AMB ceramic substrate vacuum welding tool

Abstract

The utility model discloses an AMB ceramic substrate vacuum welding tool which is characterized in that a ceramic substrate is welded on the top of a heat dissipation bottom plate, the tool comprises a positioning frame which is placed on the top of the heat dissipation bottom plate, a plurality of positioning holes are formed in the positioning frame, and the ceramic substrate is placed in the positioning holes; the support frame is positioned above the positioning frame; the positioning piece is connected with the supporting frame, and the positioning piece is used for enabling the bottom of the positioning frame to be attached to the top of the heat dissipation bottom plate.

Description

Technical Field

[0001] This utility model relates to the field of AMB welding technology, and in particular to a vacuum welding fixture for AMB ceramic substrates. Background Technology

[0002] The vacuum welding process for the base plate involves soldering the AMB ceramic substrate onto the heat sink base plate using solder pads. Due to the large welding area and the large size of the heat sink base plate, the heat sink base plate is prone to bending and deformation during the welding process. Therefore, the heat sink base plate needs to be pre-bent before welding, and it will be flat after welding.

[0003] Placing the AMB modules on the surface of the heat sink base plate is an essential step, and specific tooling is needed for positioning to ensure that the AMB modules are accurately placed in the intended positions. However, because the surface curvature of the heat sink base plate changes before and after welding, the existing positioning tooling cannot adjust accordingly to the change in the curvature of the base plate. This leads to deviations in the positioning of the AMB modules or inaccurate positions of the solder pads during actual operation. Utility Model Content

[0004] The purpose of this invention is to solve the above-mentioned problems by providing a vacuum welding fixture for AMB ceramic substrates.

[0005] The technical solution of this utility model is implemented as follows:

[0006] This utility model provides a vacuum welding fixture for an AMB ceramic substrate, wherein the ceramic substrate is welded to the top of a heat dissipation base plate, and the fixture includes:

[0007] A positioning frame is placed on top of the heat dissipation base plate, and the positioning frame has several positioning holes, in which the ceramic substrate is placed;

[0008] The support frame is located above the positioning frame;

[0009] A positioning element is connected to the support frame, and the positioning element is used to keep the bottom of the positioning frame in contact with the top of the heat dissipation base plate.

[0010] The advantages or beneficial effects of the above technical solutions include at least the following:

[0011] Precise positioning is achieved using a specially designed positioning frame equipped with spring pins (PINs). These spring pins effectively hold the positioning frame in place, ensuring consistent contact between the positioning frame and the heatsink base plate throughout the entire soldering process. This design and operation method not only guarantees the accuracy of the AMB and heatsink base positions before soldering but also maintains this precise positioning after soldering, thereby ensuring the stability of the entire soldering process and the quality of the final product. Attached Figure Description

[0012] The accompanying drawings illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the principles of the present invention. These drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification.

[0013] Figure 1 This diagram shows the structure of the heat dissipation base plate before welding in the first embodiment of the present invention;

[0014] Figure 2 This diagram shows the structure of the heat dissipation base plate after welding in the first embodiment of the present invention;

[0015] Figure 3 A schematic diagram of the ceramic substrate and heat dissipation base plate positioning frame according to an embodiment of the present invention is shown;

[0016] Figure 4 A schematic diagram of the structure of the spring PI N according to an embodiment of the present invention is shown;

[0017] Figure 5 This diagram illustrates the process of removing the positioning bracket from the heat dissipation base plate after welding, as described in an embodiment of the present invention, to obtain the finished product.

[0018] Figure 6 A schematic diagram of the self-weight column in the second embodiment of this utility model is shown;

[0019] Reference numerals: 10, heat dissipation base plate; 11, ceramic substrate; 21, positioning frame; 211, positioning hole; 22, support frame; 231, spring pin; 2311, base end; 2312, telescopic end; 232, self-weight column; 2321, upper end; 2322, lower end; 2323, counterweight block; Detailed Implementation

[0020] Embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While some embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the present invention. It should be understood that the accompanying drawings and embodiments of the present invention are for illustrative purposes only and are not intended to limit the scope of protection of the present invention.

[0021] It should be noted that, where there is no conflict, the embodiments and features described in these embodiments can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0022] It should be understood that the term "comprising" and its variations as used herein are open-ended, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". Definitions of other terms will be given in the following description. It should be noted that the concepts of "first", "second", etc., mentioned in this utility model are only used to distinguish different devices, modules, or units, and are not used to limit the order of functions performed by these devices, modules, or units or their interdependencies.

[0023] It should be noted that the terms "one" and "multiple" used in this utility model are illustrative rather than restrictive. Those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0024] The names of the messages or information exchanged between the multiple devices in this embodiment of the invention are for illustrative purposes only and are not intended to limit the scope of these messages or information.

[0025] Reference Figure 1 and Figure 2 A vacuum welding fixture for AMB ceramic substrates is disclosed. The ceramic substrate 11 is welded to the top of a heat sink base plate 10. Before being welded to the heat sink base plate 10, the ceramic substrate 11 has an irregular hemispherical structure, and after welding, it becomes flat.

[0026] Tooling 20 includes:

[0027] Positioning frame 21 is placed on top of heat dissipation base plate 10. Positioning frame 21 has several positioning holes 211. Ceramic substrate 11 is placed in the positioning holes 211. Preferably, positioning frame 21 is made of metal sheet. Positioning holes 211 are opened on metal sheet. The height of the upper surface of metal sheet is lower than the height of the upper surface of ceramic substrate 11.

