Circuit board lead automatic welding device

Abstract

The utility model discloses a circuit board lead automatic welding device, and relates to the technical field of circuit board lead welding. The circuit board placing device comprises a bottom plate and further comprises a placing part which is installed at the top of the bottom plate and used for placing a circuit board; the lead placing part is mounted on the left side of the positioning table, and the lead placing part is used for placing a plurality of leads; and the welding part is installed above the placing part, and the welding part is used for welding the lead wire. According to the utility model, through the arrangement of the pressing assembly, the leads needing to be welded are sequentially placed on the plurality of notches, the joints of the leads are aligned with the welding points of the circuit board, after the leads are placed, the pressing plate is put down and reset, and the pressing plate can clamp and fix the leads under the elastic action of the spring; in this way, the lead can be prevented from deviating, the welding effect can be improved, the situation of welding deviation is reduced, and the welding quality is improved.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board lead welding technology, and in particular relates to an automatic circuit board lead welding device. Background Technology

[0002] The automatic soldering device for printed circuit board leads is an automated device used in the manufacturing of electronic equipment. It is mainly used to achieve efficient and precise soldering of leads on printed circuit boards (PCBs).

[0003] Traditional circuit board lead soldering equipment typically places the circuit board on a positioning table and places the leads to be soldered on a lead frame, aligning the ends of the leads with the soldering positions on the circuit board. Then, the soldering head performs automatic soldering. However, after placement, the leads are easily affected by gravity, causing them to shift or tilt, which can lead to deviations or failures during soldering, thus affecting the soldering quality. Utility Model Content

[0004] The purpose of this invention is to provide an automatic soldering device for circuit board leads. Specifically, by setting a pressing component, the leads to be soldered are placed sequentially on several slots, with the connectors of the leads aligned with the soldering points on the circuit board. After the leads are placed, the pressure plate is lowered and reset. The pressure plate then clamps and fixes the leads under the elastic action of a spring. This method prevents the leads from shifting, improves the soldering effect, reduces soldering deviations, and improves soldering quality. It solves the problem that after placement, the leads are easily affected by gravity, causing them to shift or tilt, which can lead to deviations or failures during soldering, thus affecting the soldering quality.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0006] This utility model relates to an automatic soldering device for circuit board leads, including a base plate, and further comprising:

[0007] A placement section is mounted on the top of the base plate and is used to place a circuit board.

[0008] A lead wire placement section, mounted on the left side of the positioning platform, is used to place multiple leads; and

[0009] A welding section is installed above the placement section and is used to weld the lead wires.

[0010] The placement section can position and place the circuit board, and the lead placement section can position and place multiple leads, thereby improving the soldering quality.

[0011] Furthermore, the placement part includes a positioning platform placed on the base plate. Positioning blocks are inserted into both the front and back of the positioning platform. A groove is provided on the top right side of the positioning platform. Two positioning blocks one and two positioning blocks two are fixedly connected to the top of the positioning platform. Two docking slots are provided on the left side of the positioning platform. Positioning blocks one and two positioning blocks two are integrally formed with the positioning platform.

[0012] The positioning block is fixedly connected to the top of the base plate at its bottom. The positioning block is used to position the positioning platform during installation. The positioning platform is fixed to the base plate by bolts.

[0013] Furthermore, two positioning blocks are distributed on the front and back of the positioning platform, and two positioning blocks are distributed on the top right side of the positioning platform. The positioning blocks and positioning blocks cooperate to position the circuit board.

[0014] Furthermore, the lead wire placement part includes an auxiliary platform located on the left side of the positioning platform. The top of the auxiliary platform has several slots, and two connecting strips are fixedly connected to the right side of the auxiliary platform. The connecting strips are installed on the auxiliary platform by welding, and the connecting strips cooperate with the connecting slots to position and install the auxiliary platform.

