Totally enclosed automatic chemical nickel plating device for printed circuit board gold plating

Abstract

The utility model relates to circuit board nickel gold technical field, specifically disclose printed circuit board gold immersion is used full -enclosed automatic chemical nickel gold device, including closed storehouse, the top inner wall of closed storehouse is provided with mobile clamping assembly, and the inside left side of closed storehouse is provided with circulating nickel plating assembly, mobile clamping assembly is used for clamping circuit board and processes, and circulating nickel plating assembly is used for nickel plating to circuit board, through to nickel plating groove is divided into three -segment mode, and every pool is provided with first heating pipe and thermocouple, and carries out accurate temperature control, and the temperature in every pool gradually increases and forms the heating of subregion, can make gold layer pore reduction on the surface of circuit board, and cooperate with the fixed pipe and venturi nozzle set up in bottom, make three -dimensional end flow in nickel plating groove, eliminate the dead angle that conventional nickel plating cannot deposit, can keep nickel layer thickness balance, improve the deposit uniformity of circuit board, improve circuit board quality and reliability.

Description

Technical Field

[0001] This utility model relates to the field of nickel-gold technology for printed circuit boards, specifically a fully enclosed automated chemical nickel-gold device for immersion gold plating of printed circuit boards. Background Technology

[0002] Electroless nickel-gold plating (ENIG), also known as electroless nickel-gold plating, is a process that involves chemically replacing palladium on the surface of copper, then electrolessly plating a nickel-phosphorus alloy layer onto the palladium core, and finally plating a layer of gold onto the nickel surface through a displacement reaction. There are two main processes for ENIG plating: displacement and a hybrid bath of partial displacement and partial reduction. It is primarily used to protect circuit board pads and improve solderability and reliability. However, existing PCB ENIG plating devices often have uneven nickel layer thickness (e.g., differences between the board edge and center), leading to poor soldering or signal loss. Therefore, we propose a fully enclosed automated electroless nickel-gold plating device for printed circuit board ENIG plating. Utility Model Content

[0003] The purpose of this invention is to provide a fully enclosed automated electroless nickel-gold device for immersion gold plating of printed circuit boards, so as to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a fully enclosed automated electroless nickel plating device for immersion gold plating of printed circuit boards, comprising a closed chamber, a movable clamping assembly provided on the top inner wall of the closed chamber, and a circulating nickel plating assembly provided on the left side inside the closed chamber. The movable clamping assembly is used to clamp the circuit board for processing, and the circulating nickel plating assembly is used to plate nickel on the circuit board.

[0005] The circulating nickel plating assembly includes a nickel plating tank with two first partitions inside, dividing the tank into three sections. Each of the three sections is fixedly connected to a first heating tube. A filter box is fixedly connected to the right side of the nickel plating tank, and a suction pump is fixedly connected to the top of the filter box. A circulation pipe is fixedly connected to the output end of the suction pump. The circulation pipe is inverted M-shape and has two ends, front and back. The other end of the circulation pipe is connected to a fixed pipe, and several Venturi nozzles are fixedly connected to the top of the fixed pipe.

[0006] The nickel plating tank has thermocouples installed in all three internal partitions, and the top opening of the first partition is equipped with a flow guide plate.

[0007] The filter box contains a filter element, and the other end of the suction pump is fixedly connected to a suction pipe. The other end of the suction pipe passes through the top of the filter box and extends downward.

[0008] The movable clamping assembly includes a first motor and a sliding groove. The output end of the first motor is fixedly connected to a first threaded rod, and the outer side of the first threaded rod is threadedly connected to a threaded seat. The threaded seat is slidably connected inside the sliding groove. The bottom of the sliding groove is fixedly connected to a telescopic cylinder, and the bottom of the telescopic cylinder is fixedly connected to a movable frame.

[0009] The front side of the movable frame is fixedly connected to a second motor, the output end of the second motor is fixedly connected to a second threaded rod, and several movable clamping plates are threadedly connected to the outer side of the second threaded rod.

[0010] The movable frame has several fixed clamps inside, and anti-slip pads are fixedly connected to the bottom inner side of both the fixed clamps and the movable clamps on the opposite side.

