Scrap removing device for mold machining

Abstract

The utility model provides a scrap removing device for mold machining. The scrap removing device comprises a supporting pedestal, a waste liquid box, a removing unit and a flushing unit. The supporting pedestal comprises a workbench, supporting legs and a cover plate covering an opening in the front side of the workbench. A mold containing groove is formed in the upper end face of the workbench, and a grating net is arranged below the mold containing groove. The waste liquid box is arranged on the lower end face of the workbench and corresponds to the grating net; the removing unit comprises a magnetic adsorption assembly and a cleaning assembly which are suspended above the mold placing groove, and an adjusting assembly which is mounted on the cover plate and is used for adjusting the positions of the magnetic adsorption assembly and the cleaning assembly in the transverse direction and the vertical direction; the cleaning liquid outlet end of the flushing unit corresponds to the area of the injection mold containing groove and is used for flushing the mold placed in the mold containing groove. The waste chip removing device for mold machining has the advantages of being good in cleaning effect, high in efficiency, low in manual participation degree, capable of avoiding waste chip flying and suitable for complex molded surfaces.

Description

Technical Field

[0001] This utility model belongs to the field of mold processing equipment, and in particular relates to a waste chip removal device for mold processing. Background Technology

[0002] During mold making, the surface of newly formed metal molds often has fine metal shavings and adhering impurities and dirt attached to it, requiring cleaning. Traditional cleaning methods rely on manual brushing, compressed air blowing, or washing with cleaning fluid, which have problems such as limited cleaning effect, high labor intensity, low efficiency, flying shavings polluting the environment, and difficulty in thoroughly cleaning complex surfaces. Utility Model Content

[0003] In view of this, in order to solve the above-mentioned technical problems, this utility model proposes a waste removal device for mold processing that has good cleaning effect, high efficiency, low manual intervention, avoids waste flying, and is applicable to complex surfaces.

[0004] To achieve the above objectives, the technical solution of this utility model is implemented as follows:

[0005] A waste chip removal device for mold processing includes:

[0006] A support base, comprising a worktable, support legs supporting the worktable, and a cover plate covering the worktable with an open front side; the upper surface of the worktable is provided with a mold placement groove, and a grid mesh is provided below the mold placement groove;

[0007] Waste liquid tank, which is located on the lower end face of the workbench at a position corresponding to the grid mesh;

[0008] The removal unit includes a magnetic adsorption assembly and a cleaning assembly suspended above the mold placement slot, and an adjustment assembly mounted on the cover plate to adjust the position of the magnetic adsorption assembly and the cleaning assembly in the horizontal and vertical directions.

[0009] A rinsing unit, wherein the cleaning fluid outlet of the rinsing unit corresponds to the area of ​​the mold placement tank, is used to rinse the mold placed in the mold placement tank.

[0010] The mold is placed in the mold placement slot. Under the action of the adjustment component, the magnetic adsorption component and the cleaning component sweep across the mold surface in the horizontal direction (depending on the actual situation, the mold can be manually flipped so that all surfaces of the mold are cleaned). The magnetic adsorption component adsorbs ferromagnetic waste debris, while the cleaning component further removes non-magnetic waste debris and other adhering impurities. Finally, the rinsing unit sprays the mold to further clean the adhering waste debris and impurities on the mold surface (the rinsing unit and the removal unit can also be started simultaneously, suction, sweeping, and rinsing at the same time). Through multi-stage cleaning of magnetic adsorption, sweeping, and rinsing, a good cleaning effect and high cleaning efficiency can be achieved. At the same time, due to the presence of the cover plate and the rinsing of the rinsing unit, waste debris can be prevented from flying. The waste liquid after rinsing is collected in the waste liquid tank.

[0011] Furthermore, the bottom of the waste liquid tank is provided with a drain port with a valve, which can be used to discharge the waste liquid accumulated in the waste liquid tank.

