A cooling water channel and motor controller

Abstract

This application discloses a heat dissipation channel and a motor controller, belonging to the field of power module heat dissipation technology. The heat dissipation channel includes a shell and a flow guiding assembly. The shell has a receiving cavity, which has a first partition and a second partition. The flow guiding assembly is disposed within the receiving cavity and includes multiple first flow guiding structures and multiple second flow guiding structures, which are arranged at intervals along a first direction. In the first partition, the first and second flow guiding structures are staggered along a second direction, which intersects the first direction. In the second partition, at least one first flow guiding structure and at least one second flow guiding structure are arranged opposite to each other. By staggering the first and second flow guiding structures, a specific water flow path is formed, increasing the heat exchange efficiency of the coolant and enhancing the heat dissipation effect. The opposite arrangement of the first and second flow guiding structures adjusts the cross-sectional area of ​​the channel, increases the flow velocity, and improves the heat dissipation capacity.

Description

Technical Field

[0001] This application relates to the field of power module heat dissipation technology, and in particular to a heat dissipation channel and a motor controller. Background Technology

[0002] In the thermal management design of power electronic devices, the control of thermal resistance uniformity is of critical importance. Currently, the main heat dissipation method for power module structures is as follows: power devices are soldered onto a heat sink substrate, the bottom of the heat sink substrate is designed with heat dissipation fins, and heat exchange is carried out in the water channels to achieve the purpose of heat dissipation.

[0003] However, existing power modules have significant thermal management deficiencies, with poor heat dissipation at the rear end of the water channel. Utility Model Content

[0004] This application provides a heat dissipation channel to solve the technical problem of poor heat dissipation effect of the power module at the rear end of the channel; this application also provides a motor controller.

[0005] Technical solution: This application provides a heat dissipation channel, including:

[0006] A housing having a receiving cavity having a first partition and a second partition;

[0007] A flow guiding component is disposed within the accommodating cavity. The flow guiding component includes a plurality of first flow guiding structures and a plurality of second flow guiding structures, which are arranged at intervals along a first direction.

[0008] Within the first partition, the first flow guiding structure and the second flow guiding structure are staggered along the second direction, and the second direction intersects with the first direction;

[0009] Within the second partition, at least one of the first flow guiding structures is disposed opposite to at least one of the second flow guiding structures.

[0010] In some embodiments, the housing is provided with a liquid inlet and a liquid outlet, and the plurality of first flow guiding structures and the plurality of second flow guiding structures are all spaced apart between the liquid inlet and the liquid outlet;

[0011] The first partition is located on the side of the second partition closest to the inlet.

[0012] In some embodiments, the projected areas of the first flow guiding structure and the second flow guiding structure disposed opposite to each other are different on the plane defined by the first direction and the second direction.

[0013] In some embodiments, the dimension of one of the first flow guiding structure and the second flow guiding structure disposed opposite to each other along the first direction is smaller than that of the other.

[0014] And / or, the dimension of one of the first flow guiding structure and the second flow guiding structure disposed opposite to each other along the second direction is smaller than that of the other.

[0015] In some embodiments, the housing includes a first sidewall and a second sidewall, the first sidewall and the second sidewall being spaced apart to form the accommodating cavity;

[0016] The first flow guiding structure is disposed on the first sidewall, and the second flow guiding structure is disposed on the second sidewall.

[0017] In some embodiments, both the first flow guiding structure and the second flow guiding structure include a first arc surface and a second arc surface connected to each other. The first arc surface and the second arc surface of the first flow guiding structure are respectively connected to the first sidewall, and the first arc surface and the second arc surface of the second flow guiding structure are respectively connected to the second sidewall.

[0018] In some embodiments, the housing further has an opening that communicates with the receiving cavity;

[0019] The cooling channel further includes a heat dissipation component, which includes a connected substrate and a plurality of heat dissipation teeth. The substrate covers the opening and contacts the first flow guiding structure and the second flow guiding structure. The plurality of heat dissipation teeth are disposed in the accommodating cavity.

[0020] In some embodiments, the housing includes a plurality of guide surfaces that surround the opening, a first sidewall of the housing is connected to at least one of the guide surfaces, and a second sidewall of the housing is connected to at least one of the guide surfaces.

[0021] In some embodiments, the housing is provided with a liquid inlet and a liquid outlet, and the first partition is located on the side of the second partition closer to the liquid inlet;

[0022] Multiple heat dissipation components are spaced apart between the liquid inlet and the liquid outlet, and distributed within the first partition and the second partition. The total heat dissipation area of ​​the heat dissipation components located in the first partition is less than the total heat dissipation area of ​​the heat dissipation components located in the second partition.

[0023] This application also discloses a motor controller, including the cooling water channels as described in the above embodiments.

[0024] In some embodiments, the housing is provided with a liquid inlet and a liquid outlet, and the first partition is located on the side of the second partition closer to the liquid inlet;

[0025] The controller further includes at least two power devices, with at least one power device located in the first partition and at least one power device located in the second partition. The power consumption of the power device located in the first partition is less than the power consumption of the power device located in the second partition.

