Coating and cleaning integrated device
By designing an integrated coating and cleaning equipment, the carrier plate can be cleaned and dried during the coating process, which solves the problem of low carrier plate cleaning efficiency in the existing technology, improves production efficiency and reduces resource costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GUANGDONG PIONEER YUANCHUANG PRECISION TECH CO LTD
- Filing Date
- 2025-05-13
- Publication Date
- 2026-06-12
AI Technical Summary
Existing carrier cleaning methods require removing the carrier from the coating process and transporting it to the cleaning station, resulting in low production efficiency.
Design an integrated coating and cleaning equipment, including a coating device, a feeding mechanism, a discharging mechanism, a recirculation mechanism, a cleaning chamber, and a drying chamber, to realize acid washing, water washing, and drying of the carrier plate during the recirculation process, and to complete the cleaning and drying directly in the coating process, thereby improving production efficiency.
The carrier plate can be cleaned and dried without interrupting the coating process, which improves production efficiency and reduces resource costs by reusing materials through the recycling tank.
Smart Images
Figure CN224346484U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of solar cell equipment technology, specifically relating to an integrated coating and cleaning device. Background Technology
[0002] Heterojunction with Intrinsic Thin Layer (HJT) cells are a type of high-efficiency crystalline silicon solar cell structure. The manufacturing process of HJT cells typically includes texturing and cleaning, PECVD (Plasma Enhanced Chemical Vapor Deposition), TCO (Transparent Conductive Oxide) coating, and screen printing.
[0003] During the TCO coating process, the carrier plate supporting the silicon wafer is also coated with indium tin oxide (ITO). Since the carrier plate needs to be reused, the ITO accumulation on it gradually increases. Indium has strong water absorption properties, leading to higher moisture content on carrier plates with more ITO accumulation, resulting in higher water pressure. This, in turn, increases the resistivity of the thin film deposited on the target material, affecting the efficiency of the HJT cell. To address this issue, the carrier plate is typically cleaned. However, current carrier cleaning methods usually require removing the carrier plate from the coating process and transporting it to a cleaning station for cleaning, before returning it to the coating process for reuse, which is inefficient. Utility Model Content
[0004] The technical problem to be solved by this application is that the existing carrier plate cleaning requires the plate to be removed from the coating process and transported to the cleaning station for cleaning, which is inefficient. In order to solve this technical problem, a more efficient integrated coating and cleaning equipment is provided.
[0005] The technical solution proposed in this application is as follows:
[0006] An integrated coating and cleaning device, comprising:
[0007] Coating equipment;
[0008] The feeding mechanism and the unloading mechanism are provided, wherein the discharge end of the feeding mechanism is connected to the feed end of the coating device, and the feed end of the unloading mechanism is connected to the discharge end of the coating device.
[0009] A reflux mechanism, wherein the feed end of the reflux mechanism is connected to the discharge end of the unloading mechanism, and the discharge end of the reflux mechanism is connected to the feed end of the loading mechanism;
[0010] A cleaning device includes a cleaning chamber and a drying chamber, both of which are mounted on the reflux mechanism and arranged sequentially along the feeding direction of the reflux mechanism. The cleaning chamber includes an acid washing zone and a water washing zone arranged sequentially along the feeding direction of the reflux mechanism. The acid washing zone is provided with multiple acid washing nozzles located above the reflux mechanism and facing the reflux mechanism, and the water washing zone is provided with multiple water washing nozzles located above the reflux mechanism and facing the reflux mechanism.
[0011] Using the aforementioned integrated coating and cleaning equipment, after the coating unit completes the coating of the silicon wafer, the carrier board is conveyed to the recirculation mechanism via the unloading mechanism. Subsequently, under the action of the recirculation mechanism, it passes through the cleaning chamber and the drying chamber sequentially. In the cleaning chamber, the carrier board sequentially passes through the acid pickling zone and the water washing zone. In the acid pickling zone, the acid pickling nozzles first spray hydrochloric acid onto the carrier board to remove indium oxides. Then, in the water washing zone, the water washing nozzles spray water onto the carrier board to remove any residual substances. Next, the carrier board is dried in the drying chamber, and the dried carrier board is returned to the loading mechanism for reuse. In this way, the carrier board can be cleaned and dried during the recirculation process, eliminating the need to remove the carrier board from the coating process and convey it to the cleaning station, thus improving production efficiency.
