Wafer fixing assembly and polishing device
By combining negative pressure adsorption components and multiple platforms, efficient fixation and polishing of wafers of different sizes are achieved, solving the problem of time-consuming and labor-intensive polishing of the beginning and end of wafers in the existing technology and improving polishing efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 北京旭灿半导体科技有限公司
- Filing Date
- 2025-05-12
- Publication Date
- 2026-05-26
Smart Images
Figure CN224274619U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of wafer fixing components, and more particularly to a wafer fixing component and a polishing apparatus. Background Technology
[0002] The development of new materials such as semiconductors has been very rapid in the past two years. For example, silicon wafers, sapphire substrates, and ceramic wafers. The common production process of most new materials mainly consists of the following steps: crystal growth, squaring, ingot cutting (or rounding), slitting, chamfering, slicing, and cleaning. Slicing is the process of cutting the ingot into individual slices by passing it through a high-speed diamond wire mesh. Usually, the ingot is first ground into the required shape before slicing. For example, if the shape of the ingot can be round or square, the slices will form corresponding round or square slices. After each ingot is cut, there will be two head and tail slices. Because one side of the head and tail slices has not been cut by the diamond wire mesh, the thickness of the head and tail slices is inconsistent, that is, their TTV is very poor, and the thickness of each head and tail slice is also inconsistent.
[0003] Some rod materials are very expensive, such as gallium oxide. Although the number of head and tail wafers is small, their unit price is very high, and the total number of head and tail wafers is considerable in the long run. Therefore, it is a waste not to utilize these head and tail wafers. In some existing technologies, head and tail wafers are ground one by one, which is a manual operation that consumes a lot of time and results in very low utilization of equipment and personnel. Utility Model Content
[0004] One of the technical problems that this application aims to solve is that existing head and tail wafer polishing is time-consuming, labor-intensive, and inefficient.
[0005] To address the aforementioned technical problems, in a first aspect, embodiments of this application provide a wafer fixing assembly, comprising: a negative pressure adsorption assembly, the negative pressure adsorption assembly including a negative pressure plate, the negative pressure plate being provided with a stage placement groove, a negative pressure adsorption channel and a negative pressure connecting groove, the negative pressure adsorption channel being connected to the stage placement groove, and the negative pressure connecting groove being located on the bottom surface of the stage placement groove; and a stage assembly, the stage assembly including multiple stages, each stage having an adsorption connecting channel penetrating its upper and lower surfaces, each stage having the same shape and being adapted to the stage placement groove, the projected area of the adsorption connecting channel of each stage on the surface of the stage being different, and the adsorption connecting channel being connected to the negative pressure connecting groove.
[0006] In some embodiments, the platform includes a first platform, which includes a first plate and a boss, the boss being disposed on the first plate and an adsorption through channel being disposed on the boss.
[0007] In some embodiments, the adsorption through channel includes a plurality of concentric first rings of different diameters, the plurality of first rings being arranged concentrically, and a first connecting rib being provided in the adsorption through channel, the two ends of the first connecting rib being connected to an adjacent first cylinder.
[0008] In some embodiments, the stage further includes a second stage, which includes a second plate. The adsorption channel includes a plurality of second rings with different diameters, which are concentrically arranged. A second connecting rib is provided in the adsorption channel, and the two ends of the second connecting rib are connected to the adjacent second cylinder.
[0009] In some embodiments, the maximum diameter of the second ring is smaller than the maximum diameter of the first ring.
[0010] In some embodiments, the second platform is further provided with a positioning groove, which is disposed between the edge of the adsorption through channel and the edge of the second plate. The second platform also includes a positioning ruler, which is adapted to the positioning groove.
[0011] In some embodiments, the stage further includes a third stage, which includes a third plate, and the adsorption through channel includes a plurality of triangular collars disposed on the third plate.
[0012] In some embodiments, the negative pressure communication channel includes a plurality of concentric channels, which are connected to each other through a communication hole.
[0013] In some embodiments, there are multiple stage placement slots, which are spaced apart on the negative pressure plate.
[0014] According to another aspect of this application, a polishing apparatus is also provided, which includes a surface grinder and a wafer fixing assembly, wherein the wafer fixing assembly is the wafer fixing assembly described above.
[0015] Through the above technical solution, the wafer fixing assembly provided in this application, when in use, places the wafer on a corresponding carrier according to its size. The carrier is placed in a carrier placement slot, and the wafer is adsorbed and fixed on the carrier by negative pressure before proceeding to the next step, such as polishing. Since there are various types of carriers, and the projected area of the adsorption channel on the surface of the carrier is different for different carriers, this can be applied to wafers of various sizes. The technical solution of this application effectively solves the problems of time-consuming, labor-intensive, and inefficient wafer polishing at both ends in the prior art.