[0026] In some embodiments, the at least two power devices are arranged at intervals between the liquid inlet and the liquid outlet;

[0027] On the plane where the first direction and the second direction intersect, the orthographic projection of the power device is located between the orthographic projections of the first flow guiding structure and the second flow guiding structure, and on the plane perpendicular to the first direction, the orthographic projection of the power device is staggered from the orthographic projections of the first flow guiding structure and / or the second flow guiding structure along the second direction.

[0028] In some embodiments, the power device includes a body portion and a heating portion, the body portion and the heating portion are arranged along the first direction, and the arrangement directions of the body portion and the heating portion of two adjacent power devices are opposite.

[0029] Within the first partition, at least one of the power devices is provided with a first flow guiding structure and a second flow guiding structure on the side near the liquid inlet, wherein the one of the first flow guiding structure and the second flow guiding structure that is closest to the power device is located on the side of the power device's body that is away from the heating element;

[0030] Alternatively, within the first partition, at least one of the power devices is provided with the first flow guiding structure or the second flow guiding structure on the side near the liquid inlet, wherein the first flow guiding structure or the second flow guiding structure is located on the side of the body portion of the power device away from the heating portion.

[0031] Beneficial Effects: The heat dissipation channel in this embodiment includes a shell and a flow guiding assembly. The shell has a receiving cavity, which has a first partition and a second partition. The flow guiding assembly is disposed within the receiving cavity and includes multiple first flow guiding structures and multiple second flow guiding structures, which are arranged at intervals along a first direction. Within the first partition, the first and second flow guiding structures are staggered along a second direction, which intersects with the first direction. Within the second partition, at least one first flow guiding structure and at least one second flow guiding structure are arranged opposite to each other. By staggering the first and second flow guiding structures, a specific water flow path is formed, increasing the heat exchange efficiency of the coolant and enhancing the heat dissipation effect. The opposite arrangement of the first and second flow guiding structures adjusts the cross-sectional area of ​​the channel, increases the flow velocity, and improves the heat dissipation capacity.

[0032] The motor controller of this application includes the heat dissipation channel as described in the above embodiments. Therefore, it can have all the technical features and effects of the above-described heat dissipation channel, which will not be repeated here. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a three-dimensional structural diagram of the heat dissipation channel in an embodiment of this application;

[0035] Figure 2 This is a top view of the heat dissipation channel structure in an embodiment of this application;

[0036] Figure 3 This is an exploded view of the controller according to an embodiment of this application;

[0037] Figure 4 This is a top perspective view of the heat sink and power devices in the controller of an embodiment of this application;

[0038] Figure 5 This is a partial cross-sectional view of the controller according to an embodiment of this application, showing the assembly position relationship of the heat sink, power device and housing;

[0039] Figure 6 for Figure 5 A magnified view of a portion of point A in the middle.

[0040] Explanation of reference numerals in the attached figures:

[0041] 10. Housing; 100. Receiving cavity; 101. First partition; 102. Second partition; 20. Flow guiding assembly; 210. First flow guiding structure; 220. Second flow guiding structure; X, First direction; Y, Second direction; 103. Liquid inlet; 104. Liquid outlet; 110. First sidewall; 120. Second sidewall; 201. First arc surface; 202. Second arc surface; 105. Opening; 30. Heat sink; 310. Substrate; 320. Heat dissipation teeth; 130. Guide surface; 40. Power device; 410. Body part; 420. Heating part. Detailed Implementation

[0042] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0043] In the description of this application, it should be understood that the terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. In the description of this application, "multiple" means two or more, and "at least one" can refer to one, two, or more, unless otherwise explicitly specified. The terms "first," "second," and "third," etc., are only for the convenience of description and are used to name parts or embodiments by number, and do not imply any order of importance between the parts or embodiments.

[0044] It should also be noted that in the accompanying drawings of this application, the arrow marked X indicates the first direction X, and the arrow marked Y indicates the second direction Y. The introduction of the first direction X and the second direction Y in the description of this application is to more clearly define the structure and relative positional relationship of each component in the heat dissipation channel. In actual implementation, the first direction X and the second direction Y are generally horizontal, and the first direction X intersects the second direction Y. Optionally, the first direction X and the second direction Y are perpendicular to optimize the heat dissipation channel layout. In the description of this application, "perpendicular" means completely perpendicular to 90° or almost completely perpendicular; for example, an angle within the range of 80° to 100° is considered perpendicular. Similarly, "parallel" means completely parallel or almost completely parallel; for example, a completely parallel angle within the range of 10° is considered parallel.