[0011] The bottom inner wall of the sealed chamber is fixedly connected to a gold immersion tank, the middle of which is fixedly connected to a second partition. The left and right sides of the gold immersion tank are equipped with second heating pipes, and the bottom inner wall of the sealed chamber is fixedly connected to a cleaning tank.

[0012] The front of the enclosed compartment is fixedly connected to a viewing window.

[0013] This utility model has at least the following beneficial effects:

[0014] By dividing the nickel plating bath into three sections, each equipped with a heating element and thermocouple for precise temperature control, the temperature in each section gradually increases, creating zoned heating. This reduces the porosity of the gold layer on the circuit board surface. Furthermore, the bottom-mounted fixing tube and Venturi nozzle create a three-dimensional flow within the nickel plating bath, eliminating dead zones that conventional nickel plating methods cannot reach. This maintains a uniform nickel layer thickness, improves plating uniformity, and enhances the quality and reliability of the circuit board. Simultaneously, the overflowing nickel-gold liquid from each immersion of the circuit board in different sections of the nickel plating bath... The solution is smoothly guided into the next nickel plating tank by the guide plate, maintaining a balanced flow of chemicals in each tank. Finally, it is circulated into the filter box through the opening on the right side of the nickel plating tank. After being filtered by the filter element, it is then introduced into the circulation pipe by the suction pump. Finally, it is returned to each tank through the circulation pipe and the fixed pipe, ensuring the capacity of the solution in each tank. At the same time, the solution circulation is from far to near. When it is input into the right tank, the temperature of the solution is the same as the temperature inside the tank. When it is input into the left tank, the temperature of the solution is not much different from the temperature inside the corresponding tank after being transported a distance, ensuring temperature consistency. Attached Figure Description

[0015] Figure 1 This is a three-dimensional view of the structure of this utility model;

[0016] Figure 2 This is a right view of the structure of this utility model;

[0017] Figure 3This is a cross-sectional view of the internal structure of this utility model from the left side;

[0018] Figure 4 This is a cross-sectional view of the internal structure of the mobile frame of this utility model;

[0019] Figure 5 This is a cross-sectional view of the internal structure of the cyclic nickel plating assembly of this utility model;

[0020] Figure 6 This is a right-side sectional view of the internal structure of the cyclic nickel plating assembly of this utility model.

[0021] In the diagram: 1. Enclosed chamber; 2. Viewing window; 3. Moving clamping assembly; 301. First motor; 302. Sliding groove; 303. Threaded seat; 304. First threaded rod; 305. Telescopic cylinder; 306. Moving frame; 307. Second motor; 308. Second threaded rod; 309. Moving clamping plate; 310. Fixed clamping plate; 311. Anti-slip pad; 4. Circulating nickel plating assembly; 401. Nickel plating tank; 402. First heating tube; 403. Guide plate; 404. First partition; 405. Fixed tube; 406. Circulation tube; 407. Venturi nozzle; 408. Filter box; 409. Thermocouple; 410. Filter element; 411. Suction pump; 412. Suction pipe; 5. Immersion gold tank; 6. Cleaning tank; 7. Second partition; 8. Second heating tube. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example 1

[0024] Please see Figures 1 to 6 This utility model provides a technical solution: a fully enclosed automated chemical nickel-gold device for immersion gold plating of printed circuit boards, including a closed chamber 1, a movable clamping component 3 is provided on the top inner wall of the closed chamber 1, and a circulating nickel plating component 4 is provided on the left side inside the closed chamber 1. The movable clamping component 3 is used to clamp the circuit board for processing, and the circulating nickel plating component 4 is used to plate nickel on the circuit board.

[0025] The circulating nickel plating assembly 4 includes a nickel plating tank 401. The nickel plating tank 401 has two first partitions 404 inside, which divide the inside of the nickel plating tank 401 into three sections. A first heating tube 402 is fixedly connected to each of the three sections inside the nickel plating tank 401. A filter box 408 is fixedly connected to the right side of the nickel plating tank 401. A suction pump 411 is fixedly connected to the top of the filter box 408. A circulation pipe 406 is fixedly connected to the output end of the suction pump 411. The circulation pipe 406 is inverted M-shaped and has two ends. The other end of the circulation pipe 406 is connected to a fixed pipe 405. Several Venturi nozzles 407 are fixedly connected to the top of the fixed pipe 405.

