Thick-wall part module and signal lamp

Abstract

The utility model relates to the technical field of automobile lamps, and discloses a thick-wall part module and a signal lamp. The thick-wall part module comprises a circuit board, a radiator assembly, a thick-wall part body and a thick-wall part lower support. A signal lamp assembly and a driving chip assembly are integrated on the circuit board; the thick-wall part body is used for bearing a circuit board; the thick-wall part lower support is connected with the thick-wall part body, and the radiator assembly is installed on the thick-wall part lower support. Wherein the radiator assembly is matched with the drive chip assembly in size, and when the thick-wall part body is connected with the thick-wall part lower support, the radiator assembly is configured to cover the drive chip assembly of the circuit board. By means of the mode, on the premise that heat dissipation of the main heating component driving chip assembly on the circuit board is guaranteed, the size of the radiator is reduced, the spatial layout of the thick-wall part module is optimized, the overall weight and cost of the thick-wall part module are reduced, and the lamp further meets the requirements for internal heat dissipation, spatial layout, weight reduction, cost reduction and the like.

Description

Technical Field

[0001] This application relates to the field of automotive lighting technology, specifically to a thick-walled module and a signal light. Background Technology

[0002] As an important component of the automotive lighting system, the front signal lights are mainly used as illumination lights to indicate road conditions and other relevant driving information. Currently, the front signal lights on the market mainly have functions such as turn signals, daytime running lights, and position lights. With the increasing demands of the automotive market and the continuous development of lighting designs, the functions of automotive front signal lights on the market need to be further improved based on the existing national standards.

[0003] Currently, automotive headlights on the market mainly function as turn signals, daytime running lights, and position lights. With the continuous advancement of automotive intelligence, the functions of headlights are becoming increasingly diverse. For example, ADS (Autonomous Driving System Light) lights are dedicated lights used to indicate that the vehicle is in autonomous driving mode. Implementing ADS lights, as well as turn signals, daytime running lights, and position lights, requires increasing the power of the LEDs inside the light fixture, which further leads to problems such as increased internal temperature, more complex spatial layout, and increased overall weight. Therefore, balancing the requirements of internal heat dissipation, spatial layout, and weight and cost reduction is crucial for the design of headlights. Utility Model Content

[0004] This application provides a thick-walled component module and a signal light fixture, which can reduce the size of the heat sink, optimize the spatial layout of the thick-walled component module, and reduce the overall weight and cost of the thick-walled component module while ensuring heat dissipation of the main heat-generating components and driver chip components on the circuit board. This further enables the light fixture to meet the requirements of internal heat dissipation, spatial layout, weight reduction and cost reduction, and makes the light fixture more practical.

[0005] This application provides a thick-walled component module, including:

[0006] A circuit board, which integrates a signal light assembly and a driver chip assembly;

[0007] Heat sink assembly;

[0008] A thick-walled component body, the thick-walled component body being used to support the circuit board;

[0009] A thick-walled component lower bracket is connected to the thick-walled component body, and the heat sink assembly is mounted on the thick-walled component lower bracket.

[0010] The heat sink assembly is sized to match the driver chip assembly. When the thick-walled component body is connected to the thick-walled component lower bracket, the heat sink assembly is configured to cover the driver chip assembly of the circuit board.

[0011] In one embodiment of this application, the heat sink assembly has a mating surface that matches the size of the driver chip assembly, and the heat sink assembly is connected to the driver chip assembly via the mating surface; and / or,

[0012] A heat conductor is provided between the heat sink assembly and the driver chip assembly, and the heat conductor is connected to the bonding surface and the driver chip assembly respectively.

[0013] In one embodiment of this application, the thick-walled component body is provided with a plurality of sub-positioning parts, and the circuit board is provided with a plurality of female positioning parts. The circuit board and the thick-walled component body can be fixed by the sub-positioning parts and the female positioning parts.

[0014] In one embodiment of this application, the heat sink assembly has at least one mounting portion, the mounting portion has at least two mounting channels, the thick-walled lower bracket is provided with a mounting seat and a first guide, each mounting seat is connected to a mounting channel by a fastener, each first guide extends through a mounting channel, and the first guide is configured to abut against the circuit board when the heat sink assembly and the driver chip assembly are connected.

[0015] In one embodiment of this application, the thick-walled component body is provided with a first connecting portion, and the thick-walled component lower support is provided with a first connecting seat. The first connecting portion and the first connecting seat are connected by a fixing member.