[0045] As a preamble to the embodiments of this application, thermal resistance uniformity control is of crucial importance in the thermal management design of power electronic devices. Currently, the main heat dissipation method for power module structures is as follows: power devices are soldered onto a heat dissipation substrate, and the bottom of the heat dissipation substrate is designed with heat dissipation fins, which exchange heat in the channels to achieve heat dissipation. However, existing single-row linear layout power modules have significant thermal management defects. The heat dissipation channels form a narrow and elongated region with a small channel width, resulting in poor heat dissipation at the rear end of the channel, which in turn affects the performance and reliability of the module system. As the design of single-row layout of power devices places higher demands on the heat dissipation structure, the design of the heat dissipation substrate becomes more complex. During the production process and after-sales service, significant losses are often caused by substrate leakage, wear, and collisions.

[0046] In view of this, embodiments of this application provide a heat dissipation channel, which aims to solve at least one of the above-mentioned technical problems.

[0047] Please see Figure 1 As shown, this application embodiment provides a heat dissipation channel, including a housing 10 and a flow guiding assembly 20. The housing 10 has a receiving cavity 100, which has a first partition 101 and a second partition 102. The flow guiding assembly 20 is disposed within the receiving cavity 100 and includes a plurality of first flow guiding structures 210 and a plurality of second flow guiding structures 220. The plurality of first flow guiding structures 210 and the plurality of second flow guiding structures 220 are arranged at intervals along a first direction X. In the first partition 101, the first flow guiding structures 210 and the second flow guiding structures 220 are arranged in a staggered manner along a second direction Y, and the second direction Y intersects the first direction X. In the second partition 102, at least one first flow guiding structure 210 and at least one second flow guiding structure 220 are disposed opposite to each other. It should be understood that the flow guiding assembly 20 of this application is disposed within the receiving cavity 100 for adjusting the flow path of the coolant in the receiving cavity 100. The first flow guiding structure 210 and the second flow guiding structure 220 are arranged at intervals along the first direction X to change the coolant flow channel structure in the receiving cavity. The division of the first section 101 and the second section 102 of the receiving cavity can be based on the flow direction of the coolant, with the front section after the coolant enters the receiving cavity 100 designated as the first section 101 and the rear section designated as the second section 102.

[0048] Specifically, within the first partition 101, the first flow guiding structure 210 and the second flow guiding structure 220 are staggered along the second direction Y, which intersects with the first direction X. It should be understood that the staggered arrangement means that, along the first direction X, the projections of the first flow guiding structure 210 and the second flow guiding structure 220 on the inner wall of the housing 10 do not overlap at least partially, forming a serpentine flow path. This staggered arrangement alters the extension direction of the coolant flow channels within the first partition 101, breaking the conventional flow path of the coolant in the channels, avoiding laminar flow, and promoting turbulent flow of the coolant to fully absorb heat. Turbulence significantly increases the contact area and contact time between the coolant and the heat dissipation substrate 310 and the heat dissipation fins 320, greatly improving heat exchange efficiency.

[0049] Within the second partition 102, at least one first flow guide structure 210 and at least one second flow guide structure 220 are arranged opposite to each other. The opposite arrangement means that along the first direction X, the projections of the first flow guide structure 210 and the second flow guide structure 220 on the inner wall of the housing 10 overlap to form a narrow channel, reduce the cross-sectional area of ​​the flow channel, accelerate the flow rate of the coolant within the second partition 102, improve the heat dissipation capacity, effectively improve the problem of poor heat dissipation effect at the rear end of the heat dissipation channel, and thus improve the uniformity and effectiveness of heat dissipation for the power module.

[0050] In some embodiments, the first flow guiding structure 210 and the second flow guiding structure 220 may be curved plate-like structures. In some embodiments, the first flow guiding structure 210 and the second flow guiding structure 220 may be straight plates with protrusions. It should be understood that the flow guiding assembly 20 may be disposed on two side walls of the housing 10 along the first direction X, or disposed within the housing 10 and cooperate with the two side walls to form parallel dual flow channels. In some embodiments, the first flow guiding structure 210 and the second flow guiding structure 220 may be columnar structures, which may be disposed perpendicular to the bottom surface of the accommodating cavity 100, and their shape may be a cylinder, a prism, etc.

[0051] It is also important to understand that the division between the first partition 101 and the second partition 102 is related to the heat dissipation requirements of the power devices 40 on the water-cooled plate. For power devices 40 with high heat generation and high heat dissipation requirements, they are arranged in the first partition 101, which mainly undertakes the functions of rapid heat absorption and initial heat dissipation. For power devices 40 with relatively low heat generation and relatively low heat dissipation requirements, they are arranged in the second partition 102, which focuses on further heat dissipation and adjustment of thermal resistance uniformity.

[0052] Please see Figure 2 As shown, in some embodiments, the housing 10 is provided with an inlet 103 and an outlet 104, and multiple first flow guiding structures 210 and multiple second flow guiding structures 220 are spaced apart between the inlet 103 and the outlet 104; the first partition 101 is located on the side of the second partition 102 near the inlet 103. It should be understood that by spaced apart multiple first flow guiding structures 210 and multiple second flow guiding structures 220 between the inlet 103 and the outlet 104, the coolant can be guided to form a specific flow path within the housing 10. The staggered arrangement of the first flow guiding structures 210 and second flow guiding structures 220 in the first partition 101, and the opposite arrangement of the first flow guiding structures 210 and second flow guiding structures 220 in the second partition 102, allows the coolant to have different flow characteristics in different areas, avoiding simple straight-line flow of the coolant, increasing the contact area and contact time between the coolant and the heat dissipation components, and improving heat dissipation efficiency.

