Multi-layer circuit board lamination pre-positioning and pressing integrated equipment

Abstract

A multi-layer circuit board lamination pre-positioning and pressing integrated device comprises a processing table, a mounting frame, a feeding assembly, a discharging assembly, a bearing assembly, a detection assembly and a pressing assembly, the mounting frame stands on the processing table, the feeding assembly and the discharging assembly are both arranged on the processing table and the mounting frame, and the bearing assembly is arranged on the processing table. The bearing assembly is arranged on the machining table and located on one side of the feeding assembly and the discharging assembly. The detection assembly and the pressing assembly are both arranged on the mounting frame and located above the bearing assembly. The bearing assembly comprises a bearing frame, a plurality of lamination pre-positioning jigs and a driving motor. According to the utility model, through designing the multi-station bearing assembly capable of flexibly rotating, lamination pre-positioning and press-fit processing can be rapidly, reliably and synchronously carried out in the press-fit processing process of the multilayer circuit board, so that the processing efficiency can be greatly improved, and the problem of inter-layer deviation of the circuit board in the transfer process can be effectively improved; the utility model has the advantages of strong practicability and strong popularization significance.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to an integrated device for pre-positioning and pressing of multilayer circuit board stacking. Background Technology

[0002] Circuit boards can be broadly classified into three categories based on the number of layers: single-sided boards, double-sided boards, and multilayer boards. Multilayer boards refer to printed circuit boards with three or more conductive pattern layers laminated with insulating material in between, and the conductive patterns are interconnected as required. Multilayer circuit boards are a product of the development of electronic information technology towards high speed, multifunctionality, large capacity, small size, thinness, and lightweight.

[0003] In existing multilayer circuit board lamination processes, the multilayer boards are typically stacked and pre-positioned manually on a lamination fixture, and then the fixture and boards are transferred to a lamination machine for lamination. This method is not only inefficient, but also prone to interlayer misalignment during the transfer process, ultimately affecting the lamination effect. Utility Model Content

[0004] Therefore, it is necessary to provide an integrated device for pre-positioning and laminating multilayer circuit boards to address the shortcomings of existing technologies.

[0005] A multilayer circuit board stacking pre-positioning and pressing integrated device includes a processing table, a mounting frame, a feeding assembly, a discharging assembly, a support assembly, a detection assembly, and a pressing assembly. The mounting frame stands on the processing table. The feeding and discharging assemblies are both mounted on the processing table and the mounting frame. The support assembly is mounted on the processing table and located to one side of the feeding and discharging assemblies. The detection and pressing assemblies are both mounted on the mounting frame and located above the support assembly. The support assembly includes a support frame, several stacking pre-positioning fixtures, and a drive motor. The support frame has a cross-shaped design. The support frame is axially connected to the upper end of the processing table and can rotate. Its outer ends correspond to the positions of the feeding assembly, discharging assembly, detection assembly, and pressing assembly, and each outer end is also provided with a mounting groove. Several stacking pre-positioning fixtures are respectively installed in several mounting grooves. The drive motor is installed in the processing table and is poweredly connected to the support frame.

[0006] Furthermore, the pre-positioning fixture for the stacked layers includes a support plate and several positioning rods, and the mounting groove of the support frame is also provided with several mounting screw holes. The support plate is snapped into the mounting groove, and the several positioning rods are all inserted through the support plate and can rotate movably. The lower ends of the several positioning rods are also screwed into the mounting screw holes in the mounting groove.

[0007] Furthermore, the positioning rod is also equipped with a heating structure inside.

[0008] Furthermore, the supporting component also includes a cover plate, and the processing table is provided with a placement groove. The placement groove is located on one side of the feeding component, and the cover plate is placed in the placement groove. The cover plate can also be closed onto the stacking pre-positioning fixture.