[0012] Furthermore, the magnetic adsorption assembly includes a vertical cantilever connected to the adjustment assembly, a connecting member connected to the lower end of the vertical cantilever, a mounting frame connected to the lower end of the connecting member and arranged in the front-rear direction, and magnetic adsorption rollers mounted on the mounting frame at both ends via rotating shafts; the lower end of the vertical cantilever is provided with a mounting groove, and both the front and rear side walls of the mounting groove are provided with vertical slots; the connecting member includes a shaft disposed on the mounting groove and inserted into the slots at both ends, a spring connecting the top of the mounting groove and the shaft, and a connecting rod connecting the shaft and the mounting frame.

[0013] The spring in the connecting component can provide elastic buffering for the magnetic adsorption roller in the vertical direction, which can better adapt to different shapes and ensure that the contact between the magnetic adsorption roller and the mold has a certain buffer to avoid scratching the mold surface.

[0014] Furthermore, the magnetic adsorption roller includes a hollow roller, a magnetic adsorption sheet embedded in the surface of the hollow roller, and a removable protective sleeve covering the outer surface of the magnetic adsorption sheet.

[0015] Furthermore, the protective sleeve is a flexible sheet structure, and its two ends are detachably covered on the outer surface of the magnetic adsorption sheet by means of lamination and adhesion.

[0016] The protective sleeve allows for flexible contact with the mold, and it is also removable for easy cleaning of adhering debris.

[0017] Furthermore, the cleaning assembly includes a transverse cantilever connected at one end to the first vertical cantilever, a second vertical cantilever connected at its upper end to the transverse cantilever, a second connecting member connected to the lower end of the second vertical cantilever, a mounting plate connected to the lower end of the second connecting member and arranged in the front-back direction, and a plurality of cleaning brushes arranged in the front-back direction and mounted on the lower end surface of the mounting plate; the lower end of the second vertical cantilever is provided with a second mounting groove, and the front and rear side walls of the second mounting groove are provided with second vertical slots; the second connecting member includes a second shaft disposed on the second mounting groove and inserted at both ends into the second slots, a second spring connecting the top of the second mounting groove and the second shaft, and a second connecting rod connecting the second shaft and the mounting plate.

[0018] The spring 2 in the connecting component 2 can provide elastic buffering for the cleaning brush in the vertical direction, which can better adapt to different surfaces and ensure that there are no dead corners in the cleaning.

[0019] Furthermore, the cleaning brush includes a spring three connected to the lower end of the mounting plate at its upper end, a brush plate connected to the lower end of the spring three, and a brush disposed on the lower end of the brush plate.

[0020] The cleaning brushes are arranged in multiple rows, and each brush can adjust its height according to the different heights of the mold surface being cleaned, under the action of spring three, so that the cleaning is more thorough.

[0021] Furthermore, the adjustment assembly includes a horizontal electric guide rail assembly arranged in the left-right direction and installed on the lower end surface of the top plate of the cover plate, and a vertical electric guide rail assembly connected to a sliding plate of the horizontal electric guide rail assembly; the magnetic adsorption assembly and the cleaning assembly are connected to the sliding plate of the vertical electric guide rail assembly.

[0022] The horizontal electric guide rail group controls the left and right horizontal movement of the magnetic adsorption component and the cleaning component, while the vertical electric guide rail group controls the vertical movement of the magnetic adsorption component and the cleaning component.

[0023] Furthermore, the rinsing unit includes a cleaning fluid tank located on the workbench and outside the cover plate, a liquid pipe connected to the cleaning fluid tank via a liquid pump and extending through the side plate of the cover plate into the inner cavity of the cover plate, and a nozzle connected to the outlet end of the liquid pipe via a deflecting bend. The nozzle is used to spray the area of ​​the mold placement slot. There are two rinsing units, symmetrically arranged at the left and right ends of the cover plate.

[0024] A liquid pump draws up cleaning fluid, which is then sprayed onto the mold surface through a liquid pipe and a nozzle to wash away residual waste. A directional bend allows for adjustment of the nozzle's spray angle.

