A touch component and a touch screen

Abstract

This application discloses a touch component and a touch screen, comprising: a first protective layer; a first optical adhesive layer disposed on the first protective layer; a conductive layer disposed on the side of the first optical adhesive layer away from the first protective layer, the conductive layer being fixed to the first protective layer by the first optical adhesive layer; a second optical adhesive layer disposed on the side of the conductive layer away from the first optical adhesive layer; and a cover plate disposed on the side of the second optical adhesive layer away from the conductive layer. This design is simple in structure and low in cost, solving the problem of touch function failure easily caused by cover plate breakage.

Description

Technical Field

[0001] This application relates to the field of touch screen technology, and in particular to a touch component and a touch screen. Background Technology

[0002] Touchscreens, as an important input device, have become an indispensable part of modern electronic devices. From the early resistive touchscreens to the widely used capacitive touchscreens today, technological advancements have greatly improved the user experience and device performance.

[0003] Currently, touchscreens generally employ a double-layer thin-film structure. Conductive films are etched into circuit patterns using processes such as photolithography and lasers, and then covered with transparent optical adhesive to create the touch functionality. However, touchscreens with a double-layer thin-film structure are complex, costly, and prone to touch failure if the cover plate cracks after bonding. Utility Model Content

[0004] This application mainly provides a touch component and a touch screen to solve the problems of complex touch screen structure, high cost, and easy failure of touch function due to cracking of the cover plate after bonding with the cover plate.

[0005] This application provides a touch component, including:

[0006] First protective layer;

[0007] A first optical adhesive layer is disposed on the first protective layer;

[0008] A conductive layer is disposed on the side of the first optical adhesive layer away from the first protective layer, and the conductive layer is fixed to the first protective layer by the first optical adhesive layer;

[0009] The second optical adhesive layer is disposed on the side of the conductor layer away from the first optical adhesive layer;

[0010] A cover plate is disposed on the side of the second optical adhesive layer away from the conductor layer.

[0011] The touch component further includes:

[0012] A third optical adhesive layer is disposed on a portion of the conductive layer;

[0013] The second protective layer is disposed on the side of the third optical adhesive layer away from the conductor layer.

[0014] The second optical adhesive layer is disposed on the second protective layer, and the second optical adhesive layer partially overlaps with the second protective layer.

[0015] In this configuration, a portion of the conductive layer corresponds to the non-touch area of ​​the touch component.

[0016] In this case, a portion of the conductor layer overlaps at least partially with the cover plate.

[0017] Wherein, the sum of the thickness of the third optical adhesive layer and the thickness of the second protective layer is less than the thickness of the second optical adhesive layer.

[0018] The conductor layer includes nano-insulated conductors, which have an insulating layer for signal shielding.

[0019] The encapsulation area of ​​the nano-insulated wire and the flexible circuit board constitutes a portion of the wire layer.

[0020] The conductor layer includes a first nano-insulated conductor and a second nano-insulated conductor, which are intersected.

[0021] This application also provides a touch screen, including the touch components described above.

[0022] The beneficial effects of this application are as follows: The touch component of this application includes a first protective layer; a first optical adhesive layer disposed on the first protective layer; a conductive layer disposed on the side of the first optical adhesive layer away from the first protective layer, and the conductive layer is fixed to the first protective layer by the first optical adhesive layer; a second optical adhesive layer disposed on the side of the conductive layer away from the first optical adhesive layer; and a cover plate disposed on the side of the second optical adhesive layer away from the conductive layer. This application uses the first optical adhesive layer to fix the conductive layer on the first protective layer, and uses the second optical adhesive layer to fix the conductive layer and the cover plate, thus forming a touch component. The touch component has a simple structure and low cost. Furthermore, the second optical adhesive layer is located between the conductive layer and the cover plate. When the cover plate is subjected to external impact, the second optical adhesive layer can absorb some of the impact energy, reducing the direct transmission of impact force to the conductive layer. In other words, the second optical adhesive layer can be used as an explosion-proof film, solving the problem that touch functionality failure is easily caused by cover plate breakage. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0024] Figure 1 This is a schematic diagram of the structure of an embodiment of the touch component provided in this application;

[0025] Figure 2 This is a schematic diagram of another embodiment of the touch component provided in this application. Detailed Implementation

[0026] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0028] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly indicating the number, specific order, or primary and secondary relationship of the indicated technical features.