[0009] Furthermore, the loading assembly includes a first gripping robotic arm and a first conveyor belt, and the unloading assembly includes a second gripping robotic arm and a second conveyor belt. The mounting frame is also equipped with loading and unloading slide rails. The loading and unloading slide rails are arranged in a crisscross pattern and are respectively located above the two adjacent outer ends of the support frame. The first and second gripping robotic arms are respectively mounted on the loading and unloading slide rails and are slidable and extendable vertically. The first and second conveyor belts are both mounted on the processing table and are respectively located below the first and second gripping robotic arms.

[0010] Furthermore, the detection assembly includes a detection lifting rod, a detection seat, a detection plate, and several elastic detection sensors. The detection lifting rod is mounted on a mounting frame and can be raised and lowered. The detection seat is mounted at the lower end of the detection lifting rod, and a ball bearing sleeve is provided at the center of the bottom of the detection seat. A ball bearing is provided at the center of the top of the detection plate. The detection plate is spaced below the detection seat, and the ball bearing is engaged with the ball bearing sleeve. Several elastic detection sensors are disposed between the detection seat and the detection plate, and their two ends are respectively abutted and connected to the bottom of the detection seat and the top of the detection plate.

[0011] Furthermore, the pressing assembly includes a pressing robotic arm and a pressing plate. The pressing robotic arm is mounted on a mounting frame and can be moved up and down. The lower end of the pressing robotic arm is also provided with a sliding mounting block. The top of the pressing plate is provided with a corresponding sliding mounting groove. The pressing plate is mounted on the lower end of the pressing robotic arm, and the sliding mounting groove and the sliding mounting block are engaged with each other.

[0012] Furthermore, the multilayer circuit board stacking pre-positioning and pressing integrated equipment also includes a lifting assembly, which is mounted on the processing table. The lifting assembly includes a lifting robotic arm and a lifting plate. The lifting robotic arm is installed inside the processing table and can be moved up and down. The lifting plate is installed at the upper end of the lifting robotic arm and located below the pressing assembly and the support frame.

[0013] In summary, the beneficial effects of this utility model's integrated multilayer circuit board stacking pre-positioning and lamination equipment are as follows: by designing a flexible, rotatable multi-station support component, multilayer circuit boards can be quickly and reliably pre-positioned and laminated simultaneously during the lamination process, which not only significantly improves processing efficiency but also effectively addresses the issue of interlayer misalignment during transfer; the design of an automatic loading and unloading component further enhances the efficiency of circuit board stacking and lamination; the design of a detection component effectively detects the flatness of the circuit board after stacking pre-positioning, further reducing the risk of lamination defects; this utility model is highly practical and has significant potential for widespread application. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of a multilayer circuit board stacking pre-positioning and pressing integrated device according to the present invention;

[0015] Figure 2 for Figure 1 A schematic diagram of the decomposed structure;

[0016] Figure 3 for Figure 2 Schematic diagram of the intermediate processing table;

[0017] Figure 4 for Figure 2 Schematic diagram of the loading and unloading components;

[0018] Figure 5 for Figure 2 A schematic diagram of the exploded structure of the load-bearing components;

[0019] Figure 6 for Figure 2 A schematic diagram of the exploded structure of the detection component;

[0020] Figure 7 for Figure 2 Exploded structural diagram of the medium-pressure composite component;

[0021] Figure 8 for Figure 2 Exploded view of the central lifting component. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of the utility model.

[0023] like Figures 1 to 8As shown, this utility model provides an integrated device 100 for pre-positioning and pressing of multilayer circuit boards, which includes a processing table 10, a mounting frame 20, a feeding assembly 30, an unloading assembly 40, a supporting assembly 50, a detection assembly 60, and a pressing assembly 70. The mounting frame 20 stands on the processing table 10. The feeding assembly 30 and the unloading assembly 40 are both mounted on the processing table 10 and the mounting frame 20. The supporting assembly 50 is mounted on the processing table 10 and located on one side of the feeding assembly 30 and the unloading assembly 40. The detection assembly 60 and the pressing assembly 70 are both mounted on the mounting frame 20 and located above the supporting assembly 50. It is understood that this utility model also includes several drive structures, control structures, and automation systems, which are all conventional technologies in the field and will not be described in detail here.

