Positioning device of rigid-flex board

Abstract

The utility model belongs to the technical field of battery manufacturing, and particularly relates to a positioning device of a rigid-flex board, which comprises a positioning piece, a plurality of insulating pieces and a cover plate, the positioning piece comprises a hard oxygen alloy plate which can position the rigid-flex board; the insulating part is arranged on the hard oxygen alloy plate, a plurality of information acquisition parts are arranged on the rigid-flex board, and the insulating part can separate the information acquisition parts from the hard oxygen alloy plate; the cover plate is matched with the positioning piece to fix the rigid-flex board; compared with the prior art, the positioning device provided by the utility model can be sequentially processed by an SMT (Surface Mount Technology) procedure, a testing procedure and a dispensing and coating procedure after the rigid-flex board is positioned once, so that an information acquisition piece can be insulated in the testing procedure, and meanwhile, the positioning device can bear high temperature and does not generate swelling deformation in the SMT procedure.

Description

Technical Field

[0001] This utility model belongs to the field of battery manufacturing technology, and in particular relates to a positioning device for a rigid-flex plate. Background Technology

[0002] The rigid-flex PCB in a Battery Management System (BMS) refers to a rigid-flex PCB formed by soldering a flexible circuit board to a printed circuit board (PCB). The fabrication of the rigid-flex PCB involves surface mount technology (SMT), testing, and adhesive application. In the SMT process, the rigid-flex PCB undergoes high-temperature oxidation, requiring the positioning device to be made of rigid materials such as metal to prevent deformation due to high-temperature expansion and contraction. In the testing process, if the data acquisition components on the rigid-flex PCB come into contact with the metal material in the positioning device, they will conduct electricity, posing a risk of burning out the chips in the rigid-flex PCB. Therefore, an insulating positioning device is needed to insulate the data acquisition components on the rigid-flex PCB. In the adhesive application process, the strength of the positioning device must be ensured, typically using a metal positioning device. Therefore, the current manufacturing method uses three different positioning devices to position the rigid-flex PCB, allowing for processing at three different stages. This requires multiple switching of positioning devices and repeated handling of the rigid-flex PCB throughout the entire manufacturing process, which can easily affect the stability and production efficiency of the rigid-flex PCB fabrication process. Utility Model Content

[0003] The purpose of this utility model is to address the aforementioned technical problems by providing a positioning device for rigid-flex boards. After positioning the rigid-flex board once, this positioning device can sequentially process it through the SMT process, the testing process, and the adhesive application process. It can insulate the information acquisition components during the testing process and withstand high temperatures during the SMT process without causing inflation or deformation.

[0004] In view of this, the present invention provides a positioning device for a rigid-flexible bonded plate, comprising:

[0005] Positioning components, including hard oxide alloy plates, which can position the rigid-soft bonded plates;

[0006] Multiple insulating components are installed on the hard oxide alloy plate, and multiple information acquisition components are installed on the flexible-hard bonding plate. The insulating components can separate the information acquisition components from the hard oxide alloy plate.

[0007] The cover plate, in conjunction with the positioning component, secures the rigid-soft bonding plate.

[0008] In this technical solution, a rigid-flex PCB is positioned on a positioning component, with the entire rigid-flex PCB in contact with a hard oxide plate. The rigid-flex PCB has multiple data acquisition components, each in contact with an insulating component, thus separating the data acquisition components from the hard oxide plate. A cover plate is then placed on the rigid-flex PCB and fixed to the positioning component, thereby securing the rigid-flex PCB between the positioning component and the cover plate. The positioning device with the rigid-flex PCB can then be processed sequentially through SMT (Surface Mount Technology), testing, and adhesive application processes. During the testing process, the data acquisition components are insulated to prevent damage to the chips within the rigid-flex PCB. During the SMT process, the hard oxide plate has good high-temperature resistance, and the insulating component is small in size, making it less prone to swelling and deformation under high temperatures.

[0009] In the above technical solution, the number of insulating parts on the hard oxide alloy plate is consistent with the number of information acquisition parts set on the soft and hard bonding plate fixed by the positioning device, and the outline of the insulating parts is adapted to the outline of the information acquisition parts.

[0010] In the above technical solution, furthermore, the hard oxide alloy plate is provided with a positioning groove for positioning the insulating component.

[0011] Furthermore, in the above technical solution, heat dissipation holes are provided on the hard oxide alloy plate, and the heat dissipation holes are located around the insulating component and the information acquisition component.

