A wafer chemical plating equipment

Abstract

This utility model discloses a wafer electroless plating apparatus, comprising: a main body of the apparatus, which has an internal electroless plating chamber for containing electroless plating solution; a lifting frame, which is liftable and mounted on the main body; multiple fixing fixtures for fixing wafers, which are detachably connected to the lifting frame and are lifted by the lifting frame to enter the electroless plating chamber for electroless plating; the fixing fixtures are provided with multiple liquid inlets; and a filter assembly for removing impurities from the electroless plating chamber. The advantages of this utility model are that, through the design of the lifting frame and fixing fixtures, multiple wafers can be electroless plated simultaneously, improving electroless plating efficiency; at the same time, the multiple liquid inlets reduce turbulence, ensuring electroless plating quality, and simplifying operation.

Description

Technical Field

[0001] This utility model relates to the field of chemical plating technology, specifically to a wafer chemical plating device. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits. Its raw material is silicon. Before being processed into a finished product, a coating is applied to its surface. Wafer coating is a chemical reaction process that improves the performance and functionality of the wafer by depositing a thin film on its surface. This film can be made of materials such as metals, oxides, nitrides, and silicon. The principle of wafer coating is to form a thin film on the wafer surface using a chemical reaction. This reaction can be achieved through methods such as physical vapor deposition, chemical vapor deposition, sputtering, electroplating, and electroless plating.

[0003] Existing coating devices, such as the invention patent with application number 202211657822.8, disclose a device and method for single-sided chemical plating of wafers, which can achieve wafer chemical plating, but the processing efficiency is low. There is an urgent need for a device with high coating efficiency and convenient operation. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a wafer electroless plating equipment that improves electroless plating efficiency, reduces turbulence, ensures electroless plating quality, and is easy to operate.

[0005] Specifically, this utility model discloses a wafer electroless plating apparatus, comprising:

[0006] The main body of the equipment has an internal electroless plating chamber for containing the electroless plating solution;

[0007] The lifting frame is installed and can be raised and lowered along with the main body of the equipment.

[0008] A fixing fixture, used to fix the wafer, is provided in multiple locations and is detachably connected to the lifting frame. The wafer is lifted and moved into the chemical plating chamber by the lifting frame for chemical plating. The fixing fixture is provided with multiple liquid inlets.

[0009] Filter assembly used to remove impurities from the chemical plating chamber.

[0010] The advantages of adopting the above technical solution are that, by setting up the lifting frame and fixed fixture, multiple wafers can be electroplated at one time, improving the electroplating efficiency. At the same time, setting up multiple liquid inlets reduces turbulence, ensures the quality of electroplating, and is easy to operate.

[0011] Furthermore, lifting drive components are provided on both sides of the lifting frame. The lifting frame includes a main rod and a crossbar provided on the main rod. The crossbar is provided with a fixing groove for positioning the fixing fixture, and a clamping component is provided on the upper side of the fixing groove.

[0012] The advantage of adopting the above technical solution is that the lifting drive component is used to drive the lifting frame to rise and fall. When the lifting frame falls, it drops the fixed fixture into the chemical plating chamber, thereby fixing multiple fixed fixtures and improving the overall chemical plating efficiency.

[0013] Furthermore, the fixing groove is provided with a vertical rod, the clamping member is sleeved on the vertical rod, and a spring is provided on the vertical rod for pressing down the clamping member.

[0014] The advantage of adopting the above technical solution is that the clamping part is used to fix the fixed hanger, ensuring that the fixed hanger will not shake after installation. At the same time, the fixed hanger can be removed without removing any screws, which is simple and convenient.

[0015] Furthermore, the fixing fixture includes: an upper plate, a bottom plate, positioning posts, and a sleeve. There are multiple positioning posts, which are used to connect the bottom plate and the upper plate and form a receiving cavity between the bottom plate and the upper plate for accommodating the wafer. The positioning posts are provided with multiple positioning grooves along the vertical direction for fixing the wafer. The sleeve is sleeved on the outside of the bottom plate and the positioning posts.

[0016] The advantage of adopting the above technical solution is that the positioning posts are used to limit the wafers, so that multiple wafers can be stacked and fixed along the vertical direction, increasing the amount of chemical plating and improving the efficiency of chemical plating.

[0017] Furthermore, the liquid inlet is located on the side of the sleeve, the height of the liquid inlet is less than 2 cm, the length is greater than 3 cm, and the opening area of ​​the liquid inlet is less than 5 square centimeters.

[0018] The advantages of adopting the above technical solution are that the setting of the liquid inlet ensures that the chemical plating solution enters the sleeve for chemical plating, while limiting the height and opening area of ​​the liquid inlet, balancing the concentration of the chemical plating solution inside and outside the sleeve, reducing turbulence in the vertical direction, and ensuring uniform chemical plating.

