Punching die for photoelectric film
By combining the structure of springs and guide rods and designing the rolling friction of rollers, the problem of fatigue failure of urethane blocks in optoelectronic thin film punching dies is solved, achieving automatic material removal and reducing frictional resistance, thereby improving the service life of the die and punching efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- KUNSHAN PULIFEI PRECISION MOULD CO LTD
- Filing Date
- 2025-07-15
- Publication Date
- 2026-05-15
AI Technical Summary
The urethane blocks in existing optoelectronic thin film punching dies are prone to fatigue failure, resulting in poor frictional stability and affecting the die life and smoothness of movement.
The combination structure of spring, guide rod and fixed plate realizes energy storage and automatic material removal during punching. At the same time, the roller makes rolling contact with the inner wall of the recess, converting sliding friction into rolling friction and reducing motion resistance.
Ensure stable and reliable stripping operation, extend mold life, improve the smoothness and precision of the punching process, and reduce component wear.
Smart Images
Figure CN224239852U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of punching die technology, specifically to a punching die for optoelectronic thin films. Background Technology
[0002] Photovoltaic thin film punching refers to the process of cutting photovoltaic thin films using a punching machine. Specifically, the punching machine uses its internal support mechanism, lifting mechanism, and cutting mechanism to perform the punching operation on the photovoltaic thin film. Precision punching of photovoltaic thin films requires the use of punching dies.
[0003] According to patent number CN202210911285.9, an easy-to-process label punching die includes a limiting plate with a recessed pit on its upper surface; a cover plate, assembled with the upper surface of the limiting plate, the cover plate having a hollow hole communicating with the recessed pit, and the upper surface of the cover plate having an upwardly extending closed-loop protruding edge along the outline of the hollow hole; an inner support push block passing through the hollow hole; a middle plate; and an urethane block, the inner support push block, the middle plate, and the urethane block being arranged sequentially from top to bottom, with the middle plate and the urethane block located within the recessed pit; the number of sides of the horizontal cross-sectional outline of the recessed pit is less than the number of sides of the horizontal cross-sectional outline of the hollow hole, the vertical projection of the hollow hole is located within the recessed pit, the horizontal cross-sectional outline of the inner support push block matches the horizontal cross-sectional outline of the hollow hole, and the horizontal cross-sectional outline of the middle plate matches the horizontal cross-sectional outline of the recessed pit. The use of this invention reduces the processing difficulty and cost of the mold, reduces the extension and retraction resistance of the inner push block, and ensures that the label can still be completely held by the inner push block, thus achieving material removal.
[0004] The ejection mechanism of the punching die in the above patent relies on the rebound of the urethane block, which has insufficient elastic stability and is prone to failure due to fatigue. In addition, during punching, there is sliding friction between the intermediate plate and the recess, which affects the smoothness of movement and the life of the die. Utility Model Content
[0005] To address the shortcomings of existing technologies, this invention provides a punching die for optoelectronic thin films, thereby solving the problems mentioned in the background art, such as the easy fatigue failure of urethane blocks and the impact of sliding friction on the die life.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a punching die for optoelectronic thin films, comprising a cover plate and a die base. The upper surface of the cover plate has a hollowed-out hole, and the upper surface of the die base has a recessed pit. A positioning pin is fixedly connected to the side of the upper surface of the die base. A groove is formed on the side of the upper surface of the cover plate, and a positioning hole is formed in the middle of the bottom of the groove. A fixing seat is fixedly connected to the bottom of the inner surface of the recessed pit. A guide rod is sleeved inside the fixing seat. A fixing plate is fixedly connected to the bottom end of the guide rod. A spring is sleeved on the outer surface of the guide rod. A connecting plate is fixedly connected to the top end of the guide rod. An inner support push block is fixedly connected to the upper surface of the connecting plate. A connecting seat is fixedly connected to the side of the lower surface of the connecting plate. A second inner groove is formed on the outer surface of the connecting seat. A fixing shaft is fixedly connected inside the second inner groove, and a roller is rotatably connected to the outer surface of the fixing shaft.
[0007] Preferably, the upper part of the positioning pin is provided with a threaded portion, and a nut is threadedly connected to the outer surface of the threaded portion, and the outer surface of the positioning pin is adapted to the interior of the positioning hole.
[0008] Preferably, the fixing base has a first internal groove inside, and the inner surface of the first internal groove is adapted to the outer surface of the fixing plate.
[0009] Preferably, the outer surface of the guide rod penetrates the top of the fixing seat, and the bottom end of the guide rod extends to the first inner groove.
[0010] Preferably, the bottom end of the spring is fixedly connected to the upper surface of the fixed base, and the top end of the spring is fixedly connected to the lower surface of the connecting plate.
[0011] Preferably, the outer surface of the inner support push block is adapted to the hollow hole, and the hollow hole is arranged in a rectangular array on the cover plate.
