A warped sheet flattening and positioning mechanism

Abstract

The utility model provides a kind of warping sheet leveling positioning mechanism, belong to wafer positioning device field, specifically including carrier and buffer pressing disc, buffer pressing disc is located the top of carrier and can be vertically moved, carrier is used to carry warping sheet and carries out adsorption positioning to warping sheet, several buffer pressing columns are connected on buffer pressing disc, in the process of buffer pressing disc moving downwards, warping sheet is pressed by several buffer pressing columns, so that warping sheet becomes flat state;Compared with prior art, when adsorbing and positioning warping sheet, first, warping sheet is pressed by buffer pressing disc, so that warping sheet becomes leveling state, then, warping sheet is adsorbed and positioned by carrier, so even if different shapes and curvatures of warping sheet need to be adsorbed and positioned, carrier does not need to be replaced, thereby reducing application cost and improving applicability.

Description

Technical Field

[0001] This utility model belongs to the field of positioning devices, specifically relating to a warped sheet leveling and positioning mechanism. Background Technology

[0002] During the processing of warped wafers, it is often necessary to position the warped wafers. Since the processing needs to be carried out on the surface of the warped wafer, in order to avoid affecting the processing surface, the warped wafer is generally positioned by adsorption.

[0003] Due to the shape of the warped sheet, in the prior art, when adsorbing and positioning the warped sheet, it is generally placed on a special carrier stage. The bearing surface of this carrier stage can match the curved surface of the warped sheet, thereby achieving the adsorption and positioning of the warped sheet.

[0004] However, when changing to warp wafers of different shapes or curvatures, the wafer stage also needs to be adapted, resulting in higher application costs. Utility Model Content

[0005] The purpose of this invention is to provide a warped sheet leveling and positioning mechanism that can level the warped sheet, making it easier for the warped sheet to be adsorbed and positioned.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is a warped sheet leveling and positioning mechanism, including a sheet carrier and a buffer pressing plate. The buffer pressing plate is located above the sheet carrier and can move vertically. The sheet carrier is used to support the warped sheet and adsorb and position the warped sheet.

[0007] Several buffer pressing pins are connected to the buffer pressing plate. As the buffer pressing plate moves downward, pressure is applied to the warped sheet through the several buffer pressing pins, so that the warped sheet becomes flat.

[0008] Furthermore, it also includes an interface and a slide. The interface is set on the buffer pressing plate and is arranged in an array around the central axis of the buffer pressing plate. The slide is mated to the upper end of the buffer pressing column and passes through the interface for connecting the buffer pressing plate.

[0009] Furthermore, it also includes a transmission disc, which is connected to the buffer pressing disc and is used to adjust the distance from the buffer pressing post to the center of the buffer pressing disc.

[0010] Furthermore, the transmission disc is provided with a sliding opening, through which the slide passes.

[0011] Furthermore, the stage includes a base stage and a transfer stage. The base stage is used to adsorb and position the warped sheet. The transfer stage is connected to the base stage and has a placement opening for placing the warped sheet.

[0012] Furthermore, a buffer reset component is provided on the transfer table, which can be moved above the placement port to limit the warped sheet.

[0013] Furthermore, the buffer reset component includes a reference sleeve and a stop bar. The reference sleeve is connected to the turntable and can rotate; the stop bar is connected to the reference sleeve, and the rotation of the reference sleeve causes the stop bar to make a circular motion.

[0014] Furthermore, the buffer reset component also includes a buffer element, which is connected to the stop bar and moves synchronously with the stop bar to limit the recovery speed of the warped plate.

[0015] Furthermore, the buffer includes a first support rod and a second support rod, the first support rod being hinged to a stop rod; a pressure plate is hinged to the first support rod; the second support rod is hinged to the pressure plate; and a damper is hinged to the second support rod, the damper being mounted on the stop rod.

[0016] Furthermore, the upper surface of the transfer table is provided with a track groove. During the rotation of the reference sleeve, the bottom end of the pressure plate moves within the track groove and can enter the area where the placement port is located.

[0017] Compared with the prior art, the beneficial effects of this utility model are: when adsorbing and positioning warped sheets, the warped sheets are first pressed by a buffer pressing plate to flatten them, and then the warped sheets are adsorbed and positioned by a sheet carrier stage. In this way, even if warped sheets of different shapes and curvatures need to be adsorbed and positioned, there is no need to replace the sheet carrier stage, thereby reducing application costs and improving applicability. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the buffer pressing plate structure of this utility model;

[0020] Figure 3 This is a schematic diagram of the buffer pressing column structure of this utility model;

[0021] Figure 4 This is a schematic diagram of the slide stage structure of this utility model;

[0022] Figure 5 This is a schematic diagram of the transfer platform structure of this utility model;

[0023] Figure 6 This is a schematic diagram of the buffer reset component of this utility model.

