Heating assembly and semiconductor device

Abstract

The utility model relates to the technical field of fluid heating components, in particular to a heating component, which comprises a first support, a second support, an electric heating tube and an electrical element, the electric heating tube is provided with an overflowing channel, a sealing cavity is arranged between the first support and the second support, and an inflow end and an outflow end of the overflowing channel are both positioned outside the sealing cavity. The electric heating tube comprises a heating tube part, and the heating tube part and the electrical element are both installed in the sealing cavity in a sealed mode. The heating pipe part and the electrical element are completely isolated in the airtight space by the sealing cavity, so that the heating pipe part and the electrical element are not directly exposed in an external environment containing volatile gas. The first bracket and the second bracket reliably seal the sealing cavity, so that the electrical part is prevented from being corroded, and the service life of the assembly is prolonged. The utility model also relates to semiconductor equipment adopting the heating assembly.

Description

Technical Field

[0001] This utility model relates to the field of fluid heating component technology, and in particular to a heating component and semiconductor device. Background Technology

[0002] Heating components have electrical elements that are generally exposed to air. In some industries, such as the semiconductor field, certain chemicals are heated, which may produce volatile gases that affect the lifespan of the electrical components in the heating component. Utility Model Content

[0003] The purpose of this invention is to provide a heating component to address the problems identified in the background art.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A heating assembly includes a first bracket, a second bracket, a heating element, and electrical components. The heating element has a flow channel, and a sealed cavity is formed between the first bracket and the second bracket. The heating element includes a heating tube portion, and the heating tube portion and the electrical components are both sealed and installed within the sealed cavity.

[0006] The heating assembly proposed in this utility model has the following advantages: the sealed cavity completely isolates the heating tube and electrical components within an airtight space, preventing them from being directly exposed to an external environment containing volatile gases. The first and second supports reliably seal the sealed cavity, ensuring that the electrical components are not corroded and extending the service life of the assembly.

[0007] A semiconductor device including the heating component described above, the semiconductor device having a fluid passage, the flow channel being a part of the fluid passage.

[0008] The semiconductor device proposed in this utility model has the following advantages: the sealed cavity of the heating component effectively isolates the electrical components from the fluid environment, avoiding corrosion or performance degradation of the electrical components due to contact with volatile gases, thereby ensuring the long-term safe operation of the device. Attached Figure Description

[0009] Figure 1 This is a three-dimensional structural diagram of a heating component according to one embodiment of the present invention;

[0010] Figure 2 This is a half-sectional structural diagram of a heating component according to one embodiment of the present invention;

[0011] Figure 3 This is an exploded view of the heating assembly according to one embodiment of the present invention. Figure 1 ;

[0012] Figure 4 This is an exploded view of the heating assembly according to one embodiment of the present invention. Figure 2 ;

[0013] Figure 5 This is a schematic diagram of the plug structure according to one embodiment of the present invention;

[0014] Figure 6 This is a schematic diagram of the spoiler structure according to one embodiment of the present invention. Figure 1 ;

[0015] Figure 7 This is a schematic diagram of the spoiler structure according to one embodiment of the present invention. Figure 2 ;

[0016] Figure 8 This is a schematic diagram of the spoiler structure according to one embodiment of the present invention. Figure 3 ;

[0017] Figure 9 This is a schematic diagram of the spoiler structure according to one embodiment of the present invention. Figure 4 .

