Chip adapter with heat dissipation duct

Abstract

This utility model discloses a chip adapter with heat dissipation channels, including a chip adapter body, which includes a chip positioning frame and a base. The chip positioning frame is mounted on the base and forms a chip positioning groove. The chip positioning frame and the base cooperate to form a plurality of through heat dissipation channels, which are connected to the interior of the chip positioning groove. This utility model's chip adapter with heat dissipation channels solves the problem of chip heat dissipation, reduces the chip surface temperature, and ensures the correctness of data burning.

Description

Technical Field

[0001] This utility model belongs to the field of chip adapter technology, and in particular relates to a chip adapter with heat dissipation channels. Background Technology

[0002] Current chip adapter designs lack proper heat dissipation channels. Heat dissipation is typically achieved through heat-dissipating materials or external fans within the adapter. However, heat-dissipating materials have limited effectiveness. During high-speed programming of large-capacity chips, the chip generates heat, and if this heat cannot be dissipated in time, it may cause programming errors. External fans, on the other hand, require significant space, which is detrimental to compact circuit board designs. Summary of the Invention

[0003] To address the shortcomings of the existing technology, this utility model aims to provide a chip adapter with a heat dissipation channel, which solves the problem of chip heat dissipation, reduces the chip surface temperature, and ensures the correctness of data burning.

[0004] To achieve the above objectives, this utility model provides a chip adapter with heat dissipation channels, including a chip adapter body, the chip adapter body including a chip limiting frame and a base, the chip limiting frame being installed on the base, the chip limiting frame forming a chip limiting groove, the chip limiting frame and the base cooperating to form a plurality of through heat dissipation channels, the heat dissipation channels being in communication with the inside of the chip limiting groove.

[0005] In one embodiment, the heat dissipation channel is perpendicular to the chip limiting bracket and the base.

[0006] In one embodiment, a probe contact portion is provided in the middle of the bottom surface of the chip limiting groove, and a plurality of first heat dissipation through holes or heat dissipation openings are formed on the outer side of the probe contact portion; the base forms a second heat dissipation through hole corresponding to the position of the first heat dissipation through hole or the heat dissipation opening; the first heat dissipation through hole and the second heat dissipation through hole or the heat dissipation opening and the second heat dissipation through hole cooperate to form the heat dissipation channel.

[0007] In one embodiment, at least one first heat dissipation through hole or heat dissipation opening is formed on one side, two sides, three sides or all four sides of the probe contact portion.

[0008] As one implementation, the cross-sectional shape of the heat dissipation channel includes elliptical, circular, and rectangular shapes.

[0009] In one implementation, the heat dissipation channel has an irregular shape.

[0010] In one implementation, the heat dissipation opening is arc-shaped, streamlined, semi-elliptical, semi-circular, rectangular, or irregular in shape.

[0011] Because of the adoption of the above technical solution, this utility model has the following beneficial effects:

[0012] By setting up several heat dissipation channels that are connected to the inside of the chip limiting slot, the heat generated by the chip during chip programming can be dissipated in a timely manner through the heat dissipation channels, reducing the chip surface temperature and ensuring the correctness of data programming. The heat dissipation channels are perpendicular to the chip limiting frame and the base. Compared with side-mounted heat dissipation channels, there is no need to reserve heat dissipation gap space on the side of the chip adapter, which can achieve a compact layout of circuit board components and save circuit board layout space. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a top view of the chip adapter with heat dissipation channels according to Embodiment 1 of this application;

[0015] Figure 2 This is a top view of the chip adapter with heat dissipation channels according to Embodiment 2 of this application;

[0016] Figure 3 This is a top view of the chip adapter with heat dissipation channels according to Embodiment 3 of this application.

[0017] Explanation of icon numbers:

[0018] 1-Chip limiting bracket;

[0019] 11-Chip limiting slot;

[0020] 2-Base;

[0021] 3- Heat dissipation channels;

[0022] 31-First heat dissipation through hole;

[0023] 32- Heat dissipation opening. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0025] In the description of this utility model, it should be noted that the terms "upper," "lower," "left," "right," "center," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "setting," "connection," "linking," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] Please see Figures 1-3 A chip adapter with heat dissipation channels according to an embodiment of the present invention includes a chip adapter body, the chip adapter body includes a chip limiting frame 1 and a base 2, the chip limiting frame 1 is installed on the base 2, the chip limiting frame 1 forms a chip limiting groove 11, the chip limiting frame 1 and the base 2 cooperate to form a plurality of through heat dissipation channels 3, and the heat dissipation channels 3 are in communication with the inside of the chip limiting groove 11.

[0028] In one embodiment, the heat dissipation channel 3 is perpendicular to the chip limiting frame 1 and the base 2.

[0029] In one embodiment, a probe contact portion is provided in the middle of the bottom surface of the chip limiting groove 11, and a plurality of first heat dissipation through holes 31 or heat dissipation openings 32 are formed on the outer side of the probe contact portion; the base 2 forms a second heat dissipation through hole corresponding to the position of the first heat dissipation through hole 31 or the heat dissipation opening 32; the first heat dissipation through hole 31 and the second heat dissipation through hole or the heat dissipation opening 32 and the second heat dissipation through hole cooperate to form the heat dissipation channel 3.

[0030] In one embodiment, at least one first heat dissipation through hole 31 or heat dissipation opening 32 is formed on one side, two sides, three sides or around the probe contact portion.