[0024] The loading assembly 30 includes a first gripping robotic arm 31 and a first conveyor belt 32, and the unloading assembly 40 includes a second gripping robotic arm 41 and a second conveyor belt 42. The mounting frame 20 is also equipped with loading rails (not shown) and unloading rails (not shown). The loading and unloading rails are arranged in a crisscross pattern and are located above the adjacent outer ends of the support frame 51. The first gripping robotic arm 31 and the second gripping robotic arm 41 are respectively mounted on the loading and unloading rails and are slidable and extendable vertically. The first conveyor belt 32 and the second conveyor belt 42 are both mounted on the processing table 10 and are located below the first gripping robotic arm 31 and the second gripping robotic arm 41, respectively. This automated loading and unloading structure enables more efficient and reliable multilayer circuit board lamination processing.

[0025] The support assembly 50 includes a support frame 51, several stacking pre-positioning fixtures 52, and a drive motor (not shown). The support frame 51 has a cross-shaped design and is axially connected to the upper end of the processing table 10 and can rotate. Its outer ends correspond to the positions of the loading assembly 30, unloading assembly 40, detection assembly 60, and pressing assembly 70, respectively, and each outer end is provided with a mounting groove 511. Several stacking pre-positioning fixtures 52 are respectively installed in several mounting grooves 511. The drive motor is installed in the processing table 10 and is poweredly connected to the support frame 51.

[0026] When multi-layer circuit board stacking and lamination are required, the loading assembly 30 first places the layers of boards onto the stacking pre-positioning fixture 52 of the carrier frame 51. Next, the drive motor drives the carrier frame 51 to rotate, moving the stacking pre-positioning fixture 52 with the multi-layer boards below the detection assembly 60, which checks whether the multi-layer boards are stacked flat. Then, the drive motor continues to drive the carrier frame 51 to rotate, moving the stacking pre-positioning fixture 52 with the multi-layer boards below the lamination assembly 70, where the lamination assembly 70 presses the multi-layer boards into a complete multi-layer circuit board. Finally, the carrier frame 51 continues to rotate, moving the lamination-completed multi-layer circuit board to the unloading assembly 40, where the unloading assembly 40 removes the multi-layer circuit board from the carrier frame 51.

[0027] Because the support frame 51 has a cross-shaped multi-station design, each station can simultaneously perform different actions such as loading, inspection, pressing, or unloading during the lamination and pressing process, which can greatly improve the efficiency of the pressing process. Moreover, the cross-shaped support frame 51 with rotatable and switchable stations is more stable and reliable when transferring multi-layer boards, which can effectively reduce the risk of interlayer misalignment between boards.

[0028] The pre-positioning fixture 52 for multi-layer circuit boards includes a support plate 521 and several positioning rods 522. The mounting groove 511 of the support frame 51 also has several mounting screw holes 511a. The support plate 521 is snapped into the mounting groove 511. The positioning rods 522 pass through the support plate 521 and are rotatable. The lower ends of the positioning rods 522 are screwed into the mounting screw holes 511a in the mounting groove 511. The positioning rods 522 also have a heating structure (not shown). The pre-positioning fixture 52 is designed with a convenient disassembly and assembly structure, allowing operators to easily replace fixtures of different sizes according to the processing requirements of different sized circuit boards during the pressing process. The heating structure inside the positioning rods 522 facilitates heating of the circuit board during the pressing process, thereby improving the pressing effect of the multi-layer circuit board.

[0029] The supporting component 50 also includes a cover plate 53, and the processing table 10 is provided with a placement groove 11. The placement groove 11 is located on one side of the loading component 30, and the cover plate 53 is placed in the placement groove 11. The cover plate 53 can also cover the stacking pre-positioning fixture 52. During loading, the loading component 30 can remove the cover plate 53 from the placement groove 11 and place it on top of the multilayer board, thereby protecting the circuit board from damage caused by the pressing component 70 during pressing. During unloading, the unloading component 40 can easily remove the cover plate 53 from the top of the multilayer circuit board and put it back into the placement groove 11.

