Multi-head die bonding equipment
By setting up first and second working areas and a translation adjustment mechanism in the multi-head die bonding equipment, the adaptability of the multi-head die bonding equipment is improved, solving the problem of poor applicability of existing equipment and realizing the flexibility of selecting the working mode according to the product size.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN XINYICHANG TECH CO LTD
- Filing Date
- 2025-03-31
- Publication Date
- 2026-05-12
AI Technical Summary
Existing multi-head die bonding equipment can only use a single working mode, resulting in poor applicability.
Design a multi-head die bonding device, including first and second working areas on a worktable, a product transport mechanism and multiple die bonding groups, and adjust the distance between the die bonding groups by a translation adjustment mechanism to achieve alternating or simultaneous operation modes to adapt to different product sizes.
It improves the overall adaptability of multi-head die bonding equipment, enabling the selection of appropriate working modes for die bonding operations based on product size.
Smart Images
Figure CN224234150U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor manufacturing technology, and in particular relates to a multi-head die bonding device. Background Technology
[0002] A die bonder is a piece of equipment used in semiconductor device manufacturing. Its function is to bond wafers to other components to achieve die bonding. Currently, for specific products such as display panels, multi-head die bonders can be used to perform die bonding operations on display panels. However, existing multi-head die bonders can only use a single working mode to process products, resulting in a technical problem of poor applicability. Utility Model Content
[0003] The purpose of this invention is to provide a multi-head die bonding device, which aims to solve the technical problem that existing die bonding devices can only use a single working mode and have poor applicability.
[0004] This utility model is implemented as follows: a multi-head die bonding device, comprising:
[0005] A workbench, the top surface of which has a first working area and a second working area;
[0006] A product transport mechanism is provided on the workbench and located between the first work area and the second work area, for transporting products along a first direction;
[0007] Multiple first and second die-bonding groups are used to bond the product to its current position as it passes through them. Each first die-bonding group is located within the first working area, and these groups are arranged sequentially along the first direction. Similarly, multiple second die-bonding groups are located within the second working area, and these groups are arranged sequentially along the first direction.
[0008] Multiple translation adjustment mechanisms are provided, and each of the multiple translation adjustment mechanisms is respectively disposed between the second die bonding group and the worktable, for adjusting the distance between the second die bonding group and the first die bonding group along the second direction, wherein the second direction and the first direction are arranged at an angle.
[0009] In an optional embodiment, the translation adjustment mechanism includes a translation mounting plate and a drive assembly. The translation mounting plate is slidably disposed on the top surface of the worktable, and the drive assembly is disposed on the worktable. The drive assembly is used to drive the translation mounting plate to move along the second direction, and a plurality of second die bonding groups are respectively fixed on the translation mounting plate.
[0010] In an optional embodiment, a sliding structure is further provided between the translation mounting plate and the worktable. The sliding structure includes a sliding guide rail and a movable slider. The sliding guide rail is disposed on the worktable and is arranged along the second direction. The movable slider is fixed on the translation mounting plate and can slide along the length direction of the sliding guide rail.
[0011] In one optional embodiment, the drive assembly includes a connecting block, a rotating screw, and a power unit. The rotating screw is rotatably mounted on the worktable along the second direction. The connecting block is mounted on the translational mounting plate and threadedly connected to the rotating screw. The drive end of the power unit is connected to the rotating screw and is used to drive the rotating screw to rotate.
[0012] In an optional embodiment, a fixed support plate is further provided at the first working area on the top surface of the workbench. The fixed support plate is used to install and fix the first die bond assembly, and the top surface of the fixed support plate is flush with the top surface of the translation mounting plate.
[0013] In an optional embodiment, each of the first die bonding groups includes a first die bonding mechanism and a first die supply group, the first die supply group being used to provide a crystal ring and separate the wafer from the crystal ring, the first die bonding mechanism being used to mount the wafer onto the product, and each of the second die bonding groups includes a second die bonding mechanism and a second die supply group, the second die supply group being used to provide a crystal ring and separate the wafer from the crystal ring, the second die bonding mechanism being used to mount the wafer onto the product, and the plurality of first die supply groups and the plurality of second die supply groups are arranged opposite to each other.