[0029] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0030] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0031] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0032] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a connection between two components or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0033] This application provides a touch screen with a dual-layer thin film structure. The touch screen in this embodiment includes a thin film, a transparent optical adhesive, a cover plate, and a display screen.

[0034] In some embodiments, a conductive film is formed by methods such as coating or plating. Then, conductive circuit patterns are fabricated on the conductive film using methods such as photolithography, etching, or laser processing. Two conductive films with different circuit orientations are then bonded together using transparent optical adhesive to form a touch film. The touch film is then bonded to a cover plate using transparent optical adhesive to form a touchpad. Finally, the touchpad is bonded to a display screen using transparent optical adhesive to form a touch screen.

[0035] In some embodiments, a conductive circuit pattern is created by printing wires on a thin film. Then, a transparent optical adhesive is first applied to the surface of the thin film, followed by a protective film, and then another layer of transparent optical adhesive. This transparent optical adhesive is then used to bond the touchpad to a cover plate, forming a touch panel. The touchpad is then bonded to a display screen using the transparent optical adhesive, forming a touch screen.

[0036] The aforementioned touchscreen with a double-layer thin film structure is complex and costly, and the cover plate is prone to failure if it cracks after being bonded to the screen.

[0037] Please see Figure 1 As shown, Figure 1 This is a schematic diagram of an embodiment of the touch component provided in this application. The touch component 1 of this embodiment includes a first protective layer 10, a first optical adhesive layer 20, a conductive layer 30, a second optical adhesive layer 40, and a cover plate 50.

[0038] The first optical adhesive layer 20 is disposed on the first protective layer 10. Optionally, the first optical adhesive layer 20 is adhered to or coated on the first protective layer 10.

[0039] The first protective layer 10 includes, but is not limited to, polyethylene terephthalate (PET), polycarbonate, or glass. The first optical adhesive layer 20 includes, but is not limited to, optically clear adhesive (OCA), UV-curable adhesive, or thermosetting adhesive.

[0040] The conductive layer 30 is disposed on the side of the first optical adhesive layer 20 away from the first protective layer 10, and the conductive layer 30 is fixed to the first protective layer 10 by the first optical adhesive layer 20.

[0041] In some embodiments, the first optical adhesive layer 20 is disposed on one side of the first protective layer 10, and the conductive layer 30 is disposed on the side of the first optical adhesive layer 20 away from the first protective layer 10; in this case, the first optical adhesive layer 20 is located between the first protective layer 10 and the conductive layer 30, so that the conductive layer 30 is fixed to the first protective layer 10 by the first optical adhesive layer 20.

[0042] The first protective layer 10 is used to provide mechanical protection for the conductor layer 30, preventing the conductor layer 30 from being subjected to external physical damage during manufacturing, assembly and use.

[0043] For example, the optically transparent adhesive is disposed on one side of the polyester film, and the conductive layer 30 is disposed on the side of the optically transparent adhesive away from the polyester film, so that the conductive layer 30 is fixed to the polyester film by the optically transparent adhesive.

[0044] The second optical adhesive layer 40 is disposed on the side of the conductor layer 30 away from the first optical adhesive layer 20. The second optical adhesive layer 40 includes, but is not limited to, optically transparent adhesive, UV-curable adhesive, or thermosetting adhesive.

[0045] Optionally, the second optical adhesive layer 40 is applied or coated on the side of the conductor layer 30 away from the first optical adhesive layer 20.

[0046] The cover plate 50 is disposed on the side of the second optical adhesive layer 40 away from the conductor layer 30, that is, the cover plate 50 is fixed to one side of the conductor layer 30 by the second optical adhesive layer 40.

[0047] In some embodiments, a first optical adhesive layer 20 is disposed on one side of the first protective layer 10, a conductive layer 30 is disposed on the side of the first optical adhesive layer 20 away from the first protective layer 10, a second optical adhesive layer 40 is disposed on the side of the conductive layer 30 away from the first optical adhesive layer 20, and a cover plate 50 is disposed on the side of the second optical adhesive layer 40 away from the conductive layer 30. In this case, one side of the conductive layer 30 is fixed to the first protective layer 10 by the first optical adhesive layer 20, and the other side of the conductive layer 30 is fixed to the cover plate 50 by the second optical adhesive layer 40. The first protective layer 10 and the cover plate 50 are used to protect the conductive layer 30.

