An IGBT module performance testing device

Abstract

This utility model discloses an IGBT module performance testing device, including a housing and a support frame disposed within the housing. A partition fixed to the support frame is also provided inside the housing, dividing the inner cavity of the housing into a heat dissipation cavity and a testing cavity. An IGBT module is mounted on the partition, located within the testing cavity. A rectifier module is mounted below the IGBT module on the partition. Multiple capacitors are mounted on the support frame, and these capacitors are connected to the IGBT module via busbars. A control module is installed inside the housing, located below the capacitors. A first heat sink for dissipating heat from the IGBT module and a second heat sink for dissipating heat from the rectifier module are installed within the heat dissipation cavity. A heat dissipation duct connecting to the top of the heat dissipation cavity is provided on the housing. This device enables testing of the IGBT module with good heat dissipation performance, ensuring normal testing.

Description

Technical Field

[0001] This utility model relates to the field of IGBT module testing technology, and in particular to an IGBT module performance testing device. Background Technology

[0002] An IGBT module includes a busbar and multiple IGBT modules integrated on the busbar. It is generally used in frequency converters and is mainly responsible for the conversion and control of electrical energy. Its role is throughout the rectification, intermediate DC link and inversion process of the frequency converter.

[0003] IGBT modules need to be assembled directly into the frequency converter after performance testing to avoid the need for adjustments after assembly. However, IGBT modules generate a lot of heat during testing, so good heat dissipation needs to be considered to ensure that the test can proceed normally. Utility Model Content

[0004] (a) Technical issues

[0005] The purpose of this invention is to provide an IGBT module performance testing device that enables testing of IGBT modules and has good heat dissipation performance, ensuring that the test can be carried out normally.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] An IGBT module performance testing device includes a housing and a support frame disposed within the housing. A partition fixed to the support frame is also provided inside the housing, dividing the inner cavity of the housing into a heat dissipation cavity and a testing cavity. An IGBT module is mounted on the partition, located within the testing cavity. A rectifier module is mounted on the partition below the IGBT module. Multiple capacitors are mounted on the support frame and connected to the IGBT module via busbars. A control module is installed inside the housing, located below the capacitors. A first heat sink for dissipating heat from the IGBT module and a second heat sink for dissipating heat from the rectifier module are installed within the heat dissipation cavity. A heat dissipation duct communicating with the top of the heat dissipation cavity is provided on the housing.

[0009] Preferably, a cooling fan is installed inside the housing at the bottom of the heat dissipation cavity, and a cooling impeller is connected to the cooling fan.

[0010] Preferably, the outer casing is equipped with an air guide shell located at the top of the heat dissipation cavity, and the air guide shell is provided with heat dissipation air ducts whose size gradually decreases from the inside to the outside.

[0011] Preferably, the partition includes a heat sink and a circulating heat dissipation channel integrated within the heat sink.

[0012] Preferably, the first heat sink includes a plurality of first heat-conducting pillars arrayed on the partition plate, and multiple layers of first heat-conducting fins are spaced apart on the first heat-conducting pillars.

[0013] Preferably, the second heat sink includes a plurality of second heat-conducting pillars arrayed on the partition, and multiple layers of second heat-conducting fins are spaced apart on the second heat-conducting pillars.

[0014] Preferably, the outer casing is equipped with a first door panel for closing the heat dissipation cavity and a second door panel for closing the test cavity.

[0015] Preferably, one of the first door panels is equipped with an observation window, and the observation window is fitted with transparent glass.

[0016] Preferably, the bottom of the housing is equipped with a movable roller with a brake.

[0017] (III) Beneficial Effects

[0018] The main load-bearing and protective frame structure is formed by the outer shell, support frame, and partition. The interior of the outer shell is divided into a heat dissipation chamber and a test chamber. The test chamber integrates IGBT modules, rectifier modules, capacitors, and control modules to simulate the test process under normal operating conditions of IGBT modules. The heat generated during the test is relatively large. After being conducted through the partition, the heat is quickly conducted to the first heat sink and the second heat sink, and then quickly flows out through the heat dissipation air duct at the top of the heat dissipation chamber, thereby ensuring that the IGBT module can operate normally and be tested during the test. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0020] Figure 2 This is a three-dimensional structural diagram of disassembling the first and second door panels in an embodiment of this utility model.