[0024] Among them, 101-buffer pressing plate, 102-driving component, 103-hanging seat, 104-interface, 105-center docking column, 201-buffer pressing column, 202-insertion column, 203-locking plate, 204-bottom tray, 205-bottom buffer medium, 301-center sleeve, 302-transmission plate, 303-pushing port, 401-bottom base, 402-turning platform, 403-sinking port, 501-driving plate, 601-reference sleeve, 602-shaft, 603-transmission gear, 604-stop bar, 605-first support rod, 606-second support rod, 607-damper, 608-pressing plate, 701-track groove. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] See Figure 1 As shown, a warped sheet leveling and positioning mechanism includes a sheet carrier stage and a buffer pressing plate 101. The buffer pressing plate 101 is disposed above the sheet carrier stage. The sheet carrier stage is used to support the warped sheet. The warped sheet is then pressed by the buffer pressing plate 101 so that the warped sheet is completely attached to the sheet carrier stage. A vacuum device is connected to the sheet carrier stage, which at this time achieves adsorption of the warped sheet and makes the warped sheet stable on the sheet carrier stage.

[0028] When pressing the warped plate, the buffer pressing plate 101 needs to move downward. A driving component 102 can be provided above the buffer pressing plate 101. The driving component 102 can be installed on the hanging base 103. The output end of the driving component 102 is connected to the center position of the buffer pressing plate 101. The driving component 102 is an electric push rod. When the control output end of the driving component 102 moves downward, it can drive the buffer pressing plate 101 to move downward.

[0029] See Figure 1 and Figure 2 As shown, several buffer pressing posts 201 are provided on the buffer pressing plate 101. When the buffer pressing plate 101 moves downward, it drives the buffer pressing posts 201 to move downward, eventually making the lower end of the buffer pressing posts 201 contact the warp sheet. As the buffer pressing plate 101 continues to move downward, the buffer pressing posts 201 completely press the warp sheet, making the warp sheet fully contact the stage.

[0030] See Figure 2 and Figure 3 As shown, in this embodiment, the buffer pressing post 201 and the buffer pressing plate 101 are detachably connected. Specifically, a plurality of mating interfaces 104 are provided on the buffer pressing plate 101. The mating interfaces 104 are elongated and arranged in an array around the central axis of the buffer pressing plate 101. The upper end of the buffer pressing post 201 is connected to a slide block, which is connected to the buffer pressing plate 101 through the mating interfaces 104.

[0031] The slide includes a pin 202, the lower end of which is fixed to the upper end of a buffer pressing pin 201. The pin 202 passes through a mating interface 104, and a locking plate 203 is mated to the upper end of the pin 202. A bottom tray 204 is provided on the pin 202, and the buffer pressing plate 101 is located between the bottom tray 204 and the locking plate 203. This allows the position of the buffer pressing pin 201 to be adjusted. The locking plate 203 and the pin 202 can be screwed together. At this time, the buffer pressing pin 201 can be locked by tightening the locking plate 203.

[0032] See Figures 1 to 3 As shown, since there are several buffer pressing posts 201, a central docking post 105 is provided on the buffer pressing plate 101 to facilitate simultaneous position adjustment of several buffer pressing posts 201. The central docking post 105 is located at the center of the upper surface of the buffer pressing plate 101. A rotatable central sleeve 301 is sleeved on the central docking post 105, and a transmission plate 302 is connected through the central sleeve 301. The transmission plate 302 is located above the buffer pressing plate 101, and several pushing holes 30 are provided on the transmission plate 302. 3. The sliding port 303 is also elongated, so that the insert 202 on the slide passes through both the interface 104 and the sliding port 303. At this time, the sliding port 303 and the corresponding interface 104 form an angle of 30-45°. Thus, when the transmission disk 302 is rotated, the insert 202 corresponding to the buffer pressing post 201 can be moved within the interface 104, changing the distance between the insert 202 and the center of the buffer pressing disk 101, thereby adjusting the distance between the buffer pressing post 201 and the center of the buffer pressing disk 101.

