Power conversion device and photovoltaic system

Abstract

The utility model provides a power conversion device and a photovoltaic system. The power conversion equipment comprises a shell assembly, the shell assembly is internally provided with a cavity and an air duct, the air duct is stacked on one side of the cavity, and the shell assembly is provided with an air inlet and an air outlet which are communicated with the air duct; the fan is positioned in the air duct; the first electronic component group is positioned in the cavity; the radiator is located in the air duct; the second electronic component group and the radiator are located on the same side of the cavity, the second electronic component group is located on one side of the radiator in the first direction, a plurality of radiating helical teeth are arranged on the side, away from the cavity, of the second electronic component group, and each radiating helical tooth is provided with a first end and a second end which are opposite to each other; the first end is closer to the air inlet and the radiator than the second end; and at least a part of the heat dissipation helical teeth are located in the air channel. The heat exchange flow of the second electronic component group can be effectively improved, and the temperature of the second electronic component group can be effectively reduced.

Description

Technical Field

[0001] This application relates to the field of power conversion equipment technology, and more specifically, to a power conversion device and a photovoltaic system. Background Technology

[0002] In related technologies, power conversion equipment includes a heat sink and power components. The heat sink is located in a separate air duct and is used to dissipate heat from the electronic components inside the power conversion equipment. The power components are located outside the air duct and dissipate heat by being exposed to the external environment. This results in poor heat exchange efficiency and high temperatures for the power components, severely affecting their performance and lifespan. Utility Model Content

[0003] This application aims to address at least one of the technical problems existing in the prior art or related technologies.

[0004] Therefore, the first aspect of this application proposes a power conversion device.

[0005] The second aspect of this application proposes a photovoltaic system.

[0006] In view of this, the first aspect of this application proposes a power conversion device, comprising: a housing assembly having a chamber and an air duct inside, the air duct being stacked on one side of the chamber, and the housing assembly having an air inlet and an air outlet communicating with the air duct; a fan located inside the air duct; a first electronic component group located inside the chamber; a heat sink located inside the air duct, the heat sink being used to dissipate heat from the chamber; and a second electronic component group, the second electronic component group and the heat sink being located on the same side of the chamber and along a first direction, the second electronic component group being located on one side of the heat sink, the side of the second electronic component group facing away from the chamber having a plurality of heat dissipation serrations, the plurality of heat dissipation serrations being arranged at intervals along a second direction, the heat dissipation serrations having a first end and a second end opposite to each other, the first end being closer to the air inlet and the heat sink than the second end; wherein at least a portion of the plurality of heat dissipation serrations are located inside the air duct.

[0007] The power conversion device provided in this application includes a housing assembly, a fan, a first electronic component group, a heat sink, and a second electronic component group.

[0008] The shell assembly contains a chamber and an air duct, with the air duct stacked on one side of the chamber.

[0009] The first electronic component assembly is located within the cavity, which serves as the mounting carrier for the first electronic component assembly, and is responsible for mounting and securing it. A heat sink is used to dissipate heat from the cavity; most of the heat generated by the first electronic component assembly during operation is directly conducted to the heat sink. The heat sink then transfers the heat to the outside air through the air outlet via convection heat exchange with the airflow within the duct.

[0010] The second electronic component group and the heat sink are located on the same side of the chamber, and along the first direction, the second electronic component group is located on one side of the heat sink. This defines the positional relationship between the second electronic component group and the heat sink. The side of the second electronic component group facing away from the chamber has multiple heat dissipation serrations, each extending at an angle, and these serrations are spaced apart along the second direction. Each heat dissipation serration has a first end and a second end, which are positioned opposite each other. The first end is closer to the air inlet and the heat sink than the second end, thus defining the angled extension direction of the heat dissipation serration. Specifically, the distance from the first end to the plane containing the air inlet is less than the distance from the second end to the plane containing the air inlet, and the distance from the first end to the side of the heat sink facing the second electronic component group is less than the distance from the second end to the side of the heat sink facing the second electronic component group. In other words, this defines the correlation between the angled direction of the heat dissipation serrations and the positions of the air inlet and the heat sink.

[0011] In this system, at least a portion of the multiple heat dissipation fins, the fan, and the heat sink are all located within an air duct. The fan operates to drive air from the ambient environment into the air duct through the air inlet. A portion of the cool air is blown towards the heat sink and undergoes convective heat exchange, transferring the heat from the first electronic component assembly to the heat sink, thus cooling the heat sink. This air, carrying the transferred heat, flows under the power of the fan to the air outlet and then exits into the ambient environment, thereby achieving the purpose of cooling the first electronic component assembly. Another portion of the cool air is blown towards at least a portion of the heat dissipation fins located within the air duct and undergoes convective heat exchange, transferring the heat generated by the second electronic component assembly to the cool air, thus cooling the heat dissipation fins. This air, carrying the transferred heat, flows under the power of the fan to the air outlet and then exits into the ambient environment, thereby achieving the purpose of cooling the second electronic component assembly.

[0012] Therefore, it can be seen that at least some of the heat dissipation tines and the heat sink are in the same air duct. This not only ensures the heat dissipation effect of the heat sink, but also allows more airflow to flow through the multiple heat dissipation tines of the second electronic component group for heat exchange. This can effectively increase the heat exchange flow rate of the second electronic component group, effectively reduce the temperature of the second electronic component group, ensure the performance of the second electronic component group, and help extend the service life of the second electronic component group.

[0013] Furthermore, by defining the extension direction of the cooling fins and the positional relationship between the air inlet and the radiator, the flow direction of the cold air entering the air duct through the air inlet is matched with the inclined extension direction of the cooling fins. This allows the cold air to pass through the cooling fins more smoothly, reducing eddies and turbulence as the airflow passes through them. This reduces pressure loss, allowing more energy to be converted into static pressure, reducing resistance, and resulting in a faster airflow velocity. This allows more heat to be carried away per unit time, improving heat dissipation efficiency. It is understandable that the cooling fins guide the airflow along their surface, which helps to prolong the contact time between the airflow and the outer surface of the cooling fins, enhancing the convective heat transfer effect. Simultaneously, matching the flow direction of the cold air entering the air duct with the inclined extension direction of the cooling fins reduces detours as the airflow passes through them, reducing the frequency of airflow separation, flow breakdown, and vortices. This, in turn, helps to reduce noise and further improves the performance of the power conversion equipment.

[0014] In some technical solutions, optionally, the second electronic component group is provided with a plurality of first heat dissipation teeth on the side facing the heat sink. The plurality of first heat dissipation teeth are arranged at intervals along the direction from the chamber to the air duct, and the first heat dissipation teeth extend along the direction from the air inlet to the heat sink. At least a portion of the plurality of first heat dissipation teeth are located in the air duct.

[0015] In this technical solution, the structure of the second electronic component group is further defined such that the second electronic component group has multiple first heat dissipation teeth on the side facing the heat sink, and the multiple first heat dissipation teeth are arranged at intervals along the direction from the chamber to the air duct. Alternatively, it can be understood that the multiple first heat dissipation teeth are stacked along the direction from the chamber to the air duct. The first heat dissipation teeth extend along the direction from the air inlet to the heat sink. At least a portion of the multiple first heat dissipation teeth are located within the air duct.