[0016] In one embodiment of this application, the thick-walled component module further includes an upper thick-walled component support, which is configured to cooperate with the lower thick-walled component support to fix the thick-walled component body.

[0017] In one embodiment of this application, a sub-fastener is provided at one end of the upper bracket of the thick-walled member, and a female fastener is provided on the lower bracket of the thick-walled member for snap-fit ​​connection with the sub-fastener; and / or,

[0018] The upper support of the thick-walled component is provided with an upper connecting part at the other end, the lower support of the thick-walled component is provided with a lower connecting part, and the body of the thick-walled component is provided with a middle connecting part located between the upper connecting part and the lower connecting part. The upper connecting part, the middle connecting part and the lower connecting part are fixedly connected.

[0019] In one embodiment of this application, the contact surfaces between the upper connecting portion, the lower connecting portion, and the middle connecting portion are all planar; and / or,

[0020] The upper connecting portion is provided with an upper connecting channel, the middle connecting portion is provided with a middle connecting channel, and the lower connecting portion is provided with a lower connecting seat. The upper connecting channel and the middle connecting channel are configured to be connected by a fastener and the lower connecting seat; and / or

[0021] The upper connecting part is provided with an upper guide channel, the middle connecting part is provided with a middle guide channel, and the lower connecting part is provided with a second guide body, the second guide body being configured to pass through the upper guide channel and the middle guide channel.

[0022] In one embodiment of this application, the thick-walled member has a second connecting portion on its upper bracket and a second connecting seat on its body. The second connecting portion and the second connecting seat are connected by a fastener.

[0023] Accordingly, this application also provides a signal light fixture, including the thick-walled component module described in the above embodiments.

[0024] The beneficial effects of this application are:

[0025] The circuit board integrating the signal light assembly and driver chip is placed on the thick-walled component body, and the heat sink assembly is placed on the lower bracket of the thick-walled component. The size of the heat sink assembly is adapted to the size of the corresponding driver chip. During the connection of the thick-walled component body and the lower bracket, the heat sink assembly can cover only the driver chip assembly on the circuit board that generates a lot of heat. While ensuring heat dissipation of the main heat-generating components on the circuit board, such as the driver chip assembly, the size of the heat sink is reduced, the spatial layout of the thick-walled component module is optimized, and the overall weight and cost of the thick-walled component module are reduced. This further enables the lamp to meet the requirements of internal heat dissipation, spatial layout, weight reduction and cost reduction, and makes the lamp more practical. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a first-person exploded view of the thick-walled component module of this application;

[0028] Figure 2 yes Figure 1 Schematic diagram of structure at point A in the diagram.

[0029] Figure 3 This is a second-view exploded structural diagram of the thick-walled component module of this application;

[0030] Figure 4 yes Figure 3 Schematic diagram of the structure at point B in the diagram;

[0031] Figure 5 This is a third-view exploded structural diagram of the thick-walled component module of this application.

[0032] Explanation of reference numerals in the attached figures:

[0033] 10. Circuit board; 11. Signal light assembly; 12. Driver chip assembly; 13. Female positioning part; 20. Heat sink assembly; 21. Mating surface; 22. Mounting part; 221. Mounting channel; 31. Thick-walled component body; 311. Sub-positioning part; 312. First connecting part; 313. Middle connecting part; 3131. Middle connecting channel; 3132. Middle guide channel; 314. Second connecting seat; 315. Middle assembly part; 32. Thick-walled component lower support Frame; 321, Mounting base; 322, First guide body; 323, First connecting seat; 324, Female fastener; 325, Lower connecting part; 3251, Lower connecting seat; 3252, Second guide body; 326, Lower assembly part; 33, Upper bracket of thick-walled part; 331, Sub-fastener; 332, Upper connecting part; 3321, Upper connecting channel; 3322, Upper guide channel; 333, Second connecting part; 334, Upper assembly part; 40, Heat conductor. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "up," "down," "left," and "right" generally refer to up, down, left, and right in the actual use or working state of the device, specifically the drawing directions in the accompanying drawings.

[0035] In this application, unless otherwise expressly specified and limited, the terms "connected," "linked," "stacked," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two elements or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0036] Please refer to Figure 1 and Figure 2This application provides a thick-walled component module, including a circuit board 10, a heat sink assembly 20, a thick-walled component body 31, and a thick-walled component lower support 32.