[0053] The first partition 101 is located on the side of the second partition 102 near the inlet 103, so that the low-temperature coolant entering the accommodating cavity 100 first flows through the first partition 101. In the first partition 101, strong turbulence is formed by the staggered flow guiding structure, which quickly absorbs the large amount of heat generated by the power module. Then the coolant enters the second partition 102. At this time, the coolant temperature rises, but the flow rate and direction of the coolant are further adjusted by the relatively arranged flow guiding structure in the second partition 102, so that the coolant can dissipate heat more evenly to the rest of the power module. This improves the heat dissipation uniformity of the entire power module, reduces the thermal resistance difference, and improves the performance and reliability of the module system.

[0054] Please see Figure 2 As shown, in some embodiments, the first guide structure 210 and the second guide structure 220, which are arranged opposite to each other on the plane defined by the first direction X and the second direction Y, have different projected areas. It should be understood that by setting the first guide structure 210 and the second guide structure 220 with different projected areas, the flow direction and flow field distribution of the coolant are changed. For example, the first guide structure 210 and the second guide structure 220, which have the same shape but different projected areas, can form an asymmetric flow within the water channel by being arranged opposite to each other, thereby forming an eccentric vortex, breaking the uniform flow field, accelerating the mixing of hot and cold fluids, and improving heat exchange efficiency.

[0055] More specifically, the guide structure with a larger projected area is used to guide the coolant flow to the location of the heat source, while the guide structure with a smaller projected area is used in conjunction with the guide structure with a larger projected area to adjust the cross-sectional area of ​​the flow channel, accelerate the coolant flow rate, and improve heat dissipation efficiency. Different projected areas allow the coolant to experience different resistances and turbulence effects as it flows through the relatively arranged first guide structure 210 and second guide structure 220, thereby breaking the conventional laminar flow state and promoting a more complex and uniform turbulent flow state.

[0056] Please see Figure 2 As shown, in some embodiments, one of the relatively arranged first guide structure 210 and second guide structure 220 has a smaller dimension along the first direction X than the other. This different dimensioning causes different flow paths and velocity variations in the coolant as it flows through the first guide structure 210 and the second guide structure 220. The guide structure with a larger dimension along the first direction X primarily guides the coolant from the channel boundary to the heat-generating area of ​​the power device 40, increasing the contact area between the coolant and the heat source and improving heat dissipation. The guide structure with a smaller dimension along the first direction X causes localized coolant disturbances, which, in conjunction with the guide structure with a larger dimension along the first direction X, change the cross-sectional size of the flow channel throughout the flow field, increasing the coolant flow velocity and thus improving heat dissipation.

[0057] In some embodiments, one of the relatively disposed first flow guiding structure 210 and second flow guiding structure 220 has a smaller dimension along the second direction Y than the other. It should be understood that by changing the dimensions of the first flow guiding structure 210 and the second flow guiding structure 220 in the second direction Y, the flow direction of the coolant is altered, breaking the conventional laminar flow state, enhancing the fluid mixing effect, allowing the coolant to make more thorough contact with the heat dissipation surface, and improving heat exchange efficiency.

[0058] Please see Figure 3 As shown, in some embodiments, the housing 10 includes a first sidewall 110 and a second sidewall 120, which are spaced apart to form a receiving cavity 100. A first flow guiding structure 210 is disposed on the first sidewall 110, and a second flow guiding structure 220 is disposed on the second sidewall 120. It should be understood that placing the first flow guiding structure 210 on the first sidewall 110 and the second flow guiding structure 220 on the second sidewall 120 makes the flow path of the coolant within the receiving cavity 100 more rational. During the flow process, the coolant is subjected to the combined action of the flow guiding structures on both sidewalls, thereby changing the flow direction and speed, increasing the opportunity for the coolant to contact the heat source, and helping to improve heat exchange efficiency. The coolant is simultaneously guided and disturbed by the flow guiding structures on both sides, avoiding the situation where the coolant concentrates on one side, thus making the heat dissipation within the entire receiving cavity 100 more uniform, reducing the temperature difference between different parts of the power module, improving thermal resistance uniformity, and helping to ensure the performance and reliability of the power module.

[0059] Furthermore, the first sidewall 110 and the second sidewall 120 are spaced apart and respectively support the flow guiding structure, which can share the pressure and impact force generated when the coolant flows, making the shell 10 structure more stable, reducing the risk of structural damage caused by excessive local stress, and extending the service life of the heat dissipation channel.