[0012] Furthermore, the cleaning device also includes a recovery tank, which is disposed in the cleaning chamber and located below the reflux mechanism. The recovery tank corresponds to the acid washing nozzle and the water washing nozzle.
[0013] Furthermore, the cleaning device also includes a detection mechanism, which is disposed in the cleaning chamber and is used to detect the moisture content of the carrier plate input into the cleaning chamber.
[0014] Furthermore, the cleaning device also includes an acid supply mechanism, a water supply mechanism, a first control valve, and a second control valve; the acid supply mechanism is connected to a plurality of acid washing nozzles through the first control valve, and the water supply mechanism is connected to a plurality of water washing nozzles through the second control valve.
[0015] Furthermore, the cleaning device also includes a sub-control mechanism; the sub-control mechanism is electrically connected to the detection mechanism, the first control valve, and the second control valve.
[0016] Furthermore, the top of the recycling tank is removably covered with a cover plate.
[0017] Furthermore, the bottom of the recycling tank is provided with a drain outlet, and a drain valve is provided at the drain outlet.
[0018] Furthermore, the cleaning device also includes an air compressor, which is connected to a plurality of the acid pickling nozzles and a plurality of the water washing nozzles.
[0019] Furthermore, the top of the drying chamber is equipped with multiple heating plates.
[0020] Furthermore, the coating apparatus includes a heating chamber, a process chamber, and a cooling chamber arranged in sequence. The discharge end of the feeding mechanism is connected to the heating chamber, and the feed end of the unloading mechanism is connected to the cooling chamber.
[0021] In summary, the integrated coating and cleaning equipment provided in this application has at least the following advantages:
[0022] 1. It can perform silicon wafer coating and carrier board cleaning in one device, without removing the carrier board from the coating process and transporting it to the cleaning station for cleaning, thus improving production efficiency.
[0023] 2. The drying chamber can both dry the cleaned carrier plates and preheat them, further improving production efficiency.
[0024] 3. The recycling tank can recycle and reuse the cleaning materials, reducing resource costs. Attached Figure Description
[0025] The accompanying drawings are provided to further understand this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof.
[0026] Figure 1 This is a schematic diagram of the integrated coating and cleaning equipment provided in an embodiment of this application after removing the cleaning device;
[0027] Figure 2 This is a schematic diagram of the cleaning device in an integrated coating and cleaning equipment provided in an embodiment of this application;
[0028] Figure 3 for Figure 2 The diagram shows the structure of the cleaning chamber, drying chamber, and reflux mechanism in the cleaning device.
[0029] Label Explanation:
[0030] 200. Carrier plate; 110. Coating device; 111. Heating chamber; 112. Process chamber; 113. Cooling chamber; 121. Feeding mechanism; 122. Unloading mechanism; 123. Recirculation mechanism; 130. Cleaning device; 131. Cleaning chamber; 132. Drying chamber; 1331. Pickling nozzle; 1341. Washing nozzle; 135. Recovery tank; 1351. Drain outlet; 136. Cover plate; 1332. First control valve; 1342. Second control valve; 137. Sub-control mechanism; 138. Air compressor; 139. Heating plate. Detailed Implementation
[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0032] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the equipment or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0033] This application discloses an integrated coating and cleaning device that can perform coating on silicon wafers on a carrier board and cleaning of the carrier board without removing the carrier board and transporting it to the cleaning station, thus improving efficiency.
[0034] like Figures 1 to 3 As shown, the integrated coating and cleaning equipment includes a coating device 110, a feeding mechanism 121, a discharging mechanism 122, and a reflux mechanism 123. The discharge end of the loading mechanism 121 is connected to the feed end of the coating device 110 to input the carrier plate 200 carrying silicon wafers into the coating device 110, which can coat the silicon wafers. The feed end of the unloading mechanism 122 is connected to the discharge end of the coating device 110 to receive the carrier plate 200 output by the coating device 110, which carries the coated silicon wafers. The silicon wafers on the carrier plate 200 of the unloading mechanism 122 can be removed by a gripping mechanism, and the discharge end of the unloading mechanism 122 is connected to the feed end of the return mechanism 123 to transport the carrier plate 200 to the return mechanism 123. At the same time, the discharge end of the return mechanism 123 is connected to the feed end of the loading mechanism 121 to return the carrier plate 200 to the loading mechanism 121. The silicon wafers to be coated can be placed on the carrier plate 200 at the loading mechanism 121.