[0028] Positioning elements are used to keep the bottom of the positioning frame 21 in contact with the top of the heat dissipation base plate 10. The positioning elements are distributed around and between the ceramic substrate 11.

[0029] Support frame 22 is located above positioning frame 21, and positioning element is connected to support frame 22;

[0030] Based on the above structure, this application has two embodiments for the selection of positioning elements;

[0031] In the first embodiment, the positioning component is a spring PI N231, which includes a base end 2311 and a telescopic end 2312. A spring is installed in the base end 2311 so that the telescopic end 2312 is elastically telescopically connected to the base end 2311. The end of the telescopic end 2312 abuts against the top of the positioning frame 21. The base end 2311 of the spring PI N231 is fixed to the support frame 22.

[0032] like Figure 1 As shown, before the heat dissipation base plate 10 is welded, the heat dissipation base plate 10 is arc-shaped. The end of the extension end 2312 of the spring PI N231 abuts against the part of the positioning frame 21 located around the ceramic substrate 11, so that the positioning frame 21 can be tightly attached to the heat dissipation base. During the welding process, the heat dissipation base plate 10 changes from arc shape to straight shape, and the extension end 2312 of the spring PI N231 will also move upward adaptively, so that the positioning frame 21 maintains its position, thereby keeping the position of the ceramic substrate 11 from shifting during the deformation of the heat dissipation base plate 10.

[0033] Based on the first embodiment, the end of the telescopic end 2312 away from the base end 2311 is provided with a hemispherical structure. The hemispherical structure can ensure that the telescopic end 2312 contacts the positioning frame 21 to the maximum extent during the welding process.

[0034] In the second embodiment, the positioning element includes:

[0035] The self-weight column 232 is movably connected to the support frame 22. The self-weight column 232 can move up and down along its height direction. The lower end 2322 of the self-weight column 232 abuts against the top of the positioning frame 21, and the upper end 2321 passes through the support frame 22. Due to its own weight, the self-weight column 232 will press down on the positioning frame 21. During the welding process, the heat dissipation base plate 10 changes from an arc shape to a straight shape. The lower end 2322 of the self-weight column 232 presses against the positioning frame 21, so that the positioning frame 21 maintains its position, thereby ensuring that the position of the ceramic substrate 11 does not shift during the deformation of the heat dissipation base plate 10.

[0036] Furthermore, such as Figure 6As shown, the positioning component further includes a counterweight 2323, which is detachably installed on the upper end 2321 of the self-weight column 232. The operator can select the counterweight 2323 according to the degree of curvature of the heat sink. The preferred counterweight 2323 is connected to the upper end 2321 of the self-weight column 232 by threads, which is convenient for disassembly and assembly.

[0037] Based on the above structure, the lower end 2322 of the self-weight column 232 is set in a hemispherical structure. The hemispherical structure can ensure that the telescopic end 2312 contacts the positioning frame 21 to the maximum extent during the welding process.

[0038] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0039] Those skilled in the art should understand that the above embodiments are merely for clearly illustrating the present invention and are not intended to limit the scope of the present invention. Those skilled in the art can make other changes or modifications based on the above disclosure, and these changes or modifications still fall within the scope of the present invention.

Claims

1. A vacuum welding fixture (20) for an AMB ceramic substrate (11), wherein the ceramic substrate (11) is welded to the top of a heat dissipation base plate (10), characterized in that: The tooling (20) includes: Positioning frame (21), the positioning frame (21) is placed on top of the heat dissipation base plate (10), the positioning frame (21) has a plurality of positioning holes (211), and the ceramic substrate (11) is placed in the positioning holes (211); The support frame (22) is located above the positioning frame (21); A positioning element is connected to the support frame (22), and the positioning element is used to keep the bottom of the positioning frame (21) in contact with the top of the heat dissipation base plate (10).

2. The vacuum welding fixture for AMB ceramic substrates according to claim 1, characterized in that: The positioning element includes: Spring PIN (231), the spring PIN (231) includes a base end (2311) and a telescopic end (2312), the telescopic end (2312) is elastically telescopically connected to the base end (2311), and the end of the telescopic end (2312) abuts against the top of the positioning frame (21); The base end (2311) of the spring PIN (231) is fixed to the support frame (22).

3. The vacuum welding fixture for AMB ceramic substrates according to claim 2, characterized in that: The end of the telescopic end (2312) away from the base end (2311) is configured with a hemispherical structure.

4. The vacuum welding fixture for AMB ceramic substrates according to claim 1, characterized in that: The positioning element includes: Self-weight column (232), which is movably connected to the support frame (22), can move up and down along its height direction, the lower end (2322) of the self-weight column (232) abuts against the top of the positioning frame (21), and the upper end (2321) passes through the support frame (22).

5. The vacuum welding fixture for AMB ceramic substrates according to claim 4, characterized in that: The positioning element further includes: The counterweight (2323) is detachably mounted on the upper end (2321) of the self-weight column (232).

6. The vacuum welding fixture for AMB ceramic substrates according to claim 5, characterized in that: The lower end (2322) of the self-weight column (232) is set in a hemispherical structure.

7. The vacuum welding fixture for AMB ceramic substrates according to any one of claims 1-6, characterized in that: The positioning elements are distributed around and between the ceramic substrate (11).

8. The vacuum welding fixture for AMB ceramic substrates according to claim 7, characterized in that: The positioning frame (21) includes a metal sheet, and the positioning hole (211) is formed on the metal sheet. The height of the upper surface of the metal sheet is lower than the height of the upper surface of the ceramic substrate (11).

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