A planar magnetron sputtering device

Abstract

This utility model discloses a planar magnetron sputtering device belonging to the technical field of vacuum coating equipment. The device includes a motor, a main body, a target material, a cooling backplate, and a base. The core of this application lies in the fact that the cooling backplate is composed of a cooling substrate and a cover plate. The cooling substrate has a specially shaped receiving groove, which includes a first groove segment and a second groove segment connected to each other along its depth direction. The cover plate is embedded in the first groove segment to seal the lower second groove segment, thereby forming a completely closed cooling channel. This utility model, through this permanent sealing structure of embedding the cover plate in the receiving groove, replaces the traditional removable mechanical seal that relies on sealing gaskets, fundamentally solving the technical problem of leakage easily occurring in large-size cooling backplates under high water pressure.

Description

Technical Field

[0001] This utility model relates to the field of vacuum coating equipment technology, and in particular to a planar magnetron sputtering device. Background Technology

[0002] Planar magnetron sputtering is a core piece of equipment in modern thin-film fabrication processes. It uses a magnetic field in a vacuum to bombard a target material, sputtering atoms or molecules from the target surface and depositing them onto a substrate to form a thin film with specific functions. This technology is widely used in high-tech industries such as semiconductor manufacturing, optical components, and flat panel displays due to its high deposition rate and high film quality.

[0003] In existing technologies, cooling backplates used for cooling sputtering targets typically employ removable mechanical seals for their water channels to facilitate inspection and maintenance. A typical example involves covering a cooling substrate with machined open water channel grooves with a cover plate, placing one or more elastic gaskets such as O-rings between the two, and finally tightening it with numerous bolts around the cooling backplate, relying on the clamping force on the gaskets to achieve a seal.

[0004] However, this removable structure relying on gaskets presents increasingly prominent reliability issues in modern sputtering applications that demand large sizes and high power. First, the elastic gasket, as the core of the seal, is highly susceptible to material aging, elasticity decay, or permanent deformation under the long-term high pressure of internal cooling water and the high-temperature and low-temperature cyclic impacts of the sputtering process. This makes it a major and unavoidable leakage risk point in the entire cooling system. Second, ensuring uniform clamping force between the large cooling backplate and the substrate is extremely difficult for large-sized cooling backplates; any uneven stress can lead to localized seal failure of the gasket. Once cooling water leakage occurs, it will not only contaminate the vacuum environment and damage the target material, but may even cause electrical short circuits, resulting in serious safety accidents. Therefore, there is an urgent need in the field for a new, more reliable, permanent sealing structure to replace traditional removable mechanical seals and fundamentally eliminate the risk of leakage. Utility Model Content

[0005] The purpose of this invention is to provide a planar magnetron sputtering device, which aims to solve the technical problems of unreliable structure and easy leakage of cooling medium caused by the use of detachable mechanical seals in the cooling back plate water channels of existing designs.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A planar magnetron sputtering apparatus includes a motor, a main body, a target, a cooling backplate, and a base. The motor is located at the top of the planar magnetron sputtering apparatus and drives the rotation of a magnet assembly inside the apparatus. The main body is located below the motor. The target is made of a sputterable material, with its front surface serving as the sputtering working surface, and is positioned below the main body. The cooling backplate is disposed within the main body and is attached to the rear surface of the target for cooling. The cooling backplate includes a cooling substrate and a cover plate for sealing. The cooling substrate has a receiving groove, and the cross-section of the receiving groove along its depth direction includes a first groove segment and a second groove segment that are interconnected. The first groove segment is located at the opening of the second groove segment, and the cover plate is embedded in the first groove segment and seals the second groove segment, thereby forming a cooling channel. The base is located below the target and provides support for the planar magnetron sputtering apparatus.