[0048] The second optical adhesive layer 40 is used to bond the cover plate 50, ensuring that the second optical adhesive layer 40 adheres to the cover plate 50. Furthermore, the second optical adhesive layer 40 not only secures the conductor layer 30 to ensure the correctness of the touch pattern and touch functionality, but also protects the conductor layer 30 from moisture.

[0049] Compared to the double-layer film structure which requires multiple layers of optically transparent adhesive, the touch component 1 in this embodiment fixes the first protective layer 10, the conductor layer 30 and the cover plate 50 through the first optical adhesive layer 20 and the second optical adhesive layer 40, which reduces the number of adhesive layers used. The fewer adhesive layers, the more effectively the product thickness can be reduced, and the risk of bubble rebound and delamination caused by bonding can also be reduced.

[0050] In this embodiment, the conductor layer 30 is fixed on the first protective layer 10 by the first optical adhesive layer 20, and the conductor layer 30 and the cover plate 50 are fixed by the second optical adhesive layer 40 to form a touch component 1. The touch component 1 has a simple structure and low cost. The second optical adhesive layer 40 is located between the conductor layer 30 and the cover plate 50. When the cover plate 50 is impacted by external force, the second optical adhesive layer 40 can absorb part of the impact energy and reduce the impact force from being directly transmitted to the conductor layer 30. That is, the second optical adhesive layer 40 can be used as an explosion-proof film to solve the problem that the touch function is easily malfunctioning due to the cracking of the cover plate 50.

[0051] See Figure 2 As shown, Figure 2 This is a schematic diagram of another embodiment of the touch component provided in this application. The touch component 1 in this embodiment further includes a third optical adhesive layer 60 and a second protective layer 70.

[0052] The third optical adhesive layer 60 is disposed on a portion of the conductive layer 30. The third optical adhesive layer 60 includes, but is not limited to, optically transparent adhesive, UV-curable adhesive, or thermosetting adhesive. Optionally, the third optical adhesive layer 60 is adhered to or coated on a portion of the conductive layer 30.

[0053] In some embodiments, the third optical adhesive layer 60 is disposed on a portion of the conductor layer 30 on the side away from the first optical adhesive layer 20, and the third optical adhesive layer 60 is spaced apart from the second optical adhesive layer 40 disposed on the side of the conductor layer 30 away from the first optical adhesive layer 20, that is, the third optical adhesive layer 60 and the second optical adhesive layer 40 are separated from each other. Figure 2 As shown.

[0054] The second protective layer 70 is disposed on the side of the third optical adhesive layer 60 away from the conductor layer 30. The second protective layer 70 includes, but is not limited to, polyester film, polycarbonate, or glass.

[0055] In some embodiments, the third optical adhesive layer 60 is disposed on a portion of the conductor layer 30 on the side away from the first optical adhesive layer 20, and the second protective layer 70 is disposed on the side of the third optical adhesive layer 60 away from the conductor layer 30; in this case, the second protective layer 70 is used to include a portion of the conductor layer 30 on the side away from the first optical adhesive layer 20, that is, the first protective layer 10 and the second protective layer 70 are respectively disposed on both sides of the conductor layer 30 in the portion of the region.

[0056] In this embodiment, a third optical adhesive layer 60 is provided on a portion of the conductor layer 30, and a second protective layer 70 is provided on the side of the third optical adhesive layer 60 away from the conductor layer 30; that is, a first protective layer 10 and a second protective layer 70 are respectively provided on both sides of a portion of the conductor layer 30, forming a double-layer protective structure for a portion of the area, thereby enhancing the protective performance of the conductor layer 30.

[0057] According to some embodiments of this application, the second optical adhesive layer 40 is disposed on the second protective layer 70, and the second optical adhesive layer 40 partially overlaps with the second protective layer 70.

[0058] In some embodiments, a third optical adhesive layer 60 is disposed on a portion of the conductor layer 30 away from the first optical adhesive layer 20, and a second protective layer 70 is disposed on the side of the third optical adhesive layer 60 away from the conductor layer 30; a second optical adhesive layer 40 is disposed on the side of the conductor layer 30 away from the first optical adhesive layer 20, and the second optical adhesive layer 40 is disposed on a portion of the side of the second protective layer 70 away from the third optical adhesive layer 60, so that the second optical adhesive layer 40 partially overlaps with the second protective layer.

