A bottom boat rod and silicon wafer support device

Abstract

This application discloses a bottom boat rod and a silicon wafer support device. The bottom boat rod is used to support the silicon wafer from below and includes a boat rod body with a first surface. A plurality of positioning protrusions are disposed on the first surface along the length direction of the boat rod body. Two silicon wafers facing away from each other are placed between adjacent positioning protrusions. Each positioning protrusion includes two guide sidewalls facing away from each other along the length direction of the boat rod body. The guide sidewalls are configured to allow the silicon wafers located on the guide sidewalls to move towards the bottom end of the guide sidewalls under the action of gravity. The distance between the bottom ends of the guide sidewalls of adjacent positioning protrusions is less than or equal to the sum of the thicknesses of the two silicon wafers, so that the two silicon wafers are always close to each other along the guide sidewalls. This ensures that the two silicon wafers can be placed tightly and fitted between adjacent positioning protrusions, so that no gaps are generated between the two silicon wafers, preventing the back side of the silicon wafers from being coated with a passivation film, and preventing the two silicon wafers from shaking or shifting.

Description

Technical Field

[0001] This application relates to the field of solar cell technology, and in particular to a bottom boat rod and silicon wafer support device. Background Technology

[0002] TOPCON (Tunnel Oxide Passivated Contact) cells are a new type of high-efficiency cell technology that has attracted much attention in the field of solar photovoltaics in recent years. In the fabrication process of TOPCON cells, the ALD (Atomic Layer Deposition) process is crucial, especially in the formation of the passivation film. Currently, the industry commonly uses tubular passivation equipment to deposit Al₂O₃ onto the silicon wafer surface using ALD technology to form a dense passivation film, achieving a good passivation effect, reducing electron-hole recombination, and thus improving cell performance.

[0003] In the ALD process, the dual-insertion mode is commonly used, where silicon wafers are typically bonded back-to-back for coating. However, in actual production, it has been found that due to the difficulty in achieving a completely tight fit between silicon wafers, a certain gap exists. This causes the passivation film, which should only be deposited on the front side of the silicon wafer, to seep between the two wafers, resulting in passivation film being deposited on the back side as well. On the one hand, non-standard coating areas appear on the surface of the cell, affecting the product's appearance quality. On the other hand, the unintended passivation film on the back side alters the electrical characteristics of the cell's back side, increasing the probability of electron recombination and reducing the cell's photoelectric conversion efficiency, severely impacting the overall performance and quality of TOPCON cells. Utility Model Content

[0004] This application discloses a bottom boat rod and a silicon wafer support device, which enables two silicon wafers to always be close to each other along the guide sidewall, ensuring that the two silicon wafers can be placed tightly between adjacent positioning protrusions, so that no gap is generated between the two silicon wafers, preventing the back of the silicon wafers from being coated with a passivation film, and at the same time preventing the two silicon wafers from shaking or shifting, thus playing a role in limiting and positioning the silicon wafers.

[0005] To achieve the above objectives, this application discloses a bottom boat support for supporting the silicon wafer from below, comprising:

[0006] A mast body, the mast body including a first surface;

[0007] Multiple positioning protrusions are disposed on the first surface along the length direction of the boat body. Two silicon wafers facing away from each other are placed between adjacent positioning protrusions. Each positioning protrusion includes two guide sidewalls facing away from each other along the length direction of the boat body. The guide sidewalls are configured to allow the silicon wafers located on the guide sidewalls to move towards the bottom end of the guide sidewalls under the action of gravity. The distance between the bottom ends of the guide sidewalls of adjacent positioning protrusions is less than or equal to the sum of the thicknesses of the two silicon wafers. The bottom end of the guide sidewall is the end of the guide sidewall closest to the first surface.

[0008] In one possible implementation, the bottom ends of the guide sidewalls of adjacent positioning protrusions are connected to each other.

[0009] In one possible implementation, the guide sidewall is a slope, with one end of the guide sidewall closer to the first surface being closer to the guide sidewall of the adjacent positioning protrusion than the end farther from the first surface.

[0010] In one possible implementation, the guide sidewall is an arc surface, with one end of the guide sidewall closer to the first surface being closer to the guide sidewall of the adjacent positioning protrusion than the end farther from the first surface.

