Cooling frame

Abstract

This utility model provides a heat dissipation frame for use in an electronic device. The electronic device includes a cover plate, a motherboard, and a heat source. The heat dissipation frame includes two side baffles and two heat dissipation connecting plates. Each side baffle is disposed on the motherboard and has a first end and a second end. Each heat dissipation connecting plate is disposed on the motherboard and connected between the side baffles. Each heat dissipation connecting plate has multiple through holes, a third end, and a fourth end. Each through hole is located between the third end and the fourth end. The third end and the fourth end of each heat dissipation connecting plate are respectively connected to the first end of one side baffle and the second end of the other side baffle. The side baffles, the heat dissipation connecting plates, the cover plate, and the motherboard together surround the heat source and form a heat dissipation chamber. The heat dissipation chamber is connected to the external space through the through holes. This can effectively reduce production and storage costs.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation, and more particularly to a heat dissipation frame for use in electronic devices. Background Technology

[0002] With the development of electronic technology, electronic devices such as computers, workstations, and servers are widely used in various fields. A typical electronic device usually includes a casing, a motherboard inside the casing, and multiple electronic components mounted on the motherboard. As various electronic devices move towards artificial intelligence (AI) and high performance, their computing power and processing speed have greatly improved. Consequently, the electronic components generate a large amount of heat during operation. Therefore, many electronic devices use natural convection, air cooling, or liquid cooling to cool the electronic components and ensure that the devices can operate normally within their operating temperature range.

[0003] However, due to the large number of components and complex structures within electronic devices, fluid flow is easily obstructed and dispersed, making it difficult for the fluid to effectively cool the various electronic components that require heat dissipation. Furthermore, some electronic devices employ customized heat dissipation modules for each component to improve heat dissipation efficiency. However, customized designs not only fail to achieve universal applicability across different electronic components or devices but also significantly increase mold, production, warehousing, and maintenance costs. Therefore, finding a way to effectively cool the various electronic components within a specific range while minimizing the types of parts and the number of corresponding molds, while maintaining versatility, is a crucial issue that urgently needs to be addressed.

[0004] In view of this, the inventor of this utility model has devoted himself to research and applied theoretical knowledge to address the shortcomings of the prior art, and has made every effort to solve the above-mentioned problems, which is the goal of the inventor's improvement. Utility Model Content

[0005] The main purpose of this utility model is not only to provide air cooling for the internal heat source, but also to have good versatility and reduce the types of parts and the number of corresponding molds, thereby effectively reducing production costs, warehousing costs and maintenance costs.

[0006] To achieve the above objectives, this utility model provides a heat dissipation frame for use in an electronic device. The electronic device includes a cover plate, a motherboard arranged parallel to the cover plate, and a heat source disposed on the motherboard. The heat dissipation frame includes a pair of side baffles and a pair of heat dissipation connecting plates. The side baffles are arranged parallel to each other on the motherboard, and each side baffle has a first end and a second end opposite to each other. The heat dissipation connecting plates are arranged parallel to each other on the motherboard and connected between the side baffles. Each heat dissipation connecting plate has multiple through holes, a third end, and a fourth end. Each through hole of each heat dissipation connecting plate is located between the third end and the fourth end. The third end and the fourth end of each heat dissipation connecting plate are respectively connected to the first end of one side baffle and the second end of the other side baffle. The side baffles and the heat dissipation connecting plates, together with the cover plate and the motherboard, surround the heat source and form a heat dissipation chamber. The heat dissipation chamber is connected to the external space through the through holes of each heat dissipation connecting plate.

[0007] In one embodiment of the present invention, each side baffle further has a first fastening structure and a pair of first positioning structures. The first fastening structure and one of the first positioning structures in each side baffle are located at a first end, and the other first positioning structure in each side baffle is located at a second end. Each flow guide connecting plate further has a second fastening structure and a pair of second positioning structures. The second fastening structure and one of the second positioning structures in each flow guide connecting plate are located at a third end, and the other second positioning structure in each flow guide connecting plate is located at a fourth end. Each first positioning structure is positioned on each second positioning structure, and each first fastening structure fastens on each second fastening structure.

