A data processing device and system

Abstract

This application discloses a data processing device for data acquisition or testing, including a substrate with two mounting positions for mounting a processing module, at least one of which houses the processing module. The data processing device is used to connect to an I / O module, which connects to a target object, including any one or more of the following: electronic devices installed on vehicles, a device under test (DUT), or auxiliary equipment for assisting the DUT in testing. This application allows for the installation of one or two processing modules, providing flexibility in device configuration. Different numbers of processing modules can be installed to adapt to different data processing loads and functional requirements, eliminating the need to replace different data processing devices at different stages.

Description

Technical Field

[0001] This disclosure relates to the field of data processing technology, specifically to a data processing device and system. Background Technology

[0002] In data acquisition and testing applications, a computer is needed as the host to control the data acquisition and testing process. Common host system architectures include single-processor and dual-processor structures. Single-processor systems are simple in structure, low in cost, and easy to design and maintain. For applications that do not require extreme computing power or multitasking capabilities, single-processor systems can provide sufficient performance. Dual-processor structures offer higher computing power and better resource utilization. In data acquisition and testing applications, dual-processor systems can process more data streams simultaneously, accelerating processing speed and improving system responsiveness and real-time performance. They are suitable for scenarios that require processing large amounts of data, executing complex algorithms, or performing high-concurrency processing. Moreover, the redundancy design of dual processors also provides higher reliability and fault tolerance.

[0003] However, for equipment manufacturers, producing single-processor architecture mainframes and dual-processor architecture mainframes requires manufacturing circuit boards of different sizes, resulting in disadvantages in terms of cost, design, and other aspects. Summary of the Invention

[0004] This application provides a data processing device and system. The substrate of the data processing device includes two mounting positions, which can be used to install one or two processing modules. Whether it is a single-processor architecture or a dual-processor architecture, the same substrate can be used, eliminating the need to design different substrates separately, thus reducing design and manufacturing costs, and facilitating inventory management and maintenance replacement.

[0005] This application provides a data processing device for data acquisition or testing, including a substrate with two mounting positions for mounting a processing module, at least one of which is equipped with a processing module. The data processing device is used to connect to an I / O module, which is used to connect to a target object. The target object includes any one or more of the following: an electronic device installed on a vehicle, a device under test (DUT), and auxiliary equipment for assisting the DUT in testing.

[0006] This application provides a system for data acquisition or testing, including an IO module and the aforementioned data processing device. The IO module is connected to the data processing device and is used to connect to a target object.

[0007] In some embodiments, when processing modules are installed in both mounting positions, the two processing modules are connected in communication.

[0008] In some embodiments, the data processing device further includes a plurality of first communication interfaces, all of which are connected to the processing module; or, at least one of the plurality of first communication interfaces is connected to the processing module, while the remaining first communication interfaces are not connected to the processing module.

[0009] In some embodiments, the first communication interface is disposed on the substrate, and the processing module is mechanically connected to the substrate through a connector and communicatively connected to the substrate through a flexible circuit board.

[0010] In some embodiments, the data processing device further includes a communication expansion module, at least one processing module is connected to the communication expansion module, and the communication expansion module is provided with a plurality of second communication interfaces.

[0011] In some embodiments, the IO module is provided with multiple communication connection parts for connecting to target objects. One type of communication connection part is used to transmit one type of signal. The signal type transmitted by one communication connection part is any one of the following: CAN bus signal, LIN bus signal, FlexRay bus signal, vehicle Ethernet bus signal, SENT bus signal, DSI bus signal, PSI bus signal, K-Line bus signal, analog voltage output signal, digital voltage output signal, analog voltage input signal, digital voltage input signal, analog voltage output signal, digital voltage output signal, analog voltage input signal, and digital voltage input signal.

[0012] In some embodiments, the data processing device further includes a cabinet for providing space to accommodate the substrate and processing module.

[0013] In some embodiments, the data processing device further includes a heat dissipation structure disposed in the gap between the substrate and the processing module for dissipating heat from the processing module.

[0014] In some embodiments, the system further includes a backplane, the IO module includes at least one IO device, the data processing device and the IO device are respectively provided with connectors, the connectors are used to connect to connectors on the backplane, signal lines are arranged between the connectors on the backplane, and the data processing device and the IO device are respectively connected to the signal lines on the backplane through connectors and connectors. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1a This is a schematic diagram of the structure of the data processing device provided in the embodiments of this application;

[0017] Figure 1b This is a schematic diagram of the structure of the data processing device provided in the embodiments of this application. Figure 2 ;

[0018] Figure 2 This is a schematic diagram of an application scenario of the data processing device provided in the embodiments of this application;

[0019] Figure 3 This is a schematic diagram of an application scenario of the data processing device provided in the embodiments of this application;

[0020] Figure 4 This is a schematic diagram of an application scenario of the data processing device provided in the embodiments of this application;

[0021] Figure 5 This is a schematic diagram of an application scenario of the data processing device provided in the embodiments of this application;

[0022] Figure 6a This is a schematic diagram showing the connection between the first communication interface and the processing module provided in this embodiment of the application;

[0023] Figure 6b This is a schematic diagram of the connection between the first communication interface and the processing module provided in the embodiments of this application. Figure 2 ;

[0024] Figure 7a This is a schematic diagram showing the connection between the first communication interface and the processing module provided in this embodiment of the application;

[0025] Figure 7b This is a schematic diagram of the connection between the first communication interface and the processing module provided in the embodiments of this application. Figure 2 ;

[0026] Figure 8 This is a schematic diagram of the mechanical connection between the processing module and the substrate provided in the embodiments of this application;

[0027] Figure 9 This is a schematic diagram of the mechanical connection between the heat dissipation structure and the substrate provided in the embodiments of this application;

[0028] Figure 10aThis is a schematic diagram showing the connection between the processing module and the communication expansion module provided in this application embodiment;

[0029] Figure 10b This is a schematic diagram of the connection between the processing module and the communication expansion module provided in the embodiments of this application. Figure 2 ;

[0030] Figure 10c This is a schematic diagram of the connection between the processing module and the communication expansion module provided in the embodiments of this application. Figure 3 ;

[0031] Figure 11 This is a connection diagram of the first Ethernet switch unit, the second Ethernet switch unit, and the third Ethernet switch unit provided in the embodiments of this application;

[0032] Figure 12 This is a schematic diagram of the backplane and the connector on the backplane provided in the embodiments of this application;

[0033] Figure 13 This is a schematic diagram of an application scenario of the system provided in the embodiments of this application;

[0034] Figure 14 This is a schematic diagram of the structure of the first switch matrix provided in the embodiments of this application. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. At the same time, in the description of the embodiments of this application, terms, etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly and specifically defined.