[0014] In an optional embodiment, both the first and second crystal supply groups include a crystal ring feeding mechanism, a crystal ring transport mechanism, a crystal ring rotation platform, and a pin mechanism. The crystal ring feeding mechanism is used to accommodate and store crystal rings, the crystal ring rotation platform is used to support the crystal rings, the crystal ring transport mechanism is used to transport the crystal rings from the crystal ring feeding mechanism to the crystal ring rotation platform, and the pin mechanism is used to separate the wafer from the crystal rings.
[0015] In an optional embodiment, both the first die bonding mechanism and the second die bonding mechanism include a die bonding support, a die bonding position module, a die bonding power unit, and a swing arm assembly. The die bonding power unit is movably connected to the die bonding support through the die bonding position module, and the swing arm assembly is connected to the drive end of the die bonding power unit for picking up and transporting the wafer.
[0016] In an optional embodiment, the product transport mechanism includes a plurality of clamping mechanisms arranged sequentially at intervals along the first direction. Each clamping mechanism is located between the first die bonding mechanism and the second die bonding mechanism. A connecting transport rail is also provided between two adjacent clamping mechanisms for transporting the product from one clamping mechanism to another.
[0017] In an optional embodiment, the clamping mechanism includes a clamping base, a first clamping translation part, and a second clamping translation part. The clamping base is disposed on the worktable. The first clamping translation part is slidably disposed on the clamping base along the first direction. The second clamping translation part is slidably disposed on the first clamping translation part along the second direction. A clamping bracket for placing and fixing the product is also provided on the top surface of the second clamping translation part.
[0018] The technical advantages of this invention compared to existing technologies are as follows: A first working area and a second working area are provided on the top surface of the worktable, and a product transport mechanism is provided between the first and second working areas. Simultaneously, multiple first die-bonding groups are arranged sequentially along a first direction within the first working area. Multiple second die-bonding groups are also arranged sequentially along the first direction within the second working area. When the multi-head die-bonding equipment is operating, the product can be transported along the first direction via the product transport mechanism. As the product passes through the first die-bonding group and the corresponding second die-bonding group, the product is die-bonded by the first and second die-bonding groups. Compared to existing multi-head die-bonding equipment, by providing a translation adjustment mechanism between the second die-bonding group and the worktable, the distance between the second and first die-bonding groups along the second direction can be adjusted when the product size changes. When the distance between the second die bonding group and the first die bonding group is small, an alternating operation mode can be selected. When the distance between the second die bonding group and the first die bonding group is large, a simultaneous operation mode can be selected. This allows the equipment to select the appropriate working mode for die bonding operation according to the size of the product, thereby improving the overall adaptability of the equipment. Attached Figure Description
[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is a schematic diagram of the structure of the multi-head die bonding device provided in this embodiment of the utility model;
[0021] Figure 2This is a partial structural schematic diagram of the multi-head die bonding device provided in this embodiment of the utility model;
[0022] Figure 3 This is a schematic diagram of the structure of the workbench used in this embodiment of the utility model;
[0023] Figure 4 yes Figure 2 Enlarged structural diagram at point A;
[0024] Figure 5 This is a schematic diagram of the structure of the translational mounting plate used in this embodiment of the utility model;
[0025] Figure 6 This is a schematic diagram of the clamping mechanism used in the embodiment of this utility model.
