430. The upper sides of the linkage rod 44... Each link rod 44 has an upper protrusion 441 and lower protrusions 442 on both sides of its lower part. The upper part of the link rod 44 is inserted into the irregular hole and lower interface 432 of the upper link member 43 and is fixed to the lower interface 432 by a locking screw 440. The upper protrusions 441 on both sides are respectively engaged with the corresponding link slots 4320. The lower part of the link rod 44 is inserted into the upper interface 433 of the lower link member 43, and the lower protrusions 442 on both sides are respectively connected and engaged with the corresponding baffles 434 to realize the delayed rotation linkage of the upper and lower link members 43.

[0041] Specifically, a limiting ring 431 is fixed to the top of the linkage component 43. The limiting ring 431 is sleeved on the corresponding linkage rod 44 and cooperates with the upper protrusion 441 for limiting.

[0042] Specifically, a hexagonal nut 42 is provided on the top of the linkage component 43 located at the top.

[0043] During actual clamping, for each PCB motherboard 9 inserted, the hexagonal nut 42 is rotated and tightened one turn to extend the upper telescopic support rod 412, allowing the next PCB motherboard 9 to be clamped. The operation is simple and the clamping is quick.

[0044] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A high and low temperature aging test device for an EC fan motherboard, characterized in that: The test unit includes a test host (1). Inside the test host (1), from top to bottom, there are a vibration chamber (13), a heating chamber (12), and a freezing chamber (11). Test fixtures (4) are installed inside the vibration chamber (13), the heating chamber (12), and the freezing chamber (11). Each test fixture (4) is used in conjunction with the freezing chamber (11), the heating chamber (12), and the vibration chamber (13) for testing. An ultrasonic base (131) is provided at the bottom of the vibration chamber (13). Multiple suspended support rods (1310) are connected between the ultrasonic base (131) and the bottom surface of the vibration chamber (13), and a suspended space is formed between the ultrasonic base (131) and the bottom surface of the vibration chamber (13). At least one ultrasonic transducer (1312) is installed at the bottom of the ultrasonic base (131). The heating chamber (12) is provided with an air inlet on the side, and a fan device is provided at the air inlet. A condenser (22) is provided on the outside of the air inlet to heat the interior of the heating chamber (12) with hot air. The side of the freezer compartment (11) is provided with another air inlet, which is equipped with another fan device. An evaporator (21) is provided on the outside of the air inlet to cool the interior of the freezer compartment (11). The side of the test host (1) is provided with an air conditioning host (2). The air conditioning host (2) is equipped with a compressor (23) and an expansion valve (24). The condenser (22), expansion valve (24), evaporator (21) and compressor (23) are connected in sequence through copper pipes. An ultrasonic host (3) is provided on the top of the air conditioning unit (2). An ultrasonic generator (31) is provided inside the ultrasonic host (3). The ultrasonic generator (31) is connected to each ultrasonic transducer (1312).

2. The high and low temperature aging test device for an EC fan motherboard according to claim 1, characterized in that: A metal heat-conducting partition (130) is provided between the vibration chamber (13) and the heating chamber (12), and the two chambers are separated by the heat-conducting partition (130). The heat-conducting partition (130) has multiple heat-conducting holes (1301) that run vertically through it. A heat insulation board (110) is provided between the heating chamber (12) and the freezing chamber (11), and the two chambers are separated by the heat insulation board (110). The heat insulation board (110) is made of rigid polyurethane or rock wool insulation board.

3. The high and low temperature aging test device for an EC fan motherboard according to claim 2, characterized in that: The bottom sides of the heating chamber (12) and the freezing chamber (11) are respectively provided with guide rails (10) for sliding and inserting the test fixture (4).

4. The high and low temperature aging test device for an EC fan motherboard according to claim 3, characterized in that: The top of the ultrasonic base (131) is provided with multiple positioning pins (1311); the bottom of the test fixture (4) is provided with multiple positioning holes (40), the test fixture (4) is placed on the top surface of the ultrasonic base (131), and each positioning hole (40) is respectively fitted into the corresponding positioning pin (1311).