[0036] This application provides a data processing device for data acquisition or testing, as shown in FIG1. ​​It includes a substrate with two mounting positions for mounting a processing module, and at least one mounting position is used to install a processing module. The data processing device is used to connect to an I / O module, and the I / O module is used to connect to a target object. The target object includes any one or more of the following: an electronic device installed on a vehicle, a device under test, and an auxiliary device for assisting the device under test in testing.

[0037] The substrate includes two mounting positions, which can be used to install one or two processing modules. Whether it is a single-processor architecture or a dual-processor architecture, the same substrate can be used, eliminating the need to design different substrates separately. This reduces design and manufacturing costs and facilitates inventory management and maintenance replacement.

[0038] The processing module of the data processing equipment has the ability to execute program instructions and process data. The data processing equipment can connect to external devices and transmit data with them. It can send data to external devices and receive data sent by external devices, and perform operations such as control, data acquisition, and testing on external devices.

[0039] In one application scenario of this application embodiment, such as Figure 2 As shown, the external device connected to the data processing device is the target object. The data processing device can connect to one target object or multiple target objects. The target object can be any object or combination of objects that output signals during data acquisition, or any object or combination of objects that output or receive signals during testing. The object usually refers to a hardware object.

[0040] In one example, the target object could be an electronic device installed on a vehicle. In this case, the data processing device connects to the target object and collects data from it. The target object serves as the data source, and the data processing device can receive and record signals emitted by the target object, thus achieving data collection. Furthermore, during the data collection process, the data processing device can also send trigger signals, feedback signals, and other signals to the target object to trigger signal output.

[0041] Among them, the means of transportation can be vehicles, high-speed trains, drones, airplanes, etc. The means of transportation are equipped with electronic devices, which include sensors, controllers, and actuators. Sensors can be cameras, lidar, temperature sensors, accelerometers, gyroscopes, GPS and other electronic devices. Controllers can be electronic control units (ECUs), battery management units, cockpit controllers, flight control units and other electronic devices. Actuators can be motors, engines, speakers and other electronic devices.

[0042] In one example, the target object can be the device under test (DUT). In this case, the data processing device connects to the target object and performs tests on it. The target object can refer to the DUT in Hardware-in-the-Loop (HIL) testing, for example, a controller during the development and / or verification phases.

[0043] In one example, the target object may include electronic devices installed on a vehicle, or a device under test (DUT), such as mounting the DUT on a vehicle to test it in a real-world operating environment.

[0044] In one example, the target object can be an auxiliary device used to assist in testing the device under test (DUT), such as a simulation device for simulating sensors and actuators, or a test bench built for simulating part of the electrical system of a vehicle for software algorithm testing; the test bench could be, for example, a driver's operating bench. Taking rapid prototyping (RCP) testing as an example, the software under test (e.g., algorithm, model) runs in the data processing device, and the target object connected to the data processing device is the sensors, actuators, etc., that the software under test communicates with when applied to a vehicle.

[0045] In one example, the target object may include the device under test (DUT) and auxiliary equipment used to assist in testing the DUT. For example, when testing an ECU, in addition to the vehicle's original sensors, additional sensors, controllers, actuators, etc., will be installed to obtain richer data during the test and make it easier to analyze the test results.

[0046] In one example, such as Figure 3 As shown, the external devices connected to the data processing equipment also include storage devices, which can store data received by the data processing equipment from the target object during testing and data acquisition, as well as data generated by the data processing equipment. Furthermore, the data processing equipment can connect to other types of external devices, such as user terminals, allowing users to exchange information with the data processing equipment through a user terminal that is communicatively connected to it.

[0047] In one example, the processing module includes a motherboard, CPU, and memory. The motherboard is a circuit board used to support and connect various computer hardware components. The CPU is the central processing unit, responsible for executing program instructions and processing data. The memory includes RAM modules, solid-state drives, etc. Additionally, the processing module includes a network interface card (NIC) to support Ethernet communication. Of course, depending on actual needs, the processing module can also include expansion cards such as sound cards and optical drives.

[0048] In one example, such as Figure 1a As shown, a processing module is installed in one mounting position on the substrate, while the other mounting position is idle. In this case, the data processing device is a single-processor architecture. The processing module can be configured with a real-time operating system or a desktop operating system. Examples of real-time operating systems include QNX and Linux, while examples of desktop operating systems include Windows and Mac.

[0049] Real-time operating systems ensure that events are responded to within a predetermined time, which is crucial for time-sensitive tasks. Desktop operating systems provide user-friendly graphical interfaces, enabling intuitive human-computer interaction and supporting the installation of a wide range of application software.

[0050] When the processing module is configured with a real-time operating system, the data processing device can act as an industrial control computer (i.e., a lower-level machine) for data acquisition or testing, possessing high real-time performance and reliability, and directly controlling the data acquisition and testing process of the target object. For example... Figure 4 As shown, the data processing equipment can also be connected to a computing device simultaneously. This computing device, equipped with a desktop operating system, acts as a host computer. The host computer connects to an industrial control computer, which then controls the data acquisition and testing process of the target object. The computing device can be a server, computer, tablet, or other computer equipment, as well as a circuit board with a processor capable of running an operating system. The computing device can run target software, which executes to cooperate with the data processing equipment in testing, data acquisition, and other tasks. Target software may include simulation software or data analysis software.