[0016] In other words, based on the positional relationship between the second electronic component group, the heat sink, and the air inlet, the structure of the second electronic component group facing the heat sink is further defined. This ensures that the extension direction and arrangement of the multiple first heat dissipation teeth match the flow direction of the cold air flowing into the air duct through the air inlet. This allows the cold air to pass more smoothly through the first heat dissipation teeth, reducing eddies and turbulence as the airflow passes through them. This reduces pressure loss, converts more energy into static pressure, reduces resistance, and increases airflow velocity, allowing more heat to be carried away per unit time, thus improving heat dissipation efficiency. It is understandable that the first heat dissipation teeth guide the airflow along their surface, which helps to prolong the contact time between the airflow and the outer surface of the first heat dissipation teeth, enhancing the convective heat transfer effect. Simultaneously, matching the flow direction of the cold air flowing into the air duct with the extension direction of the first heat dissipation teeth reduces detours as the airflow passes through them, reducing the frequency of airflow separation, flow breakdown, and vortices. This, in turn, helps to reduce noise and further improve the performance of the power conversion equipment.

[0017] In some technical solutions, optionally, the second electronic component group is provided with a plurality of second heat dissipation teeth on the side away from the heat sink. The plurality of second heat dissipation teeth are arranged at intervals along the direction from the chamber to the air duct, and the second heat dissipation teeth extend along the direction from the air inlet to the heat sink. At least a portion of the plurality of second heat dissipation teeth are located in the air duct.

[0018] In this technical solution, the structure of the second electronic component group is further defined such that a plurality of second heat dissipation teeth are provided on the side of the second electronic component group away from the heat sink, and the plurality of second heat dissipation teeth are arranged at intervals along the direction from the chamber to the air duct. Alternatively, it can be understood that the plurality of second heat dissipation teeth are stacked along the direction from the chamber to the air duct. The second heat dissipation teeth extend along the direction from the air inlet to the heat sink. At least a portion of the plurality of second heat dissipation teeth are located within the air duct.

[0019] In other words, based on the positional relationship between the second electronic component group, the heat sink, and the air inlet, the structure of the second electronic component group facing away from the heat sink is further defined. This ensures that the extension direction and arrangement of the multiple second heat dissipation teeth match the flow direction of the cold air flowing into the air duct through the air inlet. This allows the cold air to pass more smoothly through the second heat dissipation teeth, reducing eddies and turbulence as the airflow passes through them. This reduces pressure loss, converts more energy into static pressure, reduces resistance, and allows for faster airflow, carrying away more heat per unit time and improving heat dissipation efficiency. It can be understood that the second heat dissipation teeth guide the airflow along their surface, which helps prolong the contact time between the airflow and the outer surface of the second heat dissipation teeth, enhancing convective heat transfer. Simultaneously, matching the flow direction of the cold air flowing into the air duct with the extension direction of the second heat dissipation teeth reduces detours as the airflow passes through them, decreasing the frequency of airflow separation, flow breakdown, and vortices. This, in turn, helps reduce noise and further improves the performance of the power conversion equipment.

[0020] In some technical solutions, the air outlet may optionally include a first outlet and a second outlet; the heat sink is located between the air inlet and the first outlet; a portion of the second electronic component group is located inside the air duct, and another portion of the second electronic component group extends out of the housing assembly through the second outlet.

[0021] In this technical solution, the structure of the power conversion device is further defined.

[0022] The air outlet includes a first outlet, and the radiator is located between the air inlet and the first outlet. This defines the positional relationship between the first outlet, the radiator, and the air inlet. Air from the outside environment enters the air duct through the air inlet, with some cool air blowing directly onto the radiator, and then exiting the housing assembly through the first outlet. This design helps reduce the detours of the cool air flowing through the radiator, ensuring the frequency and area of ​​contact between the cool air and the radiator, thus guaranteeing the radiator's heat dissipation efficiency.

[0023] The air outlet also includes a second outlet. A portion of the second electronic component assembly is located within the air duct, while another portion extends outside the housing assembly through the second outlet. Ambient air enters the air duct through the air inlet, while a portion of cool air is blown towards multiple heat dissipation fins on the second electronic component assembly, then flows out of the housing assembly along these fins through the second outlet. The matching angles of the second outlet, air inlet, and heat dissipation fins allow cool air to pass more smoothly through the fins, resulting in a faster airflow velocity and the removal of more heat per unit time, thus improving heat dissipation efficiency.

[0024] In some technical solutions, the air outlet may optionally include a first outlet and a second outlet; the heat sink is located between the air inlet and the first outlet; the second electronic component group is entirely located within the air duct, and the second electronic component group is located between the second outlet and the heat sink.

[0025] In this technical solution, the structure of the power conversion device is further defined.

[0026] The air outlet includes a first outlet, and the radiator is located between the air inlet and the first outlet. This defines the positional relationship between the first outlet, the radiator, and the air inlet. Air from the outside environment enters the air duct through the air inlet, with some cool air blowing directly onto the radiator, and then exiting the housing assembly through the first outlet. This design helps reduce the detours of the cool air flowing through the radiator, ensuring the frequency and area of ​​contact between the cool air and the radiator, thus guaranteeing the radiator's heat dissipation efficiency.

[0027] The air outlet also includes a second outlet. The second electronic component assembly is entirely located within the air duct, between the second outlet and the heat sink. Ambient air enters the air duct through the air inlet, while a portion of the cool air is blown towards the multiple heat dissipation fins of the second electronic component assembly, and then flows out of the housing assembly along the heat dissipation fins through the second outlet. It is understood that the first and second outlets are located on adjacent sides of the air duct. The matching inclined extension directions of the second outlet, air inlet, and heat dissipation fins allow cool air to pass more smoothly through the heat dissipation fins, resulting in a faster airflow velocity and the removal of more heat per unit time, thus improving heat dissipation efficiency.

[0028] In some technical solutions, the shell assembly may optionally include: a first shell having a cavity inside; and a second shell stacked on one side of the first shell, the second shell having an air inlet and a first outlet, the first shell and the second shell enclosing an air outlet duct and a second outlet.

[0029] In this technical solution, the structure of the shell assembly is defined. The shell assembly includes a first shell and a second shell. The second shell is stacked on one side of the first shell. That is, along the direction from the chamber to the air duct, the second shell is located on one side of the first shell.

[0030] The second housing has an air inlet and a first outlet, and the first and second housings enclose an air outlet duct and a second outlet. This arrangement can meet the usage requirements where a part of the second electronic component group is located inside the air outlet duct, and another part of the second electronic component group extends out of the housing assembly through the second outlet. It can also meet the usage requirements where the entire second electronic component group is located inside the air outlet duct, and the second electronic component group is located between the second outlet and the heat sink.

[0031] In addition, when the entire second electronic component group is located inside the air duct, each part of the second electronic component group can come into contact with and exchange heat with the cold air inside the air duct, which can further improve the heat dissipation efficiency of the second electronic component group.