[0016] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 A top view schematic diagram of the negative pressure adsorption component of the wafer fixing assembly disclosed in an embodiment of this application is shown;
[0019] Figure 2 It shows Figure 1 A three-dimensional structural diagram of the negative pressure adsorption component;
[0020] Figure 3 It shows Figure 1 A three-dimensional structural diagram of the negative pressure adsorption component from another angle;
[0021] Figure 4 It shows Figure 1 A three-dimensional structural diagram of the first type of stage for the stage assembly of the wafer fixing component;
[0022] Figure 5 It shows Figure 4 A top view of the first type of platform;
[0023] Figure 6 It shows Figure 1 A three-dimensional structural diagram of the second type of platform;
[0024] Figure 7 It shows Figure 6 A front view schematic diagram of the positioning ruler for the second type of platform;
[0025] Figure 8 It shows Figure 1 A three-dimensional structural diagram of the third type of platform.
[0026] The above figures include the following reference numerals:
[0027] 10. Negative pressure adsorption component; 11. Negative pressure plate; 12. Platform placement groove; 13. Negative pressure adsorption channel; 14. Negative pressure connecting groove; 20. Platform assembly; 21. Adsorption through channel; 22. First type of platform; 221. First plate; 222. Boss; 23. Second type of platform; 231. Positioning groove; 232. Positioning ruler; 24. Third type of platform. Detailed Implementation
[0028] The embodiments of this application will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of this application by way of example, but should not be used to limit the scope of this application. This application can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
[0029] These embodiments are provided to make the application thorough and complete, and to fully express the scope of the application to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values illustrated in these embodiments should be interpreted as merely exemplary and not as limiting.
[0030] It should be noted that, in the description of this application, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0031] Furthermore, the terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after it, and do not exclude the possibility of encompassing other elements as well.
[0032] It should also be noted that, in the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application depending on the specific circumstances. When a specific device is described as being located between a first device and a second device, an intermediary device may or may not be present between the specific device and the first or second device.
[0033] All terms used in this application have the same meaning as understood by one of ordinary skill in the art to which this application pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.
[0034] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.
[0035] Firstly, such as Figures 1 to 8 As shown, some embodiments of this application provide a wafer fixing assembly, including a negative pressure adsorption assembly 10 and a stage assembly 20. The negative pressure adsorption assembly 10 includes a negative pressure plate 11, on which a stage placement groove 12, a negative pressure adsorption channel 13, and a negative pressure connecting groove 14 are provided. The negative pressure adsorption channel 13 is connected to the stage placement groove 12, and the negative pressure connecting groove 14 is located on the bottom surface of the stage placement groove 12. The stage assembly 20 includes multiple stages, each stage having an adsorption connecting channel 21 penetrating its upper and lower surfaces. Each stage has the same shape and is adapted to the stage placement groove 12. The projected area of the adsorption connecting channel 21 on the surface of each stage is different, and the adsorption connecting channel 21 is connected to the negative pressure connecting groove 14.
[0036] Through the above technical solution, the wafer fixing assembly provided in this embodiment, when in use, places the wafer on a corresponding carrier according to its size. The carrier is placed in the carrier placement groove 12, and the wafer is adsorbed and fixed on the carrier by negative pressure before proceeding to the next step, such as polishing. Since there are various types of carriers, and the projected area of the adsorption channel 21 on the surface of the carrier is different for different carriers, it can be applied to wafers of various sizes. The technical solution of this embodiment effectively solves the problems of time-consuming, labor-intensive, and inefficient wafer polishing at both ends in the prior art.
[0037] It should be noted that the negative pressure device is connected to the negative pressure adsorption channel 13 by a thread (interference fit, such as a rubber plug). The negative pressure adsorption channel 13 is connected to the negative pressure connecting groove. When the negative pressure connecting groove 14 is multi-segmented, the segments of the negative pressure connecting groove 14 are connected to each other by grooves or through holes.
[0038] like Figures 1 to 5As shown, in some embodiments, the stage includes a first stage 22, which includes a first plate 221 and a boss 222. The boss 222 is disposed on the first plate 221, and the adsorption through channel 21 is disposed on the boss 222. The wafer is adsorbed on the boss 222. The first stage 22 is used to adsorb relatively large wafers, and the boss 222 makes it less likely for the wafer to interfere with external structures. In addition, the wafer on the first stage 22 needs to be aligned and straightened, and the boss 222 also facilitates alignment using an L-shaped ruler.