[0051] During testing, the industrial control computer (ICC) controls the testing process, including running test cases and sending simulation signals to the target object. During data acquisition, the ICC controls the data acquisition process, including adding timestamps to the acquired data and filtering and sorting the data. During data acquisition or testing, the ICC interacts with the user through a host computer, allowing the user to monitor and / or influence the tests or data acquisition performed by the ICC. This influence can include pre-testing and post-testing / data acquisition actions, such as selecting and configuring the test environment and test cases, and configuring the acquisition frequency and storage path.

[0052] It should be noted that the data processing equipment can be connected to the computing device throughout the entire data acquisition and testing process, or it can be connected to the computing device only during certain time periods of the data acquisition and testing process, such as before the data acquisition and testing begins or during the data acquisition and testing process.

[0053] When the processing module is configured with a desktop operating system, the data processing device can act as a host computer for data acquisition or testing. It does not require connection to a separate computing device; it can provide a user interface and directly control the data acquisition and testing process of the target object, such as collecting information from the target object and sending commands to it. Although the real-time performance and stability of a desktop operating system are lower than those of a real-time operating system, it can still meet the needs of some data acquisition or testing scenarios where real-time requirements are not high.

[0054] In one example, such as Figure 1b As shown, processing modules are installed in both mounting positions on the substrate. When processing modules are installed in both mounting positions, the two processing modules are connected in communication. In this case, the data processing device has a dual-processor architecture. Both processing modules can be configured with a real-time operating system or a desktop operating system, or one processing module can be configured with a real-time operating system and the other with a desktop operating system. The two processing modules can communicate with each other via Ethernet, PCIe, or other communication methods.

[0055] In some examples, both processing modules are configured with desktop operating systems, and the data processing device can act as a host computer during data acquisition or testing, directly controlling the data acquisition and testing process of the target object.

[0056] In some examples, both processing modules are configured with a real-time operating system. The data processing device can act as an industrial control computer (ICSC) during data acquisition or testing, i.e., a lower-level machine. Each of the two processing modules can undertake a portion of the data acquisition or testing tasks, working collaboratively to enable multitasking and significantly improve performance. Before or during data acquisition or testing, the data processing device can also be connected to a computing device, which acts as a host computer. This host computer connects to the ICCC, controlling the data acquisition and testing process of the target object.

[0057] In some examples, one processing module is configured with a real-time operating system, and another processing module is configured with a desktop operating system. The processing module with the real-time operating system acts as an industrial control computer during data acquisition or testing, while the processing module with the desktop operating system acts as a host computer during data acquisition or testing. This is equivalent to... Figure 4 The computing device in this system is implemented by a processing module within the data processing equipment. In endurance testing and other tests, the testing time is long and the testing environment is harsh. It's inconvenient for the computing device, acting as the host computer, to be placed in the testing environment for extended periods. For example, when a user's laptop is used as the computing device, it cannot be continuously placed in the testing environment connected to the industrial control computer. However, during the test, it's necessary to view the test process and issue test commands through the host computer. If the industrial control computer is not connected to the host computer, it may affect the test progress. In this scenario, in a dual-processor architecture data processing module, one processing module acts as the host computer and the other as the industrial control computer. This ensures that the host computer remains connected to the industrial control computer throughout the test. Moreover, since the processing module is a component of the data processing equipment, it is protected by the equipment's casing, thus solving the problem of the host computer being easily damaged if continuously placed in the testing environment.

[0058] In one example, during data acquisition or testing, the number of host computers can be one or more, and the number of industrial control computers can be zero or one or more. Correspondingly, the number of data processing systems can be one or more. The testing system can be at least one of the following: HIL testing system, RCP testing system, simulation testing system, back-injection testing system, etc.

[0059] In one example, the data processing device also includes a human-computer interaction (HCI) module. A processing module equipped with a desktop operating system is connected to the HCI module, which is used for data display. The HCI module can be, for example, a graphical user interface, a command-line interface, a natural language interface, a touchscreen, a mouse and keyboard, or a brain-computer interface, facilitating data input and output for the user and making the data processing device more user-friendly.

[0060] In one example, a data processing device is used in a data acquisition system or testing system. The data acquisition system or testing system includes a data processing device and an I / O module. The data processing device is used to connect to the I / O module, and the I / O module is used to connect to the target object.

[0061] For example, a data processing device is used to connect to a target object via an I / O module, wherein, as Figure 5 As shown, the IO module includes at least one IO device, which has multiple communication connections. A data processing device is connected to at least one IO device, and all IO devices connected to the data processing device have at least two types of communication connections. Each type of communication connection is used to transmit one type of signal. The signal type transmitted by one communication connection is any of the following: CAN bus signal, LIN bus signal, FlexRay bus signal, automotive Ethernet bus signal, SENT bus signal, DSI bus signal, PSI bus signal, K-Line bus signal, analog voltage output signal, digital voltage output signal, analog voltage input signal, digital voltage input signal, analog voltage output signal, digital voltage output signal, analog voltage input signal, and digital voltage input signal. For example, the DSI bus signal is a DSI3 bus signal, and the PSI bus signal is a PSI5 bus signal.

[0062] In some examples, the I / O device includes at least one host interface for connecting to a data processing device and multiple communication connectors. The host interface transmits signals of any of the following types: PCIe signals, USB signals, traditional Ethernet signals, Ethernet signals, IIC signals, SPI signals, GPIO signals, etc. That is, the I / O device can convert the signal type received by the host interface and send it through a communication connector, and / or can convert the signal type received by the communication connector and send it through a host device. For example, the I / O device is a CAN bus board with a USB interface and a CAN bus interface. The USB interface is used to connect to the data processing device, and the CAN bus interface is used to transmit and receive CAN bus signals.