[0032] In some technical solutions, optionally, when another part of the second electronic component group extends out of the shell assembly through the second outlet, the shell assembly includes: a first shell, the first shell having a cavity inside; a surrounding plate, stacked on one side of the first shell, the surrounding plate having an air inlet and a first outlet, a heat sink located inside the surrounding plate, and the second electronic component group located on one side of the surrounding plate; a cover plate, connected to the surrounding plate, a part of the cover plate extending out of the outer peripheral wall of the surrounding plate and covering the top of the second electronic component group, the surrounding plate, the cover plate, and the first shell enclosing the air outlet and the second outlet.

[0033] In this technical solution, the structure of the shell assembly is defined. The shell assembly includes a first shell, a surrounding plate and a cover plate. The surrounding plate is stacked on one side of the first shell, that is, along the direction from the chamber to the air duct, the surrounding plate is located on one side of the first shell.

[0034] The first housing has a cavity, and the first electronic component group is located inside the first housing.

[0035] The enclosure has an air inlet and a first outlet. The heat sink is located inside the enclosure, and the second electronic component group is located outside the enclosure.

[0036] The cover plate connects to the enclosure plate, and a portion of the cover plate extends beyond the outer peripheral wall of the enclosure plate and covers the top of the second electronic component assembly. That is, the cover plate covers at least a portion of the heat dissipation fins. The enclosure plate, the cover plate, and the first housing enclose the air outlet and the second outlet. The cover plate has the function of limiting the flow path of the airflow through the heat dissipation fins, which can meet the usage requirements that a portion of the second electronic component assembly is located inside the air outlet, while another portion of the second electronic component assembly extends out of the housing assembly through the second outlet.

[0037] In some technical solutions, optionally, the heat sink includes: a substrate, an opening in the shell assembly, the substrate covering the opening, at least a portion of the first electronic component group being connected to the substrate through the opening; and a plurality of fins disposed on the side of the substrate away from the cavity, the plurality of fins being spaced apart along a first direction, the fins extending along the direction from the air inlet to the first outlet.

[0038] In this technical solution, the structure of the heat sink is defined such that the heat sink includes a substrate and multiple fins.

[0039] The housing assembly has an opening, which is covered by a substrate. At least a portion of the first electronic component group is connected to the substrate through the opening. The opening avoids the portion of the first electronic component group that is connected to the substrate, allowing at least a portion of the first electronic component group to be effectively connected to the substrate. This arrangement shortens the distance between the first electronic component group and the substrate, enabling the heat generated by the first electronic component group to be conducted to the heat sink in a timely and rapid manner, thus improving the heat dissipation efficiency of the heat sink.

[0040] It is understandable that the substrate covers the opening, which can also be said to ensure the airtightness of the cavity. The substrate can form part of the cavity wall, which can reduce the amount of material used in the shell assembly and help reduce the production cost of the power conversion equipment.

[0041] Furthermore, multiple fins are disposed on the side of the substrate away from the chamber, and the fins are spaced apart along a first direction, extending from the air inlet to the first outlet. That is, the extension direction and arrangement of the multiple fins of the radiator are matched with the flow direction of the cold air flowing into the air duct through the air inlet. This allows the cold air to pass through the fins more smoothly, reducing eddies and turbulence as it flows over the fins, lowering pressure loss, converting more energy into static pressure, reducing resistance, increasing airflow velocity, and carrying away more heat per unit time, thus improving heat dissipation efficiency. It is understandable that the fins guide the airflow along their surface, which helps to prolong the contact time between the airflow and the outer surface of the fins, enhancing the effect of convective heat transfer. Simultaneously, matching the flow direction of the cold air flowing into the air duct with the extension direction of the fins reduces detours as the airflow passes over the fins, reducing the frequency of airflow separation, flow breakdown, and vortices, thereby reducing noise and further improving the performance of the power conversion equipment.

[0042] In some technical solutions, the second electronic component group optionally includes: a housing with multiple heat dissipation serrations; multiple boost inductors and multiple inverter inductors, all located inside the housing, with an inverter inductor located between two adjacent boost inductors.

[0043] In this technical solution, the structure of the second electronic component group is further defined, such that the second electronic component group includes a housing, multiple boost inductors and multiple inverter inductors, all of which are located inside the housing, and the housing serves as the mounting carrier for the multiple boost inductors and multiple inverter inductors.

[0044] By defining a configuration that combines multiple boost inductors and multiple inverter inductors, an inverter inductor is positioned between every two adjacent boost inductors; in other words, the boost inductors and inverter inductors are arranged in an alternating pattern. For example, boost inductors generate significant heat under low-voltage conditions, while inverter inductors generate significant heat under high-voltage conditions. This alternating arrangement effectively improves the temperature distribution of the boost inductors and inverter inductors, preventing heat concentration and thus ensuring the performance and lifespan of the second electronic component assembly.

[0045] In some technical solutions, optionally, multiple boost inductors are arranged at intervals along the direction from the air inlet to the heat sink.

[0046] In this technical solution, the placement of multiple boost inductors is further defined, such that the multiple boost inductors are arranged at intervals along the direction from the air inlet to the heat sink. That is, the placement of multiple inverter inductors is indirectly defined, and the multiple inverter inductors are also arranged at intervals along the direction from the air inlet to the heat sink.

[0047] This design makes good use of the space in the housing assembly, saving installation space for the second electronic component group.

[0048] In some technical solutions, optionally, a sealant is provided inside the housing, and the sealant fills the internal area of ​​the housing.

[0049] In this technical solution, the structure of the second electronic component group is further defined, such that a sealant is provided inside the housing, filling the internal area of ​​the housing and covering multiple boost inductors and multiple inverter inductors located within the housing. The sealant also fills the connection points between the inner surface of the housing and the multiple boost inductors and multiple inverter inductors. The sealant protects the multiple boost inductors and multiple inverter inductors, securing and sealing them, and providing waterproofing.

[0050] In some technical solutions, the heat dissipation helical teeth can optionally be strip-shaped heat dissipation teeth; or the heat dissipation helical teeth can include multiple tooth segments, which are arranged at intervals along the inclination direction of the heat dissipation helical teeth.

[0051] In this technical solution, the structure of the heat dissipation teeth is defined.

[0052] The heat dissipation fins are strip-shaped heat dissipation fins. This design can increase the heat dissipation area of ​​the heat dissipation fins and the contact area between the heat dissipation fins and the airflow. In this way, more heat can be removed from the heat dissipation fins per unit time, which is beneficial to improving heat dissipation efficiency.

[0053] The heat dissipation helical tooth comprises multiple tooth segments, which are spaced apart along the inclined direction of the heat dissipation helical tooth. It can be understood that, along the inclined extension direction of the heat dissipation helical tooth, the two tooth segments located furthest to the side form the first and second ends of the heat dissipation helical tooth, respectively. This arrangement helps reduce the material input for the second electronic component assembly and thus lowers its production cost.

[0054] The second aspect of this application proposes a photovoltaic system comprising: a power conversion device as described in the first aspect.

[0055] The photovoltaic system provided in this application includes the power conversion device as described in the first aspect, and therefore has all the beneficial effects of the aforementioned power conversion device, which will not be described in detail here.

[0056] Additional aspects and advantages of this application will become apparent in the following description or may be learned by practice of this application. Attached Figure Description

[0057] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0058] Figure 1 This invention provides a first-view structural schematic diagram of a power conversion device according to a first embodiment of the present application.