[0008] Compared to existing designs, this invention creates a permanent, integrated sealing structure by designing a receiving groove with two sections on the cooling substrate and embedding a cover plate in the first section to seal the second section. This structure fundamentally changes the traditional sealing method that relies on elastic gaskets and bolt tightening, resulting in higher structural strength and sealing reliability. It effectively prevents leakage of the cooling medium under high water pressure and large-size cooling backplate application conditions, greatly improving the safety and stability of the planar magnetron sputtering device. Attached Figure Description

[0009] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 This is a three-dimensional schematic diagram of the planar magnetron sputtering apparatus provided in the embodiments of this application;

[0011] Figure 2 yes Figure 1 Another schematic diagram of the planar magnetron sputtering device shown;

[0012] Figure 3 yes Figure 1 A cross-sectional view of the planar magnetron sputtering apparatus shown;

[0013] Figure 4 yes Figure 3 A magnified view of a portion of region A shown;

[0014] Figure 5 This is a schematic diagram of a cooling backplate provided in an embodiment of this application;

[0015] Figure 6 yes Figure 5 Another angle view of the cooling backplate;

[0016] Figure 7 yes Figure 5 Cross-sectional view of the cooling backplate;

[0017] Figure 8 This is a perspective view of the base according to an embodiment of this application;

[0018] Figure 9 yes Figure 8 Another angle of the base.

[0019] Icon labels:

[0020] 1. Planar magnetron sputtering device;

[0021] 10. Motor; 101. Output shaft; 102. Drive shaft;

[0022] 11. Main body; 111. Magnet assembly; 112. Insulating component; 113. Rotating chassis; 114. Magnet back plate; 115. Magnet cover plate; 117. Top cover plate; 118. Outer shell; 119. Universal lifting ring; 116. Cooling back plate; 1161. Cover plate; 1162. Cooling base plate; 11621a. First groove section; 11621b. Second groove section; 11622. Water inlet; 11623. Water outlet; 11624. Sealing ring; 11625. Threaded hole;

[0023] 12. Target material;

[0024] 13. Base; 131. Annular groove; 132. Cooling copper pipe; 133. Elbow connector; 134. Mounting through hole; 135. Sealing groove. Detailed Implementation

[0025] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0026] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0027] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0028] Please see Figure 1 and Figure 2 . Figure 1 This is a three-dimensional schematic diagram of a planar magnetron sputtering device 1 provided in an embodiment of the present invention. Figure 2 Then it is Figure 1 A three-dimensional schematic diagram of the planar magnetron sputtering device 1 from another angle (looking down).

[0029] like Figure 1 As shown, the planar magnetron sputtering apparatus 1 of this embodiment, in its overall structure from top to bottom, includes: a motor 10 disposed at the top, a main body 11 located below the motor 10, and a base 13 located at the bottom of the apparatus. The motor 10 serves as the power source for the planar magnetron sputtering apparatus 1, driving the core components inside the main body 11 to rotate. The main body 11 has a cylindrical outer shell 118 (see...). Figure 3 ), for accommodating and protecting various functional components inside the main body 11, and the upper cover 117 of the main body 11 (see Figure 3 The device may also be equipped with universal lifting rings 119 for easy lifting and transportation (see...). Figure 3 The base 13 is a robust annular flange structure that provides stable support for the entire planar magnetron sputtering device 1.

[0030] Please refer to the following: Figure 2 , Figure 2 The bottom structure of this embodiment is clearly shown. A disc-shaped target 12 is disposed below the main body 11 and surrounded by a base 13. The target 12 is made of a sputterable material such as metal or ceramic, and its exposed, flat lower surface is the sputtering working surface. Inside the main body 11, there is also a [missing information - likely a component or material]. Figure 1 and Figure 2 The cooling backplate 116 is shown directly in the image (see [reference]). Figure 3 The core function of the cooling backplate 116 is to adhere to the upper surface of the target 12 in order to efficiently remove the heat generated by the target 12 during the sputtering process.

[0031] The above components (motor 10, main body 11, target material 12, cooling back plate 116, base 13) together constitute the whole of this utility model. Their specific internal structure, connection relationship and function will be described in detail later with reference to other accompanying drawings.

[0032] Please see Figure 3 This figure is an overall cross-sectional view of the planar magnetron sputtering device 1 in an embodiment of this application. Figure 3The assembly relationship of the various components inside the main body of the embodiment of this application is clearly revealed.