[0018] In the diagram: 1. First bracket; 2. Second bracket; 3. First component; 4. Second component; 5. Heating tube; 6. Heating tube section; 7. Electrical component; 8. Electrode; 9. Temperature controller; 10. Wire; 11. Baffle; 12. Plug; 13. Mounting tube section; 14. Limiting protrusion; 15. Sealing cavity; 16. Flow channel; 17. First cavity; 18. Second cavity; 19. Through hole; 20. Mounting base; 21. Through hole; 22. Mounting hole; 23. Wire lead-out component; 24. First groove; 25. End plate section; 26. Groove opening; 27. Rod body; 28. Helical spring; 29. ​​First support rod; 30. First spiral plate; 31. Second spiral plate; 32. Second support rod; 33. Protrusion; 34. Disc; 35. Flow hole; 36. Assembly hole. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0020] Reference Figures 1-9 A heating assembly includes a first support 1, a second support 2, an electric heating tube 5, and an electrical component 7. The electric heating tube 5 has a flow channel 16. A sealing cavity 15 is provided between the first support 1 and the second support 2. The electric heating tube 5 includes a heating tube portion 6. The heating tube portion 6 and the electrical component 7 are both sealed and installed in the sealing cavity 15.

[0021] When the fluid flows in from the inlet end of the flow channel 16, it passes through the inside of the heating tube 5 and then exits from the outlet end of the flow channel 16. The core heating part of the heating tube 5 is the heating tube section 6. The heating tube section 6 and the electrical component 7 are sealed together in the sealed cavity 15 formed between the first support 1 and the second support 2, thereby realizing the heating of the fluid.

[0022] The sealed cavity 15 completely isolates the heating tube section 6 and electrical components 7 within an airtight space, preventing them from being directly exposed to an external environment containing volatile gases. The first bracket 1 and the second bracket 2 reliably seal the sealed cavity 15, ensuring that the electrical components are not corroded and extending the service life of the components.

[0023] As one implementation method, the environment required is one in which the NMP fluid is heated.

[0024] refer to Figures 1-4 The second support 2 includes a first component 3 and a second component 4. The first component 3 is at least partially located between the first support 1 and the second component 4. The sealing cavity 15 includes a first cavity 17 located between the first support 1 and the first component 3 and a second cavity 18 located between the first component 3 and the second component 4. The heating tube part 6 is located in the first cavity 17. The electrical component has a wiring part, and the wiring part of the electrical component 7 is located in the second cavity 18.

[0025] And / or, the heating tube 6 includes a tube substrate and a thick film heating layer printed on the surface of the tube substrate; or the heating tube 6 includes a tube substrate and an electric heating wire wound on the surface of the tube substrate; or the heating tube 6 includes a tube substrate and a nano-electric heating film attached to the surface of the tube substrate.

[0026] The first component 3 and the second component 4 constitute the second support 2. The first support 1 and the first component 3 form a first cavity 17, and the first component 3 and the second component 4 form a second cavity 18. Together, they constitute a sealed cavity 15, which is used to encapsulate and isolate the key heating element and electrical control element.

[0027] During operation, the fluid flows along the flow channel, and heat is conducted to the fluid through the heating tube 6, thus achieving rapid heating. The heating tube 6 is installed inside the first cavity 17 and is the core heating unit of this component. The heating tube 6 can adopt three heating methods according to different application requirements: one is a thick film heating layer printed on the surface of the tube substrate; the second is an electric heating wire wound on the surface of the tube substrate, which is a mature and reliable process; the third is a nano-electric heating film attached to the surface of the tube substrate, which has advantages such as high heating efficiency and ultra-thin structure.

[0028] The wiring portion of electrical component 7 is located in the second cavity 18, where it is electrically connected to the heating tube 6, ensuring the normal operation of the entire heating assembly. The separate design of the first cavity 17 and the second cavity 18 physically isolates the heating element and the wiring portion, optimizing the spatial layout and improving electrical safety. The three-section structure of the first bracket 1, the first component 3, and the second component 4 helps reduce the overall machining difficulty and facilitates modular assembly and maintenance. Especially in terms of electrical connection, by centralizing the wiring portion in the second cavity 18, electrical connections can be completed without interfering with the heating structure, making installation more convenient and safer.