[0063] Specifically, the communication connector is used to connect to a communication medium connected to the target object, and communication media of the same signal type are connected to communication connectors of the same type.

[0064] In some examples, the communication medium is a signal line used for signal transmission. The difference between different types of communication media lies in the types of signals they support for transmission. Generally, communication media are divided into bus signal lines and unidirectional transmission signal lines. One type of bus signal line supports the transmission of one type of bus signal, which can be any of the following: CAN bus signal, LIN bus signal, FlexRay bus signal, automotive Ethernet bus signal, SENT bus signal, DSI bus signal, PSI bus signal, or K-Line bus signal. Similarly, one type of unidirectional transmission signal line supports the transmission of one type of unidirectional signal, which can be any of the following: analog voltage output signal, digital voltage output signal, analog voltage input signal, digital voltage input signal, analog voltage output signal, digital voltage output signal, analog voltage input signal, or digital voltage input signal. Furthermore, the communication medium may also include interfaces or terminals on the target object for connecting the bus signal lines and unidirectional transmission signal lines, and may also include connectors for connecting the bus signal lines and unidirectional transmission signal lines to the target object.

[0065] A target object is connected to at least one type of communication medium, and the number of each type of communication medium connected to the target object is one or more. For example, the target object is an ECU, which is connected to a CAN bus and two analog voltage input signal lines.

[0066] In one example, the data processing device further includes a plurality of first communication interfaces, all of which are connected to the processing module; or, at least one of the plurality of first communication interfaces is connected to the processing module, while the remaining first communication interfaces are not connected to the processing module.

[0067] For example, the first communication interface may be one or more of the following: Ethernet communication interface, USB communication interface, PCIe communication interface, HDMI communication interface, and UART communication interface, so that the data processing device can communicate with the outside world. For instance, the data processing device may include two USB communication interfaces, two Ethernet communication interfaces, four PCIe communication interfaces, and one HDMI communication interface.

[0068] For example, when the data processing device has a single-processor architecture, such as Figure 6a As shown, all the first communication interfaces are connected to the processing module of the data processing device; when the data processing device has a dual-processor architecture, such as Figure 6b As shown, all the first communication interfaces are connected to the same processing module of the data processing device, and there is no connection between the other processing module and the first communication interface. That is, regardless of whether it is a single-processor architecture or a dual-processor architecture, all the first communication interfaces are connected to one processing module. With this design, the connection relationship between the first communication interface and the processing module is fixed, and even if processing modules are added or removed, there is no need to rewire, making operation simpler.

[0069] For example, when the data processing device has a single-processor architecture, such as Figure 7a As shown, some of the first communication interfaces are connected to the processing module of the data processing device, while others are not connected to the processing module and are in a disconnected state; when the data processing device has a dual-processor architecture, such as Figure 7b As shown, part of the first communication interface is connected to one processing module of the data processing device, and part of the first communication interface is connected to another processing module of the data processing device.

[0070] This design allows for flexible adjustment of the connection between the first communication interface and the processing module, satisfying the communication needs of each processing module. Furthermore, it allows the allocation of the first communication interface based on the functional characteristics of the processing module. For example, the first communication interface required for image signal transmission can be connected to one processing module, while the first communication interface required for Ethernet signal transmission can be connected to another processing module. Moreover, it ensures that the number of available first communication interfaces in a dual-processor architecture is no less than that in a single-processor architecture, meeting the requirement of more communication interfaces in a dual-processor architecture.

[0071] For example, the first communication interface of the data processing device is disposed on the substrate and is communicatively connected to the substrate via a flexible printed circuit (FPC), such as... Figure 8As shown, the processing module 200 is mechanically connected to the substrate 100 via a connector 300, which may be, for example, a bolt or screw. One end of the flexible circuit board is connected to the substrate via a connector, and the other end is connected to the processing module via a connector. The processing module establishes a communication connection with the substrate through the flexible circuit board, thereby enabling it to communicate with the first communication interface on the substrate.

[0072] In some examples, all the first communication interfaces are connected to a flexible circuit board, which in turn is connected to a processing module. That is, regardless of whether it is a single-processor architecture or a dual-processor architecture, all the first communication interfaces are connected to a processing module.

[0073] In some examples, multiple first communication interfaces can connect to multiple flexible circuit boards. Each flexible circuit board can be connected to a processing module or be in a disconnected state. Thus, in a single-processor architecture, all first communication interfaces are connected to a processing module, or some first communication interfaces are connected to a processing module while others are disconnected. In a multi-processor architecture, all first communication interfaces are connected to one processing module, or some first communication interfaces are connected to one processing module while others are connected to another. This allows for more flexible and varied connection methods between the first communication interfaces and the processing modules, enabling them to be connected to the same processing module or to be connected to different processing modules, or to have some first communication interfaces disconnected.

[0074] Flexible circuit boards offer a degree of bending and twisting capability, allowing for more efficient layout within limited space. They adapt to different spatial arrangements, reduce space occupancy, and make the installation and maintenance of components in data processing equipment more flexible and convenient. For example, when connecting the processing module to the substrate via physical plug-in, the processing module needs to be vertically plugged into the substrate. However, when connecting the processing module to the substrate via connectors and flexible circuit boards, the processing module can be horizontally positioned above the substrate, thereby reducing the space occupied by the data processing equipment.

[0075] In addition, compared to physical plug-in connections, bolts and other connectors provide a stable mechanical fixing method that can withstand greater mechanical stress and vibration. Flexible circuit boards are not easily damaged by pulling or bending, reducing signal interruptions or errors caused by poor contact. Flexible circuit boards can also absorb some vibration and impact, improving the stability and durability of the equipment.