[0059] For example, such as Figure 2 As shown, the second protective layer 70 is fixedly disposed on a portion of the conductor layer 30 away from the first optical adhesive layer 20 by the third optical adhesive layer 60. The second optical adhesive layer 40 is disposed on the side of the conductor layer 30 away from the first optical adhesive layer 20, and the second optical adhesive layer 40 is extended on the side of the second protective layer 70 away from the third optical adhesive layer 60. At this time, the second optical adhesive layer 40 and the second protective layer 70 partially overlap, and the cover plate 50 disposed on the side of the second optical adhesive layer 40 away from the conductor layer 30 does not contact the second protective layer 70.

[0060] In this embodiment, the second optical adhesive layer 40 is disposed on the second protective layer 70, and the second optical adhesive layer 40 partially overlaps with the second protective layer 70, ensuring that a portion of the second protective layer 70 can be bonded to the cover plate 50 through the second optical adhesive layer 40, thereby ensuring the stability of the touch component 1.

[0061] According to some embodiments of this application, a portion of the conductor layer 30 is configured to correspond to the non-touch area of ​​the touch component 1.

[0062] In some embodiments, a portion of the conductive layer 30 in the touch component 1 is used to connect circuits, such as connecting a circuit board. Because this portion of the portion is connected to the circuit, it is not attached to the cover plate 50 and does not participate in the touch sensing portion. That is, a portion of the conductive layer 30 is correspondingly set to the non-touch area of ​​the touch component 1.

[0063] This embodiment forms a double-layer protective structure for a portion of the conductor layer 30 by providing a third optical adhesive layer 60 on a portion of the conductor layer 30 and a second protective layer 70 on the side of the third optical adhesive layer 60 away from the conductor layer 30. This solves the problem that the conductor layer is prone to breakage when it needs to be bent because the portion of the conductor layer is located on the cover plate 50.

[0064] According to some embodiments of this application, a portion of the conductor layer 30 at least partially overlaps with the cover plate 50.

[0065] In some embodiments, a third optical adhesive layer 60 is disposed on a portion of the conductor layer 30 away from the first optical adhesive layer 20, and a second protective layer 70 is disposed on the side of the third optical adhesive layer 60 away from the conductor layer 30; a second optical adhesive layer 40 is disposed on the side of the conductor layer 30 away from the first optical adhesive layer 20, and the second optical adhesive layer 40 and the third optical adhesive layer 60 are spaced apart, and the second optical adhesive layer 40 is extended on the side of the second protective layer 70 away from the third optical adhesive layer 60, so that the second optical adhesive layer 40 and the second protective layer 70 partially overlap; at the same time, a cover plate 50 is disposed on the side of the second optical adhesive layer 40 away from the conductor layer 30 and the second protective layer 70, that is, the cover plate 50 is fixed by the second optical adhesive layer 40; since the second optical adhesive layer 40 and the second protective layer 70 partially overlap, the cover plate 50 fixed by the second optical adhesive layer 40 partially overlaps with a portion of the conductor layer 30.

[0066] For example, such as Figure 2 As shown, the cross-sectional length of the cover plate 50 is less than the cross-sectional length of the conductor layer 30, and the cross-sectional length of the cover plate 50 is greater than the cross-sectional length of the second optical adhesive layer 40, so that when the cover plate 50 is disposed on the side of the second optical adhesive layer 40 away from the conductor layer 30, the cover plate 50 and a portion of the conductor layer 30 at least partially overlap.

[0067] In this embodiment, by setting a portion of the conductor layer 30 to at least partially overlap with the cover plate 50, a portion of the conductor layer 30 can be effectively protected by the cover plate 50, reducing the risk of damage to a portion of the conductor layer 30 due to external forces.

[0068] According to some embodiments of this application, see Figure 2 As shown, the sum of the thickness of the third optical adhesive layer 60 and the thickness of the second protective layer 70 is less than the thickness of the second optical adhesive layer 40.

[0069] In this embodiment, by setting the sum of the thickness of the third optical adhesive layer 60 and the thickness of the second protective layer 70 to be less than the thickness of the second optical adhesive layer 40, the second optical adhesive layer 40 can be disposed on the second protective layer 70, and the second optical adhesive layer 40 and the second protective layer 70 partially overlap, ensuring that a part of the second protective layer 70 is bonded to the cover plate 50 through the second optical adhesive layer 40, thereby improving the overall structural stability of the touch component 1; and the combination of the thinner third optical adhesive layer 60 and the second protective layer 70 can reduce bubbles and unevenness caused by excessively thick adhesive layers.