[0015] A pressing assembly, mounted above an auxiliary platform, is used to press the lead wire; and

[0016] A limiting component, which is mounted on the front of the auxiliary platform, is used to restrict and support the pressing component;

[0017] The slot is used to place the lead wire. The right side of the auxiliary platform is inserted into the docking slot on the positioning platform through a docking strip. The auxiliary platform is fixed to the base plate with bolts.

[0018] Furthermore, the pressing assembly includes a pressure plate disposed above the auxiliary platform. Two limiting rods are slidably connected inside the pressure plate. A support block is fixedly connected to the bottom of each limiting rod. The support block is fixedly connected to the surface of the auxiliary platform. A spring is sleeved on the outside of each limiting rod. The limiting rod and the support block are integrally formed. The support block is installed on the auxiliary platform by welding.

[0019] The top of the spring is fixedly connected to the bottom of the pressure plate, the bottom of the spring is fixedly connected to the top of the support block, and the limiting rod is used to limit the pressure plate.

[0020] Furthermore, the limiting component includes a movable rod disposed on the front of the auxiliary platform, the bottom of the movable rod being rotatably connected to the auxiliary platform via a pivot, a second limiting rod being fixedly connected to the front of the auxiliary platform, and a limiting protrusion being fixedly connected to the right side of the movable rod; the limiting protrusion is integrally formed with the movable rod, and the second limiting rod is integrally formed with the auxiliary platform;

[0021] The limiting protrusion on the pressure plate is used to limit and fix the pressure plate. When the movable rod is in a horizontal state, the limiting rod 2 supports the movable rod.

[0022] Furthermore, the welding section includes a bracket fixedly connected to the top of the base plate, an electric push rod fixedly connected to the top of the bracket, a Y-axis servo drive device disposed inside the bracket, a moving plate mounted at the bottom of the Y-axis servo drive device, a welding head mounted at the bottom of the moving plate, a vision positioning module mounted on the front of the moving plate, and a feeding mechanism mounted on the back of the moving plate; the feeding mechanism is used to automatically feed solder wire or solder paste, the vision positioning module uses a high-speed camera (resolution up to micrometer level) to capture the position of PCB solder joints and leads, and the welding head uses heating to melt and weld the solder wire.

[0023] The output end of the electric push rod is connected to the Y-axis servo drive device via a flange, and the Y-axis servo drive device is used to drive the moving plate to move back and forth.

[0024] This utility model has the following beneficial effects:

[0025] 1. This utility model uses a pressing component to place the leads to be soldered sequentially on several slots and align the connectors of the leads with the soldering points on the circuit board. After the leads are placed, the pressure plate is lowered to reset, and the pressure plate will clamp and fix the leads under the elastic action of the spring. This method can prevent the leads from shifting, improve the soldering effect, reduce the occurrence of soldering deviations, and improve the soldering quality.

[0026] 2. This utility model uses a limiting component. Specifically, when the pressure plate is pulled upward, it slides on the limiting rod and stretches the spring. Then, the movable rod is rotated to move the limiting protrusion to the bottom of the pressure plate, thus releasing the pressure plate. At this time, the pressure plate is limited by the limiting protrusion. This method can move the pressure plate away from the auxiliary table, making it more convenient for workers to place the lead wire.

[0027] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0030] Figure 2 This is a schematic diagram of the left side structure of the auxiliary platform of this utility model;

[0031] Figure 3 This utility model Figure 2 A magnified structural diagram of A in the middle;

[0032] Figure 4 This is a schematic diagram of the top structure of the positioning platform of this utility model;

[0033] Figure 5 This is a schematic diagram of the bottom structure of the bracket of this utility model.