[0037] Specifically, circuit board 10 integrates a signal light assembly 11 and a driver chip assembly 12. The signal light assembly 11 may include signal lights with two or more functions. The signal light assembly 11 may include signal lights with functions such as turn signals, daytime running lights, position lights, and ADS lights (Autonomous Driving System Lights), enabling the signal light to simultaneously possess multiple functions, facilitating information interaction between the vehicle equipped with the signal light and its surrounding environment, and improving the practicality of the signal light. The driver chip assembly 12 may include one or more driver chips, which are used to control the on / off state of the signal lights on circuit board 10 and other circuit parameters.

[0038] The heat sink assembly 20 may include multiple heat sinks, with the number of heat sinks corresponding to the number of driver chips, so that each driver chip can be cooled down separately.

[0039] The thick-walled body 31 is used to support the circuit board 10. The thick-walled body 31 can be an injection molded part. The circuit board 10 is disposed on the thick-walled body 31, and the thick-walled body 31 can serve as a carrier for the circuit board 10, supporting the circuit board 10.

[0040] The lower support 32 of the thick-walled component is connected to the body 31 of the thick-walled component, and the heat sink assembly 20 is mounted on the lower support 32 of the thick-walled component. The lower support 32 of the thick-walled component can also be an injection molded part. The multiple heat sinks included in the heat sink assembly 20 are set on the body 31 of the thick-walled component, and the lower support 32 of the thick-walled component can serve as a support for the heat sinks.

[0041] The heat sink assembly 20 is sized to match the driver chip assembly 12. When the thick-walled component body 31 is connected to the thick-walled component lower support 32, the heat sink assembly 20 is configured to cover the driver chip assembly 12 on the circuit board 10. Specifically, the area of ​​the heat sink assembly 20 projected onto the circuit board 10 is slightly larger than or equal to the area of ​​the driver chip assembly 12 projected onto the circuit board 10. Furthermore, when the heat sink assembly 20 includes multiple heat sinks and the driver chip assembly 12 includes multiple driver chips, the heat sinks included in the heat sink assembly 20 correspond one-to-one with the driver chips included in the driver chip assembly 12. The projected area of ​​each heat sink on the circuit board 10 is slightly larger than or equal to the projected area of ​​the corresponding driver chip on the circuit board 12. This ensures that when the thick-walled component body 31 and the thick-walled component lower support 32 are connected, each heat sink covers the corresponding driver chip to dissipate heat and cool the driver chip on the circuit board 10.

[0042] By means of the above method, the circuit board 10 integrating the signal light assembly 11 and the driver chip is placed on the thick-walled component body 31, and the heat sink assembly 20 is placed on the thick-walled component lower bracket 32, so that the size of the heat sink assembly 20 is adapted to the size of the corresponding driver chip. In the process of connecting the thick-walled component body 31 and the thick-walled component lower bracket 32, the heat sink assembly 20 can cover only the driver chip assembly 12 on the circuit board 10 that generates a lot of heat. While ensuring heat dissipation of the main heat-generating component driver chip assembly 12 on the circuit board 10, the volume of the heat sink is reduced, the spatial layout of the thick-walled component module is optimized, and the overall weight and cost of the thick-walled component module are reduced. This further enables the lamp to meet the requirements of internal heat dissipation, spatial layout, weight reduction and cost reduction, and makes the lamp have stronger practical performance.

[0043] In one embodiment, please refer to Figure 3 and Figure 4 The heat sink assembly 20 has a mating surface 21, which matches the size of the driver chip assembly 12. The heat sink assembly 20 is connected to the driver chip assembly 12 through the mating surface 21. The mating surface 21 is used to conduct heat from the driver chip assembly 12 to the heat sink assembly 20. In practical applications, the surface of the driver chip assembly 12 is generally roughly rectangular. The mating surface 21 can be a rectangle slightly larger than the surface of the driver chip assembly 12. This allows the heat sink assembly 20 to maintain a small volume while completely covering the surface of the driver chip assembly 12 for heat dissipation, reducing the space occupied by the heat sink assembly 20 and optimizing the spatial layout of the thick-walled module.