[0076] In one example, the data processing device also includes a heat dissipation structure, such as... Figure 9 As shown, the heat dissipation structure is disposed in the gap between the substrate 100 and the processing module 200, and is used to dissipate heat from the processing module 200.

[0077] In some examples, such as Figure 9 As shown, the heat dissipation structure includes a heat sink 400 and a fan 500. The heat generated by the processing module 200 is transferred to the heat sink 400. The heat sink 400 has a large heat dissipation area, which helps to disperse heat. At the same time, the fan 500 can promote airflow to improve the heat dissipation effect of the heat sink 400. The heat dissipation structure can be fixedly connected to the substrate 100 through a connecting structure 699, such as bolts, screws, or other connecting components.

[0078] The heat dissipation structure is positioned within the gap between the substrate and the processing module, allowing it to be close to the heat source (near the processing module) for more effective heat dissipation and efficient use of space. Specifically, when the processing module is connected to the substrate via connectors or a flexible circuit board, it can be positioned horizontally above the substrate instead of being vertically inserted. This creates a space between the horizontally positioned processing module and the substrate to accommodate the heat dissipation structure.

[0079] In one example, the data processing device further includes at least one communication expansion module, at least one processing module is connected to the communication expansion module, and the communication expansion module is provided with multiple second communication interfaces.

[0080] It is understandable that the processing module, including the motherboard and CPU, has its own communication channels. The external communication of the data processing device is actually the external communication of the processing module. Therefore, the first communication interface on the substrate connects to the communication channels of the processing module, allowing external devices to connect to it and communicate with the processing module. The communication expansion module connects to the communication channels of the processing module, and it has a second communication interface. External devices can connect to this second interface and communicate with the processing module through the expansion module. Thus, both the first and second communication interfaces are communication interfaces used by the data processing device to connect to external devices such as target objects, storage devices, and computing devices.

[0081] The number and types of communication channels that the processing module can connect to are limited. The number of first communication interfaces is limited by the similarity and number of communication channels of the processing module itself. For example, when the processing module uses a Xinbu SCM motherboard and an Intel CPU, the types and number of communication channels it can support are limited by the model. In this regard, this application sets up a communication expansion module. The data processing device can expand to obtain more second communication interfaces through the communication expansion module, thereby improving the scalability of the device. Moreover, the type and number of second communication interfaces can be flexibly configured in the communication expansion module according to actual needs, adapting to different application scenarios and changes in requirements.

[0082] For example, the communication expansion module includes at least one of a PCIe switch unit, a first Ethernet switch unit, and an FPGA unit.

[0083] In some examples, the communication expansion module includes a PCIe switch unit. This PCIe switch unit can be expanded to provide multiple PCIe communication interfaces, allowing the data processing device to connect to more external devices. The PCIe switch unit can utilize a PCIe switch chip, which itself has functions such as supporting high-speed data transmission, effectively performing load balancing and data transmission quality control, and supporting different PCIe versions and speeds, thereby sharing some of the communication workload with the processing module.

[0084] In some examples, the communication expansion module includes a first Ethernet switch unit, which can be expanded to provide multiple Ethernet communication interfaces, allowing the data processing device to connect to more external devices. The first Ethernet switch unit can be an Ethernet switch chip, which itself has some functions, such as supporting high-speed data transmission, supporting Ethernet ports with different communication rates, and supporting flow control, buffer management, and queue scheduling, thereby sharing some of the communication work of the processing module.

[0085] In some examples, the communication expansion module includes an FPGA unit with multiple communication interfaces. The FPGA unit is a programmable device that flexibly supports various communication protocols, thus enabling support for multiple types and numbers of communication interfaces. Furthermore, the FPGA unit has parallel processing capabilities, allowing it to process data from multiple communication interfaces simultaneously, distributing the communication workload of the processing module and improving device performance. For example, the FPGA unit may have Ethernet, IIC, EtherCAT, and PCIe communication interfaces.

[0086] When the data processing device has a single-processor architecture, one processing module is connected to the communication expansion module; when the data processing device has a dual-processor architecture, one processing module is connected to the communication expansion module, and the other processing module is not connected to the communication expansion module, or both processing modules are connected to the communication expansion module.

[0087] For example, such as Figure 10aAs shown, the communication expansion module includes a PCIe switch unit, a first Ethernet switch unit, and an FPGA unit. The data processing device has a single-processor architecture. The communication channels of the processing module include 16 PCIe lanes. Four of these PCIe lanes are connected to the PCIe communication interface on the substrate, and four of these PCIe lanes are connected to the FPGA unit. The FPGA unit is equipped with an Ethernet communication interface, an IIC communication interface, an EtherCAT communication interface, and a PCIe communication interface. Eight of these PCIe lanes are allocated to the PCIe switch unit, which expands them into 10 PCIe communication interfaces. The communication channels of the processing module also include two Ethernet lanes. Two of these Ethernet lanes are connected to the first Ethernet switch unit, which expands them into four Ethernet communication interfaces.

[0088] For example, such as Figure 10b As shown, the communication expansion module includes a first Ethernet switch unit and an FPGA unit. The data processing device has a dual-processor architecture. One Ethernet channel of one processing module is allocated to the first Ethernet switch unit, which expands it into four Ethernet communication interfaces. The four PCIe channels of the processing module are allocated to the FPGA unit. The FPGA unit is equipped with Ethernet communication interfaces, IIC communication interfaces, EtherCAT communication interfaces, and PCIe communication interfaces. The other processing module is not connected to the communication expansion module.

[0089] For example, such as Figure 10c As shown, the communication expansion module includes a PCIe switch unit, a first Ethernet switch unit, and an FPGA unit. The data processing device has a dual-processor architecture. Four PCIe lanes of one processing module are connected to the FPGA unit, eight PCIe lanes are connected to the PCIe switch unit, and one Ethernet lane of the other processing module is connected to the first Ethernet switch unit.

