Air knife mechanism, drying device and cleaning equipment

Abstract

This utility model belongs to the field of silicon wafer processing technology, and particularly relates to an air knife mechanism, a drying device, and a cleaning equipment. The air knife mechanism includes an upper air knife assembly configured to blow air from the top of the silicon wafer onto its top surface. The upper air knife assembly includes an upper air knife body. A first, second, and third strip-shaped air duct are sequentially arranged on the bottom surface of the upper air knife body along the length of the silicon wafer. The length directions of the first, second, and third air ducts are parallel to the width direction of the silicon wafer. Vertical air outlets are formed on the bottom surfaces of the first and third air ducts along their length directions, ensuring the airflow is vertically downwards for positioning the silicon wafer. At least one inclined air outlet is formed on the bottom surface of the second air duct along its length direction, causing the airflow to be inclined, thereby achieving non-contact positioning, avoiding the formation of roller marks on the silicon wafer during the drying process, and improving the drying effect.

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