[0030] The detection assembly 60 includes a detection lifting rod 61, a detection seat 62, a detection plate 63, and a plurality of elastic detection sensors 64. The detection lifting rod 61 is mounted on the mounting frame 20 and can be raised and lowered. The detection seat 62 is mounted on the lower end of the detection lifting rod 61, and a ball bearing sleeve (not shown) is provided at the bottom center of the detection seat 62. A ball bearing rod 631 is provided at the top center of the detection plate 63. The detection plate 63 is spaced below the detection seat 62, and the ball bearing rod 631 is engaged with the ball bearing sleeve. The plurality of elastic detection sensors 64 are all located between the detection seat 62 and the detection plate 63, and their two ends are respectively abutted and connected to the bottom of the detection seat 62 and the top of the detection plate 63.

[0031] When performing flatness testing on a multilayer board, the testing plate 63 is simply pushed downwards and pressed against the top of the multilayer board by the testing lifting rod 61. If any layer of the multilayer board is uneven, the surface of the top layer will show a tilting problem. At this time, the pressing and pressing testing plate 63 will also tilt accordingly, causing a significant difference in the elasticity values ​​detected by the several elasticity detection sensors 64 between the testing plate 63 and the testing seat 62. When the difference in values ​​of multiple elasticity detection sensors 64 is large, it can be determined that the stacked multilayer board is extremely uneven, and the pressing process should be stopped to investigate the problem.

[0032] The pressing assembly 70 includes a pressing robotic arm 71 and a pressing plate 72. The pressing robotic arm 71 is mounted on the mounting frame 20 and can be raised and lowered. A sliding mounting block 711 is provided at the lower end of the pressing robotic arm 71. A corresponding sliding mounting groove 721 is provided at the top of the pressing plate 72. The pressing plate 72 is mounted at the lower end of the pressing robotic arm 71, and the sliding mounting groove 721 and the sliding mounting block 711 are engaged with each other. The pressing assembly 70 with the sliding mounting structure facilitates the assembly and disassembly of the pressing plate 72, allowing for the selection of the appropriate specification of the pressing plate 72 according to different circuit board processing requirements.

[0033] The multilayer circuit board stacking pre-positioning and pressing integrated equipment 100 also includes a lifting assembly 80, which is mounted on the processing table 10. The lifting assembly 80 includes a lifting robotic arm 81 and a lifting plate 82. The lifting robotic arm 81 is installed inside the processing table 10 and can be moved up and down. The lifting plate 82 is installed at the upper end of the lifting robotic arm 81 and is located below the pressing assembly 70 and the support frame 51. The lifting assembly 80 can help support the support frame 51 and prevent the pressing assembly 70 from applying excessive force during pressing, which could damage the support frame 51.

[0034] In summary, the beneficial effects of this utility model's integrated multilayer circuit board stacking pre-positioning and lamination equipment 100 are as follows: By designing a flexibly rotatable multi-station support component 50, multilayer circuit boards can be quickly and reliably pre-positioned and laminated simultaneously during the lamination process, significantly improving processing efficiency and effectively mitigating interlayer misalignment during transfer; the automatic loading and unloading component 40 further enhances the efficiency of circuit board stacking and lamination; and the detection component 60 effectively detects the flatness of the circuit board after pre-positioning, further reducing the risk of lamination defects. This utility model is highly practical and has significant potential for widespread application.

[0035] The embodiments described above illustrate only one implementation of the utility model, and while the description is relatively specific and detailed, it should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the inventive concept, and these all fall within the protection scope of the utility model. Therefore, the protection scope of the utility model patent should be determined by the appended claims.