[0012] In the above technical solution, the insulating component is further connected to the hard anodized alloy plate by threaded fasteners.

[0013] In the above technical solution, furthermore, the surface of the insulating component is provided with a countersunk hole, and the threaded fastener is entirely located in the countersunk hole.

[0014] In the above technical solution, the positioning component is further provided with a product positioning pin, which is adapted to the positioning through hole on the product.

[0015] In the above technical solution, the positioning component further includes a base, a hard anodized alloy plate and an insulating component to form a tray, a product positioning pin is set on the base, and a product positioning hole is provided on the tray for the product positioning pin to pass through.

[0016] In the above technical solution, the base is further provided with a tray positioning pin, and the tray is provided with a tray positioning hole that cooperates with the tray positioning pin.

[0017] In the above technical solution, furthermore, when the positioning component is installed with the positioning soft and hard bonding plate, the end of the product positioning pin does not extend beyond the product surface.

[0018] In the above technical solution, the cover plate is further made of magnetic metal plate, and a high-temperature magnet is provided on the hard oxide alloy plate. The high-temperature magnet attracts the cover plate to fix the product.

[0019] The beneficial effects of this utility model are:

[0020] 1. By setting a hard anodizing plate to contact the rigid-flex PCB, and placing an insulating component on the hard anodizing plate at each contact point with the data acquisition component on the rigid-flex PCB, and ensuring that the outline of the insulating component matches the outline of the individual data acquisition component, the hard anodizing plate has good high-temperature resistance and can withstand the high temperature of the high-temperature furnace in the SMT process. The insulating component is small in size and is not prone to expansion and deformation when passing through the high-temperature furnace, thus ensuring the stability of the rigid-flex PCB during the manufacturing process.

[0021] 2. By designing the positioning component as a combination of a base and a tray, the base mainly serves to assist in the positioning of the rigid-flex PCB. The base is equipped with product positioning pins for positioning the rigid-flex PCB, the tray is equipped with product positioning holes for the product positioning pins to pass through, and the rigid-flex PCB is equipped with positioning through holes. In this way, through the cooperation of the product positioning pins, product positioning holes, and positioning through holes, the rigid-flex PCB can be accurately placed on the tray.

[0022] 3. By designing the cover plate as a magnetic metal plate and setting a high-temperature magnet on the back of the hard oxide alloy plate, the soft and hard bonding plate is fixed by the cooperation of the magnetic metal plate and the high-temperature magnet. The structure is simple and can reduce the overall size of the positioning device. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a three-dimensional structural diagram of the base, tray, multiple soft and hard combined plates, and cover plate in this utility model.

[0025] Figure 2 This is a schematic diagram of the rigid-soft composite plate in this utility model.

[0026] Figure 3 These are top and side view structural diagrams of the base in this utility model.

[0027] Figure 4 This is a top view of the tray structure in this utility model.

[0028] Figure 5 for Figure 4 A magnified view of a portion of point A in the middle.

[0029] Figure 6 This is a top view of the cover plate structure of this utility model.

[0030] The markings in the diagram are as follows:

[0031] 1. Base; 101. Pallet positioning pin; 102. Product positioning pin; 2. Pallet; 201. Insulating component; 202. Product positioning hole; 203. Positioning groove; 204. Pallet positioning hole; 205. High-temperature magnet; 206. Heat dissipation hole; 207. Threaded fastener; 3. Cover plate; 4. Hard anodized steel plate; 100. Flexible-rigid bonding plate; 1001. Rigid plate; 1002. Information acquisition component; 1003. Flexible plate; 1004. Positioning through hole; Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] In the description of this utility model, it should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. For ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items, and therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0034] The rigid-flexible bonded plate 100 structure in this utility model is as follows: Figure 1 and Figure 2 As shown, the rigid-flex PCB 100 is composed of a rigid board 1001 (PCB) and a flexible board 1003 (flexible circuit board). Multiple data acquisition components 1002 are disposed on the flexible board 1003. Multiple positioning through holes 1004 are disposed on both the rigid board 1001 and the flexible board 1003. (See also...) Figure 1The positioning device in this utility model can simultaneously position four sets of rigid-soft bonding plates 100.

[0035] Example 1

[0036] The positioning device provided in this embodiment includes: a positioning component, multiple insulating components 201, and a cover plate 3;

[0037] The positioning component includes a hard anodized plate 4, which can position the hard-soft bonded plate 100. The hard anodized plate 4 refers to the metal undergoing an electrochemical process of hard anodizing, thereby forming an oxide metal layer on the metal surface to improve the high temperature resistance and other properties of the metal. In this embodiment, the hard anodized plate 4 is a hard anodized aluminum plate.