[0008] In one embodiment of the present invention, each first positioning structure is one of a rib and a groove, and each second positioning structure is the other of a rib and a groove.

[0009] In one embodiment of the present invention, each first fastening structure is one of a hook and a groove, and each second fastening structure is the other of a hook and a groove.

[0010] In one embodiment of the present invention, each side baffle further has a third positioning structure, and each flow guiding connecting plate further has a fourth positioning structure. The third positioning structure of each side baffle is located at the second end, and the fourth positioning structure of each flow guiding connecting plate is located at the fourth end. Each third positioning structure is positioned at each fourth positioning structure.

[0011] In one embodiment of the present invention, each third positioning structure is one of a protrusion and a groove, and each fourth positioning structure is the other of a protrusion and a groove.

[0012] In one embodiment of the present invention, a pair of flow-guiding expansion plates are further included. Each flow-guiding expansion plate is connected in parallel to each flow-guiding connecting plate. Each side baffle is connected to each flow-guiding expansion plate between each side baffle. Each side baffle, each flow-guiding connecting plate, and each flow-guiding expansion plate, together with the cover plate and the main board, surround the heat source and form a flow-guiding chamber.

[0013] In one embodiment of the present invention, each flow-guiding expansion plate has a plurality of through holes and a fifth end and a sixth end opposite to each other. Each through hole of each flow-guiding expansion plate is located between the fifth end and the sixth end. The fifth end and the sixth end of each flow-guiding expansion plate are respectively connected to the fourth end of the corresponding flow-guiding connecting plate and the second end of the corresponding side baffle. The flow-guiding chamber is connected to the external space through each through hole of each flow-guiding connecting plate and each through hole of each flow-guiding expansion plate.

[0014] In one embodiment of the present invention, each flow guide expansion plate further comprises a first positioning structure and a second positioning structure. The first positioning structure of each flow guide expansion plate is located at the fifth end and positioned at the second positioning structure at the fourth end of the corresponding flow guide connecting plate. The second positioning structure of each flow guide expansion plate is located at the sixth end and positioned at the first positioning structure at the second end of the corresponding side baffle.

[0015] In one embodiment of the present invention, each side baffle further has a third positioning structure located at the second end, each flow guiding connecting plate further has a fourth positioning structure located at the fourth end, and each flow guiding expansion plate further has a third positioning structure and a fourth positioning structure located at the fifth end and the sixth end, respectively. The third positioning structure of each side baffle is positioned at the fourth positioning structure of the corresponding flow guiding expansion plate, and the third positioning structure of each flow guiding expansion plate is positioned at the fourth positioning structure of the corresponding flow guiding connecting plate.

[0016] The heat dissipation frame of this utility model, through the parallel arrangement of side baffles on the main board and the parallel connection of flow guiding plates between the side baffles, allows the side baffles and the flow guiding plates to jointly enclose the heat source and form a flow guiding chamber with the cover plate and the main board. The flow guiding chamber can be connected to the external space through the through holes of the flow guiding plates. Therefore, it can not only provide air cooling for the internal heat source, but also has good versatility and reduces the types of parts and the number of corresponding molds, thereby effectively reducing production costs, warehousing costs and maintenance costs. Attached Figure Description

[0017] Figure 1 This is a top cross-sectional view of the electronic device to which this utility model is applied;

[0018] Figure 2 This is a cross-sectional side view of the electronic device to which this utility model is applied;

[0019] Figure 3 This is a perspective view of the present utility model;

[0020] Figure 4 This is an exploded perspective view of the present invention;

[0021] Figure 5 This is a partially enlarged exploded perspective view of the present invention;

[0022] Figure 6 This is a partially enlarged cross-sectional top view of the present invention;

[0023] Figure 7 This is another enlarged cross-sectional top view of the present invention;

[0024] Figure 8 This is an exploded perspective view of another embodiment of the present invention;

[0025] Figure 9 This is a partially enlarged exploded perspective view of another embodiment of the present invention;