[0025] Compared with the prior art, the waste chip removal device for mold processing described in this utility model has the following advantages:

[0026] (1) The waste chip removal device for mold processing described in this utility model has a reasonable structural design. It adopts magnetic suction, sweeping and rinsing to reduce manual operation, and has high cleaning efficiency and good effect. At the same time, due to the presence of the cover plate and the rinsing of the rinsing unit, the waste chips can be prevented from flying.

[0027] (2) The magnetic adsorption component and the cleaning component in the waste removal device for mold processing described in this utility model can be adjusted elastically in the vertical direction to a certain extent, so as to achieve a gentle and buffered contact with the mold. It can adapt to the mold surface and still have a good cleaning effect when processing complex molds without damaging the mold surface. Attached Figure Description

[0028] The accompanying drawings, which form part of this utility model, are used to provide a further understanding of the utility model. The illustrative embodiments of the utility model and their descriptions are used to explain the utility model and do not constitute an undue limitation of the utility model. In the drawings:

[0029] Figure 1 This is a schematic diagram of the waste chip removal device for mold processing described in an embodiment of the present invention;

[0030] Figure 2 This is a schematic diagram of the internal structure of the workbench described in an embodiment of the present utility model;

[0031] Figure 3 This is a schematic diagram of the structure of the magnetic adsorption component and the cleaning component described in the embodiment of this utility model;

[0032] Figure 4 This is a side view of the magnetic adsorption component described in an embodiment of the present invention.

[0033] Figure 5 This is a schematic diagram of the structure of the magnetic adsorption roller described in an embodiment of the present invention;

[0034] Figure 6 This is a side view of the cleaning component described in an embodiment of the present invention.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1-Waste liquid tank, 2-Workbench, 3-Support legs, 4-Cover plate, 5-Mold placement slot, 6-Grid mesh, 7-Drain outlet, 8-Magnetic adsorption assembly, 9-Cleaning assembly, 10-Adjustment assembly, 11-Vertical cantilever one, 12-Mounting bracket, 13-Magnetic adsorption roller, 14-Mounting slot one, 15-Slot one, 16-Shaft one, 17-Spring one, 18-Connecting rod one, 19-Hollow roller, 20-Magnetic adsorption sheet, 21- Protective cover, 22- Horizontal cantilever, 23- Nozzle, 24- Vertical cantilever II, 25- Mounting plate, 26- Cleaning brush, 27- Mounting slot II, 28- Slot II, 29- Shaft II, 30- Spring II, 31- Connecting rod II, 32- Spring III, 33- Brush plate, 34- Brush, 35- Horizontal electric guide rail assembly, 36- Vertical electric guide rail assembly, 37- Cleaning fluid tank, 38- Liquid pump, 39- Liquid pipe, 40- Steering bend. Detailed Implementation

[0037] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0038] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0039] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0040] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0041] like Figures 1 to 6 As shown, a waste chip removal device for mold processing includes a support base, a waste liquid tank 1, a removal unit, and a rinsing unit;

[0042] The support base includes a worktable 2, support legs 3 supporting the worktable 2, and a cover plate 4 covering the worktable 2 with an open front side; the upper end surface of the worktable 2 is provided with a mold placement groove 5, and a grid mesh 6 is provided below the mold placement groove 5.

[0043] Waste liquid tank 1 is located on the lower end face of workbench 2, corresponding to the grid 6. Waste liquid tank 1 has a drain port 7 with a valve at the bottom.