[0035] Furthermore, the integrated coating and cleaning equipment also includes a cleaning device 130, which includes a cleaning chamber 131 and a drying chamber 132. Both the cleaning chamber 131 and the drying chamber 132 are mounted on the reflux mechanism 123 and are arranged sequentially along the feeding direction of the reflux mechanism 123. The cleaning chamber 131 includes an acid pickling zone and a water washing zone arranged sequentially along the feeding direction of the reflux mechanism 123. The acid pickling zone is equipped with multiple acid pickling nozzles 1331 located above the reflux mechanism 123 and facing the reflux mechanism 123, and the water washing zone is equipped with multiple water washing nozzles 1341 located above the reflux mechanism 123 and facing the reflux mechanism 123.
[0036] Using the aforementioned integrated coating and cleaning equipment, after the coating device 110 completes the coating of the silicon wafer, the carrier plate 200 is conveyed to the return mechanism 123 via the unloading mechanism 122. Subsequently, under the action of the return mechanism 123, it passes through the cleaning chamber 131 and the drying chamber 132 in sequence. In the cleaning chamber 131, the carrier plate 200 passes through the acid pickling zone and the water washing zone in sequence. In the acid pickling zone, the acid pickling nozzle 1331 first sprays hydrochloric acid onto the carrier plate 200 to remove indium oxides. Then, in the water washing zone, the water washing nozzle 1341 sprays water onto the carrier plate 200 to remove any residual substances. Next, the carrier plate 200 is dried in the drying chamber 132. The dried carrier plate 200 is then returned to the loading mechanism 121 for reuse. In this way, the carrier plate 200 can be cleaned and dried during the return process, eliminating the need to remove the carrier plate 200 from the coating process and convey it to the cleaning station, thus improving production efficiency.
[0037] It should be explained that in this embodiment, the pickling nozzle 1331 sprays hydrochloric acid, which reacts with indium oxide to produce indium chloride and water. Since indium chloride is easily soluble in water, the residue on the carrier plate 200 after pickling is liquid and includes hydrochloric acid and indium chloride. After being washed by the water washing nozzle 1341, the residue on the carrier plate 200 is basically water, so it can be dried in the drying chamber 132.
[0038] In one embodiment, the coating apparatus 110 includes a heating chamber 111, a process chamber 112, and a cooling chamber 113 arranged sequentially. The discharge end of the loading mechanism 121 is connected to the heating chamber 111, and the feed end of the unloading mechanism 122 is connected to the cooling chamber 113. Thus, the loading mechanism 121 feeds the carrier plate 200 carrying the silicon wafer into the heating chamber 111, where the carrier plate 200 and the silicon wafer are heated to a preset temperature. Then, the carrier plate 200 is fed into the process chamber 112, where the silicon wafer is coated. After coating, the wafer enters the cooling chamber 113 to cool the carrier plate 200 and the silicon wafer. Finally, the carrier plate 200 is conveyed to the unloading mechanism 122.
[0039] It should be noted that in this embodiment, the carrier plate 200 is dried by the drying chamber 132, and the carrier plate 200 can also be preheated, so that the heating chamber 111 can heat the carrier plate 200 and the silicon wafer to the preset temperature, thereby further improving production efficiency.
[0040] In one embodiment, the cleaning device 130 further includes a recovery tank 135, which is disposed in the cleaning chamber 131 and located below the reflux mechanism 123. The recovery tank 135 corresponds to the pickling nozzle 1331 and the water washing nozzle 1341 to receive the materials after pickling and washing, thereby realizing the recycling and reuse of these materials and reducing resource costs. Furthermore, a drain port 1351 is provided at the bottom of the recovery tank 135, and a drain valve is provided at the drain port 1351 to control the opening and closing of the drain port 1351. When a large amount of liquid accumulates in the recovery tank 135, the drain port 1351 is opened through the drain valve to discharge the liquid to the recycling device for material reuse.