[0026] In the attached figures, the following labels are used:

[0027] 10: Side panel

[0028] 11: First end

[0029] 12: Second end

[0030] 13: First fastening structure

[0031] 14: First positioning structure of the side baffle

[0032] 15: The third positioning structure of the side panel

[0033] 20: Flow guide connecting plate

[0034] 21: Through holes in the flow guide connecting plate

[0035] 22: Third end

[0036] 23: Fourth end

[0037] 24: Second snap-fit ​​structure

[0038] 25: Second positioning structure of the flow guide connecting plate

[0039] 26: The fourth positioning structure of the flow guide connecting plate

[0040] 30: Flow-guiding expansion plate

[0041] 31: Fifth end

[0042] 32: Sixth end

[0043] 33: Through holes in the flow guide expansion plate

[0044] 34: First positioning structure of the flow guide expansion plate

[0045] 35: Second positioning structure of the flow guide expansion plate

[0046] 36: The third positioning structure of the flow guide expansion plate

[0047] 37: The fourth positioning structure of the flow guide expansion plate

[0048] A1: Chassis

[0049] A2: Cover plate

[0050] A3: Motherboard

[0051] A4: Heat source

[0052] A5: Fluid Driver

[0053] C: Drainage chamber. Detailed Implementation

[0054] In the description of this utility model, it should be understood that the terms "front side", "rear side", "left side", "right side", "front end", "rear end", "end", "longitudinal", "lateral", "vertical", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting conditions of this utility model.

[0055] As used herein, terms such as "first," "second," "third," "fourth," and "fifth" describe various elements, components, regions, hierarchies, and / or parts, which should not be limited by these terms. These terms are used only to distinguish one element, component, region, hierarchy, or part from another. Unless the context clearly indicates otherwise, the use of terms such as "first," "second," "third," "fourth," and "fifth" herein does not imply order or sequence.

[0056] Unless otherwise defined, terms such as "substantially" and "approximately" are used to describe and narrate small changes. When combined with an event or situation, the term may include the exact moment the event or situation occurred, or an approximate point in time. For example, when combined with a numerical value, the term may include a range of variation less than or equal to ±10% of that value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

[0057] The detailed description and technical content of this utility model will be explained in conjunction with the drawings below. However, the drawings are for illustrative purposes only and are not intended to limit the scope of this utility model.

[0058] Please refer to the following first. Figure 1 and Figure 2 As shown, this utility model provides a heat dissipation frame that is disposed within an electronic device (such as a server, computer, workstation, etc.) and is used to restrict the flow range of fluids (such as gas or liquid) to improve the heat dissipation efficiency of the electronic device. Specifically, the electronic device mainly includes a housing A1, a cover plate A2 covering the housing A1, a motherboard A3 disposed parallel to the cover plate A2 within the housing A1, and at least one heat source A4 disposed on the motherboard A3. The electronic device may further include a fluid actuator A5 (such as a fan or pump) as needed, thereby forcing fluid to flow and propel it within the housing A1 to carry away the heat energy of the heat source A4 for heat dissipation. However, this utility model does not impose many limitations on this; for example, the electronic device may also dissipate heat from the heat source A4 through natural convection. In this embodiment, the heat source A4 is a dual in-line memory module (DIMM), but this invention is not limited to this; the heat source A4 can also be other forms of memory modules or electronic components. The heat dissipation frame of this invention is configured for use with a single heat source A4, but the number of heat sources A4 can be determined according to the size, performance, and usage requirements of the electronic device. Therefore, multiple heat sources A4 can also be used with multiple heat dissipation frames. However, for ease of explanation, the following description will only use a single heat source A4.

[0059] Please refer to the following: Figures 3 to 7 As shown, the heat dissipation frame of this utility model mainly includes a pair of side baffles 10 and a pair of heat dissipation connecting plates 20.

