Electronic package

Abstract

An electronic package includes disposing at least one electronic component on a substrate, and disposing an antenna module on the substrate to cover a periphery of the electronic component. The antenna module includes an insulating cover, a cavity, an isolation layer, a conductive via, and an antenna structure. The insulating cover covers the periphery of the electronic component, the electronic component is located in the cavity, the isolation layer is formed on a wall of the cavity, the conductive via is formed in the insulating cover to penetrate the insulating cover, and the antenna structure is formed on the insulating cover to sequentially electrically connect the conductive via and the substrate, and the isolation layer is between the antenna structure and the electronic component. Thus, the electronic package can provide good electromagnetic interference (EMI) protection, isolation, or shielding effect for the electronic component.

Description

Technical Field

[0001] This application relates to a manufacturing technique for an electronic package, and more particularly to an electronic package with an antenna module. Background Technology

[0002] With the booming development of portable electronic products in recent years, the development of various related products is also trending towards high density, high performance, and slimness. To this end, the industry has developed various integrated multi-functional packaging designs to meet the requirements of slimness, compactness, and high density in electronic products. For example, wireless communication technology is now widely used in various consumer electronic products to receive or transmit various wireless signals. Among them, patch antennas are widely used in wireless communication modules of electronic products such as cell phones and personal digital assistants (PDAs) due to their small size, light weight, and ease of manufacturing.

[0003] Furthermore, in radio frequency (RF) system-in-a-package (SiP) modules, electromagnetic interference (EMI) isolation typically employs metal covers or metal coatings to provide EMI protection, isolation, or shielding for electronic components. However, if a SiP module only includes the antenna structure without an isolation layer, it cannot provide adequate EMI protection, isolation, or shielding for the electronic components.

[0004] Figure 1 This is a three-dimensional schematic diagram of a prior art system-in-package module 1. (See diagram below.) Figure 1 As shown, the system-in-package module 1 can be a wireless communication module, and includes a substrate 10, multiple electronic components 11, an antenna structure 12, and a package material 13. The electronic components 11 are disposed on the substrate 10 and electrically connected to the substrate 10. The antenna structure 12 is planar and has an antenna body 120 and a wire 121. The antenna body 120 is electrically connected to the electronic components 11 through the wire 121, and the package material 13 covers the electronic components 11 and part of the wire 121.

[0005] However, this system-in-package module 1 only includes the antenna structure 12 and does not include an isolation layer, so it cannot provide good electromagnetic interference (EMI) protection, isolation or shielding for electronic components 11.

[0006] Therefore, overcoming any of the problems of the existing technologies mentioned above has become an urgent issue to be addressed. Utility Model Content

[0007] In view of the deficiencies in the prior art, this application provides an electronic package, comprising: a substrate; at least one electronic component disposed on the substrate; and an antenna module disposed on the substrate to cover the periphery of the electronic component. The antenna module includes an insulating cover, a first cavity, a first insulating layer, a first conductive through-hole, and a first antenna structure. The insulating cover covers the periphery of the electronic component, the electronic component is located in the first cavity, the first insulating layer is formed on the wall of the first cavity, the first conductive through-hole is formed in the insulating cover to penetrate the insulating cover, the first antenna structure is formed on the insulating cover to sequentially electrically connect the first conductive through-hole and the substrate, and the first insulating layer is located between the first antenna structure and the electronic component.

[0008] This application also provides a method for manufacturing an electronic package, comprising: disposing at least one electronic component on a substrate; and disposing an antenna module on the substrate to cover the periphery of the electronic component, wherein the antenna module includes an insulating cover, a first cavity, a first insulating layer, a first conductive via, and a first antenna structure, the insulating cover covers the periphery of the electronic component, the electronic component is located in the first cavity, the first insulating layer is formed on the wall of the first cavity, the first conductive via is formed in the insulating cover to penetrate the insulating cover, the first antenna structure is formed on the insulating cover to sequentially electrically connect the first conductive via and the substrate, and the first insulating layer is located between the first antenna structure and the electronic component.

[0009] In the aforementioned electronic package and its manufacturing method, the insulating cover is a glass isolation cover, and the first conductive perforation is a glass perforation containing conductive material.