[0059] Figure 2 A partial structural schematic diagram of the power conversion device according to the first embodiment of this application is shown;

[0060] Figure 3 A second-view structural schematic diagram of the power conversion device according to the first embodiment of this application is shown;

[0061] Figure 4 for Figure 3 A cross-sectional view of the power conversion device shown along the AA direction;

[0062] Figure 5 for Figure 3 A cross-sectional view of the power conversion device shown along the BB direction;

[0063] Figure 6 A partial structural schematic diagram of the second electronic component group according to the first embodiment of this application is shown;

[0064] Figure 7 A schematic diagram of the power conversion device according to a second embodiment of this application is shown;

[0065] Figure 8 A schematic diagram of the power conversion device according to the third embodiment of this application is shown;

[0066] Figure 9 A schematic diagram of the power conversion device according to the fourth embodiment of this application is shown.

[0067] in, Figures 1 to 9 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0068] 10 Power conversion device, 100 Housing assembly, 110 Chamber, 120 Air duct, 130 Air inlet, 140 Air outlet, 142 First outlet, 144 Second outlet, 150 Opening, 160 First housing, 170 Second housing, 171 Front windshield, 172 Upper windshield, 173 Side windshield, 174 Perforated plate, 180 Enclosure, 182 Outer peripheral wall of enclosure, 190 Cover plate, 200 Fan, 300 First electronic component group, 400 Heat sink, 410 Substrate, 420 Fins, 500 Second electronic component group, 510 Heat dissipation serrations, 512 First end, 514 Second end, 520 First heat dissipation tooth, 530 Second heat dissipation tooth, 540 Housing, 550 Boost inductor, 560 Inverter inductor, 570 Sealant. Detailed Implementation

[0069] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0070] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0071] The following reference Figures 1 to 9 This application describes a power conversion device 10 and a photovoltaic system according to some embodiments.

[0072] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 7 , Figure 8 and Figure 9 As shown, a power conversion device 10 according to some embodiments of this application includes a housing assembly 100, a fan 200, a first electronic component group 300, a heat sink 400, and a second electronic component group 500.

[0073] The housing assembly 100 has a chamber 110 and an air duct 120 inside.

[0074] The air duct 120 is stacked on one side of the chamber 110.

[0075] The housing assembly 100 is provided with an air inlet 130 and an air outlet 140 that are connected to the air duct 120.

[0076] Fan 200 is located inside air duct 120.

[0077] The first electronic component group 300 is located inside chamber 110.

[0078] The radiator 400 is located inside the air duct 120 and is used to dissipate heat from the chamber 110.

[0079] The second electronic component group 500 and the heat sink 400 are located on the same side of the chamber 110, and along the first direction, the second electronic component group 500 is located on one side of the heat sink 400.

[0080] The second electronic component group 500 has multiple heat dissipation helical teeth 510 on the side opposite to the cavity 110.

[0081] Multiple heat dissipation helical teeth 510 are arranged at intervals along the second direction.

[0082] The heat dissipation helical tooth 510 has a first end 512 and a second end 514, with the first end 512 being closer to the air inlet 130 and the heat sink 400 than the second end 514.

[0083] At least a portion of the multiple heat dissipation helical teeth 510 are located within the air duct 120.

[0084] The power conversion device 10 provided in this application includes a housing assembly 100, a fan 200, a first electronic component group 300, a heat sink 400, and a second electronic component group 500.

[0085] The housing assembly 100 has a chamber 110 and an air duct 120 inside, with the air duct 120 stacked on one side of the chamber 110.

[0086] The first electronic component group 300 is located within the chamber 110, which serves as the mounting carrier for the first electronic component group 300, and has the function of mounting and fixing the first electronic component group 300. The heat sink 400 is used to dissipate heat from the chamber 110. Most of the heat generated by the operation of the first electronic component group 300 is directly conducted to the heat sink 400. The heat sink 400 transfers the heat to the outside air through the air outlet 140 via convection heat exchange with the airflow in the air duct 120.

[0087] The second electronic component group 500 and the heat sink 400 are located on the same side of the chamber 110, and along the first direction, the second electronic component group 500 is located on one side of the heat sink 400. That is, the positional relationship between the second electronic component group 500 and the heat sink 400 is defined. The side of the second electronic component group 500 away from the chamber 110 is provided with a plurality of heat dissipation angulation teeth 510, each heat dissipation angulation tooth 510 extending obliquely, and the plurality of heat dissipation angulation teeth 510 are arranged at intervals along the second direction. Each heat dissipation angulation tooth 510 has a first end 512 and a second end 514, the first end 512 and the second end 514 are arranged opposite to each other, the first end 512 is closer to the air inlet 130 than the second end 514, and the first end 512 is closer to the heat sink 400 than the second end 514, that is, the oblique extension direction of the heat dissipation angulation tooth 510 is defined. Specifically, the distance from the first end 512 to the plane where the air inlet 130 is located is less than the distance from the second end 514 to the plane where the air inlet 130 is located, and the distance from the first end 512 to the side of the heat sink 400 facing the second electronic component group 500 is less than the distance from the second end 514 to the side of the heat sink 400 facing the second electronic component group 500. In other words, the correlation between the tilt direction of the heat dissipation tines 510 and the placement positions of the air inlet 130 and the heat sink 400 is defined.

[0088] At least a portion of the multiple heat dissipation tines 510, the fan 200, and the heat sink 400 are located within the air duct 120. The fan 200 drives air from the external environment into the air duct 120 through the air inlet 130. A portion of this cool air is blown towards the heat sink 400 and undergoes convective heat exchange, transferring the heat from the first electronic component assembly 300 to the heat sink 400 to the cool air, thus cooling the heat sink 400. This air, carrying the transferred heat, flows under the power of the fan 200 to the air outlet 140, and then flows out to the external environment via the outlet air, thereby achieving the purpose of dissipating heat from the first electronic component assembly 300. Another portion of the cold air will be blown toward at least a portion of the heat dissipation sprockets 510 located in the air duct 120, and will convect and exchange heat with the heat dissipation sprockets 510 to exchange the heat generated by the operation of the second electronic component group 500 into the cold air to cool the heat dissipation sprockets 510. This portion of air, carrying the exchanged heat, will flow to the air outlet 140 under the power of the fan 200, and then flow to the outside environment through the outlet air, thereby achieving the purpose of heat dissipation for the second electronic component group 500.

[0089] Therefore, it can be seen that at least a portion of the heat dissipation sprockets 510 and the heat sink 400 are located in the same air duct 120. This not only ensures the heat dissipation effect of the heat sink 400, but also allows more airflow to flow through the multiple heat dissipation sprockets 510 of the second electronic component group 500 for heat exchange. This can effectively increase the heat exchange flow rate of the second electronic component group 500, effectively reduce the temperature of the second electronic component group 500, ensure the performance of the second electronic component group 500, and help extend the service life of the second electronic component group 500.