Claims

1. A multilayer circuit board stacking pre-positioning and lamination integrated device, characterized in that: The system includes a processing table, a mounting frame, a feeding assembly, a discharging assembly, a bearing assembly, a detection assembly, and a pressing assembly. The mounting frame stands on the processing table. The feeding and discharging assemblies are both mounted on the processing table and the mounting frame. The bearing assembly is mounted on the processing table and located to one side of the feeding and discharging assemblies. The detection and pressing assemblies are both mounted on the mounting frame and located above the bearing assembly. The bearing assembly includes a bearing frame, several stacking pre-positioning fixtures, and a drive motor. The bearing frame has a cross-shaped design. The bearing frame is axially connected to the upper end of the processing table and can rotate. Its outer ends correspond to the positions of the feeding assembly, discharging assembly, detection assembly, and pressing assembly, and each outer end is also provided with a mounting groove. Several stacking pre-positioning fixtures are respectively installed in several mounting grooves. The drive motor is installed inside the processing table and is poweredly connected to the bearing frame.

2. The multilayer circuit board stacking pre-positioning and lamination integrated equipment as described in claim 1, characterized in that: The pre-positioning fixture for the stacking includes a support plate and several positioning rods. The mounting groove of the support frame is also provided with several mounting screw holes. The support plate is snapped into the mounting groove. The positioning rods are all inserted through the support plate and can rotate. The lower ends of the positioning rods are screwed into the mounting screw holes in the mounting groove.

3. The multilayer circuit board stacking pre-positioning and lamination integrated equipment as described in claim 2, characterized in that: The positioning rod also has a heating structure inside.

4. The multilayer circuit board stacking pre-positioning and lamination integrated equipment as described in claim 1, characterized in that: The bearing assembly also includes a cover plate, and the processing table is provided with a placement groove; the placement groove is located on one side of the feeding assembly, and the cover plate is placed in the placement groove. The cover plate can also be covered on the stacking prepositioning fixture.

5. The multilayer circuit board stacking pre-positioning and lamination integrated equipment as described in claim 1, characterized in that: The loading assembly includes a first gripping robotic arm and a first conveyor belt, and the unloading assembly includes a second gripping robotic arm and a second conveyor belt. The mounting frame is also provided with loading slide rails and unloading slide rails respectively. The loading slide rails and unloading slide rails are arranged in a crisscross pattern and are located above the two adjacent outer ends of the support frame. The first gripping robotic arm and the second gripping robotic arm are respectively mounted on the loading slide rails and the unloading slide rails and can slide and extend and retract vertically. The first conveyor belt and the second conveyor belt are both mounted on the processing table and are located below the first gripping robotic arm and the second gripping robotic arm respectively.

6. The multilayer circuit board stacking pre-positioning and lamination integrated equipment as described in claim 1, characterized in that: The detection assembly includes a detection lifting rod, a detection seat, a detection plate, and several elastic detection sensors. The detection lifting rod is mounted on a mounting frame and can be raised and lowered. The detection seat is mounted at the lower end of the detection lifting rod, and a ball bearing sleeve is provided at the center of the bottom of the detection seat. A ball bearing is provided at the center of the top of the detection plate. The detection plate is spaced below the detection seat, and the ball bearing is engaged with the ball bearing sleeve. Several elastic detection sensors are located between the detection seat and the detection plate, and their two ends are respectively abutted and connected to the bottom of the detection seat and the top of the detection plate.

7. The multilayer circuit board stacking pre-positioning and lamination integrated equipment as described in claim 1, characterized in that: The pressing assembly includes a pressing robotic arm and a pressing plate; the pressing robotic arm is mounted on a mounting frame and can be moved up and down, and the lower end of the pressing robotic arm is also provided with a sliding mounting block, and the top of the pressing plate is provided with a corresponding sliding mounting groove. The pressing plate is mounted on the lower end of the pressing robotic arm and the sliding mounting groove and the sliding mounting block are engaged with each other.

8. The multilayer circuit board stacking pre-positioning and lamination integrated equipment as described in claim 1, characterized in that: It also includes a lifting assembly, which is mounted on the processing table. The lifting assembly includes a lifting robotic arm and a lifting plate. The lifting robotic arm is mounted inside the processing table and can be moved up and down. The lifting plate is mounted on the upper end of the lifting robotic arm and is located below the pressing assembly and the support frame.

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