[0034] The attached diagram lists the components represented by each number as follows:

[0035] 1. Base plate; 2. Placement section; 21. Positioning platform; 22. Positioning block; 23. Groove; 24. Positioning block one; 25. Positioning block two; 26. Docking groove; 3. Lead wire placement section; 31. Auxiliary platform; 311. Groove; 312. Docking strip; 32. Pressing assembly; 321. Pressure plate; 322. Limiting rod one; 323. Spring; 324. Support block; 33. Restriction assembly; 331. Movable rod; 332. Limiting rod two; 333. Restriction protrusion; 4. Welding section; 41. Bracket; 42. Electric push rod; 43. Y-axis servo drive device; 44. Moving plate; 441. Welding head; 442. Vision positioning module; 443. Feeding mechanism. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0037] Please see Figures 1-5As shown, this utility model is an automatic soldering device for circuit board leads, including a base plate 1, and further including: a placement part 2, which is installed on the top of the base plate 1 and is used to place circuit boards; a lead placement part 3, which is installed on the left side of the positioning table 21 and is used to place multiple leads; and a soldering part 4, which is installed above the placement part 2 and is used to solder the leads; wherein, the placement part 2 can position and place the circuit board, and the lead placement part 3 can position and place multiple leads, thereby improving the soldering quality; the placement part 2 includes a positioning table 21 positioned on the base plate 1, with positioning blocks 22 inserted into the front and back of the positioning table 21, and the top right side of the positioning table 21... The positioning platform 21 has a groove 23, and two positioning blocks 24 and two positioning blocks 25 are fixedly connected to the top of the positioning platform 21. Two docking slots 26 are provided on the left side of the positioning platform 21. The bottom of the positioning block 22 is fixedly connected to the top of the base plate 1. The positioning block 22 is used to position the positioning platform 21 during installation. The positioning platform 21 is fixed to the base plate 1 by bolts. The two positioning blocks 24 are distributed on the front and back of the positioning platform 21, and the two positioning blocks 25 are distributed on the top right side of the positioning platform 21. The positioning blocks 24 and 25 cooperate to position the circuit board. The lead wire placement part 3 includes an auxiliary platform 31 located on the left side of the positioning platform 21. The top of the auxiliary platform 31 has several slots 311, and the right side of the auxiliary platform 31... The system includes two fixed connecting strips 312; a pressing assembly 32 mounted above the auxiliary platform 31 for pressing the lead wire; and a limiting assembly 33 mounted on the front of the auxiliary platform 31 for limiting and supporting the pressing assembly 32. A slot 311 is used to place the lead wire. The right side of the auxiliary platform 31 is inserted into the connecting slot 26 on the positioning platform 21 via the connecting strips 312. The auxiliary platform 31 is fixed to the base plate 1 by bolts. The pressing assembly 32 includes a pressure plate 321 mounted above the auxiliary platform 31. Two limiting rods 322 are slidably connected inside the pressure plate 321. A support block 324 is fixedly connected to the bottom of each limiting rod 322 for support. Block 324 is fixedly connected to the surface of auxiliary platform 31, and spring 323 is sleeved on the outside of limit rod 322. The lead wires to be welded are placed in a number of slots 311 in sequence, and the joint of the lead wire is aligned with the welding point of the circuit board. After the lead wires are placed, the pressure plate 321 is lowered and reset. The pressure plate 321 will clamp and fix the lead wires under the elastic action of spring 323. This method can prevent the lead wires from shifting, improve the welding effect, reduce the welding deviation, and improve the welding quality. The top of spring 323 is fixedly connected to the bottom of pressure plate 321, the bottom of spring 323 is fixedly connected to the top of support block 324, and limit rod 322 is used to limit the pressure plate 321.The limiting component 33 includes a movable rod 331 disposed on the front of the auxiliary platform 31. The bottom of the movable rod 331 is rotatably connected to the auxiliary platform 31 via a pivot. A second limiting rod 332 is fixedly connected to the front of the auxiliary platform 31. A limiting protrusion 333 is fixedly connected to the right side of the movable rod 331. When the pressure plate 321 is pulled upward, the pressure plate 321 slides on the first limiting rod 322, stretching the spring 323. Then, the movable rod 331 is rotated, causing the limiting protrusion 333 to move to the bottom of the pressure plate 321, thus releasing the pressure plate 321. At this time, the pressure plate 321 is limited by the limiting protrusion 333. This method can move the pressure plate 321 away from the auxiliary platform 31, making it more convenient for workers to place the lead wire. Among them, the limiting protrusion 333 on the pressure plate 321... 33 is used to restrict and fix the pressure plate 321. When the movable rod 331 is in a horizontal state, the limiting rod 332 supports the movable rod 331. The welding part 4 includes a bracket 41 fixedly connected to the top of the base plate 1. An electric push rod 42 is fixedly connected to the top of the bracket 41. A Y-axis servo drive device 43 is provided inside the bracket 41. A moving plate 44 is installed at the bottom of the Y-axis servo drive device 43. A welding head 441 is installed at the bottom of the moving plate 44. A vision positioning module 442 is installed on the front of the moving plate 44. A feeding mechanism 443 is installed on the back of the moving plate 44. The output end of the electric push rod 42 is connected to the Y-axis servo drive device 43 through a flange. The Y-axis servo drive device 43 is used to drive the moving plate 44 to move back and forth.