[0038] Insulating element 201 is disposed on hard oxide alloy plate 4. Insulating element 201 can be fixedly connected to hard oxide alloy plate 4 or detachably connected to hard oxide alloy plate 4. The outline of a single insulating element 201 is adapted to the outline of a single information acquisition element 1002, or it can be adapted to the outline of multiple information acquisition elements 1002 at the same time. Generally, the width of a single insulating element 201 is slightly larger than the width of a single information acquisition element 1002. The insulating element 201 can only abut against the edge of the information acquisition element 1002. The insulating element 201 only needs to separate the information acquisition element 1002 from the hard oxide alloy plate 4. Each position on the hard oxide alloy plate 4 corresponding to the information acquisition element 1002 on the soft and hard bonding plate 100 is provided with an insulating element 201.

[0039] The insulating component 201 can be made of a composite material of high-temperature nanofiber felt and high-performance epoxy resin, or it can be made of glass fiber and antistatic high mechanical strength resin. These materials give the insulating component 201 good properties, such as low thermal conductivity, flame retardancy, antistatic properties, light weight, and chemical corrosion resistance. It can maintain stable physical properties in high-temperature environments such as wave soldering and reflow soldering, and can prevent the soft and hard bonding board from being damaged during processing, while also ensuring processing accuracy. For example, the insulating component 201 can be synthetic stone.

[0040] Please see Figure 1 or Figure 6 The cover plate 3 is provided with through grooves that are adapted to the contours of each component on the rigid-flexible plate 100. The cover plate 3 cooperates with the positioning member to fix the rigid-flexible plate 100. Specifically, the cover plate 3 is fixedly connected to the hard oxide alloy plate 4, and the fixed connection is detachable. In the prior art, any structure that can achieve a detachable fixed connection between the cover plate 3 and the hard oxide alloy plate 4 can be used as the structure in this embodiment where the cover plate 3 cooperates with the positioning member.

[0041] In the prior art, in order to ensure insulation of the information acquisition component 1002, the entire structure of the positioning component is made of insulating material. The volume of the insulating material is too large, and the insulating material undergoes large-area expansion and contraction deformation when passing through the high-temperature furnace, which affects the stability of the manufacturing process of the rigid-soft bonding board 100. In this embodiment, the volume of the insulating component 201 is reduced as much as possible while ensuring insulation of each information acquisition component 1002, thereby reducing the expansion and contraction deformation of the insulating component 201.

[0042] In this embodiment, a hard oxide alloy plate 4 is provided to contact the rigid-flex board 100, and an insulating member 201 is provided on the hard oxide alloy plate 4 at each position that contacts the information acquisition component 1002 on the rigid-flex board 100. The outline of the insulating member 201 is adapted to the outline of the individual information acquisition component 1002. In this way, the hard oxide alloy plate 4 has good high temperature resistance and can withstand the high temperature of the high temperature furnace in the SMT process. The insulating member 201 has a small volume and is not prone to large-area expansion deformation when passing through the high temperature furnace, thereby ensuring the stability of the rigid-flex board 100 during the manufacturing process.

[0043] Example 2

[0044] Based on Embodiment 1, this embodiment also discloses a positioning method for the positioning component to position the rigid-flexible bonded plate 100;

[0045] In this embodiment, the positioning component is provided with product positioning pins 102, which are adapted to positioning through holes 1004 on the rigid-flexible bonding plate 100. Specifically, multiple product positioning pins 102 are provided, and the multiple product positioning pins 102 are sequentially positioned opposite to the multiple positioning through holes 1004. Please refer to [link to relevant documentation]. Figure 2 The rigid-flex board 100 is also provided with multiple positioning through holes 1004. When positioning, the positioning through holes 1004 on the rigid-flex board 100 are aligned with the corresponding product positioning pins 102 and inserted to complete the positioning of the rigid-flex board 100.

[0046] Example 3

[0047] Based on Example 2, this embodiment further optimizes the structure of the positioning component;

[0048] In this embodiment, the positioning component also includes a base 1, a hard oxide alloy plate 4 and an insulating component 201 are combined to form a tray 2, a product positioning pin 102 is disposed on the base 1, and a product positioning hole 202 is provided on the tray 2 for the product positioning pin 102 to pass through.