[0044] The removal unit includes a magnetic adsorption assembly 8 and a cleaning assembly 9 suspended above the mold placement slot 5, and an adjustment assembly 10 mounted on the cover plate 4 to adjust the positions of the magnetic adsorption assembly 8 and the cleaning assembly 9 in the horizontal and vertical directions. The magnetic adsorption assembly 8 includes a vertical cantilever 11 connected to the adjustment assembly 10, a connecting member connected to the lower end of the vertical cantilever 11, a mounting frame 12 connected to the lower end of the connecting member and arranged in the front-to-back direction, and magnetic adsorption rollers 13 mounted on the mounting frame 12 at both ends via rotating shafts. The lower end of the vertical cantilever 11 has a mounting groove 14, and the mounting groove 14 is located at the front and back. Both side walls are provided with vertical slots 15; the connecting component includes a shaft 16 set on the mounting groove 14 and inserted into the slots 15 at both ends, a spring 17 connecting the top of the mounting groove 14 and the shaft 16, and a connecting rod 18 connecting the shaft 16 and the mounting bracket 12; the magnetic adsorption roller 13 includes a hollow roller 19, a magnetic adsorption sheet 20 embedded in the surface of the hollow roller 19, and a detachable protective sleeve 21 covering the outer surface of the magnetic adsorption sheet 20; the protective sleeve 21 is a flexible sheet structure, and its two ends are detachably covered on the outer surface of the magnetic adsorption sheet 20 by layering and adhesion; The sweeping assembly 9 includes a horizontal cantilever 22 connected at one end to a vertical cantilever 11, a vertical cantilever 24 connected at the upper end to the horizontal cantilever 22, a connecting member 2 connected to the lower end of the vertical cantilever 24, a mounting plate 25 connected to the lower end of the connecting member 2 and arranged in the front-back direction, and a plurality of sweeping brushes 26 arranged in the front-back direction and mounted on the lower end surface of the mounting plate 25; the lower end of the vertical cantilever 24 is provided with a mounting groove 27, and both the front and rear side walls of the mounting groove 27 are provided with vertical slots 28; the connecting member 2 includes a shaft rod disposed on the mounting groove 27 and inserted into the slots 28 at both ends. 29. A spring 30 connecting the top of the mounting groove 27 and the shaft 29; a connecting rod 31 connecting the shaft 29 and the mounting plate 25; the cleaning brush 26 includes a spring 32 whose upper end is connected to the lower end face of the mounting plate 25, a brush plate 33 connected to the lower end of the spring 32, and a brush 34 disposed on the lower end face of the brush plate 33; the adjustment assembly 10 includes a horizontal electric guide rail assembly 35 disposed in the left and right direction and mounted on the lower end face of the top plate of the cover plate 4, and a vertical electric guide rail assembly 36 connected to the sliding plate of the horizontal electric guide rail assembly 35; the vertical cantilever 11 is connected to the sliding plate of the vertical electric guide rail assembly 36;

[0045] The rinsing unit includes a cleaning fluid tank 37 located on the workbench 2 and outside the cover plate 4, a liquid pipe 39 connected to the cleaning fluid tank 37 via a liquid pump 38 and extending through the side plate of the cover plate 4 into the inner cavity of the cover plate 4, and a nozzle 23 connected to the outlet end of the liquid pipe 39 via a deflecting bend 40. The nozzle 23 sprays the area of ​​the mold placement slot 5 and is used to rinse the mold placed in the mold placement slot 5. There are two rinsing units, which are symmetrically arranged at the left and right ends of the cover plate 4.

[0046] The working process of the waste chip removal device for mold processing described in this embodiment is as follows:

[0047] Place the mold in the mold placement slot 5. Adjust the positions of the magnetic adsorption component 8 and the cleaning component 9 according to the height of the mold using the adjustment component 10. The magnetic adsorption roller 13 and the cleaning brush 26 are attached to the mold surface and sweep across the mold surface horizontally from left to right or from right to left. Due to the presence of springs 17, 30, and 32, the magnetic adsorption roller 13 and the cleaning brush 26 can move non-rigidly, better adapting to the mold surface. Simultaneously, the rinsing unit is activated, and the nozzle 23 sprays the cleaning fluid from the cleaning fluid tank 37 onto the mold for further rinsing. After completion, the mold direction can be manually changed, and the above steps can be repeated to complete the cleaning of all surfaces.