[0010] In the aforementioned electronic package and manufacturing method, the antenna module may include a second cavity, with multiple electronic components located in the first cavity and the second cavity respectively, and a first isolation layer is located between the first antenna structure and the electronic components in the first cavity.

[0011] In the aforementioned electronic package and manufacturing method, the antenna module may include a second isolation layer formed on the wall of the second cavity, and the second isolation layer is located between the first antenna structure and the electronic components in the second cavity.

[0012] In the aforementioned electronic package and its manufacturing method, the antenna module may include a second conductive through-hole and a second antenna structure. The second conductive through-hole is formed in an insulating cover to penetrate the insulating cover, and the second antenna structure is formed on the insulating cover to be electrically connected to the second conductive through-hole and the substrate in sequence.

[0013] In the aforementioned electronic package and its manufacturing method, the first antenna structure is an antenna array composed of multiple antenna blocks, and the first isolation layer is located between the antenna array and the electronic components.

[0014] In the aforementioned electronic package and its manufacturing method, the antenna module may include a second cavity, the first antenna structure is an antenna array composed of multiple antenna blocks, and multiple electronic components are respectively located in the first cavity and the second cavity.

[0015] In the aforementioned electronic package and its manufacturing method, the antenna module may include an insulating substrate and an antenna signal enhancement structure. The insulating substrate is formed on the insulating cover and the first antenna structure, and the antenna signal enhancement structure is formed on the insulating substrate.

[0016] In the aforementioned electronic package and its manufacturing method, the first antenna structure is a first antenna array composed of multiple first antenna blocks, and the antenna signal enhancement structure is a second antenna array composed of multiple second antenna blocks, wherein the multiple first antenna blocks correspond to multiple second antenna blocks.

[0017] In the aforementioned electronic package and its manufacturing method, the first antenna structure and the antenna signal enhancement structure are separated by a gap, and the gap is half the wavelength of the antenna signal of the first antenna structure or ±10%.

[0018] As can be seen from the above, the electronic package of this application can effectively integrate the first isolation layer (second isolation layer), the first conductive via (second conductive via), and the first antenna structure (second antenna structure) to provide good electromagnetic interference (EMI) protection, isolation, or shielding effects for electronic components. At the same time, this application can overcome the shortcomings of existing system-in-package (SiP) modules that only include an antenna structure (but not an isolation layer), resulting in an inability to provide good electromagnetic interference (EMI) protection, isolation, or shielding effects.

[0019] Furthermore, the first isolation layer of the antenna module of this application can conformally shield the first antenna structure and electronic components to effectively isolate / shield signal interference or electromagnetic interference between the first antenna structure and electronic components. Alternatively, the first isolation layer and the second isolation layer of the antenna module of this application can partition and shield the first antenna structure (second antenna structure) and multiple electronic components to effectively isolate / shield signal interference or electromagnetic interference between the first antenna structure (second antenna structure) and multiple electronic components.

[0020] In addition, the antenna signal enhancement structure (such as a second antenna array) of the antenna module of this application can be formed on an insulating substrate to effectively enhance the antenna signal of the first antenna structure (such as a first antenna array). Attached Figure Description

[0021] Figure 1 This is a three-dimensional schematic diagram of a system-in-package module based on existing technology.

[0022] Figures 2A to 2F This is a cross-sectional schematic diagram of the main manufacturing method of the antenna module of this application.

[0023] Figure 3A and Figure 3B These are a top view and a cross-sectional view of the first embodiment of the electronic package of this application, respectively.

[0024] Figure 4A and Figure 4B These are a top view and a cross-sectional view of a second embodiment of the electronic package of this application, respectively.

[0025] Figure 5A and Figure 5B These are a top view and a cross-sectional view of the third embodiment of the electronic package of this application, respectively.

[0026] Figure 6A and Figure 6B These are a top view and a cross-sectional view of the fourth embodiment of the electronic package of this application, respectively.

[0027] Figure 7A and Figure 7B These are a top view and a cross-sectional view of the fifth embodiment of the electronic package of this application, respectively.

[0028] Figure 8A and Figure 8B These are a top view and a cross-sectional view of the sixth embodiment of the electronic package of this application, respectively.

[0029] Figure 9A and Figure 9B These are a top view and a cross-sectional view of the seventh embodiment of the electronic package of this application, respectively.