[0038] One specific application of this embodiment is:

[0039] In use, the bottom of the positioning platform 21 is inserted into the two positioning blocks 22, and then the positioning platform 21 is fixed to the base plate 1 with bolts. The auxiliary platform 31 is inserted into the docking groove 26 on the positioning platform 21 through the docking strip 312, and then the auxiliary platform 31 is fixed with bolts. This allows for quick installation and facilitates the replacement of the positioning platform 21 and the auxiliary platform 31 later. When welding is required, the circuit board is placed on the positioning platform 21, and the positioning blocks 1 24 and 25 position the circuit board. Then, the pressure plate 321 is pulled upward, and the pressure plate 321 slides on the limit rod 1 322, stretching the spring 323. Then, the movable rod 331 is rotated, causing the limiting protrusion 333 to move to the limit position. By placing the pressure plate 321 at its bottom, the pressure plate 321 can be released. At this time, the pressure plate 321 is limited by the restrictive protrusion 333. Then, the leads to be soldered are placed on several slots 311 in sequence, and the connectors of the leads are aligned with the soldering points of the circuit board. After the leads are placed, the movable rod 331 is pushed to disengage the restrictive protrusion 333 from the pressure plate 321. The movable rod 331 will then be supported and limited by the limiting rod 332. At this time, the movable rod 331 is in a horizontal state, and the operator supports the pressure plate 321. Then, the pressure plate 321 is slowly lowered to reset. The pressure plate 321 will clamp and fix the leads under the elastic action of the spring 323. This method can prevent the leads from shifting.

[0040] After the lead wire is fixed, the Y-axis servo drive device 43 drives the moving plate 44 to move back and forth. The electric push rod 42 drives the Y-axis servo drive device 43 to rise and fall. The welding point is positioned by the vision positioning module 442. The feeding mechanism 443 feeds the wire. Then, the welding head 441 cooperates with the welding wire to weld the lead wire onto the circuit board. The feeding mechanism 443 automatically feeds the solder wire or solder paste. The vision positioning module 442 uses a high-speed camera (resolution up to micrometer level) to capture the position of the PCB solder point and lead wire. The welding head 441 uses heating to melt and weld the welding wire.

[0041] After the soldering is completed, the movable plate 44 is reset, then the pressure plate 321 is pulled upward away from the lead wire, and the movable rod 331 is pushed so that the limiting protrusion 333 restricts the pressure plate 321. Finally, the circuit board is removed from the positioning table 21 through the groove 23, and the soldering process is completed.

[0042] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0043] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the present utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the present utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. An automatic soldering device for circuit board leads, comprising a base plate (1), characterized in that, Also includes: Placement part (2), which is mounted on the top of the base plate (1), is used to place the circuit board; A lead wire placement section (3) is installed on the left side of the positioning platform (21), and the lead wire placement section (3) is used to place multiple leads; and The welding part (4) is installed above the placement part (2) and is used to weld the lead wire; The placement part (2) can position and place the circuit board, and the lead wire placement part (3) can position and place multiple leads to improve the welding quality.