[0026] Explanation of reference numerals in the attached figures:
[0027] 1. Workbench; 11. First working area; 12. Second working area; 2. First die bonding group; 21. First die bonding mechanism; 22. First die supply group; 3. Second die bonding group; 31. Second die bonding mechanism; 311. Die bonding support; 312. Die bonding position module; 313. Die bonding power unit; 314. Swing arm assembly; 32. Second die supply group; 321. Crystal ring feeding mechanism; 322. Crystal ring transport mechanism; 323. Crystal ring rotation platform; 324. Ejector pin mechanism; 4. Production 41. Product transport mechanism; 411. Fixture mechanism; 412. Fixture base; 413. First fixture translation part; 414. Second fixture translation part; 415. Clamping bracket; 42. Connecting transport guide rail; 5. Translation adjustment mechanism; 51. Translation mounting plate; 52. Drive assembly; 521. Connecting block; 522. Rotating screw; 523. Power unit; 6. Fixed support plate; 7. Position detection unit; 8. Sliding structure; 81. Sliding guide rail; 82. Moving slider; 9. Product. Detailed Implementation
[0028] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.
[0029] In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0030] In this embodiment, according to Figure 1 The XYZ rectangular coordinate system established in this paper is defined as follows: the first direction can be along the X-axis, the second direction can be along the Y-axis, and the third direction can be along the Z-axis. The angle between the first and second directions can be a right angle, and the angle between the third direction and the other two directions can also be a right angle. Furthermore, the side located in the positive X-axis direction is defined as "front," and the side located in the negative X-axis direction is defined as "back"; the side located in the positive Y-axis direction is defined as "left," and the side located in the negative Y-axis direction is defined as "right"; the side located in the positive Z-axis direction is defined as "up," and the side located in the negative Z-axis direction is defined as "down."
[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0032] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0033] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.
[0034] Please refer to Figures 1 to 4As shown in this embodiment of the invention, a multi-head die bonding device is provided, including a worktable 1, a product transport mechanism 4, a translation adjustment mechanism 5, a first die bonding group 2, and a second die bonding group 3. The top surface of the worktable 1 has a first working area 11 and a second working area 12. The product transport mechanism 4 is disposed on the worktable 1 and is located between the first working area 11 and the second working area 12. The product transport mechanism 4 is used to transport the product along a first direction. There are multiple first die bonding groups 2 and multiple second die bonding groups 3, used to bond the product as it passes its current position. Each first die bonding group 2 is disposed within the first working area 11, and multiple first die bonding groups 2 are arranged sequentially along the first direction. Similarly, each second die bonding group 3 is disposed within the second working area 12, and multiple second die bonding groups 3 are arranged sequentially along the first direction. There are multiple translation adjustment mechanisms 5, which are respectively arranged between the second die bonding group 3 and the worktable 1. They are used to adjust the distance between the second die bonding group 3 and the first die bonding group 2 along the second direction, and the second direction is set at an angle to the first direction.
[0035] Specifically, the workbench 1 refers to a supporting component with a certain height. A mounting plane can be provided on the top surface of the workbench 1, allowing other components to be mounted on this plane and supported by the workbench 1. The first working area 11 and the second working area 12 both refer to areas of a certain size within the mounting plane. The product transport mechanism 4 refers to a component or part used for transporting the product. The product transport mechanism 4 can be a conveyor belt, transport rail, or clamping mechanism 41, or a combination of multiple of these. The first die-bonding assembly 2 and the second die-bonding assembly 3 refer to components or parts used to mount wafers onto the product (i.e., die bonding). Both the first die-bonding assembly 2 and the second die-bonding assembly 3 include multiple mechanisms that work together to mount the wafers to designated positions on the product. The translation adjustment mechanism 5 refers to a component structure used to drive an object to reciprocate along a straight line. The first direction and the second direction both refer to directions within the same plane, and the angle between the first direction and the second direction can generally be a right angle.
[0036] It should be noted that the first die bonding group 2 and the second die bonding group 3 on both sides of the product transport mechanism 4 can be set up one-to-one. The number of the first die bonding group 2 and the second die bonding group 3 can both be three. One first die bonding group 2 and one second die bonding group 3 form a working unit. Multiple working units are set up sequentially along the first direction, so that the setting of the first die bonding group 2 and the second die bonding group 3 saves more space.
