Lifting device for heating semiconductor wafer

Abstract

The utility model discloses a lifting device for heating a semiconductor wafer. The lifting device comprises a base, a support is installed at one end of the top of the base, a guide rod is arranged in one side of the front face of the support, a detection mechanism is movably installed on the outer side of the guide rod, and a driving disc is installed at the top of the detection mechanism; through cooperative use of the detection mechanism, the driving disc and the transmission groove, the lifting position of a semiconductor wafer can be monitored through work of the detection mechanism, and the position of the detection mechanism can be adjusted through meshing transmission between work rotation of the driving disc and the transmission groove, so that personnel can conveniently adjust the lifting position of the semiconductor wafer according to actual use conditions. According to the lifting height of the lifting table, the position of the detection mechanism is adjusted to detect whether the lifting height of the lifting table is reached or not, so that the requirements of semiconductor wafer processing at different height positions are met, the semiconductor wafer is accurately conveyed to a heating position, and use by personnel is facilitated.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, specifically a lifting device for heating semiconductor wafers. Background Technology

[0002] Semiconductor wafers are ultra-thin circular semiconductor material sheets used to manufacture integrated circuits and other microelectronic devices. In the manufacturing process of semiconductor wafers, the heating process is an extremely critical step. Processes such as annealing and photoresist curing require precise heating of the wafer. During the heating process, the lifting operation of the wafer is indispensable. The lifting device can accurately place the wafer in the heating position.

[0003] The lifting device can move the wafer to the heating position. However, the device lacks an effective detection mechanism when performing wafer lifting operations, making it difficult to accurately control the movement of the wafer in the horizontal or vertical direction. Furthermore, it cannot flexibly adjust the lifting height according to different process requirements, which is detrimental to personnel operation. Utility Model Content

[0004] The purpose of this invention is to provide a lifting device for heating semiconductor wafers to solve the problems mentioned in the background art.

[0005] This utility model provides the following technical solution: a lifting device for heating semiconductor wafers, including a base; a bracket is installed at one end of the top of the base, a guide rod is provided inside the front side of the bracket, a detection mechanism is movably installed on the outside of the guide rod, a drive disk is installed on the top of the detection mechanism, a transmission groove is provided on the inner wall of the bracket near the guide rod, the transmission groove and the drive disk are connected in transmission, a lifting mechanism is installed inside the bracket on one side of the detection mechanism, a lifting platform is driven and installed on the outside of the lifting mechanism, and a fixing mechanism is installed on the surface of the lifting platform.

[0006] Preferably, the detection mechanism includes a connecting seat disposed on the outside of the guide rod, and a micro switch is installed inside one end of the connecting seat.

[0007] Preferably, a spring is installed inside the connector below the micro switch, and a stop block is installed at the bottom of the spring.

[0008] Preferably, the bracket has a limiting groove inside, and a limiting block is movable inside the limiting groove, with the limiting block located on the outer wall of the lifting platform.

[0009] Preferably, the fixing mechanism includes a power pump disposed at the bottom of the lifting platform, and an adsorption plate is installed on the surface of the lifting platform at the output end of the power pump, with the inside of the adsorption plate connected to the output end of the power pump.

[0010] Preferably, a suction device is installed on the surface of the lifting platform at one end of the adsorption plate.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. This utility model uses a detection mechanism, a drive disk, and a transmission groove in conjunction. The detection mechanism monitors the lifting position of the semiconductor wafer, while the drive disk rotates and engages with the transmission groove to adjust the position of the detection mechanism. This allows personnel to adjust the position of the detection mechanism according to the actual usage and the lifting height of the lifting platform to check whether the lifting height has been reached, thus meeting the needs of semiconductor wafer processing at different heights and accurately transporting the semiconductor wafer to the heating position, thereby benefiting personnel.

[0013] 2. This utility model uses a connecting base, a micro switch, a spring, and a stop block in combination. When the lifting platform moves to the designated position, the lifting platform will squeeze the stop block, and the stop block will compress the spring upward, thereby triggering the micro switch. The micro switch transmits a signal to the control system to monitor whether the lifting position of the semiconductor wafer is in place. This method can effectively protect the micro switch from damage, and at the same time, it can monitor the lifting position of the lifting platform and the conveyed semiconductor wafer, thus facilitating personnel use. Attached Figure Description

[0014] Figure 1 This is a front perspective view of the present utility model;

[0015] Figure 2 This is a side perspective view of the present invention;

[0016] Figure 3 This is a schematic diagram of the internal structure of the testing mechanism of this utility model;

[0017] Figure 4 This is a schematic diagram of the internal structure of the support portion of this utility model.