[0019] Furthermore, the sleeve is provided with an open top and a protruding block at its top edge. The upper plate is provided with a rotating channel for cooperating with the protruding block, and the bottom of the rotating channel is provided with a through groove for the protruding block to pass through.

[0020] The advantage of adopting the above technical solution is that during installation, the sleeve only needs to be moved from bottom to top, the top protrusion enters the rotating channel, and the installation is completed by rotating it at a certain angle. Since the protrusion hangs in the rotating channel, there is no need to remove screws, etc., which effectively improves the installation efficiency.

[0021] Furthermore, the filter assembly includes: a filter support and a filter screen, the filter screen being installed inside the filter support, and a step being provided inside the main body of the device for supporting the filter support, the filter support sliding along the step.

[0022] The advantage of adopting the above technical solution is that the filter screen is used to filter impurities in the chemical plating chamber, and it can be easily operated by simply pushing the support along the steps.

[0023] Furthermore, a movable column is provided between the upper plate and the bottom plate. The upper plate is provided with a through hole for the movable column to pass through, and the bottom plate is provided with a bottom plate groove for positioning the movable column.

[0024] The advantage of adopting the above technical solution is that the movable column is removed before the fixed bracket is inserted into the wafer, and after the wafer is inserted into the fixed bracket, the movable column is installed to limit the wafer and prevent it from falling out.

[0025] Furthermore, a cover plate is provided on the upper side of the lifting frame, and the cover plate covers the chemical plating chamber as the lifting frame rises and falls, and the cover plate is provided with a sealing element.

[0026] The advantage of adopting the above technical solution is that the cover plate is used to cover the electroless plating chamber during the electroless plating process, forming a sealed space to prevent the leakage of harmful gases generated during the electroless plating process.

[0027] Furthermore, an exhaust port is provided on the side of the main body of the device, and the exhaust port is connected to an exhaust gas pipe.

[0028] The advantage of adopting the above technical solution is that the exhaust port is designed to extract waste gas and prevent waste gas from leaking into the environment. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0030] Figure 1 This is a schematic diagram of the overall structure of the wafer chemical plating equipment of this utility model.

[0031] Figure 2 This is a schematic diagram of the structure of the cover plate removal device of this utility model.

[0032] Figure 3 This is an enlarged view of section A of this utility model.

[0033] Figure 4 This is a schematic diagram of the structure of the fixing bracket of this utility model.

[0034] Figure 5This is a structural diagram of the fixing fixture and wafer mounting of this utility model.

[0035] Figure 6 This is a structural diagram of the fixing bracket and sleeve of this utility model.

[0036] The reference numerals used in the attached figures are as follows:

[0037] Equipment body 1; chemical plating chamber 11; exhaust port 12; lifting frame 2; main rod 21; horizontal bar 22; fixing groove 23; vertical rod 24; clamping component 25; fixing hanger 3; upper plate 31; bottom plate 32; bottom plate groove 321; positioning column 33; positioning groove 34; liquid inlet 35; movable column 36; fixing hook 37; lowering drive component 4; sleeve 5; protrusion 51; rotating channel 52; through groove 53; filter bracket 6; filter screen 61; cover plate 7. Detailed Implementation

[0038] The present invention will now be described in further detail with reference to the accompanying drawings.

[0039] like Figure 1-3 As shown, this utility model discloses a wafer electroless plating apparatus, comprising:

[0040] The main body of the equipment 1 has a chemical plating chamber 11 inside for containing the chemical plating solution;

[0041] Lifting frame 2 is installed and can be raised and lowered along with the main body of the equipment;

[0042] The fixing fixture 3 is used to fix the wafer. There are multiple fixtures. It is detachably connected to the lifting frame 2. The wafer is lifted and moved into the chemical plating chamber 11 by the lifting frame 2 for chemical plating. The fixing fixture 3 is provided with multiple liquid inlets 35.

[0043] A filter assembly is used to remove impurities from the chemical plating chamber 11.

[0044] The advantages of adopting the above technical solution are that, by setting up the lifting frame 2 and the fixed hanger 3, multiple wafers can be electroplated at one time, improving the electroplating efficiency. At the same time, multiple liquid inlets 35 are set up to reduce turbulence, ensure the quality of electroplating, and make the operation simple.