[0090] It is understandable that when the data processing device has a dual-processor architecture, due to the communication connection between the two processing modules, one processing module is connected to the communication expansion module, and the other processing module, which is not directly connected to the communication expansion module, can also receive and send data from the communication expansion module. For example, processing module 1 is connected to the communication expansion module and communicates with the outside world through the communication interface on the communication expansion module. Processing module 2 can communicate with processing module 1, thereby indirectly communicating with the outside world through the second communication interface on the communication expansion module.

[0091] In one example, as shown in Figure 10, when the communication expansion module includes a first Ethernet switch unit and an FPGA unit, the first Ethernet switch unit and the FPGA unit are communicatively connected. On the one hand, the FPGA unit is equipped with an Ethernet communication interface, and the FPGA unit can transmit Ethernet communication data to the processing module through the first Ethernet switch unit without going through the PCIe channel between the FPGA unit and the processing module. This allows the Ethernet communication data with large data traffic to be transmitted separately from other types of communication data, ensuring data transmission efficiency. On the other hand, the first Ethernet switch unit is implemented by an Ethernet switch chip, and the FPGA unit can be used to control its power-on startup sequence, firmware updates, etc.

[0092] In one example, when processing modules are installed in both mounting positions, the two processing modules communicate with each other. Specifically, both processing modules are connected to a second Ethernet switch unit, through which Ethernet data transmission is performed. The second Ethernet switch unit can be implemented using an Ethernet switch chip, which connects the two processing modules. The Ethernet switch chip provides high-speed data exchange and processing capabilities, reducing network transmission time and latency when dealing with large volumes of Ethernet data, thus ensuring efficient communication between the processing modules.

[0093] In some examples, both processing modules are connected to a second Ethernet switch unit and perform Ethernet data transmission through the second Ethernet switch unit. The data processing device also includes a communication expansion module, which includes a first Ethernet switch unit. The second Ethernet switch unit can reuse the first Ethernet switch unit, meaning that the first Ethernet switch unit and the second Ethernet switch unit can use the same Ethernet switch chip.

[0094] In one example, the first communication interface of the data processing device mounted on the substrate includes multiple Ethernet interfaces. At least one processing module of the data processing device is connected to a third Ethernet switch unit, and at least two Ethernet interfaces of the first communication interface are connected to the third Ethernet switch unit. Of course, this example does not exclude the possibility that some Ethernet interfaces of the first communication interface are not connected to the third Ethernet switch unit but are directly connected to the communication channel of the processing module. The third Ethernet switch unit can be implemented using an Ethernet switch chip; that is, the processing module is externally connected to an Ethernet switch chip to connect to multiple Ethernet communication interfaces. On the one hand, the Ethernet switch chip can provide interface expansion, enabling the processing module to connect to more Ethernet communication interfaces; on the other hand, the Ethernet switch chip can provide high-speed data exchange and processing capabilities, ensuring communication efficiency.

[0095] For example, when the data processing device has a single-processor architecture, the processing module is connected to the third Ethernet switch unit, and the Ethernet communication interface in the first communication interface can be connected to the third Ethernet switch unit and then connected to the processing module through the third Ethernet switch unit.

[0096] For example, when the data processing device has a dual-processor architecture, one processing module is connected to the third Ethernet switch unit, and the Ethernet communication interface in the first communication interface can be connected to the third Ethernet switch unit and then connected to the processing module through the third Ethernet switch unit. The other processing module is not connected to the third Ethernet switch unit.

[0097] For example, when the data processing device has a dual-processor architecture, both processing modules are connected to the third Ethernet switch unit. The Ethernet communication interface in the first communication interface can be connected to the third Ethernet switch unit and the two processing modules can be connected through the third Ethernet switch unit.

[0098] In some examples, the processing module of the data processing device is connected to the third Ethernet switch unit, at least two Ethernet interfaces in the first communication interface are connected to the third Ethernet switch unit, and the data processing device also includes a communication expansion module, which includes the first Ethernet switch unit. The third Ethernet switch unit can reuse the first Ethernet switch unit, that is, the first Ethernet switch unit and the third Ethernet switch unit can use the same Ethernet switch chip.

[0099] Furthermore, in some examples, such as Figure 11 As shown, both processing modules are connected to the second Ethernet switch unit, the processing module of the data processing device is connected to the third Ethernet switch unit, at least two Ethernet interfaces in the first communication interface are connected to the third Ethernet switch unit, and the data processing device also includes a communication expansion module, which includes the first Ethernet switch unit. The second Ethernet switch unit and the third Ethernet switch unit can reuse the first Ethernet switch unit, that is, the first Ethernet switch unit, the second Ethernet switch unit and the third Ethernet switch unit can use the same Ethernet switch chip.

[0100] In one example, a data processing device is used to connect to an I / O module, which is used to connect to a target object. The I / O module includes at least one I / O device, wherein the I / O device is connected to a first communication interface disposed on a substrate and / or a second communication interface disposed on a communication expansion module. For example, one end of the I / O device is connected to the first communication interface and the other end is connected to the target object; for example, one end of the I / O device is connected to the second communication interface and the other end is connected to the target object; for example, at least one I / O device is connected to the first communication interface and the other end is connected to the target object, and at least one I / O device is connected to the second communication interface and the other end is connected to the target object.

[0101] In one example, the data processing device also includes a wireless communication module, with at least one processing module connected to the wireless communication module. The wireless communication module is, for example, a WiFi module, a 4G / 5G communication module, a Bluetooth module, a ZigBee module, etc., so that external devices can wirelessly connect to the data processing device to remotely use the data processing device, and the data processing device can be remotely controlled by the user.

[0102] In one example, the data processing device also includes a power module, which converts the supply voltage provided by the power supply to power the devices in the data processing device. For example, it converts the supply voltage provided by the power supply to a voltage of 3V, 5V, etc., to power the data processing device.

[0103] In one example, the data processing equipment also includes a cabinet that provides space to house the baseboard and processing modules.