[0060] Each side baffle 10 is substantially parallel to each other and is disposed opposite to the main board A3, with each side baffle 10 located on opposite sides of the corresponding heat source A4. Each side baffle 10 is a long strip-shaped plate, thus having a first end 11 and a second end 12 opposite to each other. Each side baffle 10 is symmetrically arranged with respect to the corresponding heat source A4, that is, the first end 11 of one side baffle 10 and the second end 12 of the other side baffle 10 are located on the same side.

[0061] Each flow guiding connecting plate 20 is substantially parallel to each other on the main board A3, and each flow guiding connecting plate 20 is substantially perpendicularly connected between each side baffle 10. Each flow guiding connecting plate 20 is a rectangular plate and has multiple through holes 21 and a third end 22 and a fourth end 23 opposite to each other. Each through hole 21 of each flow guiding connecting plate 20 is located between the third end 22 and the fourth end 23. Each flow guiding connecting plate 20 is symmetrically arranged with respect to the corresponding heat source A4, that is, the third end 22 of each flow guiding connecting plate 20 is connected to the first end 11 of one of the side baffles 10, while its fourth end 23 is connected to the second end 12 of the other side baffle 10.

[0062] Each side baffle 10 and each flow guiding connecting plate 20 together form a hollow rectangular frame surrounding the heat source A4, so that each side baffle 10, each flow guiding connecting plate 20, the cover plate A2, and the main board A3 can together form a flow guiding chamber C. The flow guiding chamber C can be connected to the external space through each through hole 21 of each flow guiding connecting plate 20 on opposite sides. As a result, some of the fluid inside the electronic device is forced to enter the flow guiding chamber C through each through hole 21 of one side of the flow guiding connecting plate 20, and carries away the heat energy of the heat source A4 and leaves the flow guiding chamber C through each through hole 21 of the other side of the flow guiding connecting plate 20, thereby effectively improving the heat dissipation efficiency of the electronic device. Furthermore, since the side baffles 10 are arranged in parallel relative to each other, and the flow guiding connecting plates 20 are also connected in parallel relative to each other between the side baffles 10, only two components are needed to form a flow guiding chamber C with the cover plate A2 and the main board A3 to improve heat dissipation efficiency. This allows for good versatility and effectively reduces the types of parts and the corresponding number of molds, thereby effectively reducing production costs, warehousing costs and maintenance costs.

[0063] Further explanation: each side baffle 10 also has a first fastening structure 13 and a pair of first positioning structures 14, and each flow guide connecting plate 20 also has a second fastening structure 24 and a pair of second positioning structures 25. The first fastening structure 13 and one of the first positioning structures 14 in each side baffle 10 are located at the first end 11, and the other first positioning structure 14 in each side baffle 10 is located at the second end 12. The second fastening structure 24 and one of the second positioning structures 25 in each flow guide connecting plate 20 are located at the third end 22, and the other second positioning structure 25 in each flow guide connecting plate 20 is located at the fourth end 23. Each first positioning structure 14 of each side baffle 10 is respectively positioned at each second positioning structure 25 of each flow guide connecting plate 20, and each first fastening structure 13 of each side baffle 10 is respectively fastened to each second fastening structure 24 of each flow guide connecting plate 20, thereby enabling effective positioning and fixation between each side baffle 10 and each flow guide connecting plate 20.

[0064] Specifically, each first positioning structure 14 is one of a rib and a groove, and each second positioning structure 25 is the other of a rib and a groove. In this embodiment, each first positioning structure 14 is a T-shaped groove, and each second positioning structure 25 is a T-shaped elongated rib, so that the ribs of each second positioning structure 25 can be inserted into the grooves of each first positioning structure 14 to form a positioning effect, i.e. Figure 6 As shown. However, this utility model is not limited to the above disclosure. For example, the first positioning structure 14 and the second positioning structure 25 can also be a combination of a protrusion and a groove, a combination of a positioning hole and a positioning pin, or a combination of a tenon and a mortise, etc. Furthermore, each first fastening structure 13 is one of a hook and a groove, and each second fastening structure 24 is the other of a hook and a groove. In this embodiment, each first fastening structure 13 is a P-shaped groove, and each second fastening structure 24 is a P-shaped hook, so that the hooks of each second fastening structure 24 can fasten to the grooves of each first fastening structure 13 to form a fastening and fixing effect, i.e., as shown. Figure 7 As shown on the left. However, this utility model is not limited to the above disclosure. For example, the first fastening structure 13 and the second fastening structure 24 can also be a combination of buckle and buckle hole, a combination of barb and buckle, or a combination of barb and stop block, etc.