[0045] The lifting frame 2 is equipped with lifting drive components 4 on both sides. The lifting drive components 4 can be vertical moving modules or hydraulic cylinders, etc., and are installed on both sides of the main body 1 to drive the lifting frame 2 to rise and fall. The lifting frame 2 includes a main rod 21 and a crossbar 22 set on the main rod 21. The two ends of the main rod 21 are fixedly connected to the lifting drive components 4. As the lifting drive components 4 move up and down, the crossbar 22 is provided with a fixing groove 23 for positioning and fixing the hanger 3. A clamping component 25 is provided on the upper side of the fixing groove 23. The crossbar 22 is fixed to the main rod 21 by screws. There are multiple crossbars, and the spacing can be set according to the usage needs. The fixing groove 23 is set at both ends of the crossbar 22. The fixing hanger 3 is provided with a fixing hook 37. During installation, the fixing hook 37 is located in the fixing groove 23.

[0046] Furthermore, such as Figure 3 As shown, the fixing groove 23 is provided with a vertical rod 24 and a clamping member 25 is sleeved on the vertical rod 24. The vertical rod 24 is fixedly installed on the horizontal rod 22 and located on both sides of the fixing groove 23. The clamping member 25 can move up and down along the vertical rod. A spring is provided on the vertical rod 24 to press down the clamping member 25. The spring is located on the upper side of the clamping member 25. When it is necessary to install the fixing bracket 3, push the clamping member 25 upward. After the fixing bracket 3 is installed, the clamping member 25 presses the fixing bracket 3 tightly under the action of the spring, ensuring that the fixing bracket 3 will not move during the chemical plating process. At the same time, the fixing bracket 3 is easy to remove, effectively reducing installation time and improving the efficiency of chemical plating.

[0047] The mounting bracket 3 includes: an upper plate 31, a bottom plate 32, positioning posts 33, and a sleeve 5. Multiple positioning posts 33 are used to connect the bottom plate 32 and the upper plate 31, forming a receiving cavity between the bottom plate 32 and the upper plate 31 for accommodating the wafer. Figure 4-5 As shown, the positioning post 33 has multiple positioning slots 34 arranged vertically to fix the wafers. The positioning slots 34 all face the inside of the receiving cavity, and each positioning slot 34 positions one wafer. The sleeve 5 is sleeved on the outside of the base plate 32 and the positioning post 33. The fixing hook 37 is fixedly installed on the top of the upper plate 31. The upper plate 31 and the base plate are both cylindrical. The positioning post 33 is arranged along the circumference and fixedly installed at both ends with the upper plate 31 and the base plate. There can be three of them. At the same time, the side of the receiving cavity has a passage for the wafer to enter. The passage has a movable post 36. The upper plate 31 is provided with a through hole for the movable post 36 to pass through. The base plate 32 is provided with a base plate groove 321 for positioning the movable post 36. After all the wafers are loaded into the receiving cavity, the movable post 36 is inserted from the top into the through hole located in the upper plate 31 and the bottom enters the base plate groove 321 for positioning, thus completing the wafer fixing. The wafers are neatly arranged vertically in the receiving cavity, which improves the efficiency of chemical plating and ensures the effect of chemical plating.

[0048] Furthermore, such as Figure 6As shown, the sleeve 5 has an open top, and a protruding block 51 is provided on its top edge. The protruding blocks 51 are symmetrically arranged inside the sleeve 5. The upper plate 31 is provided with a rotating channel 52 for engaging the protruding blocks 51. The bottom of the rotating channel 52 is provided with a through groove 53 for the protruding blocks 51 to pass through. During installation, simply move the sleeve 5 from bottom to top, and the top protruding block 51 enters into the rotating channel 52. Rotating it at a certain angle completes the installation. The protruding block 51 hangs the entire sleeve 5 in the rotating channel, eliminating the need to remove screws, effectively improving installation efficiency.

[0049] The liquid inlet 35 is located on the side of the sleeve 5. The height of the liquid inlet 35 is less than 2 cm, the length is greater than 3 cm, and the opening area is less than 5 square centimeters. There are multiple liquid inlets 35, which are arranged on the side of the sleeve 5. The chemical plating solution enters the sleeve 5 through the liquid inlet 35.

[0050] In some implementations, the filter assembly includes: a filter support 6, a filter screen 61, the filter screen 61 being installed inside the filter support 6, a step being provided inside the main body 1 for receiving the filter support 6, the filter support 6 sliding along the step, the filter support 6 being equipped with a handle, and the bottom of the filter support having a horizontal extension for receiving debris, and when not in use being located on one side of the electroless plating chamber 11, when filtration is required, the filter support 6 is moved along the step to the other side, and then the filter support 6 is removed, cleaned and dried, and then placed back into the electroless plating chamber 11 for the next use.

[0051] In some implementations, a cover plate 7 is provided on the upper side of the lifting frame 2. The cover plate 7 is fixed to the lifting frame 2. The cover plate 7 covers the chemical plating chamber 11 as the lifting frame 2 rises and falls. The cover plate 7 is provided with a sealing element, which is a sealing ring.