[0018] In the diagram: 1. Base; 2. Bracket; 201. Lifting mechanism; 202. Limiting groove; 203. Limiting block; 3. Lifting platform; 4. Fixing mechanism; 401. Power pump; 402. Adsorption plate; 5. Suction device; 6. Guide rod; 601. Detection mechanism; 6011. Connecting seat; 6012. Micro switch; 602. Drive plate; 603. Transmission groove; 7. Spring; 701. Abutment block. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments;

[0021] Example:

[0022] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Please refer to the accompanying drawings. Figures 1 to 4 Please refer to the following for details: A lifting device for heating semiconductor wafers provided in this application. Figure 1 , Figure 2 and Figure 4 The system includes a base 1; a bracket 2 is installed at one end of the top of the base 1; a guide rod 6 is provided inside the front side of the bracket 2; a detection mechanism 601 is movably installed on the outside of the guide rod 6; a drive disk 602 is installed on the top of the detection mechanism 601; a transmission groove 603 is provided on the inner wall of the bracket 2 near the guide rod 6; the transmission groove 603 and the drive disk 602 are connected in transmission; a lifting mechanism 201 is installed inside the bracket 2 on one side of the detection mechanism 601; a lifting platform 3 is installed in transmission on the outside of the lifting mechanism 201; a fixing mechanism 4 is installed on the surface of the lifting platform 3; the lifting mechanism 201 consists of a motor and a threaded rod; the output end of the motor is connected to the threaded rod, which is existing technology and can convert rotary motion into linear motion.

[0023] Specifically, the base 1 provides stable support for components such as the bracket 2, and the guide rod 6 provides a moving track for the detection mechanism 601, enabling it to slide stably along the guide rod 6 and achieve precise positional movement. The detection mechanism 601 monitors the lifting position of the semiconductor wafer. The drive disk 602 on its top is connected to the transmission groove 603 on the inner wall of the bracket 2. By rotating and engaging with the transmission groove 603, the position of the detection mechanism 601 can be adjusted. This allows personnel to adjust the position of the detection mechanism 601 according to the actual usage and the lifting height of the lifting platform 3 to check whether the lifting height of the lifting platform 3 has been reached. The lifting mechanism 201 is installed inside the bracket 2 and is connected to the lifting platform 3 through a transmission method. It can drive the lifting platform 3 to achieve vertical lifting movement to meet the needs of semiconductor wafer processing at different heights, accurately transporting the semiconductor wafer to the heating position. The fixing mechanism 4 on the surface of the lifting platform 3 is responsible for firmly fixing the semiconductor wafer placed on it, preventing the semiconductor wafer from shifting or falling during lifting or subsequent operations, ensuring the safety and accuracy of the operation process.

[0024] Please refer to this carefully. Figure 1 and Figure 3 The detection mechanism 601 includes a connecting seat 6011 disposed on the outside of the guide rod 6, and a micro switch 6012 is installed inside one end of the connecting seat 6011.

[0025] Please refer to this carefully. Figure 1 and Figure 3 A spring 7 is installed inside the connector 6011 below the micro switch 6012, and a stop block 701 is installed at the bottom of the spring 7.

[0026] Specifically, in order to monitor the lifting position of the semiconductor wafer, the connector 6011 is located outside the guide rod 6, providing a mounting base and support for other components of the detection mechanism 601. When the stop block 701 is squeezed or touched by an external object, it will compress the spring 7 upward, thereby triggering the action of the micro switch 6012. The micro switch 6012 converts this mechanical action into an electrical signal, which can be transmitted to the control system to monitor whether the lifting position of the semiconductor wafer is in place. When the stop block 701 is subjected to a certain degree of external force, it can slowly compress the spring 7 to avoid causing excessive impact on the micro switch 6012, thereby protecting the service life of the micro switch 6012.

[0027] Please refer to this carefully. Figure 1 The bracket 2 has a limiting groove 202 inside, and a limiting block 203 is provided inside the limiting groove 202 for movement. The limiting block 203 is located on the outer wall of the lifting platform 3.