[0037] The multi-head die bonding device provided in this embodiment of the invention has a first working area 11 and a second working area 12 on the top surface of the worktable 1, and a product transport mechanism 4 is provided between the first working area 11 and the second working area 12. Simultaneously, multiple first die bonding groups 2 are arranged sequentially along a first direction within the first working area 11. Multiple second die bonding groups 3 are arranged sequentially along the first direction within the second working area 12. When the multi-head die bonding device is working, the product can be transported along the first direction by the product transport mechanism 4. When the product passes through the first die bonding group 2 and the corresponding second die bonding group 3, the product can be die bonded by the first die bonding group 2 and the second die bonding group 3. Compared with existing multi-head die bonding devices, a translation adjustment mechanism 5 is provided between the second die bonding group 3 and the worktable 1. This translation adjustment mechanism 5 can adjust the distance between the second die bonding group 3 and the first die bonding group 2 along the second direction when the size of the product changes. When the distance between the second die bonding group 3 and the first die bonding group 2 is small, an alternating operation mode can be selected (i.e., the corresponding first die bonding group 2 and the second die bonding group 3 alternately perform die bonding on the product). When the distance between the second die bonding group 3 and the first die bonding group 2 is large, a simultaneous operation mode can be selected (i.e., the corresponding first die bonding group 2 and the second die bonding group 3 simultaneously perform die bonding on the product). This allows the multi-head die bonding equipment to select the appropriate working mode for die bonding operation according to the size of the product, thereby improving the overall adaptability of the multi-head die bonding equipment.
[0038] In one embodiment, see Figure 3 and Figure 5 The translation adjustment mechanism 5 includes a translation mounting plate 51 and a drive assembly 52. The translation mounting plate 51 is slidably disposed on the top surface of the worktable 1, and the drive assembly 52 is disposed on the worktable 1. The drive assembly 52 is used to drive the translation mounting plate 51 to move along a second direction. Multiple second die-bonding groups 3 are respectively fixed on the translation mounting plate 51. Specifically, the translation mounting plate 51 refers to a plate-shaped structure with a certain area. The translation mounting plate 51 can be slidably connected to the worktable 1 through a sliding structure 8. The sliding structure 8 can be a slide rail slider structure, or a slide rail roller structure, etc. The drive assembly 52 refers to a component or assembly used to drive an object to move in a straight line. The drive assembly 52 can be a drive cylinder, hydraulic cylinder, or electric push rod, etc. The drive assembly 52 can also be a lead screw structure that works in conjunction with a motor to drive the movement of the object. In this embodiment, by sliding the translation mounting plate 51 within the second working area 12 and then mounting the second die bonding assembly 3 on the translation mounting plate 51, when it is necessary to adjust the distance between the second die bonding assembly 3 and the first die bonding assembly 2 along the second direction, the translation mounting plate 51 can be driven to move along the second direction by the drive assembly 52, thereby driving the second die bonding assembly 3 to move as a whole, making the overall structure of the translation adjustment mechanism 5 simpler.
[0039] In an optional embodiment, please refer to Figure 4 The multi-head die bonding equipment also includes a controller and a position detection unit 7 for detecting whether the translation mounting plate 51 is in the zero position. The controller, position detection unit 7, and control terminals of the drive assembly 52 are all electrically connected. Specifically, the position detection unit 7 refers to a component or assembly that detects the position of an object's movement. The position detection unit 7 can be photoelectric, electromagnetic, or mechanical, and can be an encoder, laser rangefinder, or Hall sensor. The position detection unit 7 can also be a proximity switch or photoelectric switch, which is set at a preset position on the workbench 1 and cooperates with at least a portion of the translation mounting plate 51. When the translation mounting plate 51 moves to the zero position, the position detection unit 7 is triggered, and the position detection unit 7 sends a signal to the controller so that the controller detects that the translation mounting plate 51 is in the zero position. The controller refers to a component that can perform logical operations and control other electrical components. The controller can be a PLC (Programmable Logic Controller), MCU (Microcontroller Unit), or industrial computer, etc.