[0011] In one possible implementation, the arcuate surface is configured to protrude toward the guide sidewall away from the adjacent positioning protrusion.

[0012] In one possible implementation, the top ends of the two guide sidewalls of the positioning protrusion are connected to form a connecting line, and the top end of the guide sidewall is the end of the guide sidewall away from the first surface.

[0013] This application also discloses a silicon wafer carrier device, comprising:

[0014] A first support member and a second support member arranged opposite to each other along a first direction;

[0015] Multiple upper boat rods are disposed between the first support member and the second support member. The upper boat rods extend along a first direction. Adjacent upper boat rods are used to position the silicon wafer along a second direction from the top of opposite sides of the silicon wafer. The upper boat rods are also used to limit the silicon wafer along the first direction. The second direction is perpendicular to the first direction.

[0016] Multiple levers are movably disposed between the first support member and the second support member along their length direction. The levers extend along the first direction and are disposed below the multiple upper boat rods in a corresponding manner. Adjacent levers are used to position the silicon wafer along the second direction from the middle of the opposite two sides of the silicon wafer. The levers are also used to adjust the silicon wafer along the first direction.

[0017] Multiple bottom boat rods are disposed between the first support member and the second support member, the bottom boat rods extend along the first direction, and the multiple bottom boat rods are disposed below the multiple levers, wherein the bottom boat rods are any of the bottom boat rods described above.

[0018] In one possible implementation, the silicon wafer support device further includes a plurality of lower boat rods disposed between the first support member and the second support member. The lower boat rods extend along the first direction and are correspondingly located below the plurality of levers and above the plurality of bottom boat rods. Adjacent lower boat rods are used for positioning from the bottom of opposite sides of the silicon wafer along the second direction. The lower boat rods are also used for limiting the silicon wafer along the first direction.

[0019] In one possible implementation, the lower boat rod is positioned close to the bottom boat rod.

[0020] In one possible implementation, the first support member and the second support member are support plates.

[0021] Compared with the prior art, the beneficial effects of this application are as follows:

[0022] In the bottom boat and silicon wafer support device provided in this application, the boat body, as the main structure of the bottom boat, provides the foundation for supporting and carrying the silicon wafer. Its first surface is the part that directly contacts the silicon wafer. Positioning protrusions are arranged along the length direction of the boat body. Two silicon wafers facing away from each other are placed between adjacent positioning protrusions for positioning and supporting the silicon wafers so that the front sides of the two silicon wafers are coated with a passivation film. Further, each positioning protrusion includes two opposing guide sidewalls. The guide sidewalls can guide the silicon wafer to move towards the bottom under the action of gravity. Since the distance between the bottom ends of the guide sidewalls of adjacent positioning protrusions is less than or equal to the sum of the thicknesses of the two silicon wafers, the two silicon wafers are always close to each other along the guide sidewalls. This ensures that the two silicon wafers can be placed tightly and fitted between adjacent positioning protrusions, so that no gaps are generated between the two silicon wafers, preventing the back side of the silicon wafers from being coated with a passivation film as well. At the same time, it prevents the two silicon wafers from shaking or shifting, thus playing a role in limiting and positioning the silicon wafers. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A schematic diagram of the structure of a bottom boat rod provided in an embodiment of this utility model;

[0025] Figure 2 for Figure 1 A magnified view of a section at point A in the middle;

[0026] Figure 3 A front view of a bottom boat rod provided for an embodiment of this utility model;

[0027] Figure 4 for Figure 3 A magnified view of a section at point B in the middle;

[0028] Figure 5 A top view of a bottom boat rod provided for an embodiment of this utility model;

[0029] Figure 6 A schematic diagram of the structure of a silicon wafer carrier device provided in an embodiment of this utility model;

[0030] Figure 7 A front view of a silicon wafer carrier device provided in an embodiment of this utility model;

[0031] Figure 8 This is a top view of a silicon wafer carrier device provided in an embodiment of the present invention.