[0049] Please see Figure 3 Multiple product positioning pins 102 are disposed on the base 1, and are sequentially positioned opposite to multiple positioning through holes 1004. Please refer to [link / reference]. Figure 4Each product positioning pin 102 corresponds to a product positioning hole 202. The product positioning hole 202 is set on the hard oxide alloy plate 4 and penetrates the upper and lower surfaces of the hard oxide alloy plate 4.

[0050] When no other positioning structure is provided between the tray 2 and the base 1, the diameter of the product positioning hole 202 should be matched with the diameter of the product positioning pin 102.

[0051] When positioning the rigid-flex plate 100, first align the product positioning hole 202 on the tray 2 with the product positioning pin 102 on the base 1 and insert it. The end of the product positioning pin 102 will pass through the product positioning hole 202 and protrude from the tray 2. Then align the rigid-flex plate 100 with the corresponding product positioning pin 102 and insert it to complete the positioning of the rigid-flex plate 100.

[0052] In this embodiment, the base 1 mainly serves to assist in positioning the rigid-flex PCB 100. After the rigid-flex PCB 100 is positioned and fixed by the cover plate 3, the hard anodized alloy plate 4 is separated from the base 1. Finally, the hard anodized alloy plate 4, the rigid-flex PCB 100 and the cover plate 3 are transferred as a whole and processed sequentially through the SMT process, the testing process and the dispensing and coating process.

[0053] Example 4

[0054] Based on embodiment 3, this embodiment further optimizes the structure between tray 2 and base 1;

[0055] In this embodiment, please refer to Figure 3 The base 1 is equipped with a tray positioning pin 101, please refer to [reference needed]. Figure 4 The tray 2 is provided with a tray positioning hole 204 that cooperates with the tray positioning pin 101. By cooperating with the tray positioning pin 101 and the tray positioning hole 204, the installation difficulty between the tray 2 and the base 1 can be reduced, and the positioning accuracy of the rigid-soft board 100 can be improved.

[0056] In this embodiment, since independent positioning structures are provided on the tray 2 and the base 1, the diameter of the product positioning hole 202 on the tray 2 can be larger than the diameter of the product positioning pin 102 on the base 1.

[0057] Example 5

[0058] Based on Example 2, this embodiment further limits the length of the product positioning pin 102;

[0059] In this embodiment, when the positioning component is installed on the rigid-flexible bonding plate 100, the end of the product positioning pin 102 does not extend beyond the surface of the rigid-flexible bonding plate 100. In this way, the product positioning pin 102 can achieve accurate positioning without affecting the processing of the rigid-flexible bonding plate 100.

[0060] Example 6

[0061] Based on Example 1, this embodiment further optimizes the connection between the insulating component 201 and the hard oxide alloy plate 4;

[0062] In this embodiment, the hard oxide alloy plate 4 is provided with positioning grooves 203 for positioning the insulating component 201. Since there are a large number of insulating components 201 to be installed on the hard oxide alloy plate 4, when installing the insulating component 201 onto the hard oxide alloy plate 4, the insulating component 201 is first inserted into the corresponding positioning groove 203, and then the insulating component 201 is fixed on the hard oxide alloy plate 4, thereby reducing the installation difficulty between the insulating component 201 and the hard oxide alloy plate 4.

[0063] Example 7

[0064] Based on Embodiment 1, this embodiment also discloses a connection method between the cover plate 3 and the hard oxide alloy plate 4;

[0065] In this embodiment, the cover plate 3 is a magnetic metal plate, and a high-temperature magnet 205 is provided on the surface of the hard oxide alloy plate 4 away from the rigid-flexible bond plate 100. The high-temperature magnet 205 attracts the cover plate 3, thereby fixing the rigid-flexible bond plate 100. Please refer to [link to previous text]. Figure 4 Multiple high-temperature magnets 205 are distributed on the hard oxide alloy plate 4 to ensure the adsorption effect on the cover plate 3. The high-temperature magnets 205 can be commercially available products. The high-temperature magnets 205 can still maintain their own magnetism in high-temperature environments to adapt to the high temperature of the high-temperature furnace in the SMT process.

[0066] The soft-hard bonding plate 100 is fixed by the cooperation of a magnetic metal plate and a high-temperature magnet 205. The structure is simple and can reduce the overall size of the positioning device.