[0104] In some examples, the rack also provides space to accommodate other electronic devices, such as data processing equipment, storage devices, and various I / O devices.

[0105] In some examples, the rack is equipped with ventilation holes to dissipate heat from electronic devices such as data processing equipment inside the rack.

[0106] In some examples, the data processing device also includes a status indicator module. This module indicates the status of the data processing device; for example, it can set status indicator lights for the processing module, with different colors representing states such as normal operation, no power supply, or malfunction. The indicator lights can be mounted on the server rack.

[0107] In some examples, the rack has a panel with connectors for connecting to the first communication interface of the data processing equipment. External devices can then connect to these connectors and subsequently to the processing module. This unified connection of external devices to the data processing equipment via panel connectors enhances user convenience. Examples of connectors include USB connectors and traditional Ethernet connectors. Figure 8 As shown, panel 700 is connected to substrate 100 to form an installation space for accommodating processing module 200.

[0108] Furthermore, the panel is divided into a first panel and a second panel, which are located in different positions within the rack, such as one in front of the other. This allows the connectors used to connect to the first communication interface to be set up separately. For example, the connectors on the first panel are used to connect to one processing module, and the connectors on the second panel are used to connect to another processing module.

[0109] In addition, the data processing equipment also includes control buttons, such as power switch buttons and restart buttons, which can be installed on the server rack.

[0110] This application also provides a system for data acquisition or testing, including an IO module and the aforementioned data processing device, wherein the IO module is connected to the data processing device and is used to connect to a target object.

[0111] The data processing device can directly connect to the target object, but even if a communication expansion module is provided, the number and type of communication interfaces it can provide are limited. For example, it cannot directly connect to the CAN bus or the vehicle Ethernet bus. Therefore, the data processing device can be connected to the IO module, which in turn connects to the target object, thereby realizing the connection between the data processing device and the target object.

[0112] In one example, the second communication interface of the data processing device, located on the communication expansion module, is connected to the I / O module. That is, the first communication interface of the data processing device, located on the base plate, is not connected to the I / O module but is used to connect external devices such as storage devices and computing devices. The second communication interface on the communication expansion module is connected to the I / O module, thereby connecting to the target object through the I / O module.

[0113] In one example, the system is used as a test system, with one or more connected target objects acting as devices under test (DUTs). A data processing device controls the testing process. For instance, the data processing device sends data to the DUT and observes and analyzes it to perform open-loop testing. Alternatively, the data processing device sends data to the DUT and receives feedback data from it, analyzing the data to perform closed-loop testing. Specifically, it can test the accuracy of the target object's control algorithm, the correct implementation of the protocol stack, protocol compatibility, fault detection and isolation capabilities, and performance under high load.

[0114] In one example, the system is used as a data acquisition system. One or more connected target objects serve as the data source for data acquisition. The data processing device receives the data sent by the data source and stores the data in the data storage device. The data processing device can perform certain data processing functions, such as adding timestamps to the data, compressing the data, grouping the data according to criteria such as type, time, and data source, and filtering the data, etc.

[0115] In one example, the IO module includes at least one IO device, which has a communication connection for connecting to a target object. The data processing device and the IO device are connected via an EtherCAT signal line, wherein the data processing device acts as the master station in the EtherCAT communication network, and the IO device acts as the slave station in the EtherCAT communication network.

[0116] In one example, the system also includes a backplane, with connectors for the data processing device and the I / O device. The connectors are used to connect to the connectors on the backplane, and signal lines are routed between the connectors on the backplane. The data processing device and the I / O device are connected to the signal lines on the backplane through the connectors and the connectors, respectively.

[0117] like Figure 12 As shown, the connectors on the backplane include a first connector for connecting to a data processing device and a second connector for connecting to an I / O device. The first connector is connected to each of the second connectors via PCIe signal lines, IIC signal lines, and EtherNet signal lines, so that any I / O device connected to any second connector can communicate with the data processing device via signal lines.

[0118] Furthermore, the first connector and each of the second connectors are connected together via EtherCAT signal lines; for example, the first connector and multiple second connectors are cascaded sequentially. However, considering the hierarchical message transmission characteristic of EtherCAT communication, this restricts the I / O devices to being connected to the second connectors sequentially. That is, there cannot be an idle second connector between two non-idle second connectors, leading to inconvenience. To overcome this problem, each second connector in this application is equipped with a switch. The switch is used to short-circuit the second connector. Thus, when a second connector is not connected to an I / O device, the switch can short-circuit the idle second connector, allowing conduction between the upstream and downstream connectors of the idle second connector, thus meeting the EtherCAT communication requirements.

[0119] For example, the communication expansion module of the data processing equipment includes a PCIE switch unit and an FPGA unit. The PCIE switch unit is equipped with a PCIE communication interface, and the FPGA unit is equipped with an Ethernet communication interface, an IIC communication interface, a PCIE communication interface, and an EtherCAT communication interface. The first connector is used to connect to the second communication interface on the communication expansion module. It is designed with connection media, such as pins, for connecting the Ethernet communication interface, the IIC communication interface, the PCIE communication interface, and the EtherCAT communication interface.

[0120] In one example, such as Figure 13 As shown, the system also includes a signal distribution module and multiple general-purpose connection units. The multiple first connection units of the signal distribution module are respectively connected to different communication connection units. The data processing device communicates with the target object through the communication connection units, the general-purpose connection units, and a communication medium connected to the target object. The general-purpose connection units are configured to connect to communication media of different signal types at different time periods. Furthermore, the general-purpose connection units are used to transmit signals between communication media of the same signal type and the communication connection units. The multiple second connection units of the signal distribution module are respectively connected to different general-purpose connection units, or: the multiple second connection units of the signal distribution module are used as different general-purpose connection units. The signal distribution module is configured to selectively connect the first connection units and the second connection units. Further, the signal distribution module is also connected to the data processing device, which is used to control the state of each switching element.