[0032] Explanation of reference numerals in the attached figures:

[0033] 10-Bottom boat rod; 11-First surface; 12-Boat rod body; 13-Positioning protrusion; 131-Guide sidewall; 1311-Bottom end of guide sidewall; 1312-Top end of guide sidewall; 20-First support member; 30-Second support member; 40-Upper boat rod; 50-Pulling lever; 60-Lower boat rod. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0035] In this application, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0036] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0037] TOPCON (Tunnel Oxide Passivated Contact) cells are a new type of high-efficiency cell technology that has attracted much attention in the field of solar photovoltaics in recent years. In the fabrication process of TOPCON cells, the ALD (Atomic Layer Deposition) process is crucial, especially in the formation of the passivation film. Currently, the industry commonly uses tubular passivation equipment to deposit Al₂O₃ onto the silicon wafer surface using ALD technology to form a dense passivation film, achieving a good passivation effect, reducing electron-hole recombination, and thus improving cell performance.

[0038] In the ALD process, the dual-insertion mode is commonly used, where silicon wafers are typically bonded back-to-back for coating. However, in actual production, it has been found that due to the difficulty in achieving a completely tight fit between silicon wafers, a certain gap exists. This causes the passivation film, which should only be deposited on the front side of the silicon wafer, to seep between the two wafers, resulting in passivation film being deposited on the back side as well. On the one hand, non-standard coating areas appear on the surface of the cell, affecting the product's appearance quality. On the other hand, the unintended passivation film on the back side alters the electrical characteristics of the cell's back side, increasing the probability of electron recombination and reducing the cell's photoelectric conversion efficiency, severely impacting the overall performance and quality of TOPCON cells.

[0039] In view of this, some embodiments of this application provide a bottom boat rod and a silicon wafer support device, which enables two silicon wafers to always be close to each other along the guide sidewall, ensuring that the two silicon wafers can be placed tightly between adjacent positioning protrusions, so that no gap is generated between the two silicon wafers, preventing the back of the silicon wafers from being coated with a passivation film, and at the same time preventing the two silicon wafers from shaking or shifting, thus playing a role in limiting and positioning the silicon wafers.

[0040] The present application will be described in detail below through specific embodiments:

[0041] The bottom boat rod 10 in this embodiment of the application, as shown Figures 1-8 As shown, a bottom boat rod 10 for supporting a silicon wafer from below includes:

[0042] The boat pole body 12 includes a first surface 11;

[0043] Multiple positioning protrusions 13 are disposed on the first surface 11 along the length direction of the boat body 12. Two silicon wafers facing away from each other are placed between adjacent positioning protrusions 13. Each positioning protrusion 13 includes two guide sidewalls 131 facing away from each other along the length direction of the boat body 12. The guide sidewalls 131 are configured to allow the silicon wafers located on the guide sidewalls 131 to move towards the bottom end 1311 of the guide sidewalls under the action of gravity. The distance between the bottom ends 1311 of the guide sidewalls of adjacent positioning protrusions 13 is less than or equal to the sum of the thicknesses of the two silicon wafers. The bottom end 1311 of the guide sidewall is the end of the guide sidewall 131 closest to the first surface 11.

[0044] The bottom boat rod 10 provided in this application embodiment has a boat rod body 12 as the main structure of the bottom boat rod 10, which provides a foundation for bearing and supporting the silicon wafer. Its first surface 11 is the part that directly contacts the silicon wafer. The positioning protrusions 13 are arranged along the length direction of the boat rod body 12. The adjacent positioning protrusions 13 are used to place two silicon wafers facing away from each other, which are used to position and support the silicon wafers so that the front sides of the two silicon wafers are coated with a passivation film. Furthermore, each positioning protrusion 13 includes two opposing guide sidewalls 131. The guide sidewalls 131 can guide the silicon wafer to move towards the bottom under the action of gravity. Since the distance between the bottom ends 1311 of the guide sidewalls of adjacent positioning protrusions 13 is less than or equal to the sum of the thicknesses of the two silicon wafers, the two silicon wafers are always close to each other along the guide sidewalls 131, ensuring that the two silicon wafers can be placed tightly between adjacent positioning protrusions 13, so that no gap is generated between the two silicon wafers, preventing the back of the silicon wafers from being coated with a passivation film, and at the same time preventing the two silicon wafers from shaking or shifting, thus playing a role in limiting and positioning the silicon wafers.

[0045] The bottom boat rod 10 can be made of materials such as quartz, ceramic, or metal, and this application does not limit the materials used. Two silicon wafers facing away from each other refer to two silicon wafers whose front sides are exposed for coating, while their back sides are bonded together.

[0046] In the diagram, the X direction is the first direction, and the Y direction is the second direction.