5. The high and low temperature aging test device for an EC fan motherboard according to claim 4, characterized in that: The ultrasonic transducer (1312) operates at a frequency of 100kHz to 500kHz.

6. The high and low temperature aging test device for an EC fan motherboard according to claim 1, characterized in that: The test fixture (4) includes a fixture base plate and multiple clamping column assemblies (41). The fixture base plate is rectangular. Each clamping column assembly (41) is arranged in an array on the upper surface of the fixture base plate. Each clamping column assembly (41) has multiple telescopic partition brackets spaced vertically on its surface for supporting the target PCB motherboard. Each PCB motherboard is placed vertically on the corresponding partition bracket during tooling.

7. The high and low temperature aging test device for an EC fan motherboard according to claim 6, characterized in that: The clamping column assembly (41) includes an external clamping sleeve (411) and a delayed linkage assembly. The wall of the clamping sleeve (411) is provided with multiple sets of insertion holes spaced vertically. Each set of insertion holes includes three circumferentially spaced, through-hole telescopic insertion holes (410). The telescopic insertion holes (410) extend radially along the clamping sleeve (411). The separating bracket includes three circumferentially spaced telescopic support rods (412). The telescopic support rods (412) are slidably inserted into the corresponding telescopic insertion holes (410). The inner end of the telescopic support rods (412) is provided with a linkage rod (4121), which is vertically arranged. The delayed linkage assembly includes... The device includes multiple linkage components (43) connected vertically. The interiors of the three telescopic support rods (412) of the same partition bracket are respectively connected to the corresponding linkage components (43). The linkage components (43) are rotatably installed in the inner cavity of the clamping sleeve (411). The bottom of the linkage component (43) is provided with three circumferentially spaced arc-shaped linkage grooves (430). The inner ends of the arc-shaped linkage grooves (430) gradually move towards the center of the linkage component (43). The linkage round rods (4121) of each telescopic support rod (412) are slidably assembled in the corresponding arc-shaped linkage grooves (430). When the linkage component (43) rotates around its axis, it drives the telescopic support rods (412) to extend or retract in the radial direction.

8. The high and low temperature aging test device for an EC fan motherboard according to claim 7, characterized in that: A linkage rod (44) connects two adjacent linkage components (43). An upper interface (433) is provided at the center of the top surface of the linkage component (43). A baffle (434) is provided on both sides of the inner wall of the upper interface (433). A lower interface (432) and a lower cover plate (4321) are provided at the center of the bottom surface of the linkage component (43). A shaped insertion hole is provided at the center of the lower cover plate (4321). A linkage slot (4320) is provided on both sides of the shaped insertion hole. The lower cover plate (4321) is fixed to the bottom of the linkage component (43) and covers the arc-shaped linkage slot (430). The upper part of the linkage rod (44) has upper protrusions (441) on both sides and lower part of the linkage rod (44) has lower protrusions (442) on both sides. The upper part of the linkage rod (44) is inserted into the irregular hole and lower interface (432) of the upper linkage member (43) and fixed to the lower interface (432) by a locking screw (440). The upper protrusions (441) on both sides are respectively engaged with the corresponding linkage slots (4320). The lower part of the linkage rod (44) is inserted into the upper interface (433) of the lower linkage member (43) and the lower protrusions (442) on both sides are respectively connected and blocked by the corresponding baffles (434) to realize the delayed rotation linkage of the upper and lower linkage members (43).

9. The high and low temperature aging test device for an EC fan motherboard according to claim 8, characterized in that: A limiting ring (431) is fixed to the top of the linkage component (43). The limiting ring (431) is sleeved on the corresponding linkage rod (44) and is limited in cooperation with the upper protrusion (441).

10. The high and low temperature aging test device for an EC fan motherboard according to claim 9, characterized in that: The top of the linkage component (43) located at the top is provided with a screw-on hexagonal nut (42).

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