[0090] Furthermore, by defining the extension direction of the heat dissipation tines 510 and the positional relationship between the air inlet 130 and the radiator 400, the flow direction of the cold air flowing into the air duct 120 through the air inlet 130 matches the inclined extension direction of the heat dissipation tines 510. This allows the cold air to pass through the heat dissipation tines 510 more smoothly, reducing eddies and turbulence when the airflow passes through the heat dissipation tines 510, reducing pressure loss, converting more energy into static pressure, reducing resistance, and increasing the airflow velocity. This allows the airflow to carry away more heat per unit time, thus improving heat dissipation efficiency. It is understood that the heat dissipation tines 510 guide the airflow along its surface, which helps to prolong the contact time between the airflow and the outer surface of the heat dissipation tines 510, enhancing the effect of convective heat transfer. Simultaneously, matching the flow direction of the cold air flowing into the air duct 120 with the inclined extension direction of the heat dissipation tines 510 reduces the deflection of the airflow when passing through the heat dissipation tines 510, reducing the frequency of airflow separation, flow breakdown, and vortex phenomena, thereby reducing noise and further improving the performance of the power conversion device 10.

[0091] At least a portion of the multiple heat dissipation sprockets 510 are located within the air duct 120. That is, a portion of the multiple heat dissipation sprockets 510 are located within the air duct 120, or all of the multiple heat dissipation sprockets 510 are located within the air duct 120.

[0092] For example, the number of fans 200 and air inlets 130 is one.

[0093] For example, the number of fans 200 is multiple.

[0094] For example, there are multiple air inlets 130.

[0095] For example, there are multiple air inlets 130 and multiple fans 200, with each fan 200 located at one air inlet 130.

[0096] In some embodiments, optionally, such as Figure 2 As shown, the second electronic component group 500 has a plurality of first heat dissipation teeth 520 on the side facing the heat sink 400.

[0097] Multiple first heat dissipation teeth 520 are arranged at intervals along the direction from the chamber 110 to the air duct 120.

[0098] The first heat dissipation tooth 520 extends along the direction from the air inlet 130 to the radiator 400.

[0099] At least a portion of the multiple first heat dissipation teeth 520 are located within the air duct 120.

[0100] In this embodiment, the structure of the second electronic component group 500 is further defined such that the second electronic component group 500 has a plurality of first heat dissipation teeth 520 on the side facing the heat sink 400, and the plurality of first heat dissipation teeth 520 are arranged at intervals along the direction from the chamber 110 to the air duct 120. Alternatively, it can be understood that the plurality of first heat dissipation teeth 520 are stacked along the direction from the chamber 110 to the air duct 120. The first heat dissipation teeth 520 extend along the direction from the air inlet 130 to the heat sink 400. At least a portion of the plurality of first heat dissipation teeth 520 are located within the air duct 120.

[0101] In other words, based on the positional relationship between the second electronic component group 500, the heat sink 400, and the air inlet 130, the structure of the second electronic component group 500 facing the heat sink 400 is further defined. This ensures that the extension direction and arrangement of the multiple first heat dissipation teeth 520 match the flow direction of the cold air flowing into the air duct 120 through the air inlet 130. This allows the cold air to pass more smoothly through the first heat dissipation teeth 520, reducing eddies and turbulence as the airflow passes through them. This reduces pressure loss, converts more energy into static pressure, reduces resistance, and increases airflow velocity, allowing more heat to be carried away per unit time, thus improving heat dissipation efficiency. It is understood that the first heat dissipation teeth 520 guide airflow along their surface, which helps to prolong the contact time between the airflow and the outer surface of the first heat dissipation teeth 520, enhancing the effect of convective heat transfer. Meanwhile, the direction of the cold air flowing into the air duct 120 matches the extension direction of the first heat dissipation tooth 520, which can reduce the deflection of the airflow when it flows through the first heat dissipation tooth 520, and reduce the frequency of airflow separation, flow separation, vortex and other phenomena, thereby helping to reduce noise and further improve the performance of the power conversion device 10.

[0102] For example, multiple heat dissipation helical teeth 510 and multiple first heat dissipation teeth 520 cooperate to increase the heat dissipation area and heat dissipation zone of the second electronic component group 500, which is beneficial to improving heat dissipation efficiency.

[0103] At least a portion of the plurality of first heat dissipation teeth 520 are located within the air duct 120. That is, a portion of the plurality of first heat dissipation teeth 520 are located within the air duct 120, or all of the plurality of first heat dissipation teeth 520 are located within the air duct 120.

[0104] In some embodiments, optionally, such as Figure 1 As shown, the second electronic component group 500 has multiple second heat dissipation teeth 530 on the side opposite to the heat sink 400.

[0105] Multiple second heat dissipation teeth 530 are arranged at intervals along the direction from the chamber 110 to the air duct 120.

[0106] The second heat dissipation tooth 530 extends along the direction from the air inlet 130 to the radiator 400.

[0107] At least a portion of the multiple second heat dissipation teeth 530 are located within the air duct 120.

[0108] In this embodiment, the structure of the second electronic component group 500 is further defined such that a plurality of second heat dissipation teeth 530 are provided on the side of the second electronic component group 500 opposite to the heat sink 400, and the plurality of second heat dissipation teeth 530 are arranged at intervals along the direction from the chamber 110 to the air duct 120. Alternatively, the plurality of second heat dissipation teeth 530 can be understood as being stacked along the direction from the chamber 110 to the air duct 120. The second heat dissipation teeth 530 extend along the direction from the air inlet 130 to the heat sink 400. At least a portion of the plurality of second heat dissipation teeth 530 are located within the air duct 120.

[0109] In other words, based on the positional relationship between the second electronic component group 500, the heat sink 400, and the air inlet 130, the structure of the second electronic component group 500 facing away from the heat sink 400 is further defined. This ensures that the extension direction and arrangement of the multiple second heat dissipation teeth 530 match the flow direction of the cold air flowing into the air duct 120 through the air inlet 130. This allows the cold air to pass more smoothly through the second heat dissipation teeth 530, reducing eddies and turbulence as the airflow passes through them. This reduces pressure loss, converts more energy into static pressure, reduces resistance, and increases airflow velocity, allowing more heat to be carried away per unit time, thus improving heat dissipation efficiency. It can be understood that the second heat dissipation teeth 530 guide airflow along their surface, which helps to prolong the contact time between the airflow and the outer surface of the second heat dissipation teeth 530, enhancing the effect of convective heat transfer. Meanwhile, the flow direction of the cold air flowing into the air duct 120 matches the extension direction of the second heat dissipation tooth 530, which can reduce the deflection of the airflow when it flows through the second heat dissipation tooth 530, and reduce the frequency of airflow separation, flow separation, vortex and other phenomena, thereby helping to reduce noise and further improve the performance of the power conversion device 10.

[0110] For example, multiple heat dissipation helical teeth 510 and multiple second heat dissipation teeth 530 cooperate to increase the heat dissipation area and heat dissipation zone of the second electronic component group 500, which is beneficial to improving heat dissipation efficiency.

[0111] For example, multiple heat dissipation serrations 510, multiple first heat dissipation serrations 520 and multiple second heat dissipation serrations 530 cooperate to increase the heat dissipation area and heat dissipation zone of the second electronic component group 500, which is beneficial to improving heat dissipation efficiency.

[0112] At least a portion of the plurality of second heat dissipation teeth 530 are located within the air duct 120. That is, a portion of the plurality of second heat dissipation teeth 530 are located within the air duct 120, or all of the plurality of second heat dissipation teeth 530 are located within the air duct 120.