[0052] Furthermore, an exhaust port 12 is provided on the side of the main body 1, and the exhaust port 12 is connected to an exhaust gas pipe. The exhaust gas pipe is equipped with a fan for suction, and the exhaust gas pipe is also connected to an exhaust gas treatment device. The exhaust gas treatment device is used to treat the exhaust gas through adsorption conversion and other methods. The exhaust gas treatment device is existing technology and will not be described in detail here. A drain port is provided at the bottom of the main body 1 to facilitate the discharge of the chemical plating solution.

[0053] In the process, the wafer is first placed manually in the fixed fixture 3, the movable column 36 is fixed, and the sleeve 5 is installed and fixed. Then, the fixed fixture 3 is fixed on the crossbar 22. The number of fixed fixtures 3 processed at one time is 6 to 20. Then, the lifting frame 2 is lowered, and the entire fixed fixture 3 is placed in the chemical plating solution for chemical plating. After the chemical plating is completed, the lifting frame 2 is raised, the fixed fixture 3 is taken out, and the wafer to be chemically plated is placed in for further processing. Each fixed fixture holds 6 to 10 wafers, which greatly improves the efficiency of wafer chemical plating.

[0054] For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model.

Claims

1. A wafer electroless plating apparatus, characterized in that, include: The main body of the equipment (1) has a chemical plating chamber (11) inside for containing the chemical plating solution; The lifting frame (2) is installed and can be raised and lowered with the main body of the equipment (1); Fixed fixture (3) is used to fix wafers. There are multiple fixtures. It is detachably connected to the lifting frame (2). The lifting frame (2) drives the wafers to move into the chemical plating chamber (11) for chemical plating. The fixed fixture (3) is provided with multiple liquid inlets (35). A filter assembly is used to remove impurities from the chemical plating chamber (11).

2. The wafer electroless plating equipment according to claim 1, characterized in that, The lifting frame (2) is provided with lifting drive components (4) on both sides. The lifting frame (2) includes a main rod (21) and a crossbar (22) provided on the main rod (21). The crossbar (22) is provided with a fixing groove (23) for positioning the fixing fixture (3). A clamping component (25) is provided on the upper side of the fixing groove (23).

3. The wafer electroless plating equipment according to claim 2, characterized in that, The fixing groove (23) is provided with a vertical rod (24). The clamping member (25) is sleeved on the vertical rod (24). A spring is provided on the vertical rod (24) for pressing down the clamping member (25).

4. The wafer electroless plating equipment according to claim 1, characterized in that, The fixing fixture (3) includes: an upper plate (31), a bottom plate (32), positioning posts (33) and a sleeve (5). There are multiple positioning posts (33) for connecting the bottom plate (32) and the upper plate (31) and forming a receiving cavity between the bottom plate (32) and the upper plate (31) for accommodating the wafer. The positioning posts (33) are provided with multiple positioning grooves (34) along the vertical direction for fixing the wafer. The sleeve (5) is sleeved on the outside of the bottom plate (32) and the positioning posts (33).

5. The wafer electroless plating equipment according to claim 4, characterized in that, The liquid inlet (35) is located on the side of the sleeve (5). The height of the liquid inlet (35) is less than 2 cm, the length is greater than 3 cm, and the opening area of ​​the liquid inlet (35) is less than 5 square centimeters.

6. The wafer electroless plating equipment according to claim 4, characterized in that, The sleeve (5) is provided with an opening at the top and a protrusion (51) at its top edge. The upper plate (31) is provided with a rotating channel (52) for cooperating with the protrusion (51). The bottom of the rotating channel (52) is provided with a through groove (53) for the protrusion (51) to pass through.

7. The wafer electroless plating equipment according to claim 1, characterized in that, The filter assembly includes: a filter bracket (6) and a filter screen (61). The filter screen (61) is installed inside the filter bracket (6). The main body (1) of the device is provided with a step for supporting the filter bracket (6). The filter bracket (6) slides along the step.

8. The wafer electroless plating equipment according to claim 4, characterized in that, A movable column (36) is provided between the upper plate (31) and the bottom plate (32). The upper plate (31) is provided with a through hole for the movable column (36) to pass through, and the bottom plate (32) is provided with a bottom plate groove (321) for positioning the movable column (36).

9. The wafer electroless plating equipment according to claim 1, characterized in that, The lifting frame (2) is provided with a cover plate (7) on its upper side. The cover plate (7) covers the chemical plating chamber (11) as the lifting frame (2) moves up and down. The cover plate (7) is provided with a sealing element.

10. The wafer electroless plating equipment according to claim 1, characterized in that, The main body (1) of the equipment is provided with an air extraction port (12) on its side, and the air extraction port (12) is connected to an exhaust gas pipe.

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