[0040] The zero position typically refers to the position where the translation mounting plate 51 has moved zero distance in the moving direction. The specific position of the zero position can be set according to production needs. When the position of the translation mounting plate 51 needs to be moved, the controller, position detection unit 7, and drive assembly 52 are all electrically connected. The controller can send a signal to the drive assembly 52, causing the drive assembly 52 to drive the translation mounting plate 51 to move towards the zero point. After the position detection unit 7 is triggered, the translation mounting plate 51 stops moving, at which point the translation mounting plate 51 is at the zero position. After the translation mounting plate 51 is at the zero point, the controller sends a signal to the drive assembly 52 again, causing the drive assembly 52 to drive the translation mounting plate 51 to move a specified distance based on the zero point position and the product size. Alternatively, when the distance between the current position of the translation mounting plate 51 and the zero point is known, the controller can directly calculate the distance between the target position and the current position, and then send a signal to the drive assembly 52, causing the drive assembly 52 to drive the movement of the translation mounting plate 51.
[0041] In this embodiment, the controller and the position detection unit 7 work together to record the moving position and zero point position of the translation mounting plate 51, thereby avoiding the large error and inaccurate control caused by visually moving the translation mounting plate 51. This makes the position movement of the translation mounting plate 51 more precise, thus making the overall adjustment of the equipment more accurate and faster.
[0042] In addition, the position information of the translational mounting plate 51 during the production of the corresponding product can be recorded and saved by the controller, so as to quickly switch when producing the same type of product next time, thereby improving the adaptability of the equipment.
[0043] In one embodiment, see Figure 5 A sliding structure 8 is also provided between the translation mounting plate 51 and the worktable 1. The sliding structure 8 includes a sliding guide rail 81 and a movable slider 82. The sliding guide rail 81 is set on the worktable 1 and is arranged along the second direction. The movable slider 82 is fixed on the translation mounting plate 51 and can slide along the length direction of the sliding guide rail 81. Specifically, the sliding guide rail 81 refers to a component with a certain length, and the movable slider 82 refers to a block-shaped component with a certain volume. By setting the sliding guide rail 81 on the worktable 1 and arranging it along the second direction, and simultaneously fixing the movable slider 82 on the translation mounting plate 51 and allowing the movable slider 82 to slide along the length direction of the sliding guide rail 81, the relative sliding between the worktable 1 and the translation mounting plate 51 becomes more convenient and precise.
[0044] In one embodiment, see Figure 5 The drive assembly 52 includes a connecting block 521, a rotating screw 522, and a power unit 523. The rotating screw 522 is rotatably mounted on the worktable 1 in a second direction. The connecting block 521 is mounted on the translational mounting plate 51 and threadedly connected to the rotating screw 522. The drive end of the power unit 523 is connected to the rotating screw 522 and is used to drive the rotating screw 522 to rotate. The connecting block 521 refers to a component with a certain volume, which can be block-shaped, plate-shaped, or a combination of various shapes. The rotating screw 522 refers to a component with a certain length, which can be rod-shaped or column-shaped, and a first thread can be provided around the circumference of the rotating screw 522. The connecting block 521 is also provided with a mounting hole for the rotating screw 522 to pass through, and a second thread that meshes with the first thread is also provided on the inner wall of the mounting hole. The power unit 523 refers to a component or assembly that can output torque, and the power unit 523 can be a servo motor. When adjusting the position of the translation mounting plate 51, the power unit 523 can drive the rotating screw 522 to rotate around its own axis, thereby driving the connecting block 521 and the translation mounting plate 51 to move along the axis of the rotating screw 522. This makes the adjustment of the translation mounting plate 51 more convenient and the position adjustment of the translation mounting plate 51 more precise.