[0047] Furthermore, in some embodiments, such as Figure 3 and Figure 4As shown, the bottom ends 1311 of the guide sidewalls of adjacent positioning protrusions 13 are connected to each other.

[0048] When the bottom ends 1311 of the guide sidewalls of adjacent positioning protrusions 13 are connected to each other, the bottom ends 1311 of the adjacent guide sidewalls form a connecting line, and the connecting line is located at the lowest point between the adjacent positioning protrusions 13. The guide sidewall 131 of each positioning protrusion 13 still maintains the function of guiding the silicon wafer to move towards the bottom under the action of gravity. Thus, the silicon wafer always moves towards the bottom under the guidance of the guide sidewall 131 under the action of gravity. Since the bottom ends 1311 of the adjacent guide sidewalls are connected, the two silicon wafers are already attached before reaching the bottom end 1311 of the guide sidewall, and they always have a force that brings them closer together, ensuring a tighter fit.

[0049] Meanwhile, there is no need to consider the spacing between adjacent positioning protrusions 13 during manufacturing, making the manufacturing process more convenient and simple. From an overall perspective, multiple positioning protrusions 13 form a continuous structure on the first surface 11 of the boat body 12 through this connection method, and the connection at their bottom ends enhances the stability and continuity of the entire structure. A series of continuous groove-shaped structures are constructed on the boat body 12, and silicon wafers are placed in these grooves. The silicon wafers are placed between adjacent positioning protrusions 13 to achieve close arrangement and positioning.

[0050] In other embodiments, the bottom ends 1311 of the guide sidewalls of adjacent positioning protrusions 13 may not be connected, as long as the distance between the bottom ends 1311 of the guide sidewalls of adjacent positioning protrusions 13 is less than or equal to the sum of the thicknesses of the two silicon wafers.

[0051] In one possible implementation, the guide sidewall 131 is a slope, with the end of the guide sidewall 131 near the first surface 11 being closer to the guide sidewall 131 of the adjacent positioning protrusion 13 than the end of the guide sidewall 131 away from the first surface 11.

[0052] The guide sidewall 131 adopts a sloping structure, allowing the silicon wafer to slide naturally down the sloping guide sidewall 131 under the action of gravity when placed on the bottom boat rod 10. Since the end of the guide sidewall 131 closer to the first surface 11 is closer to the guide sidewall 131 of the adjacent positioning protrusion 13, it means that the distance between the adjacent guide sidewalls 131 gradually decreases from the top to the bottom of the silicon wafer. As the silicon wafer slides down, the constraint of the guide sidewalls 131 on the silicon wafer gradually increases as the position decreases, thereby more accurately positioning the silicon wafer between the adjacent positioning protrusions 13.

[0053] Therefore, the inclined structure allows the silicon wafer to slide quickly and smoothly to the predetermined position under the action of gravity, which greatly improves the positioning efficiency of the silicon wafer. The gradual spacing can accurately constrain and position the silicon wafer. As the silicon wafer slides down, as the spacing between the two guide sidewalls 131 gradually decreases, the silicon wafer is gradually confined to a smaller space and finally accurately stops at the position where it is in contact with another silicon wafer. This effectively avoids the silicon wafer from shifting or shaking during the positioning process, improves the positioning accuracy of the silicon wafer, and helps to ensure the accuracy of subsequent processes and the stability of product quality.

[0054] Moreover, this structure offers good compatibility to a certain extent, accommodating silicon wafers of different sizes. For smaller wafers, they will naturally position themselves under the constraint of the guide sidewall 131 during the descent, fitting closer to another wafer. For larger wafers, the gradient spacing design allows for precise positioning even at a relatively far distance from the bottom, meeting the positioning requirements of wafers of different specifications and improving the versatility of the bottom boat rod 10.

[0055] In another possible implementation, such as Figure 4 As shown, the guide sidewall 131 is an arc surface, and the end of the guide sidewall 131 near the first surface 11 is closer to the adjacent positioning protrusion 13 than the end away from the first surface 11.

[0056] Therefore, the guide sidewall 131 adopts an arc surface structure. The arc surface can provide a smoother guiding surface. When the silicon wafer is placed on the bottom boat rod 10, it contacts the arc surface and will naturally slide down along the curvature of the arc surface under the action of gravity. This arc surface can better fit the shape of the silicon wafer, reduce the local stress concentration between the silicon wafer and the guide sidewall 131, and play a more gentle constraint role on the silicon wafer.