[0065] Further explanation: each side baffle 10 also has a third positioning structure 15, and each flow guiding connecting plate 20 also has a fourth positioning structure 26. The third positioning structure 15 of each side baffle 10 is located at the second end 12, and the fourth positioning structure 26 of each flow guiding connecting plate 20 is located at the fourth end 23. Each third positioning structure 15 of each side baffle 10 is positioned at each fourth positioning structure 26 of each flow guiding connecting plate 20, thereby further improving the positioning effect between each side baffle 10 and each flow guiding connecting plate 20. Specifically, each third positioning structure 15 is one of a protrusion and a groove, and each fourth positioning structure 26 is the other of a protrusion and a groove. In this embodiment, each third positioning structure 15 is a rectangular protrusion, and each fourth positioning structure 26 is a rectangular groove, so that the protrusion of each third positioning structure 15 can be engaged with the groove of each fourth positioning structure 26 to further improve the positioning effect between each side baffle 10 and each flow guiding connecting plate 20, i.e. Figure 7 As shown on the right. However, this utility model is not limited to the above disclosure. For example, the third positioning structure 15 and the fourth positioning structure 26 can also be a combination of ribs and grooves, a combination of positioning holes and positioning pins, or a combination of tenons and mortises, etc.

[0066] Please continue to cooperate. Figure 1 See also Figure 8 and Figure 9 As shown, Figure 8 and Figure 9 Another embodiment of the heat dissipation frame of this utility model is described in detail below.

[0067] Each flow-guiding expansion plate 30 is connected in parallel to each flow-guiding connecting plate 20, meaning that each flow-guiding expansion plate 30 and its corresponding flow-guiding connecting plate 20 are substantially arranged in a straight line. Therefore, in this embodiment, each side baffle 10 and each flow-guiding expansion plate 30 are substantially perpendicularly connected between each side baffle 10. That is, each side baffle 10, each flow-guiding connecting plate 20, and each flow-guiding expansion plate 30 together constitute a hollow rectangular frame surrounding the heat source A4, so that each side baffle 10, each flow-guiding connecting plate 20, each flow-guiding expansion plate 30, the cover plate A2, and the main board A3 can together form a flow-guiding chamber C, thereby accommodating the use of heat sources A4 of different sizes, i.e., as shown in the figure. Figure 1 As shown in the middle. More specifically, since the heat source A4 in this embodiment is a DIMM, it will have different widths, thus requiring heat dissipation frames of different widths to be used in conjunction with it.

[0068] Each flow-guiding expansion plate 30 has a fifth end 31 and a sixth end 32 opposite to each other, and a plurality of through holes 33 identical to those of the flow-guiding connecting plate 20. Each through hole 33 of each flow-guiding expansion plate 30 is located between the fifth end 31 and the sixth end 32. Therefore, the flow-guiding chamber C can communicate with the external space through each through hole 21 of each flow-guiding connecting plate 20 and each through hole 33 of each flow-guiding expansion plate 30. The fifth end 31 of each flow-guiding expansion plate 30 is substantially parallel to the fourth end 23 of the corresponding flow-guiding connecting plate 20, while its sixth end 32 is substantially perpendicular to the second end 12 of the corresponding side baffle 10.

[0069] To further explain, each flow-guiding expansion plate 30 also has a first positioning structure 34 identical to the first positioning structure 14 of the side baffle 10, and a second positioning structure 35 identical to the second positioning structure 25 of the flow-guiding connecting plate 20. Specifically, the first positioning structure 34 of each flow-guiding expansion plate 30 is located at the fifth end 31, and the first positioning structure 34 of each flow-guiding expansion plate 30 is positioned at the second positioning structure 25 of the corresponding fourth end 23 of the flow-guiding connecting plate 20 to form a positioning effect. The second positioning structure 35 of each flow-guiding expansion plate 30 is located at the sixth end 32, and the second positioning structure 35 of each flow-guiding expansion plate 30 is positioned at the first positioning structure 14 of the corresponding second end 12 of the side baffle 10 to form a positioning effect.