[0045] In one embodiment, see Figure 3A fixed support plate 6 is also provided at the first working area 11 on the top surface of the workbench 1. The fixed support plate 6 is used to install and fix the first die bonding assembly 2, and the top surface of the fixed support plate 6 is flush with the top surface of the translation mounting plate 51. Specifically, the fixed support plate 6 refers to a plate-shaped structure with a certain area. The fact that the top surface of the fixed support plate 6 is flush with the top surface of the translation mounting plate 51 generally means that they are flush in the vertical direction. In this embodiment, the height of the first working area 11 on the workbench 1 can be higher than the height of the second working area 12. At this time, when the fixed support plate 6 is installed in the first working area 11, and the translation mounting plate 51 and the sliding structure 8 are installed in the second working area 12, the top surface of the fixed support plate 6 is flush with the top surface of the translation mounting plate 51. This allows the first die bonding assembly 2 and the second die bonding assembly 3 to be on the same horizontal plane after installation, thereby improving the die bonding accuracy of the equipment.
[0046] In one embodiment, see Figure 2 Each first die-bonding group 2 includes a first die-bonding mechanism 21 and a first die-supply group 22. The first die-supply group 22 is used to provide a die ring and separate the wafer from the die ring. The first die-bonding mechanism 21 is used to mount the wafer onto the product. Each second die-bonding group 3 includes a second die-bonding mechanism 31 and a second die-supply group 32. The second die-supply group 32 is used to provide a die ring and separate the wafer from the die ring. The second die-bonding mechanism 31 is used to mount the wafer onto the product. Multiple first die-supply groups and multiple second die-supply groups are arranged one-to-one. Specifically, the first die-bonding mechanism 21 and the second die-bonding mechanism 31 both refer to mechanisms that transport the wafer from the pick-up position to the die-bonding position and fix it onto the product. The first die-supply group 22 and the second die-supply group 32 both refer to working groups composed of multiple mechanisms, whose function is to transport the die ring to the pick-up position and separate the wafer from the die ring. During operation, the wafer can be separated from the crystal ring after it has been transported to the wafer pick-up position; alternatively, the wafer can be separated from the crystal ring before being transported to the wafer pick-up position, depending on the production process. In this embodiment, the cooperation between the first die bonding mechanism 21 and the first die supply group 22, and the cooperation between the second die bonding mechanism 31 and the second die supply group 32, makes the die bonding operations of the first die bonding group 2 and the second die bonding group 3 more convenient.
[0047] In one embodiment, see Figure 4Both the first crystal supply group 22 and the second crystal supply group 32 include a crystal ring feeding mechanism 321, a crystal ring transport mechanism 322, a crystal ring rotation platform 323, and a ejector mechanism 324. The crystal ring feeding mechanism 321 is used to accommodate and store crystal rings, the crystal ring rotation platform 323 is used to support crystal rings, the crystal ring transport mechanism 322 is used to transport crystal rings from the crystal ring feeding mechanism 321 to the crystal ring rotation platform 323, and the ejector mechanism 324 is used to separate wafers from crystal rings. Specifically, during the production process, crystal rings are stored in the crystal ring feeding mechanism 321. The crystal ring transport mechanism 322 can remove crystal rings containing wafers from the crystal ring feeding mechanism 321 and place them on the crystal ring rotation platform 323, and can also remove empty crystal rings from the crystal ring rotation platform 323 and place them into the crystal ring feeding mechanism 321. After the crystal ring is placed and fixed on the crystal ring rotating platform 323, the ejector pin mechanism 324 can separate the wafer on the crystal ring from the crystal ring so that the die bonding mechanism can pick it up and transport it to the die bonding position for die bonding, making the entire die supply working group more convenient to use.