[0067] Example 8

[0068] Based on Example 1, this embodiment further optimizes the structure of the hard oxide alloy plate 4;

[0069] In this embodiment, please refer to Figure 4 The hard oxide alloy plate 4 is provided with multiple heat dissipation holes 206. The multiple heat dissipation holes 206 are reasonably distributed on the hard oxide alloy plate 4, and are generally located around the insulating component 201 and the information acquisition component 1002. When passing through the high temperature furnace in the SMT process, the heat dissipation holes 206 can play a role in rapid heat dissipation.

[0070] In addition, the presence of multiple heat dissipation holes 206 on the hard oxide alloy plate 4 can reduce the weight of the hard oxide alloy plate 4.

[0071] Example 9

[0072] Based on Embodiment 1, this embodiment also discloses a connection method between the insulating component 201 and the hard oxide alloy plate 4;

[0073] In this embodiment, please refer to Figure 5 The insulating component 201 is connected to the hard oxide alloy plate 4 by a threaded fastener 207. The insulating component 201 has several mounting holes, and the hard oxide alloy plate 4 has a threaded hole that is opposite to the mounting holes. The threaded end of the threaded fastener 207 passes through the mounting hole and is threadedly connected to the threaded hole, thereby detachably fixing the insulating component 201 to the hard oxide alloy plate 4.

[0074] Example 10

[0075] Based on Example 9, this embodiment further optimizes the connection method between the insulating component 201 and the hard oxide alloy plate 4;

[0076] In this embodiment, the surface of the insulating component 201 is provided with countersunk holes, and each mounting hole has a countersunk hole on the outside. The threaded fastener 207 is located entirely in the countersunk hole. This ensures that the insulating component 201 and the hard anodized plate 4 are stably installed without affecting the processing of the rigid-soft bonding plate 100.

[0077] The embodiments of the present invention have been described above with reference to the accompanying drawings. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. This application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A positioning device for a rigid-flex PCB, characterized in that, include: The positioning element includes a hard oxide alloy plate (4), which can position the hard and soft bonded plate (100). Multiple insulating components (201) are disposed on the hard oxide alloy plate (4), and multiple information acquisition components (1002) are disposed on the soft-hard bonding plate (100). The insulating components (201) can separate the information acquisition components (1002) from the hard oxide alloy plate (4). Cover plate (3), which cooperates with the positioning member to fix the soft and hard bonding plate (100).

2. The positioning device for the rigid-flex PCB according to claim 1, characterized in that: The number of insulating elements (201) on the hard oxide alloy plate (4) is consistent with the number of information acquisition elements (1002) provided on the rigid-soft bonding plate (100) fixed by the positioning device, and the outline of the insulating elements (201) is adapted to the outline of the information acquisition elements (1002).

3. The positioning device for the rigid-flex PCB according to claim 1, characterized in that: The hard oxide alloy plate (4) is provided with a positioning groove (203) for positioning the insulating component (201).

4. The positioning device for the rigid-flex PCB according to claim 1, characterized in that: The hard oxide alloy plate (4) is provided with heat dissipation holes (206), which are located around the insulating component (201) and the information acquisition component (1002).

5. The positioning device for the rigid-flex PCB according to claim 1, characterized in that: The insulating component (201) is connected to the hard oxide plate (4) by a threaded fastener (207).

6. The positioning device for the rigid-flex PCB according to claim 5, characterized in that: The surface of the insulating component (201) is provided with a countersunk hole, and the threaded fastener (207) is entirely located in the countersunk hole.

7. The positioning device for the rigid-flex PCB according to claim 1, characterized in that: The positioning component is provided with a product positioning pin (102), which is adapted to the positioning through hole (1004) on the rigid-flexible plate (100).

8. The positioning device for the rigid-flex PCB according to claim 7, characterized in that: The positioning component also includes a base (1), the hard oxide alloy plate (4) and the insulating component (201) are combined to form a tray (2), the tray (2) and the base (1) are separable, the product positioning pin (102) is disposed on the base (1), and the tray (2) is provided with a product positioning hole (202) through which the product positioning pin (102) passes.

9. The positioning device for the rigid-flex PCB according to claim 8, characterized in that: The base (1) is provided with a tray positioning pin (101), and the tray (2) is provided with a tray positioning hole (204) that cooperates with the tray positioning pin (101).

10. The positioning device for the rigid-flex PCB according to claim 7, characterized in that: When the positioning component is installed to position the rigid-flex plate (100), the end of the product positioning pin (102) does not extend beyond the surface of the rigid-flex plate (100).

Images