[0026] First, after the circuit board is clamped and fixed by the movable clamping assembly 3, it is pushed downward by the telescopic cylinder 305 and immersed sequentially in the inner pool of the nickel plating tank 401 for nickel plating. After nickel plating, the telescopic cylinder 305 lifts the circuit board and transports it to the right, immersing it sequentially in the pool inside the gold immersion tank 5. Finally, it is immersed and cleaned in the cleaning tank 6. By dividing the nickel plating tank 401 into three sections, and each pool is equipped with a first heating tube 402 and a thermocouple 409 for precise temperature control, the temperature in each pool gradually increases to form zoned heating, which can reduce the porosity of the gold layer on the surface of the circuit board. In addition, with the fixed tube 405 and Venturi nozzle 407 at the bottom, a three-dimensional flow is formed in the nickel plating tank 401, eliminating dead corners that cannot be plated by conventional nickel plating, maintaining a uniform nickel layer thickness, and improving the circuit board's performance. The plating is uniform, improving the quality and reliability of the circuit board. Simultaneously, when the circuit board is immersed in different sections of the nickel plating tank 401, the overflowing nickel-gold liquid is smoothly guided by the guide plate 403 to the next section of the nickel plating tank 401, maintaining a balanced flow of the solution in each tank. Finally, it is circulated into the filter box 408 through the opening on the right side of the nickel plating tank 401. After being filtered by the filter element 410, it is then introduced into the circulation pipe 406 by the suction pump 411. Finally, it flows back to each tank through the circulation pipe 406 and the fixed pipe 405, ensuring the capacity of the solution in each tank. Furthermore, the solution circulation proceeds from far to near; when input into the right tank, the solution temperature is consistent with the tank temperature; when input into the left tank, the solution has traveled a distance, and its temperature is not significantly different from the corresponding tank temperature, ensuring temperature consistency.

[0027] Thermocouples 409 are installed in three partitions inside the nickel plating tank 401. A guide plate 403 is installed at the top opening of the first partition 404. 409 is used to monitor the temperature in each tank to ensure temperature stability. 403 is used to smoothly guide the overflowing liquid to prevent it from affecting the stability of the liquid flow in the next tank.

[0028] A filter element 410 is fixedly connected inside the filter box 408. A suction pipe 412 is fixedly connected to the other end of the suction pump 411. The other end of the suction pipe 412 passes through the top of the filter box 408 and extends downward. The filter element 410 is used to filter impurities in the medicine solution.

[0029] Example 2

[0030] The movable clamping assembly 3 includes a first motor 301 and a sliding groove 302. The output end of the first motor 301 is fixedly connected to a first threaded rod 304. The outer side of the first threaded rod 304 is threadedly connected to a threaded seat 303. The threaded seat 303 is slidably connected inside the sliding groove 302. The bottom of the sliding groove 302 is fixedly connected to a telescopic cylinder 305. The bottom of the rod of the telescopic cylinder 305 is fixedly connected to a movable frame 306.

[0031] The operation of the first motor 301 drives the first threaded rod 304 to rotate, which in turn pushes the threaded seat 303 to slide inside the sliding groove 302, thereby driving the bottom moving frame 306 and the circuit board clamped inside the moving frame 306 to move, which facilitates process flow processing.

[0032] A second motor 307 is fixedly connected to the front side of the movable frame 306. A second threaded rod 308 is fixedly connected to the output end of the second motor 307. Several movable clamping plates 309 are threadedly connected to the outer side of the second threaded rod 308. The second motor 307 drives the second threaded rod 308 to rotate, thereby pushing the outer movable clamping plates 309 to move closer to the other side, and thus cooperate with the fixed clamping plate 310 to clamp the circuit board, ensuring the stability of the circuit board during nickel-gold bonding.

[0033] The movable frame 306 has several fixed clamping plates 310 inside. The bottom inner side of the fixed clamping plates 310 and the movable clamping plate 309 on the opposite side are fixedly connected with anti-slip pads 311. The anti-slip pads 311 are used to prevent the circuit board from slipping.