[0033] like Figure 3 As shown, the main body 11 integrates multiple cooperating structural components. Among them, the magnet assembly 111 is the core functional unit for realizing magnetron sputtering. During the sputtering process, in order to effectively confine the high-energy plasma bombarding the target 12 to the surface of the target 12, a magnetic field of a specific shape needs to be set in the direction of the upper surface of the target 12. In this embodiment, the magnet assembly 111 is the structural component used to generate the magnetic field of a specific shape. The magnet assembly 111 is usually composed of multiple permanent magnets (not individually labeled) arranged in a specific polarity, and its function is to generate a magnetic field. In actual use, the magnetic field generated by the magnet assembly 111 has magnetic field lines orthogonal to the electric field direction, thereby generating a strong Lorentz force on the electrons. This force strongly binds the electrons in the region near the surface of the target 12 and forces them to make long-distance spiral motion around the magnetic field lines. Compared with the case without a magnetic field, the electrons' movement path in the plasma is greatly extended before reaching the anode, which greatly increases the probability of the electrons colliding with argon atoms, which are the working gas, and ionizing them. A higher ionization rate means that a higher density plasma is formed near the surface of the target 12, resulting in a large number of argon ions. These large numbers of argon ions are accelerated and bombard the target 12 under the action of a high-voltage electric field, achieving an extremely high sputtering rate. Therefore, the magnet assembly 111 significantly improves the efficiency of the entire magnetron sputtering process through this magnetic confinement effect on electrons.

[0034] like Figure 3 As shown, this embodiment also includes an insulating component 112. This insulating component 112 is typically a ring structure, made of high-insulation-strength materials such as ceramics or polymers. The insulating component 112 is disposed between the cooling backplate 116 and the inner wall of the main body 11, serving as reliable electrical isolation and structural support. It is a safety component that prevents high-voltage arcing or short circuits from occurring inside the equipment.

[0035] A top cover plate 117 is provided on the top of the main body 11. This top cover plate 117 not only physically closes the opening at the top of the main body 11, but also serves as a support platform. A universal lifting ring 119 can be fixed to its upper surface. The universal lifting ring 119 allows the lifting rope to be attached from different angles, greatly improving the ease of operation and safety of the planar magnetron sputtering device 1 during installation and relocation. Surrounding the sides of the main body 11 is the outer shell 118, which completely encloses and protects all the internal components, such as the magnet assembly 111, the cooling back plate 116, and the insulating components 112, from the influence of the external environment.

[0036] Figure 3The hierarchical arrangement of the planar magnetron sputtering apparatus 1 according to this application embodiment is also clearly shown. The motor 10 at the top transmits rotational power to a vertically positioned drive shaft 102 via its output shaft 101. The drive shaft 102 extends downwards, passing through the center of the main body 11. When the planar magnetron sputtering apparatus 1 is in operation, the motor 10 drives the magnet assembly 111 inside the main body to rotate. Therefore, the magnetic field generated by the magnet assembly 111 also rotates. At this time, the target material 12 is uniformly etched, which greatly improves the utilization rate of the target material 12 by the planar magnetron sputtering apparatus 1 and ensures that the film finally deposited on the substrate has good thickness uniformity. Below the magnet assembly 111, a cooling backplate 116 is also provided, with its lower surface in close contact with the upper surface of the target material 12. The planar magnetron sputtering apparatus 1 is finally supported and fixed by the base 13 located at the bottom.

[0037] Figure 3 The local magnified region A (i.e. Figure 4 The diagram shows in more detail the fit between the magnet assembly 111, the rotating chassis 113, the magnetic backplate 114, the magnet cover plate 115, and the cooling backplate 116.