[0029] refer to Figures 3-4 The electrical component 7 includes an electrode 8, which is mounted on the heating tube 5 and is electrically connected to the nano-heating film. The first component 3 is provided with a through hole 19, through which the electrode 8 extends to the second cavity 18.

[0030] And / or, electrical component 7 includes thermostat 9, first component 3 is provided with mounting base 20 and through hole 21, thermostat 9 is assembled with mounting base 20 and the temperature sensing part of thermostat 9 passes through through hole 21 and is located near heating tube part 6, and the wiring part of thermostat 9 is located in second cavity 18.

[0031] The second component 4 has a mounting hole 22, and a wire lead-out part 23 is installed in the mounting hole 22. The electrical component 7 is electrically connected to a wire, and the wire extends through the wire lead-out part 23 to the outside of the second component 4.

[0032] The electrical connection structure of this heating assembly is compact and reasonable, effectively improving assembly convenience and safety. The electrical component 7 includes an electrode 8 and a temperature controller 9, both of which are located inside the sealed cavity 15. The electrode 8 is used to energize the heating tube 6, and the temperature controller 9 is used to monitor the temperature in real time to achieve temperature control protection.

[0033] During assembly, the heating element 5 is first installed between the first support 1 and the first component 3. The electrode 8 is directly installed on the heating element 5 and is electrically connected to the nano-thermal film, completing the conductive connection between the power supply and the heating element. The first component 3 is provided with a through hole 19, through which the electrode 8 passes and extends to the second cavity 18, achieving internal power connection without affecting the structure of the heating area.

[0034] The thermostat 9 is fixed to the first component 3 via the mounting base 20, and the mounting base and the thermostat are securely fitted together. The temperature sensing part of the thermostat 9 passes through the through hole 21 and is arranged close to the heating tube 6 to ensure accurate detection of the temperature status of the heating tube 6. The wiring part of the thermostat 9 is also arranged in the second cavity 18 to ensure that the electrical parts are centrally arranged for easy connection and maintenance.

[0035] After connecting the electrode 8 to the temperature controller 9, the second component 4 is installed on the outside of the first component 3. The second component 4 has a mounting hole 22, in which a wire lead-out component 23 is installed. After the wire is connected to the electrical component 7, it extends through the wire lead-out component 23 to the outside of the second component 4, forming an electrical connection channel between the component and external equipment.

[0036] The entire electrical connection structure significantly reduces the difficulty of power connection operations through reasonable spatial partitioning. During installation, the connection between the electrode 8 and the temperature controller 9 can be completed on the outside of the first component 3, avoiding operation in a confined space and improving assembly efficiency. The wire lead-out component 23 provides a clear guiding path, ensuring that the wires exit neatly and safely.

[0037] The sealed cavity 15 completely encloses the electrical component 7, thoroughly isolating it from the external environment, especially NMP volatile gases, to prevent malfunctions caused by corrosion or contamination, effectively improving the service life of the electrical component 7 and the overall operational reliability of the machine.

[0038] refer to Figures 2-3 The heating element 5 includes mounting tubes 13 located at both ends of the heating tube 6. The mounting tubes 13 are connected to the heating tube 6. One end of the mounting tube 13 away from the heating tube 6 is placed outside the sealing cavity 15. The mounting tubes 13 are fixed or limited to the first bracket 1, and / or the mounting tubes 13 are fixed or limited to the second bracket 2. For example, the mounting tubes 13 have axial and radial limiting structures between them and the first bracket 1 and / or the second bracket 2.

[0039] The heating element 5 in the heating assembly consists of a central heating element section 6 and mounting elements 13 at both ends, forming an integrated heating structure. The mounting elements 13 are connected to the heating element section 6, and axial and radial limiting structures are provided between the mounting elements 13 and the first support 1 and the second support 2. These structures effectively constrain the movement or displacement of the heating element 5 during use, ensuring its stable position within the sealed cavity 15. Axial limiting prevents the heating element 5 from sliding along its axis during fluid impact or thermal expansion and contraction, while radial limiting ensures a reasonable gap between it and the sealed cavity wall, preventing seal failure or internal collision due to shaking.