[0034] A gold immersion tank 5 is fixedly connected to the middle of the bottom inner wall of the sealed chamber 1. A second partition 7 is fixedly connected to the middle of the gold immersion tank 5. Second heating tubes 8 are provided on both the left and right sides inside the gold immersion tank 5. A cleaning tank 6 is fixedly connected to the right side of the bottom inner wall of the sealed chamber 1. The gold immersion tank 5 is used to perform gold immersion on the circuit board. The segmented gold immersion can reduce nickel corrosion, ensure the density of the gold layer, and thus reduce the occurrence rate of black pads. The cleaning tank 6 is used to clean the circuit board after the nickel-gold process to ensure the cleanliness of the circuit board surface.

[0035] A viewing window 2 is fixedly connected to the front of the enclosed chamber 1. The viewing window 2 is used to observe the circuit board processing status inside the enclosed chamber 1.

[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A fully enclosed automated electroless nickel-gold plating apparatus for printed circuit boards, comprising: The closed chamber (1) is characterized in that: a movable clamping assembly (3) is provided on the top inner wall of the closed chamber (1), and a circulating nickel plating assembly (4) is provided on the left side inside the closed chamber (1). The movable clamping assembly (3) is used to clamp the circuit board for processing, and the circulating nickel plating assembly (4) is used to plate the circuit board with nickel. The circulating nickel plating assembly (4) includes a nickel plating tank (401). The nickel plating tank (401) has two first partitions (404) inside. The nickel plating tank (401) is divided into three sections by the first partitions (404). A first heating tube (402) is fixedly connected to each of the three sections inside the nickel plating tank (401). A filter box (408) is fixedly connected to the right side of the nickel plating tank (401). A suction pump (411) is fixedly connected to the top of the filter box (408). A circulation pipe (406) is fixedly connected to the output end of the suction pump (411). The circulation pipe (406) is in the shape of an inverted m and has two locations, front and back. The other end of the circulation pipe (406) is connected to a fixed pipe (405). Several Venturi nozzles (407) are fixedly connected to the top of the fixed pipe (405).

2. The fully enclosed automated electroless nickel-gold plating apparatus for printed circuit boards according to claim 1, characterized in that: Thermocouples (409) are provided in the three internal partitions of the nickel plating tank (401), and guide plates (403) are provided in the top openings of the first partition (404).

3. The fully enclosed automated electroless nickel-gold plating apparatus for printed circuit boards according to claim 1, characterized in that: The filter box (408) is fixedly connected to a filter element (410), and the other end of the suction pump (411) is fixedly connected to a suction pipe (412). The other end of the suction pipe (412) passes through the top of the filter box (408) and extends downward.

4. The fully enclosed automated electroless nickel-gold plating apparatus for printed circuit boards according to claim 1, characterized in that: The movable clamping assembly (3) includes a first motor (301) and a sliding groove (302). The output end of the first motor (301) is fixedly connected to a first threaded rod (304). The outer side of the first threaded rod (304) is threadedly connected to a threaded seat (303). The threaded seat (303) is slidably connected inside the sliding groove (302). The bottom of the sliding groove (302) is fixedly connected to a telescopic cylinder (305). The bottom of the rod of the telescopic cylinder (305) is fixedly connected to a movable frame (306).

5. The fully enclosed automated electroless nickel-gold plating apparatus for printed circuit boards according to claim 4, characterized in that: The front side of the movable frame (306) is fixedly connected to a second motor (307), the output end of the second motor (307) is fixedly connected to a second threaded rod (308), and the outer side of the second threaded rod (308) is threaded with several movable clamps (309).

6. The fully enclosed automated electroless nickel-gold plating apparatus for printed circuit boards according to claim 5, characterized in that: The movable frame (306) is internally fixedly connected with several fixed clamps (310), and the fixed clamps (310) and the movable clamps (309) on the opposite side are both fixedly connected with anti-slip pads (311) on their inner bottom sides.

7. The fully enclosed automated electroless nickel-gold plating apparatus for printed circuit boards according to claim 1, characterized in that: The bottom inner wall of the closed chamber (1) is fixedly connected to an immersion tank (5), the middle of the immersion tank (5) is fixedly connected to a second partition (7), the left and right sides of the immersion tank (5) are provided with second heating pipes (8), and the bottom inner wall of the closed chamber (1) is fixedly connected to a cleaning tank (6).

8. The fully enclosed automated electroless nickel-gold plating apparatus for printed circuit boards according to claim 1, characterized in that: A viewing window (2) is fixedly connected to the front side of the enclosed compartment (1).

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