[0038] Please refer to this application. Figure 3 and Figure 4 , Figure 3 for Figure 1 The cross-sectional view of the planar magnetron sputtering apparatus 1 shown is shown. Figure 4 yes Figure 3 A magnified view of a portion of region A shown. (See attached image.) Figure 4 The magnet assembly 111 shown is actually composed of multiple permanent magnets. Figure 4 In the middle, the topmost layer is a rotating chassis 113, which is directly connected to the drive shaft 102 (see...). Figure 3 The lower end of the rotating base 113 is connected to the magnetic back plate 114, which is a structural component that receives and transmits rotational power. A magnetic back plate 114 is fixed to the lower surface of the rotating base 113. This magnetic back plate 114 is typically made of a material with high magnetic permeability, and its main function is to provide an efficient magnetic flux loop for the magnet assembly 111 below, converging and guiding magnetic lines of force towards the target material 12. The magnet assembly 111 is positioned below the magnetic back plate 114 and is housed and secured by a magnet cover plate 115. This magnet cover plate 115 is typically annular or cup-shaped and made of a non-magnetic material (such as stainless steel). The magnet cover plate 115 completely encloses the magnet assembly 111 from the sides and bottom, preventing it from loosening during high-speed rotation.

[0039] When motor 10 starts and operates, its output rotational power is transmitted through drive shaft 102 (see...). Figure 3The drive shaft 102 is then firmly connected to the rotating chassis 113. Since the magnetic backplate 114, magnet assembly 111, and magnet cover plate 115 (which serves as a housing) are sequentially fixed to the lower surface of the rotating chassis 113, this entire rotating assembly, consisting of the rotating chassis 113, magnetic backplate 114, magnet assembly 111, and magnet cover plate 115, is driven synchronously by the motor 10 via the drive shaft 102 as a whole. Meanwhile, the cooling backplate 116 and target material 12 located below this rotating assembly remain stationary. This design allows the rotating magnetic field generated by the magnet assembly 111 to uniformly sweep across the entire working surface of the stationary target material 12, thereby achieving uniform etching of the target material 12. This not only significantly improves the material utilization rate of the target material 12 in the planar magnetron sputtering device 1 but also ensures the final production of high-quality, high-uniformity thin films.

[0040] Now, please see Figure 5 , Figure 5 This is a perspective view of the cooling backplate 116 in this embodiment. The cooling backplate 116 is a structural component that enables efficient and stable cooling of the target material 12.

[0041] like Figure 5 As shown, the cooling backplate 116 is mainly composed of a cooling substrate 1162 and a cover plate 1161. The entire cooling substrate 1162 is preferably a piece of metal with excellent thermal conductivity (such as oxygen-free copper) that is integrally formed by precision machining to ensure the integrity of its structure and the efficiency of heat conduction.

[0042] A long and tortuous receiving groove (its internal structure) is machined on the upper surface of the cooling substrate 1162. Figure 7 (This is shown more clearly in the image). The path of the receiving groove is machined into a single and continuous labyrinthine flow path. This labyrinthine layout maximizes the flow path length and heat dissipation area of ​​the cooling medium within a limited disk area, ensuring that the cooling medium can flow evenly through the center and edge areas of the cooling substrate 1162, avoiding insufficient local heat dissipation capacity, and thus achieving uniform cooling of the entire target material 12. In this embodiment, the cooling medium is preferably water. Of course, depending on the specific process requirements, the cooling medium can also be other fluids with good heat exchange capacity. For example, to prevent freezing at low temperatures, an aqueous solution of ethylene glycol or propylene glycol can be used; or, in applications with extremely high requirements for electrical insulation, deionized water or special insulating heat-conducting oil can also be used.

[0043] To ensure the circulation of cooling water, the cooling substrate 1162 is provided with an inlet 11622 and an outlet 11623 on its side wall. During operation, cooling water enters from the external cooling system through the inlet 11622, which is connected to the starting point of the labyrinthine flow path. The cooling water then flows along this pre-designed labyrinthine path, fully absorbing the heat transferred from the target material 12 during the flow. Finally, the heated cooling water reaches the end of the labyrinthine flow path and is discharged through the outlet 11623, thus completing one cooling cycle.