[0057] The smoothness of the curved surface ensures that the silicon wafer experiences more uniform friction during its downward movement, preventing jamming or sudden acceleration caused by uneven surfaces or sharp edges. This results in a gentle and stable positioning process, which is especially important for thin or fragile silicon wafers. It can significantly reduce the possibility of breakage or cracks caused by uneven force during positioning, thereby improving the yield of silicon wafers.

[0058] Furthermore, in some embodiments, such as Figure 2 As shown, the arc surface protrudes in a direction away from the guide sidewall 131 of the adjacent positioning protrusion 13.

[0059] As a result, a concave surface is formed between adjacent guide sidewalls 131, allowing the silicon wafer to slowly slide down the arc surface and gradually be constrained and positioned. The whole process is more gentle and smooth. The arc surface protrudes towards the guide sidewall 131 away from the adjacent positioning protrusion 13. During the sliding process, as the space gradually narrows, the silicon wafer is more precisely constrained in the center position, achieving accurate positioning.

[0060] The guiding force generated by the curved surface of this structure can more effectively guide the silicon wafer to the center position between adjacent positioning protrusions 13, improving the accuracy of silicon wafer positioning. Regardless of whether the initial placement position of the silicon wafer has a certain deviation or is slightly disturbed during the downward movement, the guiding effect of this curved surface can ensure that the silicon wafer is finally accurately stopped in the designed position, reducing subsequent process problems caused by silicon wafer position deviation, such as uneven spacing between silicon wafers and uneven coating, thereby improving the consistency of product quality.

[0061] In some embodiments, such as Figure 1 and Figure 2 As shown, the top ends 1312 of the two guide sidewalls of the positioning protrusion 13 are connected to form a connecting line, and the top end 1312 of the guide sidewall is the end of the guide sidewall 131 away from the first surface 11.

[0062] The tops 1312 of the two guide sidewalls are connected to form a connecting line, thereby positioning the top of the protrusion 13 as the tip. When the silicon wafer approaches the positioning protrusion 13, the connecting line can provide an initial guiding direction, making it easier for the silicon wafer to accurately enter the positioning position along the direction of the guide sidewall 131, without stopping or getting stuck at the top of the guide sidewall 1312. This plays a preliminary guiding and limiting role, reducing deviations and uncertainties in the positioning process, and improving the accuracy and repeatability of positioning.

[0063] Meanwhile, a connecting line is formed at the top end 1312 of the guide sidewall. During manufacturing, the structure of the connecting line is relatively simple and easy to process and shape. Based on the guide sidewall 131 with the same structure, forming a connecting line at the top end 1312 of the guide sidewall can also save some space, making the positioning protrusion 13 more compact in the length direction of the bottom boat rod 10, and able to accommodate more silicon wafers.

[0064] In other embodiments, the top end of the positioning protrusion 13 can be a flat surface, or the top end of the positioning protrusion 13 can be an arc surface.

[0065] This application also discloses a silicon wafer carrier device, such as... Figures 6 to 8 As shown, the silicon wafer carrier includes:

[0066] A first support member 20 and a second support member 30 are arranged opposite to each other along a first direction;

[0067] Multiple upper boat rods 40 are disposed between the first support member 20 and the second support member 30. The upper boat rods 40 extend along a first direction. Adjacent upper boat rods 40 are used to position the silicon wafer along a second direction from the top of the opposite sides of the silicon wafer. The upper boat rods 40 are also used to limit the silicon wafer along the first direction. The second direction is perpendicular to the first direction.

[0068] Multiple levers 50 are movably disposed between the first support member 20 and the second support member 30 along their length direction. The levers 50 extend along the first direction, and the multiple levers 50 are correspondingly disposed below the multiple upper boat rods 40. Adjacent levers 50 are used to position the silicon wafer along the second direction from the middle of the opposite two sides of the silicon wafer. The levers 50 are also used to adjust the silicon wafer along the first direction.

[0069] Multiple bottom boat rods 10 are disposed between the first support member 20 and the second support member 30. The bottom boat rods 10 extend along a first direction and are disposed below multiple levers 50. The bottom boat rods 10 are the aforementioned bottom boat rods 10.