[0070] Furthermore, in order to cooperate with the third positioning structure 15 of the second end 12 of the side baffle 10 and the fourth positioning structure 26 of the fourth end 23 of the flow guide connecting plate 20, each flow guide expansion plate 30 also has a third positioning structure 36 identical to the third positioning structure 15 of the side baffle 10 and a fourth positioning structure 37 identical to the fourth positioning structure 26 of the flow guide connecting plate 20. Specifically, the third positioning structure 36 of each flow guide expansion plate 30 is located at the fifth end 31, and the fourth positioning structure 37 of each flow guide expansion plate 30 is located at the sixth end 32. Thus, the third positioning structure 15 of each side baffle 10 is positioned at the corresponding fourth positioning structure 37 of the flow guide expansion plate 30, and the third positioning structure 36 of each flow guide expansion plate 30 is positioned at the corresponding fourth positioning structure 26 of the flow guide connecting plate 20, thereby effectively improving the positioning effect.

[0071] The heat dissipation frame of this utility model, through the side baffles 10 arranged in parallel on the main board A3 and the heat dissipation connecting plates 20 connected in parallel between the side baffles 10, allows the side baffles 10 and the heat dissipation connecting plates 20 to jointly surround the heat source A4 with the cover plate A2 and the main board A3 to form a heat dissipation chamber C. The heat dissipation chamber C can be connected to the external space through the through holes 21 of the heat dissipation connecting plates 20. Therefore, it can not only provide air cooling for the internal heat source A4, but also has good versatility and reduces the types of parts and the number of corresponding molds, thereby effectively reducing production costs, warehousing costs and maintenance costs.

[0072] In summary, the foregoing disclosure of this utility model is intended to enable those skilled in the art to clearly understand the technical content of this utility model and implement it accordingly, and is not intended to limit the scope of patent protection of this utility model. In addition, this utility model may naturally have other embodiments not listed. Without departing from the spirit and essence of this utility model, those skilled in the art should be able to devise various corresponding changes and modifications based on this utility model, but all such corresponding changes and modifications should fall within the scope of protection of the patent application filed for this utility model.

Claims

1. A heat dissipation frame for use in an electronic device, the electronic device comprising a cover plate (A2), a motherboard (A3) disposed parallel to the cover plate (A2), and a heat source (A4) disposed on the motherboard (A3), characterized in that, The heat dissipation frame includes: A pair of side baffles (10) are arranged parallel to each other on the main board (A3), each side baffle (10) having a first end (11) and a second end (12) opposite to each other; and A pair of flow guiding connecting plates (20) are arranged parallel to each other on the main board (A3) and connected between each of the side baffles (10). Each flow guiding connecting plate (20) has a plurality of through holes (21), a third end (22) and a fourth end (23). Each of the through holes (21) of each flow guiding connecting plate (20) is located between the third end (22) and the fourth end (23). The third end (22) and the fourth end (23) of each flow guiding connecting plate (20) are respectively connected to the first end (11) of one of the side baffles (10) and the second end (12) of the other side baffle (10). Each of the side baffles (10) and each of the flow guiding connecting plates (20), together with the cover plate (A2) and the main board (A3), surround the heat source (A4) and form a flow guiding chamber (C). The flow guiding chamber (C) is connected to the external space through each of the through holes (21) of each of the flow guiding connecting plates (20).