[0021] Figure 3 This is a front view structural diagram of the disassembly of the first and second door panels in an embodiment of this utility model;

[0022] Figure 4 This is a schematic diagram of the structure of the first heat sink in an embodiment of this utility model;

[0023] Figure 5 This is a schematic diagram of the structure of the second heat sink in an embodiment of this utility model;

[0024] exist Figures 1 to 5In the diagram, the correspondence between component names or lines and the drawing numbers is as follows:

[0025] 1. Outer shell; 2. Support frame; 3. Partition plate; 4. Heat dissipation cavity; 5. Test cavity; 6. IGBT module; 7. Rectifier module; 8. Capacitor; 9. Busbar; 10. Control module; 11. First heat sink; 111. First heat conduction column; 112. First heat dissipation fin; 12. Second heat sink; 121. Second heat conduction column; 122. Second heat dissipation fin; 13. Heat dissipation duct; 14. Heat dissipation fan; 15. Heat dissipation impeller; 16. Air guide shell; 17. First door panel; 18. Second door panel; 19. Observation window; 20. Transparent glass; 21. Moving rollers. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0027] See Figures 1-5 As shown in the figure, an IGBT module performance testing device is proposed in the embodiment of this utility model, which mainly simulates the operation of IGBT module 6 under normal working conditions. Specifically, it includes a housing 1 and a support frame 2 disposed inside the housing 1. The housing 1 is also provided with a partition 3 fixed on the support frame 2. The housing 1, support frame 2 and partition 3 constitute the main load-bearing frame structure of the entire device, which facilitates the support and installation of various components. The partition 3 divides the inner cavity of the housing 1 into a heat dissipation cavity 4 and a test cavity 5. The separation is also based on the heat dissipation method under actual working conditions. The heat dissipation of heat-generating components such as IGBT module 6 is mainly carried out by heat conduction. Specifically, the test chamber 5 mainly integrates the devices required to simulate actual operating conditions. The circuit control and circuit connection between the devices are all existing technologies. Among them, the IGBT module 6 located in the test chamber 5 is installed on the partition 3, and the rectifier module 7 located below the IGBT module 6 is installed on the partition 3. Multiple capacitors 8 are installed on the support frame 2, and the multiple capacitors 8 are connected to the IGBT module 6 through busbars 9. At the same time, the control module 10 located below the capacitors 8 is installed in the outer shell 1. The above-mentioned device modules drive the IGBT module 6 to operate according to the actual use state, thereby performing various tests. The specific test process can simulate the actual operating conditions.

[0028] The heat generated during operation needs to be quickly dissipated to ensure the normal operation of the IGBT module 6 and to further test and simulate the heat dissipation conditions. Therefore, a first heat sink 11 for dissipating heat from the IGBT module 6 and a second heat sink 12 for dissipating heat from the rectifier module 7 are installed in the heat dissipation cavity 4. The outer shell 1 is provided with a heat dissipation duct 13 connecting to the top of the heat dissipation cavity 4. Taking full advantage of the effect of hot air flowing upward rapidly, the first heat sink 11 and the second heat sink 12 are installed at the positions corresponding to the IGBT module 6 and the rectifier module 7 to accelerate heat conduction from the partition 3 and form heat dissipation, thereby accelerating the heat dissipation in the heat dissipation cavity 4. Generally speaking, the bottom of the heat dissipation cavity 4 is also kept in contact with the outside, which can improve the air flow efficiency and accelerate the heat dissipation effect.

[0029] The heat dissipation duct 13 needs to accelerate the flow of hot air when it is discharged. A guide shell 16 located at the top of the heat dissipation cavity 4 is installed on the outer shell 1. The guide shell 16 is provided with heat dissipation ducts 13 that gradually decrease in size from the inside to the outside. The speed of outward air discharge is increased by reducing the flow size.

[0030] Specifically, in order to accelerate the airflow speed in the heat dissipation cavity 4, a heat dissipation fan 14 is installed at the bottom of the heat dissipation cavity 4 inside the outer shell 1, and a heat dissipation impeller 15 is connected to the heat dissipation fan 14; the heat dissipation fan 14 drives the heat dissipation impeller 15 to rotate rapidly, forming a negative pressure to draw in external air and quickly blow it onto the first radiator 11 and the second radiator 12, thereby accelerating the heat exchange efficiency and improving the heat dissipation effect.