[0039] like Figures 1 to 5 As shown, in some embodiments, the adsorption channel 21 includes multiple concentric first rings of different diameters, which are arranged concentrically. A first connecting rib is provided within the adsorption channel 21, and the two ends of the first connecting rib are connected to adjacent first cylinders. The concentric arrangement of the multiple first rings ensures that the wafer is subjected to a more balanced negative pressure adsorption force, resulting in a stronger adsorption force.
[0040] like Figure 6 and Figure 7 As shown, in some embodiments, the stage further includes a second stage 23, which includes a second plate. The adsorption through channel 21 includes multiple second rings of different diameters, which are concentrically arranged. A second connecting rib is provided within the adsorption through channel 21, and both ends of the second connecting rib are connected to adjacent second cylinders. The second stage 23 improves the versatility of the wafer fixing assembly of this application, and is used to adsorb wafers of another size. It should be noted that in this embodiment, the radial width of each second ring is the same.
[0041] like Figures 4 to 6 As shown, in some embodiments, the maximum diameter of the second ring is smaller than the maximum diameter of the first ring. That is, the first stage 22 is used to adsorb larger wafers, and the second stage 23 is used to adsorb smaller wafers.
[0042] like Figure 6 and Figure 7As shown, in some embodiments, the second type of stage 23 is further provided with a positioning groove 231, which is located between the edge of the adsorption channel 21 and the second plate. The second type of stage 23 also includes a positioning ruler 232, which is adapted to the positioning groove 231. The second type of stage 23 makes full use of space to set up the positioning groove 231 and the positioning ruler 232, so there is no need to set up a separate positioning ruler. Moreover, the second type of stage 23 can achieve straightness without the need to rely on an external plane through its own positioning groove 231. It should be noted that the positioning groove 231 is L-shaped, and the positioning ruler is also L-shaped. In use, the positioning ruler is placed in the positioning groove 231, with the positioning ruler higher than the groove depth of the positioning groove 231. The protruding positioning ruler cooperates with the wafer for straightness. In this embodiment, each of the three types of stages corresponds to a fixed type of wafer.
[0043] like Figure 8 As shown, in some embodiments, the stage further includes a third stage 24, which includes a third plate. The adsorption channel 21 includes multiple triangular collars disposed on the third plate. The third stage 24 uses a triangular adsorption channel 21, which further improves the versatility of the wafer fixing assembly of this application. In addition, the triangular adsorption channel 21 has a certain preliminary positioning, that is, the wafer is placed with reference to the hypotenuse of the triangle. It should be noted that neither the second stage 23 nor the third stage 24 has a boss 222, and the triangular sleeves are connected by a second connecting rib.
[0044] like Figures 1 to 3 As shown, in some embodiments, the negative pressure communication groove 14 includes multiple concentric grooves, which are connected by communication holes. This structure can distribute the negative pressure evenly. The multiple concentric grooves can be multiple rectangles, each rectangle consisting of two disconnected L-shaped grooves connected by communication holes at the disconnected positions; alternatively, they can be connected by small grooves.
[0045] like Figures 1 to 3 As shown, in some embodiments, there are multiple stage placement slots 12, which are spaced apart on the negative pressure plate 11. This allows multiple wafers to be fixed simultaneously. For example, in the first type, there are two stages 22, so the head wafer and the tail wafer can be simultaneously adsorbed and fixed for polishing, improving polishing efficiency. It should be noted that all stage placement slots 12 are located on the same side of the negative pressure plate 11, referred to as the upper side. The shape and structure of each stage placement slot 12 are the same, and one stage placement slot 12 corresponds to one negative pressure adsorption channel 13. In this way, the stages do not affect each other. In the figure, there are three stage placement slots 12, which are connected by three branch pipes, and valves are installed on each branch pipe for control.
[0046] To illustrate with a specific example: Use vernier calipers to pick out the first and last wafers that are more than 20µm thicker than the finished wafer. Clean the first and last wafers with ultrasonic waves and spin dry.
[0047] Select a 3-5mm thick iron plate and draw lines on both sides with an oil-based pen. Grind the iron plate with a flat grinder on both sides, removing 5µm of material, until all lines are removed and the entire surface of the iron plate is smooth. Take a 4-7mm thick acrylic sheet and grind it smooth using the same method. Send the acrylic base plate for CNC machining; the surface will have multi-station grooves, and the side openings will be used to connect the vacuum adsorption pipes. After machining, connect the acrylic base plate to the ground iron plate using screws. Place the assembled base plate on the worktable of a flat grinder lathe and activate the magnetic suction.
[0048] Select the appropriate vacuum adsorption stage according to the product to be processed. The vacuum adsorption stage is also made of acrylic sheet by CNC machining. Before processing, both sides need to be sanded with a flat grinder.
