Wafer cutting and cleaning integrated machine

Abstract

This utility model discloses an integrated wafer dicing and cleaning machine, comprising a dicing and cleaning machine, a dicing frame mounted on the upper surface of the dicing and cleaning machine, a transmission housing mounted on the dicing frame, the transmission housing being a height-adjustable structure, a dicing blade mounted on one side of the transmission housing, a wafer fixing platform mounted below the dicing blade, a discharge slide mounted on the discharge end of the wafer fixing platform, and a cleaning water tank mounted on the side surface of the dicing and cleaning machine. The wafer fixing platform is connected to the cleaning water tank via the discharge slide. This utility model, after pre-dicing the chip wafer material, allows the diced wafer material to be transported to the cleaning water tank via the discharge slide for immersion and cleaning of floating dust, possessing the advantages of fast dicing and cleaning processing speed and high efficiency.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, specifically to an integrated wafer cutting and cleaning machine. Background Technology

[0002] Silicon semiconductor integrated circuits are being used more and more widely. All of these circuits require wafers, which are then processed in the early stages.

[0003] Chinese patent document CN215988676U discloses an integrated wafer dicing and cleaning machine, comprising a body, a dicing machine connected to the top of one side of the body via a hinge, a dicing cavity with a dicing table inside the dicing cavity, a cleaning pipe penetrating one side surface of the dicing cavity, a mounting base fixedly connected to the rear of the body, a clamping robot fixedly connected to the top of the mounting base, a cleaning cavity with a flower basket inside the cleaning cavity, and a multi-functional cleaning mechanism penetrating the front of the cleaning cavity. This invention changes the traditional suction cup adsorption, using clamps to hold and move the wafer, reducing contact with the wafer, reducing contamination, facilitating wafer placement, and making operation more flexible. Heated cleaning agents can be used to clean the wafer, resulting in a more thorough cleaning effect, and the cleaned wafers can be easily transferred by the user.

[0004] The existing technologies mentioned above cannot perform rapid and precise cutting and material feeding and cleaning of wafer materials, resulting in slow product forming speed. Therefore, it is necessary to develop a new type of integrated wafer cutting and cleaning machine. Utility Model Content

[0005] The purpose of this invention is to provide an integrated wafer cutting and cleaning machine to solve the problems mentioned in the background art, such as the inability to quickly and accurately cut and clean wafer materials, and the slow product forming speed.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a wafer dicing and cleaning integrated machine, comprising a dicing and cleaning machine, a dicing frame mounted on the upper surface of the dicing and cleaning machine, a transmission housing mounted on the dicing frame, the transmission housing being a height-adjustable structure, a dicing blade mounted on one side of the transmission housing, a wafer fixing platform mounted below the dicing blade, a discharge slide mounted on the discharge end of the wafer fixing platform, a cleaning water tank mounted on the side surface of the dicing and cleaning machine, and the wafer fixing platform being connected to the cleaning water tank via the discharge slide.

[0007] Preferably, a fixed slide rail is installed on the front surface of the cutting machine frame, and a lifting slider is installed on the surface of the fixed slide rail. The front surface of the lifting slider is connected to the transmission box through a lifting plate.

[0008] Preferably, a drive cylinder is installed at the top of the cutting machine frame, and the output end of the drive cylinder is connected to the lifting plate via a telescopic rod.

[0009] Preferably, a cutting motor is installed on the top of the outer side of the transmission housing, and the output end of the cutting motor is connected to a worm gear via a rotating shaft.

[0010] Preferably, a turbine structure is installed inside the transmission housing, and the turbine structure is connected to the worm gear through meshing transmission.

[0011] Preferably, the center of the surface of the turbine structure is connected to the cutting blade via a rotating shaft.

[0012] Preferably, the transmission housing is adjusted by vertical sliding along the surface of the fixed slide rail via a lifting plate.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This utility model features a transmission housing with convenient lifting and drive control. The worm gear transmission mechanism can be used to control the rotation of the cutting blade, thereby facilitating the pre-positioned cutting of chip wafer materials. By installing a discharge slide at the discharge end of the wafer fixing platform, the cut wafer material can be transported to the interior of the cleaning water tank. After soaking and cleaning the floating dust in the cleaning water tank, it has the advantages of fast cutting, cleaning and forming speed and high efficiency. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a side view of the present invention.

[0017] Figure 3 This is a schematic diagram of the back-end structure of this utility model.

[0018] In the diagram: 1. Cutting and cleaning machine; 2. Wafer fixing platform; 3. Cutting blade; 4. Cutting machine frame; 5. Lifting plate; 6. Fixed slide rail; 7. Telescopic rod; 8. Drive cylinder; 9. Cutting motor; 10. Transmission housing; 11. Discharge slide; 12. Cleaning water tank; 13. Turbine structure; 14. Rotating shaft; 15. Rotating shaft; 16. Worm gear; 17. Lifting slider. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0020] Please see Figure 1-3 An embodiment of this utility model provides: a wafer dicing and cleaning integrated machine, including a dicing and cleaning machine 1, a dicing frame 4 installed on the upper surface of the dicing and cleaning machine 1, a transmission housing 10 installed on the dicing frame 4, the transmission housing 10 having a height-adjustable structure, a dicing blade 3 installed on one side of the transmission housing 10, a wafer fixing platform 2 installed below the dicing blade 3, a discharge slide 11 installed at the discharge end of the wafer fixing platform 2, a cleaning water tank 12 installed on the side surface of the dicing and cleaning machine 1, and the wafer fixing platform 2 being connected to the cleaning water tank 12 via the discharge slide 11.