[0044] Please refer to further information. Figure 6 , Figure 6 This is a bottom view of the cooling backplate 116 in this embodiment, mainly used to show the cooling backplate 116 and the target material 12 (see [reference]). Figure 3 Structural features of the mating side.

[0045] like Figure 6 As shown, a ring-shaped sealing ring 11624 is provided on the lower surface of the cooling substrate 1162. This sealing ring 11624 is preferably made of a high-temperature and high-pressure resistant elastic material (such as fluororubber). Its core function is that when the cooling backplate 116 and the target material 12 are pressed together, the sealing ring 11624 is moderately compressed and deformed, thereby forming a reliable seal between the cooling backplate 116 and the target material 12. This sealing ring 11624 prevents leakage of high-pressure cooling water inside the cooling backplate 116.

[0046] In addition, multiple threaded holes 11625 arranged in a ring array are machined on the outer periphery of the cooling substrate 1162. These threaded holes 11625 are used to mate with fasteners such as bolts to pass the entire cooling backplate 116 through the insulating member 112 (see...). Figure 3 It is securely installed inside the main body 11.

[0047] For a clearer view of the cooling backplate 116, please refer to [link / reference needed]. Figure 7 , Figure 7 This is a cross-sectional view of the cooling backplate, showing in detail the internal cross-section of the receiving groove.

[0048] like Figure 7As shown, the receiving groove is not a simple, single trench, but rather a combination of two interconnected groove segments with different structural shapes in the depth direction. Specifically, it includes a first groove segment 11621a located at the top and a second groove segment 11621b located at the bottom. In this embodiment, the first groove segment 11621a is selected as a rectangular structure, and the second groove segment 11621b is selected as a U-shaped structure. This geometric layout of a rectangular upper section and a U-shaped lower section gives the entire receiving groove a unique T-shaped cross-section with built-in supporting steps. Of course, those skilled in the art will understand that the cross-sectional shapes of the first groove segment 11621a and the second groove segment 11621b are not limited to these. For example, in other optional embodiments, the first groove segment 11621a can be square or trapezoidal, while the second groove segment 11621b can also be semi-circular, rectangular, or other irregularly shaped structures that can effectively facilitate the flow of cooling media.

[0049] In this embodiment of the application, the cover plate 1161 is fixed in the first groove segment 11621a (e.g. Figure 7 Specifically, the upper surface of the cover plate 1161 is flush with the cooling substrate 1162, while the lower surface of the cover plate 1161 completely covers and seals the opening of the lower second groove segment 11621b, thus transforming the originally open second groove segment 11621b into a completely closed channel capable of withstanding high-pressure fluid. The closed channel formed by the cover plate 1161 and the second groove segment 11621b is the cooling flow channel for the cooling medium. Specifically, in the preferred embodiment of this application, in order to achieve a reliable seal, the cover plate 1161 is firmly welded into the first groove segment 11621a by welding.

[0050] When the planar magnetron sputtering apparatus 1 is in operation, the cooling process of the cooling back plate 116 is as follows: external cooling medium (such as cooling water) enters through the inlet 11622 and is guided into the cooling channel formed by the cover plate 1161 and the second tank section 11621b; subsequently, the cooling medium follows a preset labyrinthine path (see...). Figure 5 The cooling medium flows fully within the flow channel and exchanges heat efficiently with the inner wall of the cooling substrate 1162 during the flow process, thereby continuously carrying away the heat generated by the target material 12. Finally, the cooling medium that has absorbed heat and heated up will reach the end of the flow path and be discharged through the outlet 11623, and sent back to the external cooling circulation system for cooling, thus completing a complete and efficient cooling cycle.

[0051] As mentioned above, in the preferred embodiment of this application, the cover plate 1161 is directly welded into the first groove section 11621a. This metallurgical bond between metals forms a rigid, integrated, and permanent sealing structure. Therefore, although the cross-sectional area of ​​the target material 12 and the cooling back plate 116 will increase with the development of modern technology, the design of the cover plate 1161 being welded in this embodiment of the application will have better sealing performance than conventional methods that rely on sealing rings and bolts for tightening. Traditional technologies may have problems such as sealing ring aging, elasticity decay, or leakage due to uneven stress. In this application, the high-pressure cooling water is firmly confined within the closed flow channel formed by the second groove section 11621b and the cover plate 1161.