[0048] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A waste chip removal device for mold processing, characterized in that, include: A support base, comprising a worktable, support legs supporting the worktable, and a cover plate covering the worktable with an open front side; the upper surface of the worktable is provided with a mold placement groove, and a grid mesh is provided below the mold placement groove; Waste liquid tank, which is located on the lower end face of the workbench at a position corresponding to the grid mesh; The removal unit includes a magnetic adsorption assembly and a cleaning assembly suspended above the mold placement slot, and an adjustment assembly mounted on the cover plate to adjust the position of the magnetic adsorption assembly and the cleaning assembly in the horizontal and vertical directions. A rinsing unit, wherein the cleaning fluid outlet of the rinsing unit corresponds to the area of ​​the mold placement tank, is used to rinse the mold placed in the mold placement tank.

2. The waste chip removal device for mold processing according to claim 1, characterized in that: The bottom of the waste liquid tank is equipped with a drain port with a valve.

3. The waste chip removal device for mold processing according to claim 1, characterized in that: The magnetic adsorption assembly includes a vertical cantilever connected to the adjustment assembly, a connecting member connected to the lower end of the vertical cantilever, a mounting frame connected to the lower end of the connecting member and arranged in the front-to-back direction, and magnetic adsorption rollers mounted on the mounting frame at both ends via rotating shafts; the lower end of the vertical cantilever has a mounting groove, and both the front and rear side walls of the mounting groove have vertical slots; the connecting member includes a shaft disposed on the mounting groove and inserted into the slots at both ends, a spring connecting the top of the mounting groove and the shaft, and a connecting rod connecting the shaft and the mounting frame.

4. The waste chip removal device for mold processing according to claim 3, characterized in that: The magnetic adsorption roller includes a hollow roller, a magnetic adsorption sheet embedded in the surface of the hollow roller, and a removable protective sleeve covering the outer surface of the magnetic adsorption sheet.

5. The waste chip removal device for mold processing according to claim 4, characterized in that: The protective sleeve is a flexible sheet structure, and its two ends are detachably attached to the outer surface of the magnetic adsorption sheet by means of lamination and adhesion.

6. The waste chip removal device for mold processing according to claim 3, characterized in that: The cleaning assembly includes a horizontal cantilever connected at one end to the first vertical cantilever, a second vertical cantilever connected at the upper end to the horizontal cantilever, a second connecting member connected to the lower end of the second vertical cantilever, a mounting plate connected to the lower end of the second connecting member and arranged in the front-back direction, and a plurality of cleaning brushes arranged in the front-back direction and mounted on the lower end surface of the mounting plate; the lower end of the second vertical cantilever has a second mounting groove, and the front and rear side walls of the second mounting groove are provided with second vertical slots; the second connecting member includes a second shaft set on the second mounting groove and inserted at both ends into the second slots, a second spring connecting the top of the second mounting groove and the second shaft, and a second connecting rod connecting the second shaft and the mounting plate.

7. The waste chip removal device for mold processing according to claim 6, characterized in that: The cleaning brush includes a spring three connected to the lower end of the mounting plate at its upper end, a brush plate connected to the lower end of the spring three, and a brush disposed on the lower end of the brush plate.

8. The waste chip removal device for mold processing according to claim 1, characterized in that: The adjustment assembly includes a horizontal electric guide rail assembly arranged in the left-right direction and installed on the lower end surface of the top plate of the cover plate, and a vertical electric guide rail assembly connected to a sliding plate of the horizontal electric guide rail assembly; the magnetic adsorption assembly and the cleaning assembly are connected to the sliding plate of the vertical electric guide rail assembly.

9. The waste chip removal device for mold processing according to claim 1, characterized in that: The rinsing unit includes a cleaning fluid tank located on the workbench and outside the cover plate, a liquid pipe connected to the cleaning fluid tank via a liquid pump and extending through the side plate of the cover plate into the inner cavity of the cover plate, and a nozzle connected to the outlet end of the liquid pipe via a deflecting bend. The nozzle is used to spray the area of ​​the mold placement slot. There are two rinsing units, symmetrically arranged at the left and right ends of the cover plate.

Images