2. The automatic soldering device for circuit board leads according to claim 1, characterized in that, The placement part (2) includes a positioning platform (21) positioned on the base plate (1). Positioning blocks (22) are inserted into both the front and back of the positioning platform (21). A groove (23) is provided on the right side of the top of the positioning platform (21). Two positioning blocks (24) and two positioning blocks (25) are fixedly connected to the top of the positioning platform (21). Two docking grooves (26) are provided on the left side of the positioning platform (21). The bottom of the positioning block (22) is fixedly connected to the top of the base plate (1). The positioning block (22) is used to position the positioning platform (21) during installation. The positioning platform (21) is fixed to the base plate (1) by bolts.

3. The automatic soldering device for circuit board leads according to claim 2, characterized in that, Two positioning blocks (24) are distributed on the front and back of the positioning platform (21), and two positioning blocks (25) are distributed on the top right side of the positioning platform (21). The positioning blocks (24) and positioning blocks (25) work together to position the circuit board.

4. The automatic soldering device for circuit board leads according to claim 3, characterized in that, The lead wire placement part (3) includes an auxiliary platform (31) located on the left side of the positioning platform (21). The top of the auxiliary platform (31) has several slots (311), and two docking strips (312) are fixedly connected to the right side of the auxiliary platform (31). Pressing assembly (32), which is mounted above the auxiliary platform (31), is used to press the lead wire; and A limiting component (33) is mounted on the front of the auxiliary platform (31) and is used to restrict and support the pressing component (32); The slot (311) is used to place the lead wire. The right side of the auxiliary platform (31) is inserted into the docking slot (26) on the positioning platform (21) through the docking strip (312). The auxiliary platform (31) is fixed to the base plate (1) by bolts.

5. The automatic soldering device for circuit board leads according to claim 4, characterized in that, The pressing assembly (32) includes a pressure plate (321) disposed above the auxiliary platform (31). Two limiting rods (322) are slidably connected inside the pressure plate (321). A support block (324) is fixedly connected to the bottom of the limiting rod (322). The support block (324) is fixedly connected to the surface of the auxiliary platform (31). A spring (323) is sleeved on the outside of the limiting rod (322). The top of the spring (323) is fixedly connected to the bottom of the pressure plate (321), the bottom of the spring (323) is fixedly connected to the top of the support block (324), and the limiting rod (322) is used to limit the pressure plate (321).

6. The automatic soldering device for circuit board leads according to claim 5, characterized in that, The limiting component (33) includes a movable rod (331) disposed on the front of the auxiliary platform (31). The bottom of the movable rod (331) is rotatably connected to the auxiliary platform (31) via a pivot. A limiting rod (332) is fixedly connected to the front of the auxiliary platform (31). A limiting protrusion (333) is fixedly connected to the right side of the movable rod (331). The limiting protrusion (333) on the pressure plate (321) is used to limit and fix the pressure plate (321). When the movable rod (331) is in a horizontal state, the limiting rod (332) supports the movable rod (331).

7. The automatic soldering device for circuit board leads according to claim 4, characterized in that, The welding part (4) includes a bracket (41) fixedly connected to the top of the base plate (1), an electric push rod (42) fixedly connected to the top of the bracket (41), a Y-axis servo drive device (43) is provided on the inner side of the bracket (41), a moving plate (44) is installed at the bottom of the Y-axis servo drive device (43), a welding head (441) is installed at the bottom of the moving plate (44), a vision positioning module (442) is installed on the front of the moving plate (44), and a feeding mechanism (443) is installed on the back of the moving plate (44). The output end of the electric push rod (42) is connected to the Y-axis servo drive device (43) via a flange. The Y-axis servo drive device (43) is used to drive the moving plate (44) to move back and forth.

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