[0040] refer to Figures 2-4 As one embodiment of the limiting structure, the outer wall of the mounting tube 13 is fixedly or integrally formed with a limiting protrusion 14. The first bracket 1 is provided with a first groove 24 and end plate portions 25 located at both ends of the first groove 24. The end plate portions 25 are provided with slots 26. The limiting protrusion 14 at least partially abuts against the inner wall of the first groove 24 radially along the mounting tube 13. The limiting protrusion 14 at least partially abuts against the inner wall of the end plate portion 25 axially along the mounting tube 13. The outer peripheral wall of the heating tube 6 has a gap with the inner wall of the first groove 24. At least part of the outer wall of the mounting tube 13 abuts against the wall of the slot 26 radially.

[0041] In the first embodiment, a limiting protrusion 14 is fixedly or integrally formed on the outer wall of the mounting tube 13. The first bracket 1 is provided with a first groove 24, and end plates 25 are provided at both ends of the first groove 24. The end plates 25 are provided with slots 26. The limiting protrusion 14 at least partially abuts against the inner wall of the first groove 24 in the radial direction of the mounting tube 13, and at the same time abuts against the inner wall of the end plates 25 in the axial direction, forming a multi-directional stable support. Part of the outer wall of the mounting tube 13 can also fit against the wall of the slot 26 in its radial direction, further enhancing the positioning accuracy. At this time, there is a gap between the outer peripheral wall of the heating tube 6 and the inner wall of the first groove 24, so that the heating tube 5 is suspended in the air, avoiding heat conduction to the bracket structure during heating, improving thermal efficiency and preventing mechanical interference caused by thermal expansion.

[0042] As another embodiment of the limiting structure, the outer peripheral wall of the mounting tube 13 has a positioning groove, the first bracket 1 has a first groove 24 and end plate portions 25 located at both ends of the first groove 24, the end plate portions 25 have slots 26, and the end plate portions 25 are at least partially inserted into the positioning groove.

[0043] In the second embodiment, the outer peripheral wall of the mounting tube 13 is provided with a positioning groove, and the first bracket 1 is also provided with a first groove 24 and end plates 25 at both ends, with slots 26 on the end plates 25. During assembly, the end plates 25 are at least partially inserted into the positioning groove, thereby achieving radial and axial positioning through structural fitting. This solution has a compact structure, reliable positioning, and is also easy to process and reassemble.

[0044] The first bracket 1 and the second bracket 2 are provided with a number of assembly holes 36 arranged in a ring around their periphery. The first bracket 1 and the second bracket 2 are fixedly assembled by bolt assemblies passing through the assembly holes. The mating surfaces of the first bracket 1 and the second bracket 2 are sealed by face-to-face sealing or by annular sealing rings. Face-to-face sealing means that the adjacent surfaces of the first bracket 1 and the second bracket 2 are fitted together and sealed. Annular sealing ring sealing means that the adjacent surfaces of the first bracket 1 and the second bracket 2 are provided with sealing grooves and annular sealing rings are installed in the sealing grooves.

[0045] The mating surfaces between the brackets are sealed face-to-face or with annular sealing rings to ensure excellent overall airtightness of the sealing cavity 15, thereby effectively isolating the external environment and protecting the stable operation of the internal electrical components.

[0046] The heating assembly is used in semiconductor equipment. The heating tube 5 is located in the flow channel 16 and is provided with a flow deflector 11. Both ends of the heating tube 5 are provided with plugs 12 that can position the flow deflector 11.

[0047] The heating element 5 has a flow disruptor 11 inside, which is used to disperse the flow path of the fluid and improve its disturbance intensity and heat exchange efficiency in the heating area. The heating element 5 has plugs 12 at both ends, which are used to position the flow disruptor 11 to prevent it from shifting during fluid impact or thermal expansion, ensuring that the flow disruptor 11 is always in the designed position and fully exerts its heat exchange performance.