[0041] In one embodiment, the cleaning device 130 further includes a detection mechanism disposed in the cleaning chamber 131 for detecting the moisture content of the carrier plate 200 entering the cleaning chamber 131. Thus, the cleaning action can be controlled based on the detection results of the detection mechanism. Specifically, when the moisture content of the carrier plate 200 is ≥8.0e-12, the cleaning device 130 is activated to clean the carrier plate 200.
[0042] Furthermore, a cover plate 136 is detachably provided on the top of the recycling tank 135. In this way, when the carrier plate 200 does not need to be cleaned, the top of the recycling tank 135 can be closed by the cover plate 136 to prevent the substances in the recycling tank 135 from evaporating and adsorbing onto the carrier plate 200; when the carrier plate 200 needs to be cleaned, the cover plate 136 can be removed so that the recycling tank 135 can receive the cleaned substances.
[0043] In one embodiment, the cleaning device 130 further includes an acid supply mechanism, a water supply mechanism, a first control valve 1332, and a second control valve 1342. The acid supply mechanism is connected to multiple acid pickling nozzles 1331 via the first control valve 1332 to supply hydrochloric acid to the multiple acid pickling nozzles 1331; the water supply mechanism is connected to multiple water washing nozzles 1341 via the second control valve 1342 to supply cleaning water to the multiple water washing nozzles 1341. Therefore, when cleaning the carrier plate 200 is not required, the first control valve 1332 and the second control valve 1342 can be closed; when cleaning the carrier plate 200 is required, the first control valve 1332 and the second control valve 1342 can be opened.
[0044] Furthermore, the cleaning device 130 also includes a sub-control mechanism 137, which is electrically connected to the detection mechanism, the first control valve 1332, and the second control valve 1342 to control the operation of the first control valve 1332 and the second control valve 1342 according to the detection results of the detection mechanism. Simultaneously, the movement of the cover plate 136 can also be controlled by a drive mechanism. The sub-control mechanism 137 is electrically connected to the drive mechanism, thereby achieving automatic cleaning of the carrier plate 200. Of course, in other embodiments, the detection mechanism can also output a detection result, and then the cleaning device 130 can be manually operated by an operator; this is not limited here. Specifically, the sub-control mechanism 137 includes a sub-control box and a microcontroller disposed within the sub-control box. The microcontroller is electrically connected to the detection mechanism, the first control valve 1332, and the second control valve 1342.
[0045] In one embodiment, the cleaning device 130 further includes an air compressor 138 connected to a plurality of pickling nozzles 1331 and a plurality of water washing nozzles 1341, so that the pickling nozzles 1331 spray atomized hydrochloric acid, and simultaneously increase the spray pressure of the pickling nozzles 1331 and the water washing nozzles 1341, thereby improving the cleaning effect. Specifically, the spray pressure of the pickling nozzles 1331 is 5 MPa.
[0046] In one embodiment, the top of the drying chamber 132 is provided with a plurality of heating plates 139, which heat the interior of the drying chamber 132 to dry and preheat the carrier plate 200 that is fed into the drying chamber 132.
[0047] To facilitate understanding of the technical solutions of this application, the workflow of the integrated coating and cleaning equipment in the above embodiments is described below:
[0048] The carrier plate 200 carrying silicon wafers is fed into the heating chamber 111 via the loading mechanism 121. After being heated to a preset temperature, it is fed into the process chamber 112 for coating. After coating, it enters the cooling chamber 113 for cooling. After cooling, the carrier plate 200 enters the unloading mechanism 122, where the gripping mechanism can remove the silicon wafers. The carrier plate 200 is then conveyed to the reflow mechanism 123, and then to the loading mechanism 121, where the silicon wafers to be coated can be placed on the carrier plate 200. The carrier plate 200 on the reflow mechanism 123 then passes through the cleaning chamber 131 and the drying chamber 132.