[0113] In some embodiments, optionally, such as Figure 2 As shown, the air outlet 140 includes a first outlet 142 and a second outlet 144.

[0114] The radiator 400 is located between the air inlet 130 and the first outlet 142.

[0115] A portion of the second electronic component group 500 is located within the air duct 120, while another portion of the second electronic component group 500 extends outside the housing assembly 100 through the second outlet 144.

[0116] In this embodiment, the structure of the power conversion device 10 is further defined.

[0117] The air outlet 140 includes a first outlet 142, and the radiator 400 is located between the air inlet 130 and the first outlet 142. This defines the positional relationship between the first outlet 142, the radiator 400, and the air inlet 130. Air from the outside environment enters the air duct 120 through the air inlet 130, and a portion of the cool air is directly blown towards the radiator 400 before exiting the housing assembly 100 through the first outlet 142. This arrangement helps reduce the detours of the cool air flowing through the radiator 400, ensuring the frequency and area of ​​contact between the cool air and the radiator 400, thus guaranteeing the heat dissipation efficiency of the radiator 400.

[0118] The air outlet 140 also includes a second outlet 144. A portion of the second electronic component assembly 500 is located within the air duct 120, while another portion of the second electronic component assembly 500 extends outside the housing assembly 100 through the second outlet 144. Air from the external environment enters the air duct 120 through the air inlet 130, while another portion of the cool air is blown towards the multiple heat dissipation fins 510 of the second electronic component assembly 500, and then flows out of the housing assembly 100 along the heat dissipation fins 510 through the second outlet 144. The inclined extension directions of the second outlet 144, the air inlet 130, and the heat dissipation fins 510 are matched, allowing cool air to pass more smoothly through the heat dissipation fins 510, resulting in a faster airflow velocity and the removal of more heat per unit time, thus improving heat dissipation efficiency.

[0119] In some embodiments, optionally, such as Figure 7 As shown, the air outlet 140 includes a first outlet 142 and a second outlet 144. The heat sink 400 is located between the air inlet 130 and the first outlet 142. The second electronic component group 500 is entirely located within the air duct 120, and the second electronic component group 500 is located between the second outlet 144 and the heat sink 400.

[0120] In this embodiment, the structure of the power conversion device 10 is further defined.

[0121] The air outlet 140 includes a first outlet 142, and the radiator 400 is located between the air inlet 130 and the first outlet 142. This defines the positional relationship between the first outlet 142, the radiator 400, and the air inlet 130. Air from the outside environment enters the air duct 120 through the air inlet 130, and a portion of the cool air is directly blown towards the radiator 400 before exiting the housing assembly 100 through the first outlet 142. This arrangement helps reduce the detours of the cool air flowing through the radiator 400, ensuring the frequency and area of ​​contact between the cool air and the radiator 400, thus guaranteeing the heat dissipation efficiency of the radiator 400.

[0122] The air outlet 140 also includes a second outlet 144. The second electronic component group 500 is entirely located within the air duct 120, and is situated between the second outlet 144 and the heat sink 400. Ambient air enters the air duct 120 through the air inlet 130, while a portion of the cool air is blown towards the multiple heat dissipation fins 510 of the second electronic component group 500, and then flows out of the housing assembly 100 along the heat dissipation fins 510 through the second outlet 144. It is understood that the first outlet 142 and the second outlet 144 are located on adjacent sides of the air duct 120. The matching inclined extension directions of the second outlet 144, the air inlet 130, and the heat dissipation fins 510 allow cool air to pass more smoothly through the heat dissipation fins 510, resulting in a faster airflow velocity and the removal of more heat per unit time, thus improving heat dissipation efficiency.

[0123] In some embodiments, optionally, such as Figure 1 , Figure 2 , Figure 3 and Figure 7 As shown, the shell assembly 100 includes a first shell 160 and a second shell 170.

[0124] The first housing 160 has a chamber 110 inside.

[0125] The second housing 170 is stacked on one side of the first housing 160.

[0126] The second housing 170 is provided with an air inlet 130 and a first outlet 142.

[0127] The first housing 160 and the second housing 170 enclose the air outlet 120 and the second outlet 144.

[0128] In this embodiment, the structure of the shell assembly 100 is defined. The shell assembly 100 includes a first shell 160 and a second shell 170. The second shell 170 is stacked on one side of the first shell 160. That is, along the direction from the chamber 110 to the air duct 120, the second shell 170 is disposed on one side of the first shell 160.

[0129] The second housing 170 is provided with an air inlet 130 and a first outlet 142. The first housing 160 and the second housing 170 enclose the air outlet 120 and the second outlet 144. This arrangement can meet the usage requirements that a part of the second electronic component group 500 is located within the air outlet 120 and another part of the second electronic component group 500 extends out of the housing assembly 100 through the second outlet 144. It can also meet the usage requirements that the entire second electronic component group 500 is located within the air outlet 120 and between the second outlet 144 and the heat sink 400.

[0130] In addition, when the second electronic component group 500 is entirely located within the air duct 120, each part of the second electronic component group 500 can come into contact with and exchange heat with the cold air within the air duct 120, which can further improve the heat dissipation efficiency of the second electronic component group 500.

[0131] In some embodiments, optionally, such as Figure 8 and Figure 9 As shown, when another part of the second electronic component group 500 extends out of the housing assembly 100 through the second outlet 144, the housing assembly 100 includes a first housing 160, a surrounding plate 180 and a cover plate 190.

[0132] The first housing 160 has a chamber 110 inside.

[0133] The enclosure 180 is stacked on one side of the first housing 160.

[0134] The enclosure 180 is provided with an air inlet 130 and a first outlet 142.

[0135] The radiator 400 is located inside the enclosure 180.

[0136] The second electronic component group 500 is located on one side of the enclosure 180.

[0137] The cover plate 190 is connected to the enclosure plate 180. A portion of the cover plate 190 extends out of the outer peripheral wall 182 of the enclosure plate and covers the top of the second electronic component group 500. The enclosure plate 180, the cover plate 190 and the first housing 160 enclose the air outlet 120 and the second outlet 144.

[0138] In this embodiment, the structure of the shell assembly 100 is defined. The shell assembly 100 includes a first shell 160, a surrounding plate 180 and a cover plate 190. The surrounding plate 180 is stacked on one side of the first shell 160, that is, along the direction from the chamber 110 to the air duct 120, the surrounding plate 180 is disposed on one side of the first shell 160.

[0139] The first housing 160 has a chamber 110 inside, and the first electronic component group 300 is located inside the first housing 160.

[0140] The enclosure 180 is provided with an air inlet 130 and a first outlet 142, the heat sink 400 is located inside the enclosure 180, and the second electronic component group 500 is located outside the enclosure 180.

[0141] The cover plate 190 is connected to the enclosure plate 180. A portion of the cover plate 190 extends out of the outer peripheral wall 182 of the enclosure plate and covers the top of the second electronic component assembly 500. That is, the cover plate 190 covers at least a portion of the heat dissipation tines 510. The enclosure plate 180, the cover plate 190, and the first housing 160 enclose the air outlet 120 and the second outlet 144. The cover plate 190 has the function of defining the flow path of the airflow through the heat dissipation tines 510, which can meet the usage requirements that a portion of the second electronic component assembly 500 is located inside the air outlet 120, and another portion of the second electronic component assembly 500 extends out of the housing assembly 100 through the second outlet 144.