[0030] Figure 10A and Figure 10B These are a top view and a cross-sectional view of the eighth embodiment of the electronic package of this application, respectively.

[0031] Explanation of reference numerals in the attached figures

[0032] 1 System-in-Package Module

[0033] 10 substrate

[0034] 11 Electronic components

[0035] 12 Antenna Structure

[0036] 120 Antenna Body

[0037] 121 conductor

[0038] 13 Packaging Materials

[0039] 2 Electronic Packages

[0040] 3 Antenna Modules

[0041] 31a Insulating substrate

[0042] 31b Insulating cover

[0043] 32a First cavity

[0044] 32b Second cavity

[0045] 33 wall

[0046] 34 perforations

[0047] 35a First isolation layer

[0048] 35b Second isolation layer

[0049] 36a First conductive via

[0050] 36b Second conductive via

[0051] 37a First Antenna Structure

[0052] 37b Second Antenna Structure

[0053] 37c antenna block

[0054] 38 Insulating substrate

[0055] 39 Antenna Signal Enhancement Structure

[0056] 39a Antenna Block

[0057] 4 substrate

[0058] 5 Electronic components

[0059] 51 Bonding wire

[0060] 52 welding balls

[0061] Line segment A1 to A8

[0062] L dividing line

[0063] H spacing. Detailed Implementation

[0064] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0065] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, terms such as "above," "below," "one," "two," "first," "second," and "third" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0066] Figures 2A to 2F This is a cross-sectional schematic diagram of the main manufacturing method of antenna module 3 of this application. Furthermore, in this application, "at least one" means one or more (e.g., one, two, or three), and "multiple" means two or more (e.g., two, three, four, or ten or more).

[0067] like Figures 2A to 2C As shown, an insulating substrate 31a is first provided, and multiple (e.g., at least two) first cavities 32a are formed in the insulating substrate 31a by etching. Then, multiple (e.g., at least two) perforations 34 are formed in the insulating substrate 31a by various perforation methods (e.g., laser drilling).

[0068] In one embodiment, the insulating substrate 31a may be a glass substrate, the first cavity 32a may be an isolation cavity, a clearance cavity, an etched clearance area, or an accommodating space, and the first cavity 32a has a U-shaped or U-shaped wall surface 33.

[0069] like Figure 2D As shown, multiple (e.g., at least two) first isolation layers 35a are formed on the wall surface 33 of multiple first cavities 32a of an insulating substrate 31a (e.g., a glass substrate) by sputtering (e.g., metal sputtering), and multiple (e.g., at least two) first conductive through holes 36a are formed or filled in multiple through holes 34 of the insulating substrate 31a by metallization or filling, wherein the multiple first conductive through holes 36a do not contact the multiple first isolation layers 35a.

[0070] In one embodiment, the first isolation layer 35a may be a signal isolation layer, signal shielding layer, electromagnetic shielding layer, or electromagnetic interference (EMI) isolation layer made of a metal material, and the first conductive via 36a may be a glass via (TGV) containing a conductive material (such as a metal material).

[0071] like Figure 2E As shown, Figure 2D The overall structure is flipped up and down to form a plurality of (e.g., at least two) first antenna structures 37a on the surface (e.g., top surface) of the insulating substrate 31a (e.g., glass substrate), and one end of the first antenna structure 37a is electrically connected to the first conductive through hole 36a.

[0072] In one embodiment, the first antenna structure 37a may be serpentine in shape (see...). Figure 3A ), regular or irregular shape, or the first antenna structure 37a may be an antenna array (see Figure 7A ).

[0073] like Figure 2F As shown, based on Figure 2E The dividing line L in the middle, and through various cutting methods, Figure 2E The overall structure is segmented to obtain multiple (e.g., at least two) antenna modules 3. Each antenna module 3 includes an insulating cover 31b, a first cavity 32a, a first isolation layer 35a, a first conductive through-hole 36a, and a first antenna structure 37a, and the insulating cover 31b may be a glass isolation cover.