[0012] Preferably, the connecting seat is disposed around the guide rod, and the outer surface of the roller is in contact with the inner surface of the recess.
[0013] Preferably, the positioning hole extends to the bottom of the cover plate, and the cover plate and the mold base are assembled together by positioning pins and nuts. Beneficial effects
[0014] This invention provides a punching die for optoelectronic thin films. It has the following beneficial effects:
[0015] 1. This punching die for optoelectronic thin films, through the cooperation of spring, guide rod and fixed plate, is compressed and stores energy during the punching process. After punching is completed, the elastic potential energy is released to push the inner push block to quickly reset and eject the film, realizing automatic material removal, reducing manual intervention, and ensuring stable and reliable material removal action, thus extending the service life of the die.
[0016] 2. This punching die for optoelectronic thin films, by setting rollers, rolls into contact with the inner wall of the recess, transforming traditional sliding friction into rolling friction. This significantly reduces the movement resistance of the connecting plate, avoids jamming problems, improves the smoothness of the punching process and the movement accuracy of the die, while reducing component wear and enhancing overall durability. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0018] Figure 2 This is a cross-sectional view of the overall structure of this utility model;
[0019] Figure 3 This is an exploded structural diagram of the entire utility model;
[0020] Figure 4 This is a schematic diagram of the structure of the cover plate of this utility model;
[0021] Figure 5 This is a schematic diagram of the structure of the mold base of this utility model;
[0022] Figure 6 This is a schematic diagram of the internal components of the recessed pit of this utility model.
[0023] In the diagram: 1. Cover plate; 2. Mold base; 3. Hole; 4. Groove; 5. Positioning hole; 6. Recess; 7. Positioning pin; 8. Threaded part; 9. Nut; 10. Fixed seat; 11. First internal groove; 12. Fixed plate; 13. Guide rod; 14. Spring; 15. Connecting plate; 16. Inner support push block; 17. Connecting seat; 18. Second internal groove; 19. Fixed shaft; 20. Roller. Detailed Implementation
[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0025] like Figure 1-6As shown, this utility model provides a punching die for optoelectronic thin films, including a cover plate 1 and a die base 2. The upper surface of the cover plate 1 has a hollow hole 3, and the upper surface of the die base 2 has a recess 6. A positioning pin 7 is fixedly connected to the side of the upper surface of the die base 2. A groove 4 is formed on the side of the upper surface of the cover plate 1, and a positioning hole 5 is formed in the middle of the bottom of the groove 4. A fixing seat 10 is fixedly connected to the bottom of the inner surface of the recess 6. A guide rod 13 is sleeved inside the fixing seat 10, and a fixing plate 1 is fixedly connected to the bottom end of the guide rod 13. 2. A spring 14 is sleeved on the outer surface of the guide rod 13. A connecting plate 15 is fixedly connected to the top of the guide rod 13. An inner support push block 16 is fixedly connected to the upper surface of the connecting plate 15. A connecting seat 17 is fixedly connected to the side of the lower surface of the connecting plate 15. A second inner groove 18 is opened on the outer surface of the connecting seat 17. A fixed shaft 19 is fixedly connected inside the second inner groove 18. A roller 20 is rotatably connected to the outer surface of the fixed shaft 19. The positioning pin 7 and the positioning hole 5 constitute a reference positioning system to ensure that the cover plate 1 and the mold base 2 are accurately installed.
[0026] Specifically, the upper part of the positioning pin 7 is provided with a threaded part 8, and the outer surface of the threaded part 8 is threaded with a nut 9. The outer surface of the positioning pin 7 is adapted to the interior of the positioning hole 5. The precise fit between the positioning pin 7 and the positioning hole 5 ensures the positioning consistency during repeated assembly and avoids product size deviation caused by mold misalignment during the punching process.
[0027] Specifically, the fixed base 10 has a first internal groove 11 inside. The inner surface of the first internal groove 11 is adapted to the outer surface of the fixed plate 12. The adaptation design of the first internal groove 11 and the fixed plate 12 forms a closed guide structure, which restricts the guide rod 13 to move only along the axial direction and prevents swaying. The rigid support of the fixed base 10 ensures the stability of force transmission during the compression / release process of the spring 14.
[0028] Specifically, the outer surface of the guide rod 13 penetrates the top of the fixed base 10, and the bottom end of the guide rod 13 extends to the first internal groove 11. The design of the guide rod 13 penetrating the top of the fixed base 10 gives it both guiding and limiting functions. The bottom end extending to the first internal groove 11 can prevent the rod from coming out, while the maximum stroke is limited by the fixing plate 12.
[0029] Specifically, the bottom end of the spring 14 is fixedly connected to the upper surface of the fixed base 10, and the top end of the spring 14 is fixedly connected to the lower surface of the connecting plate 15. The spring 14 connects the fixed base 10 and the connecting plate 15 to form an elastic energy storage system. During punching, it is compressed and stores energy. After the punching is completed, it pushes the inner support push block 16 to quickly reset and push out the film, thus realizing automatic unloading.