[0142] In some embodiments, optionally, such as Figure 2 and Figure 5 As shown, the heat sink 400 includes a substrate 410 and a plurality of fins 420.

[0143] The housing assembly 100 has an opening 150 inside.

[0144] The substrate 410 covers the opening 150.

[0145] At least a portion of the first electronic component group 300 is connected to the substrate 410 through the opening 150.

[0146] Multiple fins 420 are disposed on the side of the substrate 410 away from the chamber 110.

[0147] Multiple fins 420 are arranged at intervals along the first direction.

[0148] The fins 420 extend along the direction from the air inlet 130 to the first outlet 142.

[0149] In this embodiment, the structure of the heat sink 400 is defined such that the heat sink 400 includes a substrate 410 and a plurality of fins 420.

[0150] The housing assembly 100 has an opening 150, which is covered by the substrate 410. At least a portion of the first electronic component group 300 is connected to the substrate 410 through the opening 150. The opening 150 avoids the portion where the first electronic component group 300 is connected to the substrate 410, thus ensuring effective connection between at least a portion of the first electronic component group 300 and the substrate 410. This arrangement shortens the distance between the first electronic component group 300 and the substrate 410, allowing the heat generated by the first electronic component group 300 to be conducted to the heat sink 400 in a timely and rapid manner, thereby improving the heat dissipation efficiency of the heat sink 400.

[0151] It is understandable that the substrate 410 covers the opening 150, which can also be said to ensure the airtightness of the interior of the chamber 110. The substrate 410 can form part of the cavity wall of the chamber 110, which can reduce the amount of material input of the shell assembly 100 and help reduce the production cost of the power conversion device 10.

[0152] Furthermore, multiple fins 420 are disposed on the side of the substrate 410 opposite to the chamber 110, and the multiple fins 420 are spaced apart along a first direction, extending from the air inlet 130 to the first outlet 142. That is, the extension direction and arrangement position of the multiple fins 420 of the radiator 400 are matched with the flow direction of the cold air flowing into the air duct 120 through the air inlet 130. The cold air can pass through the fins 420 more smoothly, reducing eddies and turbulence when the airflow passes through the fins 420, reducing pressure loss, converting more energy into static pressure, reducing resistance, making the airflow velocity faster, and carrying away more heat per unit time, thereby improving heat dissipation efficiency. It can be understood that the fins 420 have the function of guiding the airflow along their surface, which is beneficial to prolonging the contact time between the airflow and the outer surface of the fins 420, and enhancing the effect of convective heat transfer. Meanwhile, the flow direction of the cold air flowing into the air duct 120 matches the extension direction of the fins 420, which can reduce the deflection of the airflow when it flows through the fins 420, and reduce the frequency of airflow separation, flow separation, vortex and other phenomena, thereby helping to reduce noise and further improve the performance of the power conversion device 10.

[0153] In some embodiments, optionally, such as Figure 6 As shown, the second electronic component group 500 includes a housing 540, a plurality of boost inductors 550 and a plurality of inverter inductors 560.

[0154] The housing 540 is provided with multiple heat dissipation serrations 510.

[0155] Multiple boost inductors 550 and multiple inverter inductors 560 are located within the housing 540.

[0156] An inverter inductor 560 is provided between two adjacent boost inductors 550.

[0157] In this embodiment, the structure of the second electronic component group 500 is further defined such that the second electronic component group 500 includes a housing 540, a plurality of boost inductors 550 and a plurality of inverter inductors 560, all of which are located within the housing 540, and the housing 540 serves as a mounting carrier for the plurality of boost inductors 550 and the plurality of inverter inductors 560.

[0158] By defining the cooperative structure of multiple boost inductors 550 and multiple inverter inductors 560, an inverter inductor 560 is placed between every two adjacent boost inductors 550, meaning the multiple boost inductors 550 and multiple inverter inductors 560 are arranged in an alternating manner. For example, the boost inductors 550 generate significant heat under low-voltage conditions, while the inverter inductors 560 generate significant heat under high-voltage conditions. This alternating arrangement of the multiple boost inductors 550 and multiple inverter inductors 560 effectively improves the temperature at these locations, avoids heat concentration, and helps ensure the performance and lifespan of the second electronic component group 500.

[0159] In some embodiments, optionally, a plurality of boost inductors 550 are arranged at intervals along the direction from the air inlet 130 to the heat sink 400.

[0160] In this embodiment, the placement positions of the plurality of boost inductors 550 are further defined, such that the plurality of boost inductors 550 are arranged at intervals along the direction from the air inlet 130 to the heat sink 400, which indirectly defines the placement positions of the plurality of inverter inductors 560, and the plurality of inverter inductors 560 are also arranged at intervals along the direction from the air inlet 130 to the heat sink 400.

[0161] This design makes good use of the space in the housing assembly 100, saving installation space for the second electronic component group 500.

[0162] In some embodiments, optionally, such as Figure 6 As shown, a sealant 570 is provided inside the housing 540, and the sealant 570 fills the internal area of ​​the housing 540.

[0163] In this embodiment, the structure of the second electronic component group 500 is further defined such that a sealant 570 is provided inside the housing 540. The sealant 570 fills the internal area of ​​the housing 540 and covers the plurality of boost inductors 550 and inverter inductors 560 located within the housing 540. The sealant can also fill the connection points between the inner surface of the housing 540 and the plurality of boost inductors 550 and inverter inductors 560. The sealant 570 has the function of protecting the plurality of boost inductors 550 and inverter inductors 560, and can stabilize and seal the plurality of boost inductors 550 and inverter inductors 560, thus having a waterproof function.

[0164] In some embodiments, the heat dissipation helical tooth 510 may be a strip-shaped heat dissipation tooth; or the heat dissipation helical tooth 510 may include a plurality of tooth segments, which are arranged at intervals along the inclination direction of the heat dissipation helical tooth 510.

[0165] In this embodiment, the structure of the heat dissipation teeth is defined.

[0166] The heat dissipation spur 510 is a strip-shaped heat dissipation spur. This design can increase the heat dissipation area of ​​the heat dissipation spur 510 and increase the contact area between the heat dissipation spur 510 and the airflow. In this way, more heat can be removed from the heat dissipation spur 510 per unit time, which is beneficial to improving heat dissipation efficiency.

[0167] The heat dissipation helical tooth 510 includes multiple tooth segments, which are spaced apart along the inclined direction of the heat dissipation helical tooth 510. It can be understood that, along the inclined extension direction of the heat dissipation helical tooth 510, the two tooth segments located furthest to the side respectively form the first end 512 and the second end 514 of the heat dissipation helical tooth 510. This arrangement helps reduce the material input of the second electronic component assembly 500 and thus reduces the production cost of the second electronic component assembly 500.

[0168] A photovoltaic system according to some embodiments of this application includes: a power conversion device 10 as described in any of the above embodiments.

[0169] The photovoltaic system provided in this application includes the power conversion device 10 as described in the first aspect, and therefore has all the beneficial effects of the power conversion device 10, which will not be described in detail here.