[0074] In other embodiments, the antenna module 3 further includes a second cavity 32b and a second isolation layer 35b (see...). Figures 4A to 4B ), or may also include a second conductive via 36b and a second antenna structure 37b (see Figures 5A to 5B It may also include an insulating substrate 38 and an antenna signal enhancement structure 39 (see...). Figures 9A to 9B Meanwhile, the manufacturing methods of the second cavity 32b, the second isolation layer 35b, the second conductive perforation 36b, and the second antenna structure 37b are the same as those of the first cavity 32a, the first isolation layer 35a, the first conductive perforation 36a, and the first antenna structure 37a, respectively, so they will not be described again.

[0075] Figure 3A and Figure 3B These are a top view and a cross-sectional view of the first embodiment of the electronic package 2 of this application, respectively. Figure 3B for Figure 3A The cross-sectional view of the electronic package 2 at line segment A1.

[0076] like Figures 3A to 3B As shown, the electronic package 2 mainly includes a substrate 4, at least one (or more) electronic components 5, and an antenna module 3 (see...). Figure 2F The antenna module 3 may include an insulating cover 31b, a first cavity 32a, a first isolation layer 35a, a first conductive through hole 36a and a first antenna structure 37a, wherein the first antenna structure 37a is a single antenna.

[0077] In the manufacturing process of this electronic package 2, a substrate 4 is first provided, and at least one (or more) electronic components 5 are disposed on the surface (e.g., the top surface) of the substrate 4. The electronic components 5 are electrically connected to the substrate 4 via bonding wires 51 or solder balls 52, or the electronic components 5 can be directly contacted or directly electrically connected to the substrate 4. Next, an antenna module 3 is disposed on the surface (e.g., the top surface) of the substrate 4, so that the insulating cover 31b (e.g., a glass insulating cover) of the antenna module 3 covers the periphery (e.g., the top and sides) of all electronic components 5, so that all electronic components 5, bonding wires 51 and / or solder balls 52 are located within the first cavity 32a of the antenna module 3.

[0078] In one embodiment, the first isolation layer 35a of the antenna module 3 may be formed on the wall surface 33 of the first cavity 32a, and the first antenna structure 37a may be formed on the surface (such as the top surface) of the insulating cover 31b. The first isolation layer 35a may be located between the first antenna structure 37a and the electronic component 5 in the first cavity 32a, or between the first conductive through-hole 36a and the electronic component 5 in the first cavity 32a, so as to conformally shield the first antenna structure 37a and the electronic component 5 through the first isolation layer 35a, thereby effectively isolating / shielding signal interference or electromagnetic interference between the first antenna structure 37a and the electronic component 5.

[0079] In one embodiment, the first conductive through-hole 36a may be formed in the insulating cover 31b to penetrate the insulating cover 31b, the shape of the first antenna structure 37a may be meandering, one end of the first antenna structure 37a is electrically connected to the first conductive through-hole 36a, and the first antenna structure 37a may be fed with antenna signals (such as radio frequency signals) through the first conductive through-hole 36a or electrically connected to the substrate 4.

[0080] In one embodiment, the substrate 4 may be a circuit board, a packaging substrate, a circuit board, a circuit structure, a carrier board, or an interposer. The electronic component 5 may be an active component, a passive component, or a combination thereof. For example, the active component may be a semiconductor wafer or a semiconductor element, and the passive component may be a resistor, a capacitor, or an inductor.

[0081] Figure 4A and Figure 4B These are a top view and a cross-sectional view of the second embodiment of the electronic package 2 of this application, respectively. Figure 4B for Figure 4A The cross-sectional view of electronic package 2 at line segment A2. Meanwhile, Figures 4A to 4B With the above Figures 3A to 3B The electronic package 2 is similar to that in the previous example, so the similarities will not be described again, but only the following will be explained. Figures 4A to 4B The main differences in electronic package 2 are as follows.

[0082] like Figures 4A to 4B As shown, the antenna module 3 of the electronic package 2 may further include a second cavity 32b and a second isolation layer 35b. The first antenna structure 37a of the antenna module 3 is a single antenna, and multiple electronic components 5 are respectively located in the first cavity 32a and the second cavity 32b.