[0060] Please see Figure 2 and Figure 3As shown, in some embodiments, both the first flow guiding structure 210 and the second flow guiding structure 220 include a first arc surface 201 and a second arc surface 202 connected to each other. The first arc surface 201 and the second arc surface 202 of the first flow guiding structure 210 are respectively connected to the first sidewall 110, and the first arc surface 201 and the second arc surface 202 of the second flow guiding structure 220 are respectively connected to the second sidewall 120. It should be understood that both the first flow guiding structure 210 and the second flow guiding structure 220 are formed by two connected arc surfaces. The arc surface design can reduce the flow resistance of the coolant, reduce energy consumption, and make the coolant flow more smoothly. At the same time, the arc surface can guide the coolant at the boundary of the water channel to mix with the coolant inside the water channel, so that the hot and cold fluids are mixed more fully and the heat dissipation efficiency is improved. The first arc surface 201 is located on the side of the second arc surface 202 near the liquid inlet 103. The first arc surface 201 protrudes towards the second arc surface 202. The first arc surface 201 can smoothly guide the coolant in the water channel and reduce the impact force of the water flow on the shell 10. The second arc surface 202 protrudes towards the first arc surface 201. After the coolant passes through the first or second protrusion, the cross-section of the water channel first becomes smaller and then larger. The second arc surface 202 can reduce the pressure of the coolant and at the same time reduce the risk of coolant backflow or stagnation, ensuring uniform heat dissipation.

[0061] In some embodiments, the first arc surface 201 is concave towards the second arc surface 202, and the second arc surface 202 is concave towards the first arc surface 201, so that the first arc surface 201 and the second arc surface 202 bulge towards the water channel. The first arc surface 201 can smoothly guide the coolant near the water channel boundary to converge towards the heat source, thereby increasing the contact area between the coolant and the heat source. The second arc surface 202 is used to guide the coolant that is exchanging heat with the heat source towards the water channel boundary, so as to keep the coolant temperature at different locations in the water channel uniform, thereby making the heat dissipation in the entire accommodating cavity 100 more uniform, reducing the temperature difference between different parts of the power module, improving the uniformity of thermal resistance, and helping to ensure the performance and reliability of the power module. Furthermore, the structure of the first arc surface 201 and the second arc surface 202 can disperse the pressure and impact force generated when the coolant flows, making the structure of the shell 10 more stable, reducing the risk of structural damage caused by excessive local stress, and extending the service life of the heat dissipation channel.

[0062] In some embodiments, the housing 10 further has an opening 105 communicating with the accommodating cavity 100; the heat dissipation channel further includes a heat dissipation component 30, which includes a connected substrate 310 and a plurality of heat dissipation teeth 320. The substrate 310 covers the opening 105 and contacts the first flow guiding structure 210 and the second flow guiding structure 220, and the plurality of heat dissipation teeth 320 are disposed within the accommodating cavity 100. It should be understood that by reserving a blank area on the substrate 310 of the heat dissipation component 30 to avoid the first flow guiding structure 210 and the second flow guiding structure 220, the substrate 310, while covering the opening 105, has its side with heat dissipation teeth 320 abutting against the first flow guiding structure 210 and the second flow guiding structure 220, resulting in a more stable overall structure. Heat is transferred to the heat dissipation teeth 320 through the substrate 310, and the heat on the heat dissipation teeth 320 is carried away by the coolant flowing through the heat dissipation teeth 320. The first flow guiding structure 210 and the second flow guiding structure 220 can not only support the heat dissipation component 30, but also provide flow guiding function to ensure that the fluid boundary of the coolant participates in heat exchange, thereby improving heat exchange efficiency.

[0063] Please see Figure 5 and Figure 6 As shown, in some embodiments, the housing 10 includes a plurality of guide surfaces 130, which form an opening 105. A first sidewall 110 of the housing 10 is connected to at least one guide surface 130, and a second sidewall 120 of the housing 10 is connected to at least one guide surface 130. It should be understood that the guide surface 130 can be an inclined plane, or the guide surface 130 can be a chamfered structure. Overall, the guide surfaces 130 provided on the housing 10 create a funnel-shaped structure in the accommodating cavity 100 near the opening 105, facilitating the installation of the heat dissipation teeth 320 of the heat sink 30 into the accommodating cavity 100; at the same time, ensuring a reasonable gap between the heat dissipation teeth 320 and the inner wall of the housing 10.

[0064] In some embodiments, the housing 10 is provided with an inlet 103 and an outlet 104. The first partition 101 is located on the side of the second partition 102 near the inlet 103. A plurality of heat sinks 30 are spaced apart between the inlet 103 and the outlet 104 and distributed within the first partition 101 and the second partition 102. The total heat dissipation area of ​​the heat sinks 30 in the first partition 101 is less than the total heat dissipation area of ​​the heat sinks 30 in the second partition 102. It should be understood that by arranging heat sinks 30 with larger heat dissipation areas in the second partition 102, the heat dissipation capacity of the middle and later sections of the water channel is improved. The smaller heat dissipation area in the first partition 101 can prevent the coolant from overheating when it first enters, which would cause the temperature of the power device 40 to drop too quickly; at the same time, it ensures that the coolant still has a high heat dissipation capacity when it flows to the second partition 102. The larger heat dissipation area of ​​the second partition 102 can effectively reduce the temperature in this area, reduce the temperature difference in the entire heat dissipation area, avoid local overheating, improve the uniformity of heat dissipation, help maintain the stable operation of power modules and other equipment, and reduce the risk of performance degradation or failure caused by temperature differences.