[0044] For further details, please refer to... Figures 1 to 4 A heat conductor 40 is provided between the heat sink assembly 20 and the driver chip assembly 12, and the heat conductor 40 is connected to the mating surface 21 and the driver chip assembly 12 respectively. Specifically, the heat conductor 40 can be a thermally conductive silicone pad, thermally conductive gel, or phase change thermal paste, etc. The heat conductor 40 can enhance the heat conduction efficiency between the driver chip assembly 12 and the heat sink assembly 20, so that the heat sink assembly 20 can dissipate the heat of the driver chip assembly 12 in a timely manner.

[0045] In one embodiment, please Figures 1 to 3 Further reference Figure 5The thick-walled component body 31 is provided with several sub-positioning parts 311, and the circuit board 10 is provided with several female positioning parts 13. The circuit board 10 can be fixed to the thick-walled component body 31 through the sub-positioning parts 311 and the female positioning parts 13. Specifically, the sub-positioning parts 311 can be rod-shaped structures, and the female positioning parts 13 can be hole-shaped structures. The circuit board 10 can be installed on the installation position on the thick-walled component body 31 through the sub-positioning parts 311 and the female positioning parts 13. In practical applications, after the sub-positioning parts 311 and the female positioning parts 13 are connected, the circuit board 10 and the thick-walled component body 31 can be fixed by a hot riveting process, which replaces the more complicated screw fastening method, greatly reducing the assembly workload and labor intensity of the circuit board 10 and the thick-walled component body 31.

[0046] Of course, in other embodiments, the sub-positioning part 311 can also be a hole-like structure, and the female positioning part 13 can be a rod-like structure. In this form, the sub-positioning part 311 and the female positioning part 13 cooperate with each other to achieve the correct docking of the circuit board 10 and the thick-walled body 31.

[0047] In one embodiment, please continue to refer to Figures 1 to 4The heat sink assembly 20 has at least one mounting portion 22, and the mounting portion 22 has at least two mounting channels 221. The thick-walled lower support 32 is provided with a mounting seat 321 and a first guide 322. Each mounting seat 321 is connected to a mounting channel 221 by a fastener. Each first guide 322 passes through a mounting channel 221 and is configured to abut against the circuit board 10 when the heat sink assembly 20 and the driver chip assembly 12 are connected. Specifically, each heat sink of the heat sink assembly 20 may include two symmetrically arranged mounting portions 22, and the mounting portions 22 may be plate-shaped structures. The mounting channels 221 may be hole-shaped structures passing through the mounting portions 22. The mounting seats 321 may be threaded seats provided in the thick-walled lower support 32 and corresponding to the position of one of the mounting channels 221. The first guides 322 may be column-shaped structures provided in the thick-walled lower support 32 and corresponding to the position of the other mounting channel 221. In the process of installing the heat sink onto the lower bracket 32 ​​of the thick-walled component, the first guide 322 passes through a corresponding mounting channel 221, and the studs and other fasteners pass through the corresponding mounting channel 221 and connect to the mounting base 321. The two work together to fix the heat sink onto the lower bracket 32 ​​of the thick-walled component. Furthermore, during the connection of the thick-walled component body 31 and the lower bracket 32, not only can the driver chip assembly 12 on the circuit board 10 on the thick-walled component body 31 and the heat sink assembly 20 on the lower bracket 32 ​​of the thick-walled component be correctly aligned, but also, during the alignment process, only the design length of the first guide 322 needs to be controlled. When the first guide 322 and the circuit board 10 abut, the heat sink assembly 20 and the driver chip assembly 12 maintain a suitable contact pressure, avoiding excessive compression between them. Therefore, this design facilitates the installation of the heat sink assembly 20 and the driver chip assembly 12, reduces the workload of workers, and improves assembly efficiency.

[0048] In one embodiment, please refer to Figure 1 , Figure 3 and Figure 5 The thick-walled component body 31 is provided with a first connecting portion 312, and the thick-walled component lower support 32 is provided with a first connecting seat 323. The first connecting portion 312 and the first connecting seat 323 are connected by a fastener. Specifically, multiple first connecting portions 312 can be provided, and each first connecting portion 312 can be a hole-like structure provided on the thick-walled component body 31. The number of first connecting seats 323 is the same as the number of first connecting portions 312. Each first connecting seat 323 can be a threaded seat provided on the thick-walled component body 31. By passing a fastener such as a screw through the first connecting portion 312, it can be connected to the first connecting seat 323, thereby achieving fixation between the thick-walled component body 31 and the thick-walled component lower support 32.