[0083] In one embodiment, the first isolation layer 35a may be located between the first antenna structure 37a and the electronic components 5 in the first cavity 32a, and the second isolation layer 35b may be formed on the wall of the second cavity 32b and located between the first antenna structure 37a and the electronic components 5 in the second cavity 32b, so as to effectively isolate / shield signal interference or electromagnetic interference between the first antenna structure 37a and the multiple electronic components 5 by comparative shielding the first antenna structure 37a and the multiple electronic components 5 through the first isolation layer 35a and the second isolation layer 35b.

[0084] In one embodiment, the second cavity 32b may be an isolation cavity, a clearance cavity, an etched clearance area, or an accommodating space, and the second cavity 32b has a U-shaped or U-shaped wall surface (see reference). Figure 2B The wall 33) in the middle, and the second isolation layer 35b can be a signal isolation layer, signal shielding layer, electromagnetic shielding layer or electromagnetic interference (EMI) isolation layer made of metal material.

[0085] Figure 5A and Figure 5B These are a top view and a cross-sectional view of the third embodiment of the electronic package 2 of this application, respectively. Figure 5B for Figure 5A The cross-sectional view of electronic package 2 at line segment A3. Meanwhile, Figures 5A to 5B With the above Figures 3A to 3B The electronic package 2 is similar to that in the previous example, so the similarities will not be described again, but only the following will be explained. Figures 5A to 5B The main differences in electronic package 2 are as follows.

[0086] like Figures 5A to 5B As shown, the antenna module 3 of the electronic package 2 may further include a second conductive through-hole 36b and a second antenna structure 37b, and the first antenna structure 37a and the second antenna structure 37b together constitute a dual antenna.

[0087] In one embodiment, both the first conductive through-hole 36a and the second conductive through-hole 36b can be formed in the insulating cover 31b to penetrate the insulating cover 31b, and are respectively located on the outside of the first insulating layer 35a (such as the left and right sides). The first cavity 32a, the first insulating layer 35a and the electronic component 5 are all located between the first conductive through-hole 36a and the second conductive through-hole 36b, and neither the first conductive through-hole 36a nor the second conductive through-hole 36b contacts the first insulating layer 35a.

[0088] In one embodiment, the first antenna structure 37a and the second antenna structure 37b may be formed at different positions on the surface (such as the top surface) of the insulating cover 31b. The first antenna structure 37a may be electrically connected to the first conductive through-hole 36a and the substrate 4 in sequence, and the second antenna structure 37b may be electrically connected to the second conductive through-hole 36b and the substrate 4 in sequence.

[0089] In one embodiment, the first isolation layer 35a may be located between the first antenna structure 37a, the second antenna structure 37b and the electronic component 5 in the first cavity 32a, so as to conformally shield the first antenna structure 37a, the second antenna structure 37b and the electronic component 5 through the first isolation layer 35a, thereby effectively isolating / shielding the signal interference or electromagnetic interference between the first antenna structure 37a, the second antenna structure 37b and the electronic component 5.

[0090] In one embodiment, the second conductive through-hole 36b may be a glass through-hole (TGV) containing a conductive material (such as a metallic material), and the shape of the second antenna structure 37b may be a meandering shape (see...). Figure 5A ( ), regular shape or irregular shape.

[0091] Figure 6A and Figure 6B These are a top view and a cross-sectional view of the fourth embodiment of the electronic package 2 of this application, respectively. Figure 6B for Figure 6A The cross-sectional view of electronic package 2 at line segment A4. Meanwhile, Figures 6A to 6B With the above Figures 5A to 5B The electronic package 2 is similar to that in the previous example, so the similarities will not be described again, but only the following will be explained. Figures 6A to 6B The main differences in electronic package 2 are as follows.

[0092] like Figures 6A to 6B As shown, the antenna module 3 of the electronic package 2 may also include a second cavity 32b and a second isolation layer 35b. The first antenna structure 37a and the second antenna structure 37b together constitute a dual antenna, and multiple electronic components 5 are respectively located in the first cavity 32a and the second cavity 32b.

[0093] In one embodiment, the first isolation layer 35a may be located between the first antenna structure 37a and the electronic components 5 in the first cavity 32a, and the second isolation layer 35b may be formed on the wall of the second cavity 32b and located between the second antenna structure 37b and the electronic components 5 in the second cavity 32b, so as to effectively isolate / shield signal interference or electromagnetic interference between the first antenna structure 37a, the second antenna structure 37b and the multiple electronic components 5 by partitioning the first isolation layer 35a and the second isolation layer 35b.