[0031] As one implementation, the cross-sectional shape of the heat dissipation channel 3 includes elliptical, circular, and rectangular shapes.

[0032] In one implementation, the heat dissipation channel 3 has an irregular shape.

[0033] In one implementation, the heat dissipation opening 32 is arc-shaped, streamlined, semi-elliptical, semi-circular, rectangular, or irregular in shape.

[0034] This invention provides a chip adapter with heat dissipation channels. By providing several heat dissipation channels 3 that communicate with the inside of the chip limiting groove 11, the heat generated by the chip during chip programming can be dissipated in a timely manner through the heat dissipation channels 3, reducing the chip surface temperature and ensuring the accuracy of data programming. When the heat dissipation channels 3 are perpendicular to the chip limiting frame 1 and the base 2, compared with the side-mounted heat dissipation channels 3, there is no need to reserve heat dissipation gap space on the side of the chip adapter, which can achieve a compact layout of circuit board components and save circuit board layout space.

[0035] Example 1

[0036] Please see Figure 1 According to Embodiment 1 of this utility model, a chip adapter with heat dissipation channels includes a chip adapter body, which includes a chip limiting frame 1 and a base 2. The chip limiting frame 1 is installed on the base 2 and forms a chip limiting groove 11. The chip limiting frame 1 and the base 2 cooperate to form two through heat dissipation channels 3, which are in communication with the inside of the chip limiting groove 11.

[0037] In this embodiment, the heat dissipation channel 3 is perpendicular to the chip limiting frame 1 and the base 2.

[0038] A probe contact portion is provided in the middle of the bottom surface of the chip limiting groove 11, and two first heat dissipation through holes 31 are formed on the outer side of the probe contact portion; the base 2 forms a second heat dissipation through hole corresponding to the position of the first heat dissipation through hole 31; the first heat dissipation through hole 31 and the second heat dissipation through hole cooperate to form the heat dissipation channel 3.

[0039] In this embodiment, a first heat dissipation through hole 31 is formed on the left and right sides of the probe contact portion.

[0040] The heat dissipation channel 3 has an elliptical cross-sectional shape and is symmetrically distributed on both sides of the probe contact portion.

[0041] Example 2

[0042] The chip adapter with heat dissipation channel in Embodiment 2 of this utility model has a structure that is basically the same as that in Embodiment 1. The difference is that a first heat dissipation through hole 31 is formed on the upper and lower sides of the probe contact portion; a second heat dissipation through hole is formed on the base 2 corresponding to the position of the first heat dissipation through hole 31; the first heat dissipation through hole 31 and the second heat dissipation through hole cooperate to form the heat dissipation channel 3.

[0043] Example 3

[0044] The chip adapter with heat dissipation channel in Embodiment 3 of this utility model has a structure that is basically the same as that in Embodiment 1. The difference is that a plurality of heat dissipation openings 32 are formed on the outer side of the probe contact portion; the base 2 forms a second heat dissipation through hole corresponding to the position of the heat dissipation opening 32; the heat dissipation opening 32 and the second heat dissipation through hole cooperate to form the heat dissipation channel 3.

[0045] In this embodiment, at least one heat dissipation opening 32 is formed on both sides of the probe contact portion.

[0046] In this embodiment, the heat dissipation channel 3 has an irregular shape.

[0047] In this embodiment, the heat dissipation opening 32 is a non-elliptical shape with rounded corners at both ends.

[0048] The present invention has been described in detail above with reference to the accompanying drawings and embodiments. Those skilled in the art can make various modifications to the present invention based on the above description. Therefore, certain details in the embodiments should not be construed as limiting the present invention, and the scope of protection of the present invention shall be defined by the appended claims.

Claims

1. A chip socket with heat dissipation air ducts, comprising a chip socket body, the chip socket body comprising a chip limiting frame and a base, the chip limiting frame being installed on the base, the chip limiting frame forming a chip limiting groove, characterized in that, The chip limiting bracket and the base cooperate to form several through heat dissipation channels, which are connected to the inside of the chip limiting slot.

2. The chip socket with heat dissipation air ducts according to claim 1, wherein, The heat dissipation channel is perpendicular to the chip limiting frame and the base.

3. The chip adapter with heat dissipation duct according to claim 2, characterized in that, A probe contact portion is provided in the middle of the bottom surface of the chip limiting groove, and a plurality of first heat dissipation through holes or heat dissipation openings are formed on the outer side of the probe contact portion; the base forms a second heat dissipation through hole corresponding to the position of the first heat dissipation through hole or the heat dissipation opening; the first heat dissipation through hole and the second heat dissipation through hole or the heat dissipation opening and the second heat dissipation through hole cooperate to form the heat dissipation channel.

4. The chip adapter with heat dissipation duct according to claim 3, characterized in that, At least one of the first heat dissipation through holes or heat dissipation openings is formed on one side, two sides, three sides, or all four sides of the probe contact portion.

5. The chip adapter with heat dissipation channels according to any one of claims 1 to 4, characterized in that, The cross-sectional shape of the heat dissipation channel includes elliptical, circular, and rectangular shapes.

6. The chip adapter with heat dissipation airflow according to any one of claims 1 to 4, characterized in that, The heat dissipation channel has an irregular shape.

7. The chip adapter with heat dissipation channels according to claim 3 or 4, characterized in that, The heat dissipation openings are arc-shaped, streamlined, semi-elliptical, semi-circular, rectangular, or irregular in shape.

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