[0048] Depending on the actual application requirements, the flow-deflecting component 11 can adopt various structural forms to adapt to different fluid characteristics and heating targets. The flow-deflecting component 11 includes a rod 27 located in the flow channel 16; or, the flow-deflecting component 11 includes a helical spring 28 located in the flow channel 16; or, the flow-deflecting component 11 includes a rod 27 and a helical spring 28 located between the outer wall of the rod 27 and the inner wall of the heating tube 5; or, the flow-deflecting component 11 includes a second helical plate 31 located in the flow channel 16; or, the flow-deflecting component 11 includes a first support rod 29 located in the flow channel 16, with a first helical plate 30 on the outer peripheral wall of the first support rod 29; or, the flow-deflecting component 11 includes a second support rod 32 located in the flow channel 16, with spaced protrusions 33 fixedly connected to the outer peripheral wall of the second support rod 32.

[0049] As one implementation method of the plug, refer to Figure 5 The plug 12 includes a disc 34, which has several flow holes 35 and is fixed to the heating element 5.

[0050] As an assembly method for plugs and spoilers, refer to Figure 2 , Figure 5 The plug 12 has a cylindrical part located between multiple flow holes 35. The end of the rod 27 is inserted into the cylindrical part. It can be positioned by the disc 34 through an interference fit. Stepped parts are provided on the inner walls of both ends of the heating tube 5 so that the disc 34 abuts against the stepped parts, thereby realizing the positioning of the turbulence-disrupting component and the heating tube.

[0051] A semiconductor device includes the heating component described above, and the semiconductor device has a fluid passage, with flow channel 16 being part of the fluid passage.

[0052] During equipment operation, the fluid to be heated enters the fluid passage through the inlet end of the equipment, and then flows through the flow channel 16 inside the heating component for heating. The heated fluid continues to flow out along the passage, completing the entire fluid heat treatment process. The sealed cavity 15 of the heating component effectively isolates the electrical components 7 from the fluid environment, preventing corrosion or performance degradation of electrical components due to contact with NMP volatile gases, thereby ensuring the long-term safe operation of the equipment.

[0053] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any technical solution, concept, or design obtained by those skilled in the art by making equivalent substitutions or changes based on the technical solution and utility model concept disclosed in the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heating assembly, characterized in that, It includes a first bracket (1), a second bracket (2), an electric heating tube (5), and an electrical component (7). The electric heating tube (5) has a flow channel (16). A sealing cavity (15) is provided between the first bracket (1) and the second bracket (2). The electric heating tube (5) includes a heating tube section (6). The heating tube section (6) and the electrical component (7) are both sealed and installed in the sealing cavity (15).

2. A heating assembly according to claim 1, characterized in that, The second bracket (2) includes a first component (3) and a second component (4). The first component (3) is at least partially located between the first bracket (1) and the second component (4). The sealing cavity (15) includes a first cavity (17) located between the first bracket (1) and the first component (3) and a second cavity (18) located between the first component (3) and the second component (4). The heating tube (6) is located in the first cavity (17). The electrical component (7) has a wiring portion, and the wiring portion of the electrical component (7) is located in the second cavity (18). And / or, the heating tube section (6) includes a tube substrate and a thick film heating layer printed on the surface of the tube substrate; or the heating tube section (6) includes a tube substrate and an electric heating wire wound on the surface of the tube substrate; or the heating tube section (6) includes a tube substrate and a nano-electric heating film attached to the surface of the tube substrate.