[0028] Specifically, in order to limit the movement of the lifting platform 3, the limiting groove 202 inside the bracket 2 defines a clear path for the movement of the lifting platform 3. When the lifting platform 3 moves up and down, the limiting block 203 slides in the limiting groove 202 to ensure that the lifting platform 3 can only move along the preset vertical direction, effectively preventing the lifting platform 3 from shifting laterally or shaking during the lifting process, and ensuring the accuracy of the movement of the lifting platform 3.

[0029] Please refer to this carefully. Figure 1 and Figure 2 The fixing mechanism 4 includes a power pump 401 installed at the bottom of the lifting platform 3. An adsorption plate 402 is installed on the surface of the lifting platform 3 at the output end of the power pump 401. The inside of the adsorption plate 402 is connected to the output end of the power pump 401.

[0030] Please refer to this carefully. Figure 1 The surface of the lifting platform 3 at one end of the adsorption plate 402 is equipped with a suction device 5, which is a suction fan.

[0031] Specifically, in order to fix the semiconductor wafer, the suction device 5 works. Before the wafer is adsorbed by the adsorption plate 402, the suction device 5 can clean the surface of the lifting platform 3 and the wafer placement area, removing dust, impurities and other foreign objects to prevent foreign objects from affecting the adsorption effect and wafer quality. When the power pump 401 works, a negative pressure is formed inside the adsorption plate 402, thereby firmly adsorbing the semiconductor wafer onto the surface of the lifting platform 3. Compared with traditional clamping and other fixing methods, this adsorption fixing method can avoid physical damage to the wafer surface and has a stable fixing effect, ensuring that the wafer will not be displaced during the lifting process, providing a reliable fixing guarantee for the wafer heating process.

[0032] Working principle: By placing the semiconductor wafer on the adsorption plate 402, the suction device 5 cleans the surface of the lifting platform 3 and the wafer placement area, removing dust, impurities and other foreign objects. At the same time, the power pump 401 works, creating a negative pressure inside the adsorption plate 402, firmly adsorbing the semiconductor wafer onto the surface of the lifting platform 3. Then, the lifting mechanism 201 moves the lifting platform 3, accurately transporting the semiconductor wafer to the heating position. When the lifting platform 3 moves to the designated position, it squeezes the stop block 701, which compresses the spring 7 upward, thereby triggering the action of the micro switch 6012. The micro switch 6012 converts this mechanical action into an electrical signal, which can be transmitted to the control system to monitor whether the lifting position of the semiconductor wafer is in place.

[0033] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solution of this utility model and not to limit it. Although this utility model has been described in detail with reference to the embodiments, those skilled in the art should understand that modifications and equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications and substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A lifting device for heating semiconductor wafers, comprising a base (1); characterized in that: A bracket (2) is installed at one end of the top of the base (1). A guide rod (6) is provided inside the front side of the bracket (2). A detection mechanism (601) is movably installed on the outside of the guide rod (6). A drive disk (602) is installed on the top of the detection mechanism (601). A transmission groove (603) is provided on the inner wall of the bracket (2) near the guide rod (6). The transmission groove (603) and the drive disk (602) are connected in transmission. A lifting mechanism (201) is installed inside the bracket (2) on one side of the detection mechanism (601). A lifting platform (3) is installed on the outside of the lifting mechanism (201). A fixing mechanism (4) is installed on the surface of the lifting platform (3).

2. The lifting device for heating semiconductor wafers according to claim 1, characterized in that: The detection mechanism (601) includes a connecting seat (6011) disposed on the outside of the guide rod (6), and a micro switch (6012) is installed inside one end of the connecting seat (6011).

3. The lifting device for heating semiconductor wafers according to claim 2, characterized in that: A spring (7) is installed inside the connector (6011) below the micro switch (6012), and a stop block (701) is installed at the bottom of the spring (7).

4. The lifting device for heating semiconductor wafers according to claim 1, characterized in that: The bracket (2) is provided with a limiting groove (202) inside, and a limiting block (203) is provided inside the limiting groove (202) for movement. The limiting block (203) is located on the outer wall of the lifting platform (3).

5. A lifting device for heating semiconductor wafers according to claim 4, characterized in that: The fixing mechanism (4) includes a power pump (401) installed at the bottom of the lifting platform (3). An adsorption plate (402) is installed on the surface of the lifting platform (3) at the output end of the power pump (401). The inside of the adsorption plate (402) is connected to the output end of the power pump (401).

6. A lifting device for heating semiconductor wafers according to claim 5, characterized in that: A suction device (5) is installed on the surface of the lifting platform (3) at one end of the adsorption plate (402).

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