[0052] Furthermore, the T-shaped cross-section receiving groove design of this application, through the integral molding of the built-in support step at the junction of the first groove segment 11621a and the second groove segment 11621b, gives the cooling backplate 116 extremely high structural strength and resistance to high-pressure deformation. The cover plate 1161 fixed to the first groove segment 11621a greatly reduces the unsupported span on the upper surface of the cooling substrate 1162, which improves the structural rigidity of the entire cooling backplate 116. This highly reliable sealing and high-strength structure ensures unobstructed internal cooling channels and uniform and stable cooling efficiency, solving the problem of local overheating of the target material 12; at the same time, the high flatness of the cooling backplate 116 also facilitates its cooperation with the magnet assembly 111, thereby ensuring the uniformity and stability of the magnetic field, providing a guarantee for the high stability of the sputtering film deposition process and the high consistency of thin film product quality.

[0053] Please see Figure 8 , Figure 8 This is a perspective view of the base 13 of the planar magnetron sputtering apparatus 1 of this application. The base 13 is a robust ring structure and serves as the mounting base for the planar magnetron sputtering apparatus 1. The upper surface of the base 13 has an open annular groove 131. Figure 8 As shown, an external cooling pipeline consisting of a cooling copper pipe 132 and an elbow joint 133 is housed in an annular groove 131. Those skilled in the art will understand that the form of the external cooling pipeline is not limited to this. For example, in addition to using a rigid combination of cooling copper pipe 132 and elbow joint 133, flexible metal or polymer corrugated pipes can be used, or a closed internal channel can be directly machined into the base 13 to achieve the same function.

[0054] The external cooling pipes form an independent cooling cycle, whose main function is to assist in cooling the outer shell 118 of the main body 11. During the magnetron sputtering process, the outer shell 118 will heat up due to the thermal radiation of the plasma. The external cooling pipes of the base 13 can effectively remove this heat, thereby ensuring that the entire planar magnetron sputtering device 1 has better temperature stability and coating effect.

[0055] In addition, multiple mounting through holes 134, evenly distributed along their circumference, are provided on the outer edge of the base 13. These mounting through holes 134 are used for fasteners such as bolts to pass through. In actual use, these mounting through holes 134 are crucial for achieving a vacuum seal between the entire planar magnetron sputtering device 1 and the vacuum chamber (not shown). For a better understanding of its operation, please refer to [reference needed]. Figure 9 This image is a bottom view of base 13. Figure 9 As shown, an annular sealing groove 135 is also provided on the lower surface of the base 13, that is, the surface in contact with the vacuum chamber flange. The installation operation process in actual use of this embodiment is as follows: First, an elastic seal such as an O-ring is completely embedded into the annular sealing groove 135. Then, the entire planar magnetron sputtering device 1 is hoisted and aligned with the opening flange of the vacuum chamber, so that the mounting through hole 134 is aligned with the threaded hole on the flange. Finally, multiple bolts are passed through the mounting through hole 134 and tightened. In this process, the mounting through hole 134 provides a path for applying and transmitting the clamping force, while the sealing groove 135 provides precise positioning and accommodating space for the seal. The two work together to ensure that the tightening force of the bolts can be evenly applied to the seal, compressing and deforming it, thereby forming a highly reliable vacuum seal between the base 13 and the vacuum chamber flange, effectively preventing external atmosphere from leaking into the vacuum chamber and ensuring the high vacuum environment required for the magnetron sputtering process.