[0094] In one embodiment, the first cavity 32a, the first isolation layer 35a, the second cavity 32b, the second isolation layer 35b and the electronic component 5 are all located between the first conductive through hole 36a and the second conductive through hole 36b, and neither the first conductive through hole 36a nor the second conductive through hole 36b contacts the first isolation layer 35a and the second isolation layer 35b.

[0095] Figure 7A and Figure 7B These are a top view and a cross-sectional view of the fifth embodiment of the electronic package 2 of this application, respectively. Figure 7B for Figure 7A The cross-sectional view of electronic package 2 at line segment A5. Meanwhile, Figures 7A to 7B With the above Figures 5A to 5B The electronic package 2 is similar to that in the previous example, so the similarities will not be described again, but only the following will be explained. Figures 7A to 7B The main differences in electronic package 2 are as follows.

[0096] like Figures 7A to 7B As shown, the first antenna structure 37a of the antenna module 3 of the electronic package 2 is an antenna array composed of multiple antenna blocks 37c. The antenna blocks 37c at different positions (such as the left and right sides) of the first antenna structure 37a (such as the antenna array) are electrically connected to the first conductive through-hole 36a and the second conductive through-hole 36b, so that the first antenna structure 37a (such as the antenna array) can be fed with antenna signals (such as radio frequency signals) or electrically connected to the substrate 4 through the first conductive through-hole 36a and the second conductive through-hole 36b, respectively.

[0097] In one embodiment, the first isolation layer 35a may be located between the first antenna structure 37a (such as an antenna array) and the electronic component 5 in the first cavity 32a, so as to conformally shield the first antenna structure 37a (such as an antenna array) and the electronic component 5 through the first isolation layer 35a, thereby effectively isolating / shielding signal interference or electromagnetic interference between the first antenna structure 37a (such as an antenna array) and the electronic component 5.

[0098] In one embodiment, the plurality of antenna blocks 37c of the first antenna structure 37a (such as an antenna array) may be arranged in at least one column or several columns, the spacing or area of ​​the plurality of antenna blocks 37c may be the same or different, and the first isolation layer 35a may be located between the plurality of antenna blocks 37c of the first antenna structure 37a (such as an antenna array) and at least one (such as multiple) electronic components 5.

[0099] Figure 8A and Figure 8B These are a top view and a cross-sectional view of the sixth embodiment of the electronic package 2 of this application, respectively. Figure 8B for Figure 8A The cross-sectional view of electronic package 2 at line segment A6. Meanwhile, Figures 8A to 8B With the above Figures 7A to 7B The electronic package 2 is similar to that in the previous example, so the similarities will not be described again, but only the following will be explained. Figures 8A to 8B The main differences in electronic package 2 are as follows.

[0100] like Figures 8A to 8B As shown, the antenna module 3 of the electronic package 2 may further include a second cavity 32b and a second isolation layer 35b. The first antenna structure 37a may be an antenna array composed of multiple antenna blocks 37c, and multiple electronic components 5 are respectively located in the first cavity 32a and the second cavity 32b.

[0101] In one embodiment, a first isolation layer 35a may be located between a first antenna structure 37a (such as an antenna array) and an electronic component 5 within a first cavity 32a, and a second isolation layer 35b may be formed on the wall of the second cavity 32b and located between the first antenna structure 37a (such as an antenna array) and the electronic component 5 within the second cavity 32b, so as to effectively isolate / shield signal interference or electromagnetic interference between the first antenna structure 37a (such as an antenna array) and the multiple electronic components 5 by partitioning the first isolation layer 35a and the second isolation layer 35b.

[0102] In one embodiment, the first cavity 32a, the first isolation layer 35a, the second cavity 32b, the second isolation layer 35b and the electronic component 5 are all located between the first conductive through hole 36a and the second conductive through hole 36b, and neither the first conductive through hole 36a nor the second conductive through hole 36b contacts the first isolation layer 35a and the second isolation layer 35b.