[0049] In one embodiment, please continue to refer to Figure 1 , Figure 3 and Figure 5 The thick-walled component module also includes an upper thick-walled component support 33, which is configured to cooperate with a lower thick-walled component support 32 to fix the thick-walled component body 31. Specifically, the upper thick-walled component support 33 can be an injection-molded part. The upper thick-walled component support 33 is positioned above the thick-walled component body 31. Together with the lower thick-walled component support 32, it can provide a certain degree of protection for the upper and lower parts of the thick-walled component body 31, improving the stability and safety of the internal circuit board 10 and heat sink module of the thick-walled component module.

[0050] In one embodiment, please continue to refer to Figure 1 , Figure 3 and Figure 5 The upper bracket 33 of the thick-walled component has a sub-fastener 331 at one end, and the lower bracket 32 ​​of the thick-walled component has a female fastener 324 that is snapped into the sub-fastener 331. Specifically, the sub-fastener 331 can be a protrusion, and one or more sub-fasteners 331 can be provided. The female fastener 324 can be a sleeve that fits into the protrusion, and one or more female fasteners 324 can be provided corresponding to the sub-fasteners 331. In use, the sub-fastener 331 can extend into the female fastener 324 to achieve a snap-fit ​​connection between the two.

[0051] It should be noted that in other embodiments, the sub-fastener 331 can be a retainer and the female fastener 324 can be a protrusion adapted to the retainer. In this form, the sub-fastener 331 and the female fastener 324 can also satisfy the snap-fit ​​connection at one end of the upper bracket 33 and the lower bracket 32 ​​of the thick-walled member.

[0052] The upper support 33 of the thick-walled component has an upper connecting part 332 at one end, the lower support 32 of the thick-walled component has a lower connecting part 325, and the body 31 of the thick-walled component has a middle connecting part 313 located between the upper connecting part 332 and the lower connecting part 325. The upper connecting part 332, the middle connecting part 313, and the lower connecting part 325 are fixedly connected. Specifically, the upper connecting part 332 is located at the other end of the upper support 33 of the thick-walled component opposite to the sub-fastener 331, and the lower connecting part 325 is located at the other end of the lower support 32 of the thick-walled component opposite to the female fastener 324. During the assembly of the thick-walled component module, the body 31 of the thick-walled component is placed between the lower support 32 of the thick-walled component and the upper support 33 of the thick-walled component, the sub-fastener 331 and the female fastener 324 are snapped together, and the upper connecting part 332, the middle connecting part 313, and the lower connecting part 325 are connected accordingly. Thus, the thick-walled component module can be fixed from both ends of the upper support 33 of the thick-walled component and the lower support 32 of the thick-walled component. Meanwhile, by placing the middle connecting part 313 between the upper connecting part 332 and the lower connecting part 325, the thick-walled component body 31 can be connected simultaneously with the upper support 33 and the lower support 32 of the thick-walled component, thereby increasing the overall stability of the thick-walled component module. In other words, the thick-walled component module adopts a co-locking method, which greatly enhances the overall vibration stability of the module.

[0053] In one embodiment, please continue to refer to Figure 1 , Figure 3 and Figure 5 The contact surfaces between the upper connecting part 332, the lower connecting part 325, and the middle connecting part 313 are all planar. That is, the contact surfaces of the upper connecting part 332 and the middle connecting part 313, and the contact surfaces of the lower connecting part 325 and the middle connecting part 313 are all planar. At the same time, since the upper connecting part 332, the middle connecting part 313, and the lower connecting part 325 are smaller in size than the upper bracket 33, the body 31, and the lower bracket 32 ​​of the thick-walled component, respectively, the thick-walled component module can use small-surface contact when locked together by the upper connecting part 332, the middle connecting part 313, and the lower connecting part 325. By using the above method, not only can the connection gap between the contact surfaces of the above-mentioned connecting parts be avoided, making the connection between the upper support 33, the body 31, and the lower support 32 of the thick-walled part more stable, but also the machining accuracy of the upper support 33, the body 31, and the lower support 32 of the thick-walled part can be reduced, thus solving the problem that when the upper support 33, the body 31, and the lower support 32 of the thick-walled part are directly connected, the contact surfaces of the body 31 and the upper support 33 and the lower support 32 of the thick-walled part do not fit together due to the injection molding accuracy of the mold.