[0021] Furthermore, a fixed slide rail 6 is installed on the front surface of the cutting machine frame 4, and a lifting slider 17 is installed on the surface of the fixed slide rail 6. The front surface of the lifting slider 17 is connected to the transmission housing 10 through the lifting plate 5, which facilitates the vertical adjustment of the installation height of the transmission housing 10.

[0022] Furthermore, a drive cylinder 8 is installed at the top of the cutting machine frame 4. The output end of the drive cylinder 8 is connected to the lifting plate 5 through the telescopic rod 7. The drive cylinder 8 is activated to drive and control the lifting plate 5 to adjust its lifting and sliding position.

[0023] Furthermore, a cutting operation motor 9 is installed on the top of the external part of the transmission housing 10. The output end of the cutting operation motor 9 is connected to a worm gear 16 through a rotating shaft 15. A turbine structure 13 is installed inside the transmission housing 10. The turbine structure 13 and the worm gear 16 are connected by meshing transmission. The center of the surface of the turbine structure 13 is connected to the cutting blade 3 through a rotating shaft 14. By turning on the cutting operation motor 9, the meshing transmission between the worm gear 16 and the turbine structure 13 is controlled, thereby driving the rotating shaft 14 to drive the cutting blade 3 to rotate rapidly. This can be used for rapid cutting of the wafer material below.

[0024] Furthermore, the transmission housing 10 is vertically slidable along the surface of the fixed slide rail 6 via the lifting plate 5, which facilitates rapid lifting and lowering of the position of the cutting mechanism, making it easier for the cutting blade 3 to perform positioning and cutting operations on the wafer material.

[0025] Working Principle: During operation, a cutting frame 4 is mounted on the upper surface of the cutting and cleaning machine 1. A transmission housing 10 is mounted on the cutting frame 4. The transmission housing 10 is a height-adjustable structure. A cutting blade 3 is mounted on one side of the transmission housing 10, and a wafer fixing platform 2 is mounted below the cutting blade 3. The wafer material to be cut is placed and fixed on the surface of the wafer fixing platform 2. The driving cylinder 8 is activated to drive and control the lifting plate 5 for height adjustment. The front end of the lifting slider 17 is connected to the transmission housing 10 via the lifting plate 5, facilitating vertical height adjustment of the transmission housing 10. The cutting operation motor 9 is activated to drive the meshing transmission between the control worm gear 16 and the turbine structure 13, thereby driving the control rotating shaft 14 to drive the cutting blade 3 to rotate rapidly. This can be used to quickly cut the wafer material below. The wafer fixing platform 2 is equipped with a discharge slide 11 at its discharge end. A cleaning water tank 12 is installed on the side surface of the cutting and cleaning machine 1. The wafer fixing platform 2 is connected to the cleaning water tank 12 through the discharge slide 11. The cut wafer material slides quickly down the discharge slide 11 into the cleaning water tank 12. After being soaked and cleaned of floating dust in the cleaning water tank, it has the advantages of fast cutting, cleaning, processing and forming speed and high efficiency.

[0026] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0027] All standard parts used in this application can be purchased from the market. The specific connection methods of each part are all conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment are all conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, and will not be described in detail here.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer dicing and cleaning integrated machine, comprising a dicing and cleaning machine (1), characterized in that, The upper surface of the cutting and cleaning machine (1) is equipped with a cutting operation frame (4), and a transmission housing (10) is installed on the cutting operation frame (4). The transmission housing (10) is a height-adjustable structure. A cutting blade (3) is installed on one side of the transmission housing (10), and a wafer fixing platform (2) is installed below the cutting blade (3). A discharge slide (11) is installed at the discharge end of the wafer fixing platform (2). A cleaning water tank (12) is installed on the side surface of the cutting and cleaning machine (1). The wafer fixing platform (2) is connected to the cleaning water tank (12) through the discharge slide (11).

2. The wafer dicing and cleaning integrated machine according to claim 1, characterized in that: The front surface of the cutting machine frame (4) is equipped with a fixed slide rail (6), and the surface of the fixed slide rail (6) is equipped with a lifting slider (17). The front surface of the lifting slider (17) is connected to the transmission box (10) through a lifting plate (5).

3. The integrated wafer dicing and cleaning machine according to claim 2, characterized in that: A drive cylinder (8) is installed at the top of the cutting machine frame (4), and the output end of the drive cylinder (8) is connected to the lifting plate (5) through a telescopic rod (7).

4. The integrated wafer dicing and cleaning machine according to claim 1, characterized in that: A cutting motor (9) is installed on the top of the outer side of the transmission housing (10), and the output end of the cutting motor (9) is connected to a worm gear (16) via a rotating shaft (15).

5. The wafer dicing and cleaning integrated machine according to claim 4, characterized in that: The transmission housing (10) is equipped with a turbine structure (13), which is connected to the worm gear (16) by meshing transmission.

6. The wafer dicing and cleaning integrated machine according to claim 5, characterized in that: The turbine structure (13) is connected to the cutting blade (3) at the center of its surface via a rotating shaft (14).

7. The integrated wafer dicing and cleaning machine according to claim 2, characterized in that: The transmission housing (10) is vertically slidable along the surface of the fixed slide rail (6) via the lifting plate (5).

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