[0103] Figure 9A and Figure 9B These are, respectively, a top view and a cross-sectional view of the seventh embodiment of the electronic package 2 of this application, and Figure 9B for Figure 9A The cross-sectional view of electronic package 2 at line segment A7. Meanwhile, Figures 9A to 9BWith the above Figures 7A to 7B The electronic package 2 is similar to that in the previous example, so the similarities will not be described again, but only the following will be explained. Figures 9A to 9B The main differences in electronic package 2 are as follows.

[0104] like Figures 9A to 9B As shown, the antenna module 3 of the electronic package 2 may further include an insulating substrate 38 and an antenna signal enhancement structure 39. The insulating substrate 38 may be formed on the insulating cover 31b and the first antenna structure 37a (as shown above), and the antenna signal enhancement structure 39 may be formed on the insulating substrate 38 to effectively enhance the antenna signal of the first antenna structure 37a.

[0105] In one embodiment, the first antenna structure 37a may be an antenna array (such as a first antenna array) composed of multiple antenna blocks 37c (such as a first antenna block), and the antenna signal enhancement structure 39 may be an antenna array (such as a second antenna array) composed of multiple antenna blocks 39a (such as a second antenna block), and the multiple antenna blocks 37c (such as a first antenna block) may correspond to multiple antenna blocks 39a (such as a second antenna block).

[0106] In one embodiment, the multiple antenna blocks 39a of the antenna signal enhancement structure 39 (such as a second antenna array) can be arranged in at least one column or several columns. The spacing or area of ​​the multiple antenna blocks 39a can be the same as or different from the spacing or area of ​​the multiple antenna blocks 37c. The first isolation layer 35a is located between the multiple antenna blocks 37c of the first antenna structure 37a (such as a first antenna array) and at least one (or multiple) electronic components 5.

[0107] In one embodiment, the first antenna structure 37a (antenna block 37c) and the antenna signal enhancement structure 39 (antenna block 39a) may be separated by a distance H, and the distance H may be half the wavelength of the antenna signal of the first antenna structure 37a (i.e., 1 / 2λ), or ±10% of this half wavelength (i.e., 1 / 2λ ± 10%).

[0108] Figure 10A and Figure 10B These are a top view and a cross-sectional view of the eighth embodiment of the electronic package 2 of this application, respectively. Figure 10B for Figure 10A The cross-sectional view of electronic package 2 at line segment A8. Meanwhile, Figures 10A to 10B With the above Figures 9A to 9B The electronic package 2 is similar to that in the previous example, so the similarities will not be described again, but only the following will be explained. Figures 10A to 10B The main differences in electronic package 2 are as follows.

[0109] like Figures 10A to 10BAs shown, the antenna module 3 of the electronic package 2 may further include a second cavity 32b and a second isolation layer 35b. The first antenna structure 37a may be an antenna array composed of multiple antenna blocks 37c (such as a first antenna array). The antenna signal enhancement structure 39 may be an antenna array composed of multiple antenna blocks 39a (such as a second antenna array). The multiple electronic components 5 are respectively located in the first cavity 32a and the second cavity 32b.

[0110] In one embodiment, the first isolation layer 35a may be located between the first antenna structure 37a (such as the first antenna array) and the electronic components 5 in the first cavity 32a. The second isolation layer 35b may be formed on the wall of the second cavity 32b and located between the first antenna structure 37a (such as the first antenna array) and the electronic components 5 in the second cavity 32b. The first antenna structure 37a may be located between the first isolation layer 35a, the second isolation layer 35b and the antenna signal enhancement structure 39, so as to effectively isolate / shield the signal interference or electromagnetic interference between the first antenna structure 37a (such as the first antenna array) and the multiple electronic components 5 by partitioning the first isolation layer 35a and the second isolation layer 35b.

[0111] In summary, the electronic package 2 of this application has at least the following features, advantages or technical effects.

[0112] First, the electronic package 2 of this application effectively integrates the first isolation layer 35a (second isolation layer 35b), the first conductive via 36a (second conductive via 36b), and the first antenna structure 37a (second antenna structure 37b) to provide good electromagnetic interference (EMI) protection, isolation, or shielding for the electronic component 5. Simultaneously, this application overcomes the shortcomings of existing system-in-package (SiP) modules that only include an antenna structure (but not an isolation layer), thus failing to provide good EMI protection, isolation, or shielding.