[0070] The first support member 20 and the second support member 30 are arranged opposite each other along the first direction, providing a stable frame structure for the entire device. Multiple upper boat rods 40 are arranged between the first support member 20 and the second support member 30 and extend along the first direction. They position the silicon wafer along the second direction from the top of the opposite sides of the silicon wafer, restricting the movement of the silicon wafer in the second direction. At the same time, they limit the silicon wafer along the first direction to prevent displacement of the silicon wafer in the first direction, thereby accurately determining the position of the silicon wafer in the plane and ensuring the stability of the silicon wafer on the support device.

[0071] Multiple levers 50 are movably arranged between the first support member 20 and the second support member 30 along their length direction, and are located below the upper boat rod 40 in a corresponding manner. They position the silicon wafer along the second direction from the middle of the opposite sides of the silicon wafer, further enhancing the positioning accuracy of the silicon wafer in the second direction. At the same time, they can also adjust the silicon wafer along the first direction, and the position of the silicon wafer can be finely adjusted as needed, so that the two silicon wafers fit together more tightly.

[0072] Multiple bottom boat rods 10 are disposed between the first support member 20 and the second support member 30 and below the lever 50. They are used to support the silicon wafer from below, and cooperate with the upper boat rod 40 and the lever 50 to provide all-round support and positioning for the silicon wafer, ensuring its stable placement on the carrier device. The bottom boat rods 10 in this silicon wafer carrier device are the same as those described above. Therefore, the silicon wafer carrier device in this embodiment has roughly the same technical effect as the bottom boat rod 10 described above. Since the technical effect of the bottom boat rod 10 has been fully explained, it will not be repeated here.

[0073] Specifically, the upper boat rod 40, the lever 50, and the lower boat rod 60 are each provided with multiple positioning teeth (not shown in the figure) along their length direction. The positioning teeth on the upper boat rod 40, the lever 50, and the lower boat rod 60 are arranged in a one-to-one correspondence. The space between adjacent positioning teeth is used to place two silicon wafers facing away from each other.

[0074] Furthermore, such as Figure 6 As shown, the silicon wafer support device also includes multiple lower boat rods 60, which are disposed between the first support member 20 and the second support member 30. The lower boat rods 60 extend along a first direction and are disposed below the multiple levers 50 and above the multiple bottom boat rods 10. Adjacent lower boat rods 60 are used to position the silicon wafer from the bottom of opposite sides along a second direction. The lower boat rods 60 are also used to limit the silicon wafer along the first direction.

[0075] Multiple lower boat rods 60 are positioned between the first support member 20 and the second support member 30, extending along the first direction, and correspondingly located below the lever 50 and above the bottom boat rod 10. The lower boat rods 60 add positioning points at the bottom of the silicon wafer, and together with the upper boat rod 40 at the top and the lever 50 in the middle, constrain the silicon wafer from multiple positions. This makes the positioning of the silicon wafer in the second direction more precise, reducing the swaying and offset of the silicon wafer along the second direction during loading. Furthermore, they ensure a closer fit between the two silicon wafers from their sides and bottom, further improving the tightness of the two wafers and facilitating subsequent coating processes.

[0076] In some embodiments, such as Figure 6 As shown, the lower boat mast 60 is positioned close to the bottom boat mast 10.

[0077] The lower boat rod 60 is positioned close to the bottom boat rod 10, making the vertical distance between the lower boat rod 60 and the bottom boat rod 10 relatively close. The lower boat rod 60 is mainly positioned along the second direction from the bottom of the opposite sides of the silicon wafer and limited along the first direction. The bottom boat rod 10 mainly provides overall bottom support and limitation, together providing a stable support foundation for the silicon wafer and reducing the possibility of the silicon wafer shaking and displacement at the bottom.

[0078] By bringing the lower boat rod 60 closer to the bottom boat rod 10, the two bottom sides of the silicon wafer can be more closely fitted, enabling more precise positioning of the wafer's bottom. The positioning of the bottom sides of the silicon wafer by the lower boat rod 60, combined with the support of the bottom boat rod 10, helps to further reduce the gap between the two silicon wafers, thereby allowing for coating on the back side of the wafer as well. This further improves the positioning accuracy of the silicon wafer within the entire support device, which is beneficial for improving the accuracy of subsequent processes and product quality.