[0031] Meanwhile, the partition 3 has good heat dissipation and heat conduction properties. The partition 3 includes a heat sink and a circulating heat dissipation channel integrated within the heat sink. The heat sink can be made of metal, ceramic, etc., and the internal circulating channel can be connected to the external circulating cooling water to further verify the impact of adding water cooling on the performance of the IGBT module 6. Specifically, when the IGBT module 6 and the rectifier module 7 are specifically installed on the partition 3, it is possible to consider using two partitions 3 separately, or integrating them on one partition 3. This can be used to verify whether the heat dissipation requirements can still be met under compact installation conditions with limited volume space.

[0032] The first heat sink 11 includes a plurality of first heat-conducting columns 111 arrayed on the partition 3, and multiple layers of first heat-dissipating fins 112 are spaced apart on the first heat-conducting columns 111. The first heat-conducting columns 111 accelerate heat conduction, and the multiple layers of first heat-dissipating fins 112 accelerate heat exchange. Similarly, the second heat sink 12 includes a plurality of second heat-conducting columns 121 arrayed on the partition 3, and multiple layers of second heat-dissipating fins 122 are spaced apart on the second heat-conducting columns 121. The second heat-conducting columns 121 conduct heat from the partition 3 to the second heat-dissipating fins 122, thereby increasing the heat exchange contact area and improving the heat dissipation effect.

[0033] To facilitate internal protection and sealing, and to simulate real-world operating conditions, a first door panel 17 for closing the heat dissipation cavity 4 and a second door panel 18 for closing the test cavity 5 are specifically installed on the outer casing 1. Simultaneously, for ease of observation, an observation window 19 with a transparent glass 20 is installed on one of the first door panels 17, allowing observation of the internal operating status. Both the first door panel 17 and the second door panel 18 can be opened relative to the outer casing 1 to facilitate the assembly and disassembly of the internal components.

[0034] Meanwhile, a movable roller 21 with a brake is installed at the bottom of the outer casing 1, and the entire testing device is moved by the movable roller 21.

[0035] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0036] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0037] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An IGBT module performance testing device, characterized in that: The device includes a housing (1) and a support frame (2) disposed inside the housing (1). The housing (1) is also provided with a partition (3) fixed on the support frame (2). The partition (3) divides the inner cavity of the housing (1) into a heat dissipation cavity (4) and a test cavity (5). An IGBT module (6) located in the test cavity (5) is installed on the partition (3). A rectifier module (7) located below the IGBT module (6) is installed on the partition (3). Multiple capacitors (8) are installed on the support frame (2). The multiple capacitors (8) are connected to the IGBT module (6) through a busbar (9). The control module (10) located below the capacitor (8) is installed inside the outer casing (1). The heat dissipation cavity (4) is equipped with a first heat sink (11) for dissipating heat from the IGBT module (6) and a second heat sink (12) for dissipating heat from the rectifier module (7). The outer shell (1) is provided with a heat dissipation duct (13) that connects to the top of the heat dissipation cavity (4).

2. The IGBT module performance testing device according to claim 1, characterized in that: A cooling fan (14) is installed inside the outer casing (1) at the bottom of the heat dissipation cavity (4), and a cooling impeller (15) is connected to the cooling fan (14).

3. The IGBT module performance testing device according to claim 2, characterized in that: The outer shell (1) is equipped with a guide shell (16) located at the top of the heat dissipation cavity (4), and the guide shell (16) is provided with a heat dissipation air duct (13) whose size gradually decreases from the inside to the outside.

4. The IGBT module performance testing device according to claim 3, characterized in that: The partition (3) includes a heat sink and a circulating heat dissipation channel integrated within the heat sink.

5. The IGBT module performance testing device according to claim 4, characterized in that: The first heat sink (11) includes a plurality of first heat-conducting columns (111) arrayed on the partition (3), and multiple layers of first heat-conducting fins (112) are spaced apart on the first heat-conducting columns (111).

6. The IGBT module performance testing device according to claim 5, characterized in that: The second heat sink (12) includes a plurality of second heat-conducting columns (121) arrayed on the partition (3), and multiple layers of second heat-conducting fins (122) are spaced apart on the second heat-conducting columns (121).

7. The IGBT module performance testing device according to claim 6, characterized in that: The outer casing (1) is equipped with a first door plate (17) for closing the heat dissipation cavity (4) and a second door plate (18) for closing the test cavity (5).

8. The IGBT module performance testing device according to claim 7, characterized in that: One of the first door panels (17) is equipped with an observation window (19), and the observation window (19) is equipped with a transparent glass (20).

9. The IGBT module performance testing device according to claim 8, characterized in that: The bottom of the outer casing (1) is equipped with a movable roller (21) with a brake.

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