[0113] 2. The electronic package 2 of this application is a new system-in-package (SiP) product configuration / architecture that can make good use of the first isolation layer 35a (second isolation layer 35b), the first conductive through-hole 36a (second conductive through-hole 36b) and the first antenna structure 37a (second antenna structure 37b) to effectively combine electromagnetic interference (EMI) shielding and antenna integration.

[0114] Third, the first isolation layer 35a of the antenna module 3 of this application can conformally shield the first antenna structure 37a and the electronic component 5, so as to effectively isolate / shield the signal interference or electromagnetic interference between the first antenna structure 37a and the electronic component 5.

[0115] Fourth, the first isolation layer 35a and the second isolation layer 35b of the antenna module 3 of this application can partition and shield the first antenna structure 37a (second antenna structure 37b) and multiple electronic components 5, so as to effectively isolate / shield the signal interference or electromagnetic interference between the first antenna structure 37a (second antenna structure 37b) and multiple electronic components 5.

[0116] 5. The first isolation layer 35a of the antenna module 3 of this application can conformally shield the antenna array of the first antenna structure 37a and the electronic component 5, so as to effectively isolate / shield the signal interference or electromagnetic interference between the antenna array of the first antenna structure 37a and the electronic component 5.

[0117] VI. The insulating substrate 38 of the antenna module 3 of this application can be formed on the insulating cover 31b and the first antenna structure 37a, and the antenna signal enhancement structure 39 can be formed on the insulating substrate 38 so as to effectively enhance the antenna signal of the first antenna structure 37a by utilizing the antenna signal enhancement structure 39.

[0118] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.

Claims

1. An electronic package, characterized in that, include: substrate; Electronic components are disposed on the substrate; as well as The antenna module is mounted on the substrate to cover the electronic component. The antenna module includes an insulating cover, a first cavity, a first insulating layer, a first conductive perforation, and a first antenna structure. The insulating cover covers the periphery of the electronic component, the electronic component is located in the first cavity, the first insulating layer is formed on the wall of the first cavity, the first conductive perforation is formed in the insulating cover to penetrate the insulating cover, the first antenna structure is formed on the insulating cover to electrically connect the first conductive perforation to the substrate, and the first insulating layer is located between the first antenna structure and the electronic component.

2. The electronic package as described in claim 1, characterized in that, The insulating cover is a glass isolation cover, and the first conductive perforation is a glass perforation containing conductive material.

3. The electronic package as described in claim 1, characterized in that, The antenna module also includes a second cavity, with multiple electronic components located in the first cavity and the second cavity respectively, and the first isolation layer is located between the first antenna structure and the electronic components in the first cavity.

4. The electronic package as described in claim 3, characterized in that, The antenna module also includes a second isolation layer formed on the wall of the second cavity, and the second isolation layer is located between the first antenna structure and the electronic component in the second cavity.

5. The electronic package as described in claim 1, characterized in that, The antenna module also includes a second conductive through-hole and a second antenna structure. The second conductive through-hole is formed in the insulating cover to penetrate the insulating cover, and the second antenna structure is formed on the insulating cover to be electrically connected to the second conductive through-hole and the substrate.

6. The electronic package as claimed in claim 1, characterized in that, The first antenna structure is an antenna array composed of multiple antenna blocks, and the first isolation layer is located between the antenna array and the electronic component.

7. The electronic package as claimed in claim 1, characterized in that, The antenna module also includes a second cavity. The first antenna structure is an antenna array composed of multiple antenna blocks, and multiple electronic components are respectively located in the first cavity and the second cavity.

8. The electronic package as claimed in claim 1, characterized in that, The antenna module also includes an insulating substrate and an antenna signal enhancement structure. The insulating substrate is formed on the insulating cover and the first antenna structure, and the antenna signal enhancement structure is formed on the insulating substrate.

9. The electronic package as claimed in claim 8, characterized in that, The first antenna structure is a first antenna array composed of multiple first antenna blocks, and the antenna signal enhancement structure is a second antenna array composed of multiple second antenna blocks, wherein the multiple first antenna blocks correspond to the multiple second antenna blocks.

10. The electronic package as claimed in claim 8, characterized in that, The first antenna structure is separated from the antenna signal enhancement structure by a gap, and the gap is half the wavelength of the antenna signal of the first antenna structure or ±10%.

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