[0170] For example, the power conversion device 10 includes a second electronic component group 500, which has multiple heat dissipation serrations 510. The second electronic component group 500 and the heat sink 400 are located within an air duct 120, which may completely cover the second electronic component group 500 or cover a portion of it. Multiple boost inductors 550 and multiple inverter inductors 560 within the second electronic component group 500 are arranged in an alternating pattern.

[0171] The following example illustrates that the second electronic component group 500 includes a power inductor and the first electronic component group 300 includes a power transistor.

[0172] The power inductor has multiple heat dissipation helical teeth 510, which not only avoid the thermal cascading problem caused by straight teeth, but also better conform to the flow direction of heat exchange airflow, thereby increasing heat exchange efficiency.

[0173] The power inductor and heat sink 400 are located in the same airflow 120, which allows more airflow to flow and exchange heat between the heat dissipation helical teeth 510 of the power inductor, thereby increasing the heat exchange flow rate of the power inductor and reducing the temperature of the power inductor.

[0174] The power inductor includes an inverter inductor 560 and a boost inductor 550. Arranging the boost inductor 550 and inverter inductor 560 together saves space. However, because power inductors generate a significant amount of heat and reach high temperatures, arranging the boost inductor 550 and inverter inductor 560 together leads to heat concentration. Using an alternating arrangement of multiple boost inductors 550 and multiple inverter inductors 560 effectively mitigates the problem of excessively high temperatures caused by heat concentration in the inductors. This is because the boost inductor 550 experiences significant heat generation under low-voltage conditions, while the inverter inductor 560 experiences significant heat generation under high-voltage conditions.

[0175] At least a portion of the power inductor with heat dissipation helical teeth 510 is designed within a duct 120 with the heat sink 400.

[0176] like Figure 1 and Figure 2 As shown, the shell assembly 100 includes a first shell 160 and a second shell 170. The second shell 170 includes a front windshield 171, an upper windshield 172, a side windshield 173, and an opening plate 174. The opening plate 174 is provided with a first outlet 142.

[0177] Outside air is drawn into the air duct 120 by the fan 200. A portion of this air is blown into the fins 420 of the heatsink 400, where it undergoes convective heat exchange with the heatsink 400, transferring the heat from the power transistors to the heatsink 400. This air, carrying the transferred heat, flows through the first outlet 142 of the air duct 120 under the power of the fan 200, dissipating the heat into the outside air. Another portion of the air flows through the heatsink fins of the power inductor's casing 540, undergoing convective heat exchange with the fins 420, transferring the heat transferred from the power inductor to the casing 540. The airflow then carries this heat from the casing 540 to the outside air. The heatsink fins 420 of the power inductor include heat dissipation serrations 510, a first heatsink serration 520, and a second heatsink serration 530.

[0178] like Figure 8 and Figure 9As shown, the air duct 120 covers a portion of the housing 540 of the power inductor.

[0179] like Figure 7 As shown, air duct 120 covers the entire casing of the power inductor.

[0180] In this application, the term "multiple" refers to two or more unless otherwise expressly defined. The terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; "linking" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0181] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. The above descriptions are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A power conversion device, characterized in that, include: A shell assembly, wherein the shell assembly has a chamber and an air duct, the air duct is stacked on one side of the chamber, and the shell assembly has an air inlet and an air outlet communicating with the air duct; The fan is located inside the air duct; The first group of electronic components is located within the cavity; A radiator is located inside the air duct and is used to dissipate heat from the chamber. The second electronic component group and the heat sink are located on the same side of the chamber and along the first direction. The second electronic component group is located on one side of the heat sink. The side of the second electronic component group away from the chamber is provided with a plurality of heat dissipation oblique teeth. The plurality of heat dissipation oblique teeth are arranged at intervals along the second direction. The heat dissipation oblique teeth have opposing first ends and second ends. The first end is closer to the air inlet and the heat sink than the second end. At least a portion of the heat dissipation serrations are located within the air duct.

2. The power conversion device according to claim 1, characterized in that, The second electronic component group has a plurality of first heat dissipation teeth on the side facing the heat sink. The plurality of first heat dissipation teeth are arranged at intervals along the direction from the chamber to the air duct. The first heat dissipation teeth extend along the direction from the air inlet to the heat sink. At least a portion of the plurality of first heat dissipation teeth are located in the air duct.

3. The power conversion device according to claim 1 or 2, characterized in that, The second electronic component group has a plurality of second heat dissipation teeth on the side away from the heat sink. The plurality of second heat dissipation teeth are arranged at intervals along the direction from the chamber to the air duct. The second heat dissipation teeth extend along the direction from the air inlet to the heat sink. At least a portion of the plurality of second heat dissipation teeth are located in the air duct.

4. The power conversion device according to claim 1 or 2, characterized in that, The air outlet includes a first outlet and a second outlet; The radiator is located between the air inlet and the first outlet; A portion of the second electronic component group is located within the air duct, and another portion of the second electronic component group extends out of the housing assembly through the second outlet; or The second electronic component group is entirely located within the air duct, and is situated between the second outlet and the heat sink.

5. The power conversion device according to claim 4, characterized in that, The shell assembly includes: A first housing, wherein the chamber is provided within the first housing; The second housing is stacked on one side of the first housing. The second housing is provided with the air inlet and the first outlet. The first housing and the second housing enclose the air duct and the second outlet.

6. The power conversion device according to claim 4, characterized in that, When another portion of the second electronic component group extends outside the housing assembly through the second outlet, the housing assembly includes: A first housing, wherein the chamber is provided within the first housing; A partition panel is stacked on one side of the first housing. The partition panel is provided with the air inlet and the first outlet. The heat sink is located inside the partition panel. The second electronic component group is located on one side of the partition panel. A cover plate is connected to the enclosure plate. A portion of the cover plate extends out of the outer peripheral wall of the enclosure plate and covers the top of the second electronic component group. The enclosure plate, the cover plate, and the first housing enclose the air duct and the second outlet.

7. The power conversion device according to claim 4, characterized in that, The heat sink includes: A substrate, wherein the housing assembly has an opening, the substrate covers the opening, and at least a portion of the first electronic component group is connected to the substrate through the opening; Multiple fins are disposed on the side of the substrate away from the chamber, and the multiple fins are arranged at intervals along the first direction, and the fins extend along the direction from the air inlet to the first outlet.

8. The power conversion device according to claim 1 or 2, characterized in that, The second electronic component group includes: The housing is provided with a plurality of heat dissipation serrations; Multiple boost inductors and multiple inverter inductors are located inside the housing, with one inverter inductor located between two adjacent boost inductors.

9. The power conversion device according to claim 8, characterized in that, Multiple boost inductors are arranged at intervals along the direction from the air inlet to the heat sink; and / or The housing contains a sealant that fills the interior area of ​​the housing.

10. The power conversion device according to claim 1 or 2, characterized in that, The heat dissipation serrations are strip-shaped heat dissipation serrations; or The heat dissipation helical tooth includes multiple tooth segments, which are arranged at intervals along the inclination direction of the heat dissipation helical tooth.

11. A photovoltaic system, characterized in that, include: The power conversion device as described in any one of claims 1 to 10.

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