2. The heat dissipation frame as described in claim 1, characterized in that, Each of the side baffles (10) also has a first fastening structure (13) and a pair of first positioning structures (14). The first fastening structure (13) and one of the first positioning structures (14) in each of the side baffles (10) are located at the first end (11), and the other of the first positioning structures (14) in each of the side baffles (10) is located at the second end (12). Each flow guide connecting plate (20) also has a second fastening structure (24) and a pair of second positioning structures (25). The second fastening structure (24) and one of the second positioning structures (25) in each of the flow guide connecting plates (20) are located at the third end (22), and the other of the second positioning structures (25) in each of the flow guide connecting plates (20) is located at the fourth end (23). Each first positioning structure (14) is positioned on each of the second positioning structures (25), and each first fastening structure (13) fastens to each of the second fastening structures (24).

3. The heat dissipation frame as described in claim 2, characterized in that, Each of the first positioning structures (14) is one of the ribs and the grooves, and each of the second positioning structures (25) is the other of the ribs and the grooves.

4. The heat dissipation frame as described in claim 2, characterized in that, Each of the first fastening structures (13) is one of the hook and the groove, and each of the second fastening structures (24) is the other of the hook and the groove.

5. The heat dissipation frame as described in claim 2, characterized in that, Each of the side baffles (10) also has a third positioning structure (15), and each of the flow guiding connecting plates (20) also has a fourth positioning structure (26). The third positioning structure (15) of each side baffle (10) is located at the second end (12), and the fourth positioning structure (26) of each flow guiding connecting plate (20) is located at the fourth end (23). Each third positioning structure (15) is positioned at each of the fourth positioning structures (26).

6. The heat dissipation frame as described in claim 5, characterized in that, Each of the third positioning structures (15) is one of the protrusions and the groove, and each of the fourth positioning structures (26) is the other of the protrusions and the groove.

7. The heat dissipation frame as described in claim 2, characterized in that, It also includes a pair of flow-guiding expansion plates (30), each of which is connected in parallel to the flow-guiding connecting plate (20). Each of the side baffles (10) and the flow-guiding expansion plates (30) are connected between the side baffles (10). Each of the side baffles (10), the flow-guiding connecting plates (20), and the flow-guiding expansion plates (30), together with the cover plate (A2) and the main board (A3), enclose the heat source (A4) and form the flow-guiding chamber (C).

8. The heat dissipation frame as described in claim 7, characterized in that, Each of the flow-guiding expansion plates (30) has a plurality of through holes (33) and a fifth end (31) and a sixth end (32) opposite to each other. Each of the through holes (33) of each flow-guiding expansion plate (30) is located between the fifth end (31) and the sixth end (32). The fifth end (31) and the sixth end (32) of each flow-guiding expansion plate (30) are respectively connected to the fourth end (23) of the corresponding flow-guiding connecting plate (20) and the second end (12) of the corresponding side baffle (10). The flow-guiding chamber (C) is connected to the external space through each of the through holes (21) of each flow-guiding connecting plate (20) and each of the through holes (33) of each flow-guiding expansion plate (30).

9. The heat dissipation frame as described in claim 8, characterized in that, Each of the flow-guiding expansion plates (30) further has a first positioning structure (34) and a second positioning structure (35). The first positioning structure (34) of each flow-guiding expansion plate (30) is located at the fifth end (31) and positioned at the second positioning structure (25) of the corresponding fourth end (23) of the flow-guiding connecting plate (20). The second positioning structure (35) of each flow-guiding expansion plate (30) is located at the sixth end (32) and positioned at the first positioning structure (14) of the corresponding second end (12) of the side baffle (10).

10. The heat dissipation frame as described in claim 9, characterized in that, Each of the side baffles (10) also has a third positioning structure (15) located at the second end (12), each of the flow guiding connecting plates (20) also has a fourth positioning structure (26) located at the fourth end (23), each of the flow guiding expansion plates (30) also has a third positioning structure (36) and a fourth positioning structure (37) located at the fifth end (31) and the sixth end (32) respectively, the third positioning structure (15) of each side baffle (10) is positioned at the fourth positioning structure (37) of the corresponding flow guiding expansion plate (30), and the third positioning structure (36) of each flow guiding expansion plate (30) is positioned at the fourth positioning structure (26) of the corresponding flow guiding connecting plate (20).

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