[0065] Specifically, the size of the heat dissipation area can be controlled by adjusting the number of heat dissipation fins 320 arranged in the first partition 101 and the second partition 102. Alternatively, the shape of the heat dissipation fins 320 in the first partition 101 and the second partition 102 can be controlled so that the total heat dissipation area of ​​the first partition 101 is less than the total heat dissipation area of ​​the second partition 102. The heat dissipation areas of the first partition 101 and the second partition 102 can also be adjusted by controlling the size of the heat dissipation fins 320 in the first partition 101 and the second partition 102. Specifically, in one embodiment, by arranging more heat dissipation fins 320 in the second partition 102 and making the gaps between the heat dissipation fins 320 smaller, the contact area between the heat dissipation fins 320 and the coolant in the second partition 102 is larger, thereby improving the heat dissipation capacity of the later section of the water channel.

[0066] This application also discloses a motor controller, including the heat dissipation channel as described in the above embodiments. Therefore, it can possess all the technical features and effects of the aforementioned heat dissipation channel, which will not be elaborated further here.

[0067] In some embodiments, the housing 10 is provided with a liquid inlet 103 and a liquid outlet 104. The first partition 101 is located on the side of the second partition 102 near the liquid inlet 103. The controller also includes at least two power devices 40, with at least one power device 40 disposed in the first partition 101 and at least one power device 40 disposed in the second partition 102. The power consumption of the power device 40 located in the first partition 101 is less than that of the power device 40 located in the second partition 102. It should be understood that the first partition 101 is located near the liquid inlet 103, where the heat exchange capacity of the coolant is high. By placing the power device 40 with lower power consumption in the first partition 101, the heat dissipation requirements of the power device 40 can be ensured, while ensuring that the coolant in the second partition 102 can effectively exchange heat. This fully utilizes the temperature change characteristics of the coolant, improves the overall efficiency of the heat dissipation system, and achieves a reasonable allocation of heat dissipation resources. For the second partition 102, denser heat dissipation fins 320, a larger heat dissipation area, or a more complex flow guiding structure can be used to meet its higher heat dissipation requirements; while the first partition 101 can have its heat dissipation design appropriately simplified, reducing cost and manufacturing difficulty while ensuring heat dissipation effect. Distributing power devices 40 with different power consumptions in different partitions avoids excessive heat concentration in any one area. By rationally allocating the power devices 40, the temperature distribution within the entire controller becomes more balanced, reducing the occurrence of localized overheating.

[0068] In some embodiments, at least two power devices 40 are spaced apart between the inlet 103 and the outlet 104. On the plane where the first direction X and the second direction Y intersect, the orthographic projection of the power device 40 lies between the orthographic projections of the first flow guiding structure 210 and the second flow guiding structure 220. Furthermore, on a plane perpendicular to the first direction X, the orthographic projection of the power device 40 is staggered from the orthographic projections of the first flow guiding structure 210 and / or the second flow guiding structure 220 along the second direction Y. It should be understood that in the first direction X, the arrangement of the power device 40 is at a certain distance from both the first flow guiding structure 210 and the second flow guiding structure 220, allowing the coolant to exchange heat with the area near the power device 40 after passing through the first flow guiding structure 210 and the second flow guiding structure 220.

[0069] On a plane perpendicular to the first direction X, the orthographic projection of the power device 40 is staggered from the orthographic projection of the first flow guiding structure 210 and / or the second flow guiding structure 220 along the second direction Y. This can be understood as the orthographic projection of the power device 40 not overlapping with the orthographic projection of the first flow guiding structure 210 and / or the second flow guiding structure 220 on the plane perpendicular to the first direction X, thus disrupting the flow path of the coolant and promoting stronger turbulence. Turbulence increases the contact area and contact time between the coolant and the heat dissipation surface of the power device 40, significantly improving heat exchange efficiency and thus more effectively removing the heat generated by the power device 40, reducing its operating temperature. This staggered arrangement avoids the formation of localized flow dead zones or areas with excessively slow flow rates around the power device 40. The coolant can more evenly cover the heat dissipation surface of the power device 40, reducing the temperature difference between different parts of the power device 40 and improving the uniformity of heat dissipation. Uniform heat dissipation helps maintain the stable performance of power device 40, reduces thermal stress caused by temperature differences, extends the service life of power device 40, and improves the reliability of the entire power module system.