[0056] In summary, this utility model achieves significant technical effects through the structural design of the cooling backplate 116. Specifically, by providing a T-shaped cross-section receiving groove composed of a first groove segment 11621a and a second groove segment 11621b on the cooling substrate 1162, and preferably permanently fixing the cover plate 1161 within the first groove segment 11621a by welding, a rigid, integrated, and permanent sealing structure is formed. Thanks to this structural design, the embodiments of this application can still ensure that the cooling medium travels stably along the waterway formed by the second groove segment 11621b even under harsh working environments with a large cross-sectional area target material 12, a large cross-sectional area cooling backplate 116, and high water pressure. This solves a series of problems caused by leakage or overflow of the cooling medium from the first groove segment 11621a due to seal failure in traditional technical solutions.

[0057] It should be noted that the terms "first," "second," and "third" in this application are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0058] The above description is only a part of the embodiments of this application and does not limit the scope of protection of this application. Any equivalent device or equivalent process transformation made based on the content of this application specification and drawings, or direct or indirect application in other related technical fields, are similarly included in the patent protection scope of this application.

Claims

1. A planar magnetron sputtering apparatus, characterized in that, include: Electric motor; The motor is located at the top of the planar magnetron sputtering device and is used to drive the magnet assembly inside the planar magnetron sputtering device to rotate; main body; The main body is located below the motor; Target material; The target is made of a sputterable material, and its front surface is the sputtering working surface. The target is disposed below the main body. Cooling backplate; The cooling back plate is disposed within the main body and is attached to the rear surface of the target material for cooling the target material. The cooling back plate includes a cooling substrate and a cover plate for sealing. The cooling substrate is provided with a receiving groove. The cross-section of the receiving groove along the depth direction includes a first groove segment and a second groove segment that are interconnected. The first groove segment is located at the opening of the second groove segment. The cover plate is embedded in the first groove segment and seals the second groove segment, thereby forming a cooling channel. Base; The base is located below the target material and provides support for the planar magnetron sputtering device.

2. The planar magnetron sputtering apparatus according to claim 1, characterized in that, The cooling substrate is a one-piece molded structure, and the second groove segment is a single and continuous labyrinthine flow path on the upper surface of the cooling substrate.

3. The planar magnetron sputtering apparatus according to claim 2, characterized in that, The cooling substrate is also provided with a water inlet and a water outlet, both of which are located on the side wall of the cooling substrate; the water inlet is connected to the starting point of the labyrinth flow path, and the water outlet is connected to the ending point of the labyrinth flow path.

4. The planar magnetron sputtering apparatus according to claim 1, characterized in that, An annular sealing ring is provided on the surface of the cooling back plate that is in contact with the rear surface of the target material to form a seal between the cooling back plate and the target material.

5. The planar magnetron sputtering apparatus according to claim 1, characterized in that, The outer peripheral area of ​​the cooling back plate is provided with threaded holes, which are used to fix the insulating component to the cooling back plate, wherein the insulating component is disposed inside the main body.

6. The planar magnetron sputtering apparatus according to claim 1, characterized in that, The base is a ring structure with an open annular groove on its upper surface; an external cooling pipeline consisting of a cooling copper pipe and an elbow joint is housed in the annular groove for cooling the outer shell of the main body.

7. The planar magnetron sputtering apparatus according to claim 1, characterized in that, The outer edge of the base is provided with multiple mounting through holes evenly distributed along its circumference; and the lower surface of the base is provided with an annular sealing groove. The mounting through holes cooperate with the sealing groove to fix the planar magnetron sputtering device to the vacuum chamber in a vacuum-sealed manner.

8. The planar magnetron sputtering apparatus according to claim 1, characterized in that, The output shaft of the motor is connected to the upper end of the drive shaft, and the lower end of the drive shaft is connected to the rotating chassis; the rotation of the motor is transmitted through its output shaft and the drive shaft to drive the rotating chassis to rotate synchronously.

9. The planar magnetron sputtering apparatus according to claim 8, characterized in that, The magnetic backplate is fixed to the lower surface of the rotating chassis; the magnet assembly consists of multiple permanent magnets and is disposed on the lower surface of the magnetic backplate.

10. The planar magnetron sputtering apparatus according to claim 9, characterized in that, An annular magnet cover plate is fixed to the outer periphery of the magnet back plate, and its radially inner side is used to cover the sidewall of the magnet assembly.

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