[0054] The upper connecting portion 332 is provided with an upper connecting channel 3321, the middle connecting portion 313 is provided with a middle connecting channel 3131, and the lower connecting portion 325 is provided with a lower connecting seat 3251. The upper connecting channel 3321 and the middle connecting channel 3131 are configured to be connected to the lower connecting seat 3251 by fasteners. Specifically, the upper connecting channel 3321 can be a hole-like structure provided in the upper connecting portion 332, the middle connecting channel 3131 can be a hole-like structure provided in the middle connecting portion 313, and the lower connecting seat 3251 can be a threaded seat provided in the lower connecting portion 325. By passing fasteners such as screws through the upper connecting channel 3321 and the middle connecting channel 3131 respectively, they can be connected to the lower connecting seat 3251, thereby achieving a fixed connection between the upper connecting portion 332, the middle connecting channel 313, and the lower connecting portion 325.

[0055] Furthermore, the upper connecting portion 332 is provided with an upper guide channel 3322, the middle connecting portion 313 is provided with a middle guide channel 3132, and the lower connecting portion 325 is provided with a second guide body 3252. The second guide body 3252 is configured to pass through the upper guide channel 3322 and the middle guide channel 3132. Specifically, both the upper guide channel 3322 and the middle guide channel 3132 can be hole-like structures, and the first guide body 322 can be a columnar structure provided on the lower connecting portion 325. When assembling the upper connecting portion 332, the middle connecting portion 313, and the lower connecting portion 325, the second guide body 3252 can pass through the upper guide channel 3322 and the middle guide channel 3132, assisting the upper connecting channel 3321, the middle connecting channel 3131, and the lower connecting seat 3251 in achieving alignment. This not only reduces the assembly difficulty of the above-mentioned connecting portions but also, in conjunction with the fixing components, enhances the connection strength of the thick-walled component module at the end with the upper connecting portion 332, the middle connecting portion 313, and the lower connecting portion 325.

[0056] In this application, the upper support 33 and the lower support 32 of the thick-walled component are snap-fitted together at one end, and the other end of the upper support 33 and the lower support 32 of the thick-walled component are locked together by the upper connecting part 332, the middle connecting part 313 and the lower connecting part 325. This can improve the assembly efficiency between the upper support 33 and the lower support 32 of the thick-walled component while ensuring the connection strength between them.

[0057] In one embodiment, please refer to Figure 3 and Figure 5 The thick-walled component upper bracket 33 is provided with a second connecting part 333, and the thick-walled component body 31 is provided with a second connecting seat 314. The second connecting part 333 and the second connecting seat 314 are connected by a fastener. Specifically, the second connecting part 333 can be a hole-like structure provided on the thick-walled component upper bracket 33, and the connecting seat can be a threaded seat provided on the thick-walled component body 31. By passing a fastener such as a screw through the second connecting part 333, it can be connected to the second connecting seat 314, thereby fixing the thick-walled component upper bracket 33 and the thick-walled component body 31 together, thereby improving the strength and integrity of the thick-walled component module.

[0058] The upper support 33 and lower support 32 of the thick-walled component in this application are not only fixedly connected to the body 31 of the thick-walled component, but also can be connected by the male fastener 331 and the female fastener 324, as well as the upper connecting part 332 and the lower connecting part 325. At the same time, the body 31 of the thick-walled component can also be fixed between the upper connecting part 332 and the lower connecting part 325 by the middle connecting part 313. This allows the thick-walled component module in this application to adopt multiple fixed connection forms to improve the connection strength of the thick-walled component module and prevent the components of the thick-walled component module from becoming loose.

[0059] In addition, please refer to Figure 1 , Figure 3 and Figure 5 In this application, the thick-walled component module's upper support 33 can be provided with an upper assembly portion 334, the thick-walled component body 31 can be provided with a middle assembly portion 315, and the thick-walled component lower support 32 can be provided with a lower assembly portion 326. The upper assembly portion 334, middle assembly portion 315, and lower assembly portion 326 can all be plate-like structures with several through holes on their surfaces. The upper assembly portion 334 can be mounted on the lamp holder using screws or other fasteners. The middle assembly portion 315 can pass through the thick-walled component lower support 32 and fit against the lower assembly portion 326, and the through holes on the middle assembly portion 315 and the lower assembly portion 326 coincide, allowing the middle assembly portion 315 and the lower assembly portion 326 to be mounted on the lamp holder using screws or other fasteners. Therefore, the thick-walled component module of this application can be installed in the lamp holder using the upper assembly portion 334, middle assembly portion 315, and lower assembly portion 326.