[0048] In one embodiment, see Figure 4 Both the first die-bonding mechanism 21 and the second die-bonding mechanism 31 include a die-bonding support 311, a die-bonding position module 312, a die-bonding power unit 313, and a swing arm assembly 314. The die-bonding power unit 313 is movably connected to the die-bonding support 311 through the die-bonding position module 312, and the swing arm assembly 314 is connected to the drive end of the die-bonding power unit 313 for picking up and transporting chips. Specifically, the die-bonding support 311 refers to a support component with a certain height, which can be columnar, block-shaped, or a combination of various shapes. The die-bonding position module 312 refers to a component that can adjust the horizontal position of an object, and the die-bonding power unit 313 is disposed on the movable end of the die-bonding position module 312. The die-bonding power unit 313 refers to a component that can output torque. The die-bonding power unit 313 can be a die-bonding motor. In order for the normal long-term use of the die-bonding motor, a die-bonding heat dissipation component is also provided outside the die-bonding motor. The swing arm assembly 314 refers to a swing arm structure of a certain length. A suction nozzle structure can be provided at the end of the swing arm structure. The swing arm assembly 314 can be moved by swinging, and the suction nozzle structure can pick up or release the wafer to realize the transport of the wafer. When the position of the adjustment platform changes, the position of the die bonding power unit 313 and the swing arm assembly 314 can also be adjusted by the die bonding position module 312, making the use of the die bonder more convenient.
[0049] In one embodiment, see Figure 1 and Figure 2The product transport mechanism 4 includes multiple clamping mechanisms 41 arranged at intervals along a first direction. Each clamping mechanism 41 is located between the first die-bonding mechanism 21 and the second die-bonding mechanism 31. A connecting transport rail 42 is also provided between two adjacent clamping mechanisms 41 for transporting the product from one clamping mechanism 41 to another. Specifically, a clamping mechanism 41 refers to a component or assembly that can fix the product and adjust its position in the horizontal direction. A connecting transport rail 42 refers to a component or assembly that can transport the product in a straight line. In this embodiment, by arranging multiple clamping mechanisms 41 at intervals along the first direction, and by placing each clamping mechanism 41 in the area between the first die-bonding mechanism 21 and the second die-bonding mechanism 31, the product can be positioned and fixed during die bonding by the first die-bonding mechanism 21 and the second die-bonding mechanism 31. Furthermore, after the second die-bonding assembly 3 has been adjusted in position along the second direction, the clamping mechanisms 41 can also adjust the product's position in the horizontal direction, ensuring that the distance between the product and the first die-bonding mechanism 21 or the second die-bonding mechanism 31 remains equal.
[0050] In one embodiment, see Figure 6 The clamping mechanism 41 includes a clamping base 411, a first clamping translation part 412, and a second clamping translation part 413. The clamping base 411 is disposed on the worktable 1. The first clamping translation part 412 is slidably disposed on the clamping base 411 along a first direction, and the second clamping translation part 413 is slidably disposed on the first clamping translation part 412 along a second direction. A clamping bracket 414 for placing and fixing the product is also provided on the top surface of the second clamping translation part 413. Specifically, the position of the clamping bracket 414 can be adjusted by sliding the first clamping translation part 412 and the second clamping translation part 413, making the position adjustment of the product more convenient. In addition, sliding units are provided between the clamping base 411 and the first clamping translation part 412 and between the first clamping translation part 412 and the second clamping translation part 413. The sliding units can be a slide rail slider structure or a roller sliding structure 8. A drive unit is provided between the fixture base 411 and the first fixture translation part 412 and between the first fixture translation part 412 and the second fixture translation part 413. The drive unit can be a motor screw structure, or a linear motor, cylinder or hydraulic cylinder, etc.
[0051] The above are merely preferred embodiments of the present utility model, and only specifically describe the technical principles of the present utility model. These descriptions are only for explaining the principles of the present utility model and should not be construed as limiting the scope of protection of the present utility model in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model, as well as other specific embodiments of the present utility model that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of the present utility model.
Claims
1. A multi-head die bonding device, characterized in that, include: A workbench, the top surface of which has a first working area and a second working area; A product transport mechanism is provided on the workbench and located between the first work area and the second work area, for transporting products along a first direction; Multiple first and second die-bonding groups are used to bond the product to its current position as it passes through them. Each first die-bonding group is located within the first working area, and these groups are arranged sequentially along the first direction. Similarly, multiple second die-bonding groups are located within the second working area, and these groups are arranged sequentially along the first direction. Multiple translation adjustment mechanisms are provided, and each of the multiple translation adjustment mechanisms is respectively disposed between the second die bonding group and the worktable, for adjusting the distance between the second die bonding group and the first die bonding group along the second direction, wherein the second direction and the first direction are arranged at an angle.