[0070] According to some embodiments of this application, the conductor layer 30 includes nano-insulated conductors having an insulating layer for signal shielding.

[0071] In some embodiments, nano-insulated wires are arranged on the first optical adhesive layer 20 according to a preset circuit pattern using a device such as a wire drawing machine, a coating machine, and a photolithography device; at this time, the nano-insulated wires form a touch sensing function; and the outer layer of the nano-insulated wires is wrapped with an insulating layer for signal shielding. The nano-insulated wires include, but are not limited to, nano-insulated copper wires or nano-insulated silver wires.

[0072] This embodiment effectively shields external electromagnetic interference, i.e., signal shielding, by setting the insulation layer of the nano-insulated wire, thus ensuring the stability of signal transmission.

[0073] According to some embodiments of this application, the encapsulation area of ​​the nano-insulated wire and the flexible circuit board is part of the wire layer 30.

[0074] In some embodiments, the conductive layer 30 of the touch component 1 is encapsulated with the flexible circuit board, that is, the nano-insulated wires are connected to or encapsulated with the flexible circuit board; at this time, the encapsulation area of ​​the nano-insulated wires and the flexible circuit board is a part of the conductive layer 30.

[0075] According to some embodiments of this application, the conductor layer 30 includes a first nano-insulated conductor and a second nano-insulated conductor, which are arranged intersecting each other.

[0076] In some embodiments, a first nanometer insulated wire serves as a transmitting line and a second nanometer insulated wire serves as a receiving line. The first nanometer insulated wire and the second nanometer insulated wire are intersected to form a sensing point for communication signals.

[0077] In this embodiment, by intersecting the first nano-insulated wire and the second nano-insulated wire, more sensing points can be realized in a limited space, thereby improving the resolution of the touch component 1.

[0078] Another embodiment of this application provides a touch screen, including the touch component 1 of the above embodiment.

[0079] In summary, this application uses a first optical adhesive layer 20 to fix the conductor layer 30 onto the first protective layer 10, and a second optical adhesive layer 40 to fix the conductor layer 30 and the cover plate 50, forming a touch component 1. The touch component 1 has a simple structure and low cost. Furthermore, the second optical adhesive layer 40 is located between the conductor layer 30 and the cover plate 50. When the cover plate 50 is subjected to external impact, the second optical adhesive layer 40 can absorb part of the impact energy, reducing the direct transmission of impact force to the conductor layer 30. In other words, the second optical adhesive layer 40 can be used as an explosion-proof film, solving the problem that the touch function is easily malfunctioning due to the cracking of the cover plate 50.

[0080] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A touch component, characterized in that, include: First protective layer; A first optical adhesive layer is disposed on the first protective layer; A conductive layer is disposed on the side of the first optical adhesive layer away from the first protective layer, and the conductive layer is fixed to the first protective layer by the first optical adhesive layer; The second optical adhesive layer is disposed on the side of the conductor layer away from the first optical adhesive layer; A cover plate is disposed on the side of the second optical adhesive layer away from the conductor layer.

2. The touch component according to claim 1, characterized in that, The touch component also includes: A third optical adhesive layer is disposed on a portion of the conductive layer; The second protective layer is disposed on the side of the third optical adhesive layer away from the conductor layer.

3. The touch component according to claim 2, characterized in that, The second optical adhesive layer is disposed on the second protective layer, and the second optical adhesive layer partially overlaps with the second protective layer.

4. The touch component according to claim 2, characterized in that, A portion of the conductive layer is configured to correspond to the non-touch area of ​​the touch component.

5. The touch component according to claim 2, characterized in that, A portion of the conductor layer at least partially overlaps with the cover plate.

6. The touch component according to claim 3, characterized in that, The sum of the thickness of the third optical adhesive layer and the thickness of the second protective layer is less than the thickness of the second optical adhesive layer.

7. The touch component according to any one of claims 1-6, characterized in that, The conductor layer includes nano-insulated conductors, which have an insulating layer for signal shielding.

8. The touch component according to claim 7, characterized in that, The encapsulation area of ​​the nano-insulated wire and the flexible circuit board serves as a portion of the wire layer.

9. The touch component according to any one of claims 1-6, characterized in that, The conductor layer includes a first nano-insulated conductor and a second nano-insulated conductor, which are intersected.

10. A touch screen, characterized in that, Includes the touch component as described in any one of claims 1-9.

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