[0049] Place the vacuum adsorption stage of the appropriate specifications into the assembled acrylic work station slot on the base plate (stage placement slot 12). To ensure that the head and tail pieces can be bonded into a line, add an L-shaped fixture to one end of the assembled base plate as a fixing position. Square or triangular head and tail pieces can be directly fixed by placing one side against the L-shaped fixture. If the head and tail pieces are round, the L-shaped fixture with a round notch can be replaced. If the size of the workpiece is very small, a third type of stage 24 can be used. This vacuum adsorption stage has a small processing area, and the L-shaped fixture can be directly used to fix it on the vacuum adsorption stage. If the size of the workpiece is a strip, the corresponding strip work station can be directly processed on the vacuum adsorption stage.
[0050] The workpiece needs to be pressed firmly against the L-shaped fixture on one side to ensure that all workpieces can be ground. After flattening the edge, turn on the vacuum suction switch and remove the L-shaped fixture from the base plate. Use an oil-based pen to draw lines on the head and tail workpieces, ensuring that the surface areas of the head and tail workpieces have lines.
[0051] Use a 500-600 grit grinding wheel, set the grinding wheel speed to 600-800 rpm, start the machine, and manually crank the vertical handwheel to slowly lower the grinding wheel. When you hear the grinding wheel contacting the head and tail plates, stop manually cranking and switch to automatic operation. After 20 minutes, check if the lines drawn on the surface of the head and tail plates are still there. If not, turn off the vacuum adsorption switch and manually remove the head and tail plates. If they are not removed, polish for another 5 minutes.
[0052] The technical solution of this application also provides a grinding device, which includes a surface grinder and a wafer fixing assembly, wherein the wafer fixing assembly is the wafer fixing assembly described above. In use, the wafer fixing assembly is fixed to the surface grinder by means of clamps or magnetic attraction.
[0053] The embodiments of this application have now been described in detail. To avoid obscuring the concept of this application, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.
[0054] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any manner.
Claims
1. A wafer fixing assembly, characterized in that, include: The negative pressure adsorption component (10) includes a negative pressure plate (11), on which a platform placement groove (12), a negative pressure adsorption channel (13) and a negative pressure communication groove (14) are provided. The negative pressure adsorption channel (13) is connected to the platform placement groove (12), and the negative pressure communication groove (14) is located on the bottom surface of the platform placement groove (12). The platform assembly (20) includes multiple platforms, each platform having an adsorption channel (21) penetrating the upper and lower surfaces. Each platform has the same shape and is adapted to the platform placement groove (12). The projected area of the adsorption channel (21) on the surface of the platform is different for each platform. The adsorption channel (21) is connected to the negative pressure communication groove (14).
2. The wafer holding assembly of claim 1, wherein The platform includes a first type of platform (22), which includes a first plate (221) and a boss (222). The boss (222) is disposed on the first plate (221), and the adsorption through channel (21) is disposed on the boss (222).
3. The wafer holding assembly of claim 2, wherein, The adsorption through channel (21) includes multiple concentric first rings of different diameters. The multiple first rings are arranged concentrically. A first connecting rib is provided in the adsorption through channel (21). The two ends of the first connecting rib are connected to the adjacent first cylinder.
4. The wafer holding assembly of claim 3, wherein The platform also includes a second platform (23), which includes a second plate. The adsorption channel (21) includes multiple second rings with different diameters, which are arranged concentrically. The adsorption channel (21) is provided with a second connecting rib, and the two ends of the second connecting rib are connected to the adjacent second cylinder.
5. The wafer holding assembly of claim 4, wherein, The maximum diameter of the second ring is smaller than the maximum diameter of the first ring.
6. The wafer holding assembly of claim 4, wherein, The second type of platform (23) is also provided with a positioning groove (231), which is located between the adsorption through channel (21) and the edge of the second plate. The second type of platform (23) also includes a positioning ruler (232), which is adapted to the positioning groove (231).
7. The wafer holding assembly of claim 2, wherein The platform also includes a third platform (24), which includes a third plate. The adsorption through channel (21) includes multiple triangular collars, which are disposed on the third plate.
8. The wafer fixation assembly of any of claims 1 to 7, wherein, The negative pressure communication groove (14) includes multiple concentric grooves, and each concentric groove is connected to the other through a communication hole.
9. The wafer holding assembly of claim 8, wherein, There are multiple platform placement slots (12), and the multiple platform placement slots (12) are arranged alternately on the negative pressure plate (11).
10. A sharpening device characterized by The grinding device includes a surface grinder and a wafer fixing assembly, wherein the wafer fixing assembly is the wafer fixing assembly according to any one of claims 1 to 9.