[0030] Specifically, the outer surface of the inner support push block 16 is adapted to the hollow hole 3. The hollow hole 3 is arranged in a rectangular array on the cover plate 1. The adaptation relationship between the inner support push block 16 and the hollow hole 3 ensures that the inner support push block 16 can fully support the film when the film is unloaded.
[0031] Specifically, the connecting seat 17 is arranged around the guide rod 13, the outer surface of the roller 20 is in contact with the inner surface of the recess 6, and the connecting seat 17 rolls against the inner wall of the recess 6 through the roller 20, dispersing the motion load and maintaining the balance of the connecting plate 15. The rotation characteristics of the roller 20 further reduce frictional resistance and extend the service life of the mold.
[0032] Specifically, the positioning hole 5 extends to the bottom of the cover plate 1. The cover plate 1 and the mold base 2 are assembled together by the positioning pin 7 and the nut 9. The design of the positioning hole 5 extending through the cover plate 1 facilitates the insertion and locking of the positioning pin 7. Combined with the groove 4, it provides installation space for the nut 9, ensuring that the cover plate 1 and the mold base 2 fit tightly together.
[0033] When assembling the cover plate 1 and the mold base 2, after the positioning pin 7 passes through the positioning hole 5 of the cover plate 1, the threaded part 8 on the positioning pin 7 is in the groove 4. Tighten the nut 9 on the threaded part 8 so that the cover plate 1 is firmly installed on the mold base 2. The cooperation between the positioning pin 7 and the positioning hole 5 can ensure that the cover plate 1 and the mold base 2 are precisely aligned without deviation. When punching the photoelectric film, the inner support push block 16 is subjected to downward pressure, which pushes the connecting plate 15 and the guide rod 13 to move downward. The fixing plate 12 moves downward along the first inner groove 11. At the same time, the connecting plate 15 compresses the spring 14 to store energy. After punching is completed, the spring 14 releases the stored elastic potential energy and pushes the connecting plate 15 and the inner support push block 16 to move upward and reset. At this time, the inner support push block 16 pushes the punched film upward to complete the stripping. During the up and down movement of the connecting plate 15, the connecting seat 17 set on the side of its lower surface moves synchronously. The roller 20 rolls along the inner wall of the recess 6, which can significantly reduce the movement resistance and avoid the jamming problem caused by traditional sliding friction.
[0034] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A punching die for optoelectronic thin films, comprising a cover plate and a die base, characterized in that: The upper surface of the cover plate has a hollow hole, the upper surface of the mold base has a recess, a positioning pin is fixedly connected to the side of the upper surface of the mold base, a groove is formed on the side of the upper surface of the cover plate, a positioning hole is formed in the middle of the bottom of the groove, a fixed seat is fixedly connected to the bottom of the inner surface of the recess, a guide rod is sleeved inside the fixed seat, a fixed plate is fixedly connected to the bottom end of the guide rod, a spring is sleeved on the outer surface of the guide rod, a connecting plate is fixedly connected to the top end of the guide rod, an inner support push block is fixedly connected to the upper surface of the connecting plate, a connecting seat is fixedly connected to the side of the lower surface of the connecting plate, a second inner groove is formed on the outer surface of the connecting seat, a fixed shaft is fixedly connected inside the second inner groove, and a roller is rotatably connected to the outer surface of the fixed shaft.
2. The punching die for photoelectric thin films according to claim 1, characterized in that: The upper part of the positioning pin is provided with a threaded part, and a nut is threadedly connected to the outer surface of the threaded part. The outer surface of the positioning pin is adapted to the interior of the positioning hole.
3. The punching die for photoelectric thin films according to claim 1, characterized in that: The fixing base has a first internal groove inside, and the inner surface of the first internal groove is adapted to the outer surface of the fixing plate.
4. The punching die for photoelectric thin films according to claim 3, characterized in that: The outer surface of the guide rod penetrates the top of the fixed base, and the bottom end of the guide rod extends to the first internal groove.
5. The punching die for photoelectric thin films according to claim 1, characterized in that: The bottom end of the spring is fixedly connected to the upper surface of the fixed base, and the top end of the spring is fixedly connected to the lower surface of the connecting plate.
6. The punching die for photoelectric thin films according to claim 1, characterized in that: The outer surface of the inner support push block is adapted to the hollow hole, which is arranged in a rectangular array on the cover plate.
7. The punching die for photoelectric thin films according to claim 1, characterized in that: The connecting seat is arranged around the guide rod, and the outer surface of the roller is in contact with the inner surface of the recess.
8. The punching die for photoelectric thin films according to claim 1, characterized in that: The positioning hole extends to the bottom of the cover plate, and the cover plate and the mold base are assembled together by positioning pins and nuts.