[0070] The coordinated operation of the first guide structure 210 and the second guide structure 220 helps to enhance heat exchange efficiency and optimize the flow field distribution within the water channel. The first guide structure 210 and the second guide structure 220 guide the coolant at the water channel boundary to the heat source. As the coolant flows around the power device 40, the flow path becomes more complex and turbulent, increasing the contact opportunities and contact time between the coolant and the surface of the power device 40, thereby improving heat exchange capacity and efficiency. In the cooling path within the first partition 101, the coolant first passes through the first guide structure 210, then flows through the power device 40, then through the second guide structure 220, and then through the next group of power devices 40, circulating sequentially. In the cooling path within the second partition 102, the coolant passes through the relatively arranged first guide structure 210 and second guide structure 220, then flows through the power device 40, then through the next group of relatively arranged first guide structures 210 and second guide structures 220, circulating sequentially until it reaches the outlet 104. After bypassing the flow guide structure, the coolant impacts the surface of the power device 40 at different angles and velocities, enhancing the convective heat transfer effect. The staggered arrangement ensures a uniform flow field distribution, guaranteeing effective heat dissipation for each power device 40, reducing temperature differences between power devices 40, improving thermal resistance uniformity, and thus enhancing the performance and reliability of the entire power module.

[0071] Please see Figure 4As shown, in some embodiments, the power device 40 includes a body portion 410 and a heating portion 420, which are arranged along a first direction X, and the arrangement directions of the body portions 410 and heating portions 420 of two adjacent power devices 40 are opposite. Within the first partition 101, at least one power device 40 has a first flow guiding structure 210 and a second flow guiding structure 220 on the side near the liquid inlet 103. The first flow guiding structure 210 and the second flow guiding structure 220 closest to the power device 40 are located on the side of the body portion 410 of the power device 40 away from the heating portion 420. It should be understood that the opposite arrangement directions of the body portions 410 and heating portions 420 of two adjacent power devices 40 make the heat generated by the power device 40 more dispersed, avoiding excessive heat concentration in a certain area. The power device 40 has a first flow guiding structure 210 and a second flow guiding structure 220 on the side near the liquid inlet 103. The one closest to the power device 40 is located on the side of the body 410 of the power device 40 away from the heat-generating part 420. This arrangement allows the low-temperature coolant entering the receiving cavity 100 to first contact the body 410 of the power device 40. Since the body 410 usually generates a certain amount of heat, the coolant can first remove this heat before flowing to the heat-generating part 420. At the same time, the flow guiding structure guides the coolant to form a reasonable flow path around the power device 40, increasing the contact opportunity between the coolant and the heat-generating part 420, efficiently removing the large amount of heat generated by the heat-generating part 420, achieving targeted heat dissipation for different parts of the power device 40, balancing the temperature distribution of the power device 40, and reducing the risk of local overheating.

[0072] In other embodiments, within the first partition 101, at least one power device 40 has a first flow guiding structure 210 or a second flow guiding structure 220 on the side near the liquid inlet 103. The first flow guiding structure 210 or the second flow guiding structure 220 is located on the side of the power device 40's body 410 away from the heat-generating part 420. It should be understood that when the power device 40 has only one of the first flow guiding structure 210 and the second flow guiding structure 220 on the side near the liquid inlet 103, the first flow guiding structure 210 or the second flow guiding structure 220 is arranged on the side of the power device 40's body 410 away from the heat-generating part 420. Similarly, by placing the power device 40 on the guiding path of the flow guiding structure, the low-temperature coolant can preferentially contact the body 410 of the power device 40, and then the coolant flows to the heat-generating part 420, using its remaining heat dissipation capacity to carry away a large amount of heat from the heat-generating part 420. This achieves targeted heat dissipation for different parts of the power device 40 and improves heat dissipation efficiency. The flow-guiding structure guides the coolant to form a specific flow path around the power device 40. By changing the flow direction and velocity of the coolant, the laminar flow state of the coolant is broken, promoting turbulence and increasing the contact area and contact time between the coolant and the heat dissipation surface of the power device 40, thereby enhancing the heat exchange process. Simultaneously, it avoids the formation of flow dead zones around the power device 40, allowing the coolant to be distributed more evenly around the device, further improving the uniformity of heat dissipation.

[0073] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0074] The above provides a detailed description of the heat dissipation channel and motor controller provided in the embodiments of this application, and uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation channel, characterized in that, include: The housing (10) has a receiving cavity (100) having a first partition (101) and a second partition (102); A flow guiding component (20) is disposed within the accommodating cavity (100). The flow guiding component (20) includes a plurality of first flow guiding structures (210) and a plurality of second flow guiding structures (220). The plurality of first flow guiding structures (210) and the plurality of second flow guiding structures (220) are arranged at intervals along a first direction (X). Within the first partition (101), the first flow guiding structure (210) and the second flow guiding structure (220) are staggered along the second direction (Y), and the second direction (Y) intersects with the first direction (X); Within the second partition (102), at least one of the first flow guiding structures (210) is disposed opposite to at least one of the second flow guiding structures (220).