2. The multi-head die bonding device as described in claim 1, characterized in that, The translation adjustment mechanism includes a translation mounting plate and a drive assembly. The translation mounting plate is slidably disposed on the top surface of the worktable, and the drive assembly is disposed on the worktable. The drive assembly is used to drive the translation mounting plate to move along the second direction, and multiple second die bonding groups are respectively fixed on the translation mounting plate.
3. The multi-head die bonding device as described in claim 2, characterized in that, A sliding structure is also provided between the translation mounting plate and the worktable. The sliding structure includes a sliding guide rail and a movable slider. The sliding guide rail is disposed on the worktable and is arranged along the second direction. The movable slider is fixed on the translation mounting plate and can slide along the length direction of the sliding guide rail.
4. The multi-head die bonding device as described in claim 3, characterized in that, The drive assembly includes a connecting block, a rotating screw, and a power unit. The rotating screw is rotatably mounted on the worktable along the second direction. The connecting block is mounted on the translational mounting plate and threadedly connected to the rotating screw. The drive end of the power unit is connected to the rotating screw and is used to drive the rotating screw to rotate.
5. The multi-head die bonding device as described in claim 2, characterized in that, A fixed support plate is also provided at the first working area on the top surface of the workbench. The fixed support plate is used to install and fix the first die bonding assembly, and the top surface of the fixed support plate is flush with the top surface of the translation mounting plate.
6. The multi-head die bonding device as described in claim 1, characterized in that, Each of the first die bonding groups includes a first die bonding mechanism and a first die supply group. The first die supply group is used to provide a die ring and separate the wafer from the die ring. The first die bonding mechanism is used to mount the wafer onto the product. Each of the second die bonding groups includes a second die bonding mechanism and a second die supply group. The second die supply group is used to provide a die ring and separate the wafer from the die ring. The second die bonding mechanism is used to mount the wafer onto the product. The plurality of first die supply groups and the plurality of second die supply groups are arranged opposite to each other.
7. The multi-head die bonding device as described in claim 6, characterized in that, Both the first and second crystal supply groups include a crystal ring feeding mechanism, a crystal ring transport mechanism, a crystal ring rotating platform, and a pin mechanism. The crystal ring feeding mechanism is used to accommodate and store crystal rings, the crystal ring rotating platform is used to support the crystal rings, the crystal ring transport mechanism is used to transport the crystal rings from the crystal ring feeding mechanism to the crystal ring rotating platform, and the pin mechanism is used to separate the wafer from the crystal rings.
8. The multi-head die bonding device as described in claim 7, characterized in that, Both the first die bonding mechanism and the second die bonding mechanism include a die bonding support, a die bonding position module, a die bonding power unit, and a swing arm assembly. The die bonding power unit is movably connected to the die bonding support through the die bonding position module, and the swing arm assembly is connected to the drive end of the die bonding power unit for picking up and transporting the wafer.
9. The multi-head die bonding device as described in claim 6, characterized in that, The product transport mechanism includes a plurality of clamping mechanisms arranged at intervals along the first direction. Each clamping mechanism is located between the first die bonding mechanism and the second die bonding mechanism. A connecting transport rail is also provided between two adjacent clamping mechanisms for transporting the product from one clamping mechanism to another.
10. The multi-head die bonding device as described in claim 9, characterized in that, The clamping mechanism includes a clamping base, a first clamping translation part, and a second clamping translation part. The clamping base is disposed on the worktable. The first clamping translation part is slidably disposed on the clamping base along the first direction. The second clamping translation part is slidably disposed on the first clamping translation part along the second direction. A clamping bracket for placing and fixing the product is also provided on the top surface of the second clamping translation part.