3. A heating assembly according to claim 2, characterized in that, The electrical component (7) includes an electrode (8), which is mounted on the heating tube (5) and electrically connected to the nano-thermal film. The first component (3) has a through hole (19), through which the electrode (8) extends to the second cavity (18). And / or, the electrical component (7) includes a thermostat (9), the first component (3) is provided with a mounting base (20) and a through hole (21), the thermostat (9) is assembled with the mounting base (20), and the temperature sensing part of the thermostat (9) passes through the through hole (21) and is located near the heating tube part (6), and the wiring part of the thermostat (9) is located in the second cavity (18).

4. A heating assembly according to claim 3, characterized in that, The second component (4) has a mounting hole (22) for mounting a wire lead-out member (23). The electrical component (7) is electrically connected to a wire, which extends through the wire lead-out member (23) to the outside of the second component (4).

5. A heating assembly according to any one of claims 1-4, characterized in that, The electric heating tube (5) includes mounting tubes (13) located at both ends of the heating tube section (6). The mounting tubes (13) are connected to the heating tube section (6). One end of the mounting tubes (13) away from the heating tube section (6) is placed outside the sealing cavity (15). The mounting tubes (13) are fixed or limited by the first bracket (1) and / or the mounting tubes (13) are fixed or limited by the second bracket (2).

6. A heating assembly according to claim 5, characterized in that, The outer wall of the mounting tube (13) is fixedly connected or integrally formed with a limiting protrusion (14). The first bracket (1) is provided with a first groove (24) and end plate portions (25) located at both ends of the first groove (24). The end plate portions (25) are provided with slots (26). The limiting protrusion (14) at least partially abuts against the inner wall of the first groove (24) radially along the mounting tube (13). The limiting protrusion (14) at least partially abuts against the inner wall of the end plate portion (25) axially along the mounting tube (13). The outer peripheral wall of the heating tube (6) has a gap with the inner wall of the first groove (24). At least part of the outer wall of the mounting tube (13) abuts against the wall of the slot (26) radially. Alternatively, the outer peripheral wall of the mounting tube (13) has a positioning groove, the first bracket (1) has a first groove (24) and end plate portions (25) located at both ends of the first groove (24), the end plate portions (25) have slots (26), and the end plate portions (25) are at least partially inserted into the positioning groove.

7. A heating assembly according to any one of claims 1-4 and 6, characterized in that, The first bracket (1) and the second bracket (2) are provided with a plurality of assembly holes (36) arranged in a ring around their periphery. The first bracket (1) and the second bracket (2) are fixedly assembled by bolt assemblies passing through the assembly holes (36). The mating surfaces of the first bracket (1) and the second bracket (2) are sealed by face-to-face sealing or by annular sealing rings.

8. A heating assembly according to any one of claims 1-4, 6, characterized in that, The heating assembly is used in semiconductor devices. The heating tube (5) is located in the flow channel (16) and is provided with a flow deflector (11). The heating tube (5) is provided with plugs (12) at both ends that can position the flow deflector (11).

9. A heating assembly according to claim 8, characterized in that, The flow-deflecting element (11) includes a rod (27) located within the flow channel (16); or, the flow-deflecting element (11) includes a helical spring (28) located within the flow channel (16); or, the flow-deflecting element (11) includes a rod (27) and a helical spring (28) located between the outer wall of the rod (27) and the inner wall of the heating tube (5); or, the flow-deflecting element (11) includes a second helical plate (31) located within the flow channel (16); or, the flow-deflecting element (11) includes a first support rod (29) located within the flow channel (16), the outer peripheral wall of the first support rod (29) having a first helical plate (30); or, the flow-deflecting element (11) includes a second support rod (32) located within the flow channel (16), the outer peripheral wall of the second support rod (32) having spaced protrusions (33) fixedly connected to it. And / or the plug (12) includes a disc (34) having a plurality of flow holes (35) and the disc (34) being fixed to the heating tube (5).

10. A semiconductor device, characterized in that, The semiconductor device includes a heating component as described in any one of claims 1-9, the semiconductor device having a fluid passage, the flow channel (16) being a part of the fluid passage.

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