2. The heat dissipation channel according to claim 1, characterized in that, The housing (10) is provided with a liquid inlet (103) and a liquid outlet (104), and the plurality of first flow guiding structures (210) and the plurality of second flow guiding structures (220) are all spaced apart between the liquid inlet (103) and the liquid outlet (104); The first partition (101) is located on the side of the second partition (102) near the liquid inlet (103).

3. The heat dissipation channel according to claim 1, characterized in that, On the plane defined by the first direction (X) and the second direction (Y), the projected areas of the first flow guiding structure (210) and the second flow guiding structure (220) arranged opposite to each other are different.

4. The heat dissipation channel according to claim 3, characterized in that, The dimension of one of the first flow guiding structure (210) and the second flow guiding structure (220) arranged opposite to each other is smaller than that of the other in the first direction (X); And / or, the dimension of one of the first flow guiding structure (210) and the second flow guiding structure (220) disposed opposite to each other is smaller than that of the other in the second direction (Y).

5. The heat dissipation channel according to any one of claims 1 to 4, characterized in that, The housing (10) includes a first sidewall (110) and a second sidewall (120), which are spaced apart to form the accommodating cavity (100); The first flow guiding structure (210) is disposed on the first sidewall (110), and the second flow guiding structure (220) is disposed on the second sidewall (120).

6. The heat dissipation channel according to claim 5, characterized in that, Both the first flow guiding structure (210) and the second flow guiding structure (220) include a first arc surface (201) and a second arc surface (202) connected to each other. The first arc surface (201) and the second arc surface (202) of the first flow guiding structure (210) are respectively connected to the first side wall (110), and the first arc surface (201) and the second arc surface (202) of the second flow guiding structure (220) are respectively connected to the second side wall (120).

7. The heat dissipation channel according to any one of claims 1 to 6, characterized in that, The housing (10) also has an opening (105) that communicates with the receiving cavity (100); The heat dissipation channel also includes a heat dissipation component (30), which includes a connected substrate (310) and a plurality of heat dissipation teeth (320). The substrate (310) covers the opening (105) and contacts the first flow guiding structure (210) and the second flow guiding structure (220). The plurality of heat dissipation teeth (320) are disposed in the accommodating cavity (100).

8. The heat dissipation channel according to claim 7, characterized in that, The housing (10) includes a plurality of guide surfaces (130) that form the opening (105). A first sidewall (110) of the housing (10) is connected to at least one of the guide surfaces (130), and a second sidewall (120) of the housing (10) is connected to at least one of the guide surfaces (130).

9. The heat dissipation channel according to claim 7, characterized in that, The housing (10) is provided with a liquid inlet (103) and a liquid outlet (104), and the first partition (101) is located on the side of the second partition (102) near the liquid inlet (103); Multiple heat sinks (30) are spaced apart between the liquid inlet (103) and the liquid outlet (104), and are distributed in the first partition (101) and the second partition (102). The total heat dissipation area of ​​the heat sinks (30) located in the first partition (101) is less than the total heat dissipation area of ​​the heat sinks (30) located in the second partition (102).

10. A motor controller, characterized in that, Includes the cooling channels as described in any one of claims 1 to 9.

11. The motor controller according to claim 10, characterized in that, The housing (10) is provided with a liquid inlet (103) and a liquid outlet (104), and the first partition (101) is located on the side of the second partition (102) near the liquid inlet (103); The controller further includes at least two power devices (40), with at least one power device located in the first partition (101) and at least one power device located in the second partition (102). The power consumption of the power device located in the first partition (101) is less than the power consumption of the power device located in the second partition (102).

12. The motor controller according to claim 11, characterized in that, The at least two power devices are arranged at intervals between the liquid inlet (103) and the liquid outlet (104); On the plane where the first direction (X) and the second direction (Y) intersect, the orthographic projection of the power device is located between the orthographic projections of the first flow guiding structure (210) and the second flow guiding structure (220), and on the plane perpendicular to the first direction (X), the orthographic projection of the power device is staggered from the orthographic projections of the first flow guiding structure (210) and / or the second flow guiding structure (220) along the second direction (Y).

13. The motor controller according to claim 12, characterized in that, The power device includes a body portion (410) and a heating portion (420), the body portion (410) and the heating portion (420) are arranged along the first direction (X), and the arrangement directions of the body portion (410) and the heating portion (420) of two adjacent power devices are opposite. Within the first partition (101), at least one of the power devices is provided with a first flow guiding structure (210) and a second flow guiding structure (220) on the side near the liquid inlet (103), wherein the one of the first flow guiding structure (210) and the second flow guiding structure (220) closest to the power device is located on the side of the power device's body portion (410) away from the heating portion (420); Alternatively, within the first partition (101), at least one of the power devices is provided with the first flow guiding structure (210) or the second flow guiding structure (220) on the side near the liquid inlet (103), wherein the first flow guiding structure (210) or the second flow guiding structure (220) is located on the side of the body portion (410) of the power device away from the heating portion (420).

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