[0121] In some examples, the signal distribution module includes an FPGA module. The FPGA module is equipped with multiple first connection parts and multiple second connection parts. The FPGA module can acquire the data received by each first connection part and selectively send the data received by one first connection part through one second connection part. The FPGA module can also acquire the data received by each second connection part and selectively send the data received by one second connection part through one first connection part, thereby selectively connecting the first connection parts and the second connection parts.

[0122] In some examples, the signal distribution module includes a first switch matrix, such as... Figure 14 As shown, the first switch matrix includes multiple switching elements. Each first connection portion is connected to each second connection portion via a switching element. The switching elements are configured to switch between an on state and an off state to selectively connect the first connection portion and the second connection portion. The signal distribution module further includes a processing module for controlling the state of each switching element.

[0123] Compared to FPGA modules, selectively connecting the first and second connection parts using a first switch matrix, being hardware-based, results in faster connection establishment and switching speeds and higher reliability. Furthermore, when selectively connecting the first and second connection parts using an FPGA module, the number of first and second connection parts that can be connected is limited by the performance and size of the FPGA module itself, whereas the first switch matrix can connect a much larger number of first and second connection parts.

[0124] In one example, at least two of the multiple general-purpose connectors are of different types. The difference between the different types of general-purpose connectors lies in the communication media they support. One type of general-purpose connector supports at least two types of communication media. For example, one type of general-purpose connector supports connecting to CAN bus and LIN bus; another type supports connecting to CAN bus, LIN bus, and FlexRay bus; one type supports connecting to analog voltage input signal lines and digital voltage input signal lines; and another type supports connecting to analog current output signal lines and analog voltage output signal lines.

[0125] In some examples, the universal connector has two signal terminals. Most signal types are transmitted through these two signal lines. Therefore, the universal connector can connect to communication media with different signal types. For example, the CAN_H and CAN_L lines of a CAN bus can be connected to the universal connector, as can the input and ground lines of analog current input signals. The universal connector is used to transmit signals between communication media and the communication connector of the same signal type. It does not involve signal processing, modulation / demodulation, serialization / deserialization, or protocol conversion; it simply transmits signals between the communication media and the communication connector.

[0126] In some examples, the universal connector has a signal terminal, and one communication medium can connect two universal connectors. The two universal connectors can transmit signals between the connected communication medium and one communication connector, thus further decoupling the connectors to adapt to different application requirements. Furthermore, for some special communication media, such as the PSI bus, it can ensure the safety and reliability of the electrical connection. In further examples, the system also includes a GND connector, where one communication medium can connect one universal connector and one GND connector. The GND connector is a universal connector used to connect the ground wire in the communication medium.

[0127] In the technical solution of this application, the universal connector can be compatible with communication media of different signal types. When connecting the target object to the system, it is not necessary to wire according to the signal type of the communication medium connected to the target object. It is only necessary to connect the communication medium connected to the target object to the universal connector, which makes the wiring operation more time-saving and labor-saving.

[0128] In some examples, the aforementioned data processing equipment, communication connection unit, and signal distribution module are all housed inside the cabinet, while the general connection unit is located on the cabinet panel. The multiple first connection parts of the signal distribution module are connected to different communication connection units, and the multiple second connection parts of the signal distribution module are connected to different general connection units. The second connection parts of the signal distribution module are pins, sockets, pads, connectors, etc. The second connection parts can be connected to the general connection units via wire harnesses, or via wire harnesses and connectors.

[0129] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0130] The data processing device and system provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A data processing device for data acquisition or testing, characterized in that, The system includes a substrate, on which two mounting positions for mounting a processing module are provided, and at least one mounting position is used to mount a processing module. The data processing device is used to connect to the IO module, which is used to connect to the target object. The target object includes any one or more of the following: electronic devices installed on vehicles, devices under test, and auxiliary devices used to assist the devices under test in testing.

2. The data processing device of claim 1, wherein, When processing modules are installed in both mounting positions, the two processing modules communicate with each other.

3. The data processing device of claim 1, wherein, The data processing device further includes multiple first communication interfaces, all of which are connected to the processing module; or, at least one of the multiple first communication interfaces is connected to the processing module, while the remaining first communication interfaces are not connected to the processing module.

4. The data processing device of claim 3, wherein, The first communication interface is disposed on the substrate, and the processing module is mechanically connected to the substrate through a connector and communicates with the substrate through a flexible circuit board.

5. The data processing device of claim 1, wherein, The data processing device further includes a communication expansion module, at least one processing module is connected to the communication expansion module, and the communication expansion module is provided with multiple second communication interfaces.

6. The data processing device of claim 1, wherein, The IO module is provided with multiple communication connection parts for connecting to target objects. Each type of communication connection part is used to transmit a type of signal. The signal type transmitted by a communication connection part is any one of the following: CAN bus signal, LIN bus signal, FlexRay bus signal, vehicle Ethernet bus signal, SENT bus signal, DSI bus signal, PSI bus signal, K-Line bus signal, analog voltage output signal, digital voltage output signal, analog voltage input signal, and digital voltage input signal.

7. The data processing device of claim 1, wherein, The data processing equipment also includes a cabinet for providing space to accommodate the base plate and processing module.

8. The data processing device of claim 1, wherein, The data processing device also includes a heat dissipation structure, which is disposed in the gap between the substrate and the processing module for dissipating heat from the processing module.

9. A system for data acquisition or testing, characterized by It includes an I / O module and a data processing device as described in any one of claims 1-8, wherein the I / O module is connected to the data processing device and the I / O module is used to connect to a target object.

10. The system of claim 9, wherein, The system also includes a backplane, and the IO module includes at least one IO device. The data processing device and the IO device are respectively provided with connectors. The connectors are used to connect to the connectors on the backplane. Signal lines are arranged between the connectors on the backplane. The data processing device and the IO device are respectively connected to the signal lines on the backplane through the connectors and the connectors.

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