[0060] Accordingly, this application also provides a signal light fixture, including the thick-walled component module in the above embodiments.

[0061] The thick-walled component module and signal light fixture provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A thick-walled component module, characterized in that, include: Circuit board (10), wherein the circuit board (10) integrates a signal light assembly (11) and a driver chip assembly (12); Heat sink assembly (20); A thick-walled component body (31) is used to support the circuit board (10); The thick-walled component lower bracket (32) is connected to the thick-walled component body (31), and the heat sink assembly (20) is installed on the thick-walled component lower bracket (32); The heat sink assembly (20) is sized to match the drive chip assembly (12). When the thick-walled component body (31) is connected to the thick-walled component lower bracket (32), the heat sink assembly (20) is configured to cover the drive chip assembly (12) of the circuit board (10).

2. The thick-walled component module according to claim 1, characterized in that, The heat sink assembly (20) has a mating surface (21) that matches the size of the driver chip assembly (12), and the heat sink assembly (20) is connected to the driver chip assembly (12) through the mating surface (21); and / or, A heat conductor (40) is provided between the heat sink assembly (20) and the driving chip assembly (12), and the heat conductor (40) is connected to the bonding surface (21) and the driving chip assembly (12) respectively.

3. The thick-walled component module according to claim 1, characterized in that, The thick-walled component body (31) is provided with a plurality of sub-positioning parts (311), and the circuit board (10) is provided with a plurality of female positioning parts (13). The circuit board (10) and the thick-walled component body (31) can be fixed by the sub-positioning parts (311) and the female positioning parts (13).

4. The thick-walled component module according to claim 1, characterized in that, The heat sink assembly (20) has at least one mounting portion (22), the mounting portion (22) has at least two mounting channels (221), the thick-walled lower bracket (32) is provided with a mounting seat (321) and a first guide (322), each mounting seat (321) is connected to a mounting channel (221) by a fastener, each first guide (322) passes through a mounting channel (221), and the first guide (322) is configured to abut against the circuit board (10) when the heat sink assembly (20) and the driver chip assembly (12) are connected.

5. The thick-walled component module according to claim 1, characterized in that, The thick-walled component body (31) is provided with a first connecting part (312), and the thick-walled component lower bracket (32) is provided with a first connecting seat (323). The first connecting part (312) and the first connecting seat (323) are connected by a fastener.

6. The thick-walled component module according to claim 1, characterized in that, The thick-walled component module also includes a thick-walled component upper bracket (33), which is configured to cooperate with the thick-walled component lower bracket (32) to fix the thick-walled component body (31).

7. The thick-walled component module according to claim 6, characterized in that, One end of the upper bracket (33) of the thick-walled component is provided with a sub-fastener (331), and the lower bracket (32) of the thick-walled component is provided with a female fastener (324) that is snapped into place with the sub-fastener (331); and / or, The upper support (33) of the thick-walled component is provided with an upper connecting part (332) at the other end, the lower support (32) of the thick-walled component is provided with a lower connecting part (325), the body (31) of the thick-walled component is provided with a middle connecting part (313) located between the upper connecting part (332) and the lower connecting part (325), and the upper connecting part (332), the middle connecting part (313) and the lower connecting part (325) are fixedly connected to each other.

8. The thick-walled component module according to claim 7, characterized in that, The contact surfaces between the upper connecting part (332), the lower connecting part (325), and the middle connecting part (313) are all planar; and / or, The upper connecting portion (332) is provided with an upper connecting channel (3321), the middle connecting portion (313) is provided with a middle connecting channel (3131), and the lower connecting portion (325) is provided with a lower connecting seat (3251). The upper connecting channel (3321) and the middle connecting channel (3131) are configured to be connected by a fastener and the lower connecting seat (3251); and / or, The upper connecting part (332) is provided with an upper guide channel (3322), the middle connecting part (313) is provided with a middle guide channel (3132), and the lower connecting part (325) is provided with a second guide body (3252). The second guide body (3252) is configured to pass through the upper guide channel (3322) and the middle guide channel (3132).

9. The thick-walled component module according to claim 7, characterized in that, The upper bracket (33) of the thick-walled component is provided with a second connecting part (333), and the body (31) of the thick-walled component is provided with a second connecting seat (314). The second connecting part (333) and the second connecting seat (314) are connected by a fastener.

10. A signal light fixture, characterized in that, Includes the thick-walled component module as described in any one of claims 1 to 9.

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