[0079] In some embodiments, such as Figure 6 As shown, the first support member 20 and the second support member 30 are support plates.

[0080] The support plate has a large load-bearing area and good rigidity, providing a stable support foundation for components such as the upper boat rod 40, the lever 50, the bottom boat rod 10, and the lower boat rod 60 in the first direction. Multiple rod-shaped components are installed between the support plate, which evenly distributes the weight of these components and the silicon wafer, ensuring the stability of the entire load-bearing device. The planar structure of the support plate facilitates the installation and fixing of various boat rods and levers 50. By creating specific mounting holes or slots on the support plate, components such as boat rods and levers 50 can be accurately positioned and installed according to design requirements. This facilitates precise component layout, ensures the relative positional accuracy between components, and thus improves the overall performance of the silicon wafer load-bearing device.

[0081] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A bottom boat support for supporting a silicon wafer from below, characterized in that, include: A mast body, the mast body including a first surface; Multiple positioning protrusions are disposed on the first surface along the length direction of the boat body. Two silicon wafers facing away from each other are placed between adjacent positioning protrusions. Each positioning protrusion includes two guide sidewalls facing away from each other along the length direction of the boat body. The guide sidewalls are configured to allow the silicon wafers located on the guide sidewalls to move towards the bottom end of the guide sidewalls under the action of gravity. The distance between the bottom ends of the guide sidewalls of adjacent positioning protrusions is less than or equal to the sum of the thicknesses of the two silicon wafers. The bottom end of the guide sidewall is the end of the guide sidewall closest to the first surface.

2. The bottom boat rod according to claim 1, characterized in that, The bottom ends of the guide sidewalls of adjacent positioning protrusions are connected to each other.

3. The bottom boat rod according to claim 1, characterized in that, The guide sidewall is an inclined surface, and the end of the guide sidewall closer to the first surface is closer to the guide sidewall of the adjacent positioning protrusion than the end farther from the first surface.

4. The bottom boat rod according to claim 1, characterized in that, The guide sidewall is an arc surface, and the end of the guide sidewall closer to the first surface is closer to the guide sidewall of the adjacent positioning protrusion than the end farther away from the first surface.

5. The bottom boat rod according to claim 4, characterized in that, The arc surface protrudes in a direction away from the guide sidewall of the adjacent positioning protrusion.

6. The boat mast according to claim 1, characterized in that, The top ends of the two guide sidewalls of the positioning protrusion are connected to form a connecting line, and the top end of the guide sidewall is the end of the guide sidewall away from the first surface.

7. A silicon wafer carrier device, characterized in that, include: A first support member and a second support member arranged opposite to each other along a first direction; Multiple upper boat rods are disposed between the first support member and the second support member. The upper boat rods extend along a first direction. Adjacent upper boat rods are used to position the silicon wafer along a second direction from the top of opposite sides of the silicon wafer. The upper boat rods are also used to limit the silicon wafer along the first direction. The second direction is perpendicular to the first direction. Multiple levers are movably disposed between the first support member and the second support member along their length direction. The levers extend along the first direction and are disposed below the multiple upper boat rods in a corresponding manner. Adjacent levers are used to position the silicon wafer along the second direction from the middle of the opposite two sides of the silicon wafer. The levers are also used to adjust the silicon wafer along the first direction. A plurality of bottom boat rods are disposed between the first support member and the second support member, the bottom boat rods extend along the first direction, and the plurality of bottom boat rods are disposed below the plurality of levers, wherein the bottom boat rods are the bottom boat rods as described in any one of claims 1-6.

8. The silicon wafer carrier device according to claim 7, characterized in that, The silicon wafer support device further includes a plurality of lower boat rods, which are disposed between the first support member and the second support member. The lower boat rods extend along the first direction and are respectively disposed below the plurality of levers and above the plurality of bottom boat rods. Adjacent lower boat rods are used to position the silicon wafer from the bottom of opposite sides along the second direction. The lower boat rods are also used to limit the silicon wafer along the first direction.

9. The silicon wafer carrier device according to claim 8, characterized in that, The lower boat rod is positioned close to the bottom boat rod.

10. The silicon wafer support device according to claim 7, characterized in that, The first support member and the second support member are support plates.

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