[0049] When the testing agency detects that the water vapor content of the carrier plate 200 in the cleaning chamber 131 is ≥8.0e-12, the sub-control mechanism 137 controls the first control valve 1332 and the second control valve 1342 to open, and at the same time controls the drive mechanism to remove the cover plate 136 on the recovery tank 135. The carrier plate 200 transported to the cleaning chamber 131 first passes through the pickling zone, where the pickling nozzle 1331 sprays hydrochloric acid onto the carrier plate 200. Then the carrier plate 200 enters the water washing zone, where the water washing nozzle 1341 sprays water onto the carrier plate 200. After the carrier plate 200 is cleaned, it enters the drying chamber 132. The sub-control mechanism 137 controls the heating plate 139 in the drying chamber 132 to heat the carrier plate 200, drying it and preheating it.
[0050] It is understandable that the carrier plate 200 can be preheated through the drying chamber 132 if cleaning is not required, and this is not a limitation.
[0051] In summary, the integrated coating and cleaning equipment provided in this application has at least the following advantages:
[0052] 1. It can perform silicon wafer coating and carrier board 200 cleaning in one device, without having to remove the carrier board 200 from the coating process and transport it to the cleaning station for cleaning, thus improving production efficiency.
[0053] 2. The drying chamber 132 can both dry the cleaned carrier plate 200 and preheat the carrier plate 200, which further improves production efficiency.
[0054] 3. The recycling tank 135 can recycle and reuse the cleaning materials, reducing resource costs.
[0055] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.
Claims
1. An integrated coating and cleaning device, characterized in that, include: Coating equipment; The feeding mechanism and the unloading mechanism are provided, wherein the discharge end of the feeding mechanism is connected to the feed end of the coating device, and the feed end of the unloading mechanism is connected to the discharge end of the coating device. A reflux mechanism, wherein the feed end of the reflux mechanism is connected to the discharge end of the unloading mechanism, and the discharge end of the reflux mechanism is connected to the feed end of the loading mechanism; A cleaning device includes a cleaning chamber and a drying chamber, both of which are mounted on the reflux mechanism and arranged sequentially along the feeding direction of the reflux mechanism. The cleaning chamber includes an acid washing zone and a water washing zone arranged sequentially along the feeding direction of the reflux mechanism. The acid washing zone is provided with multiple acid washing nozzles located above the reflux mechanism and facing the reflux mechanism, and the water washing zone is provided with multiple water washing nozzles located above the reflux mechanism and facing the reflux mechanism.
2. The integrated coating and cleaning equipment according to claim 1, characterized in that, The cleaning device also includes a recovery tank, which is disposed in the cleaning chamber and located below the reflux mechanism. The recovery tank corresponds to the acid washing nozzle and the water washing nozzle.
3. The integrated coating and cleaning equipment according to claim 2, characterized in that, The cleaning device also includes a detection mechanism, which is located in the cleaning chamber and is used to detect the water vapor content of the carrier plate input into the cleaning chamber.
4. The integrated coating and cleaning equipment according to claim 3, characterized in that, The cleaning device further includes an acid supply mechanism, a water supply mechanism, a first control valve, and a second control valve; the acid supply mechanism is connected to multiple acid washing nozzles through the first control valve, and the water supply mechanism is connected to multiple water washing nozzles through the second control valve.
5. The integrated coating and cleaning equipment according to claim 4, characterized in that, The cleaning device also includes a sub-control mechanism; the sub-control mechanism is electrically connected to the detection mechanism, the first control valve and the second control valve.
6. The integrated coating and cleaning equipment according to claim 3, characterized in that, The top of the recycling tank is removably covered with a cover plate.
7. The integrated coating and cleaning equipment according to claim 2, characterized in that, The bottom of the recycling tank is provided with a drain outlet, and a drain valve is provided at the drain outlet.
8. The integrated coating and cleaning equipment according to claim 1, characterized in that, The cleaning device also includes an air compressor, which is connected to a plurality of acid pickling nozzles and a plurality of water washing nozzles.
9. The integrated coating and cleaning equipment according to claim 1, characterized in that, The top of the drying chamber is equipped with multiple heating plates.
10. The integrated coating and cleaning equipment according to claim 1, characterized in that, The coating apparatus includes a heating chamber, a process chamber, and a cooling chamber arranged in sequence. The discharge end of the feeding mechanism is connected to the heating chamber, and the feed end of the unloading mechanism is connected to the cooling chamber.