[0033] To avoid excessive compression of the warped sheet, the buffer pressing post 201 is designed with a telescopic reset structure. For example, the buffer pressing post 201 may include an upper sleeve and a lower pressing rod. The upper end of the upper sleeve is fixed to the bottom surface of the slide, and the upper end of the lower pressing rod extends into the lower end of the upper sleeve. A compression reset spring is provided inside the upper sleeve. When the lower pressing rod gradually extends into the upper sleeve, it can compress the compression reset spring. That is, when the buffer pressing post 201 is pressed, the overall length of the buffer pressing post 201 can be shortened. After the pressing force is lost, the buffer pressing post 201 will return to its initial length, thus achieving gradual pressure on the warped sheet.

[0034] A bottom buffer medium 205 can also be connected to the lower end of the buffer pressing column 201. The bottom buffer medium 205 is a flexible material, such as rubber or silicone, to avoid damage to the warped sheet.

[0035] See Figures 4 to 5 As shown, the aforementioned stage includes a base platform 401 and a transfer platform 402. The transfer platform 402 is located above the base platform 401. A downwardly extending limiting ring is provided at the edge of the transfer platform 402, and the base platform 401 is located within the limiting ring. This forms an assembly connection between the base platform 401 and the transfer platform 402. At this time, the transfer platform 402 can rotate or move upward to separate from the base platform 401, thereby facilitating the replacement of the transfer platform 402. A receiving opening 403 is provided on the transfer platform 402. The receiving opening 403 can be square or circular, depending on the shape of the warped wafer to be processed. The transfer stage 402 is selected based on the fact that the base 401 has a cavity inside and an adsorption hole is provided on the upper surface of the base 401. The area on the transfer stage 402 located on the side of the placement port 403 covers the corresponding adsorption hole. The adsorption hole is connected to the cavity inside the base 401, and the cavity inside the base 401 is connected to a vacuum device. When the vacuum device is working, it can adsorb the transfer stage 402 through the adsorption hole, thus positioning the transfer stage 402. At the same time, it can also adsorb and position the warped sheet in the placement port 403 on the transfer stage 402.

[0036] In another embodiment, since the warped sheet is adsorbed and in a horizontal state during processing, it still has restoring force. That is, after the vacuum device stops working, the warped sheet will return to its warped state. Therefore, in order to avoid the warped sheet changing shape suddenly, based on the above embodiment, a buffer reset component is provided on the transfer table 402. The buffer reset component is located at the edge of the placement port 403. After the processing of the warped sheet is completed, the buffer reset component is controlled to move so that it is exposed from the placement port 403. At this time, the buffer reset component is located directly above the warped sheet. After the vacuum device stops working, the warped sheet is limited by the buffer reset component, and its shape cannot suddenly return to its original state, but slowly returns to its initial state.

[0037] The buffer reset component is connected to a drive disk 501, which is annular and connected to the turntable 402. The drive disk 501 can rotate under control, which in turn controls the movement of the buffer reset component. Specifically:

[0038] See Figure 5 and Figure 6 As shown, the buffer reset component includes a reference sleeve 601, which is connected to the turntable 402 via a shaft 602, allowing the reference sleeve 601 to rotate. A transmission gear 603 is positioned near the lower end of the reference sleeve 601, and protruding teeth are provided on the inner circumference of the drive disc 501, ultimately causing the transmission gear 603 to mesh with the inner circumference of the drive disc 501. Thus, when the drive disc 501 rotates, it can drive the reference sleeve 601 to rotate. A horizontally extending stop bar 604 is provided on the reference sleeve 601, extending along the reference sleeve 601. Extending radially, as the reference sleeve 601 rotates, the stop rod 604 moves in a circular trajectory. After the stop rod 604 moves to a position above the warped piece, the stop rod 604 can restrict the movement of the warped piece. A buffer is connected to the stop rod 604. The buffer moves synchronously with the stop rod 604. When the stop rod 604 is above the warped piece, the buffer contacts the warped piece. At this time, the warped piece will apply a force to the buffer, eventually causing the warped piece to gradually return to its initial state. During the recovery process of the warped piece, the buffer limits the shape recovery speed of the warped piece to prevent it from deforming suddenly.

[0039] The buffer components include a first support rod 605 and a second support rod 606. The first support rod 605 is hinged to a stop rod 604, and the second support rod 606 is hinged to a damper 607, which is mounted on the stop rod 604. A pressure plate 608 is positioned between the first support rod 605 and the second support rod 606, and the pressure plate 608 is hinged to both the first support rod 605 and the second support rod 606, creating an angle between them. This is achieved by controlling the reference sleeve 60. 1. After rotating the stop 604 to position it above the warp piece, the warp piece is not yet in contact with the adsorption constraint. The pressure plate 608 contacts the upper surface of the warp piece. At this time, the pressure plate 608 limits the warp piece. After releasing the adsorption constraint on the warp piece, the pressure plate 608 is pushed upward under the action of the restoring force of the warp piece. During this process, the angle between the first support rod 605 and the second support rod 606 gradually increases, thereby avoiding the quality damage caused by the sudden deformation of the warp piece.

[0040] An arc-shaped track groove 701 is provided on the upper surface of the turning platform 402. The center of the arc of the track groove 701 is located on the central axis of the reference sleeve 601. When the damper 607 is in the initial state, the bottom end of the pressure plate 608 is located in the track groove 701. During the process of controlling the rotation of the reference sleeve 601, the bottom end of the pressure plate 608 moves in the track groove 701. This track groove 701 is connected to the placement port 403, so that the pressure plate 608 can enter the area where the placement port 403 is located. After the reference sleeve 601 is rotated in the opposite direction, the pressure plate 608 can be moved out of the area where the placement port 403 is located.

[0041] The drive component 102, vacuum device and damper 607 in this application are all prior art products. The technical solution of this application only applies their basic functions and does not improve their structure, so their structure will not be described in detail here.

[0042] When implementing this technical solution, a horizontally extending boom can be connected to the hanger 103. This boom can drive the hanger 103 to make a circular motion, which can move the buffer pressing plate 101 away from the top of the plate carrier. In this way, the corresponding transfer table 402 can be selected according to the shape of the warped sheet to be processed. Then, the warped sheet is placed in the placement port 403 of the transfer table 402. Then, the buffer pressing plate 101 is moved to be above the warped sheet. The buffer pressing column 201 on the buffer pressing plate 101 applies pressure to the warped sheet, making the warped sheet flat. At this time, the vacuum device works to achieve the adsorption operation of the transfer table 402 and the warped sheet at the adsorption port, thereby positioning the warped sheet.

[0043] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0044] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A warped sheet leveling and positioning mechanism, characterized in that, include: The stage is used to hold the warped wafers and to position them by adsorption. The buffer pressing plate (101) is located above the stage and can move vertically; There are several buffer pressing posts (201) connected to the buffer pressing plate (101). As the buffer pressing plate (101) moves downward, the several buffer pressing posts (201) apply pressure to the warped sheet, so that the warped sheet becomes flat.

2. The warped sheet leveling and positioning mechanism according to claim 1, characterized in that, Also includes: The interface (104) is set on the buffer pressing plate (101), and the interface (104) is arranged in an array around the central axis of the buffer pressing plate (101); A slide, mating to the upper end of the cushioning press post (201) and passing through the interface (104), is used to connect the cushioning press plate (101).

3. The warped sheet leveling and positioning mechanism according to claim 2, characterized in that, Also includes: The transmission disc (302) is connected to the buffer pressing disc (101) and is used to adjust the distance between the buffer pressing column (201) and the center of the buffer pressing disc (101).

4. The warped sheet leveling and positioning mechanism according to claim 3, characterized in that, The transmission disc (302) is provided with a sliding port (303) so that the slide can pass through the sliding port (303).

5. The warped sheet leveling and positioning mechanism according to claim 1, characterized in that, The stage includes: The base plate (401) is used to adsorb and position the warped sheet; A transfer platform (402) is connected to a base platform (401); The placement port (403) is set on the turning table (402) for placing the warped sheet.

6. The warped sheet leveling and positioning mechanism according to claim 5, characterized in that, The transfer table (402) is provided with a buffer reset component, which can be moved above the placement port (403) to limit the warped sheet.

7. The warped sheet leveling and positioning mechanism according to claim 6, characterized in that, The buffer reset component includes: The reference sleeve (601) is connected to the turntable (402) and is rotatable; The stop rod (604) is connected to the reference sleeve (601). After the reference sleeve (601) rotates, the stop rod (604) makes a circular motion.

8. The warped sheet leveling and positioning mechanism according to claim 7, characterized in that, The buffer reset component further includes: A buffer element, connected to the stop bar (604) and moving synchronously with the stop bar (604), is used to limit the shape recovery of the warped sheet.

9. A warped sheet leveling and positioning mechanism according to claim 8, characterized in that, The buffer includes: The first support rod (605) is hinged to the stop rod (604); The pressure plate (608) is hinged to the first support rod (605); The second support rod (606) is hinged to the pressure plate (608); A damper (607) is mounted on a stop bar (604) and hinged to a second support bar (606).

10. A warped sheet leveling and positioning mechanism according to claim 9, characterized in that, The upper surface of the transfer table (402) is provided with a track groove (701). During the rotation of the reference sleeve (601), the bottom end of the pressure plate moves in the track groove (701) and can enter the area where the placement port (403) is located.

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