An automatic lamination device

Abstract

The utility model discloses an automatic laminating device, including turning over board laminating machine main part, turnover bracket, expansion board and a pair of buffer mechanism, the fixed platform and base are installed on turning over board laminating machine main part, and turnover bracket is rotatably connected on the base, and turnover bracket and fixed platform complete laminating action by intercoordination, and expansion board can be detachably installed on the end of turnover bracket, and a pair of buffer mechanism is installed on expansion board symmetry, and buffer mechanism is used for playing the buffering effect in the process of turning over bracket turning over to laminating position, and expansion board side wall is fixedly connected with a pair of insertion column, and rubber sleeve is equipped with on the outside of insertion column, and one pair of clamping groove is equipped with on the end face of turnover bracket. The utility model can optimize the turnover bracket structure of turning over board laminating machine, reduce the probability of the impact of turnover bracket with base when turning over, and then can reduce the failure rate of turning over board laminating machine, and also can guarantee the safety of base material product, guarantees the laminating effect of base material product.

Description

Technical Field

[0001] This utility model belongs to the technical field of bonding devices, specifically relating to an automatic bonding device. Background Technology

[0002] A flip-over laminating machine is a device used for bonding soft and hard substrates. It mainly consists of three parts: mechanical components, a hydraulic system, and an electrical control system. The mechanical components include a base, a flipping bracket, hydraulic cylinders, and a walkway. The flipping bracket is installed in supports on both sides of the base and connected to the base via two trunnions. Two proximity switches are installed inside the trunnions to control the extreme positions of the flipping bracket when it flips to horizontal and vertical positions. The hydraulic system provides power to achieve the flipping action. The electrical control system is responsible for the operation control and monitoring of the entire machine. It includes sensors, positioners, and a control system to ensure accurate material positioning during the flipping process and to control the flipping mechanism's movement by precisely measuring the material's position to prevent material misalignment or folding. During operation, the flip-over laminating machine uses vacuum adsorption to fix adhesive materials such as OCA and AB glue onto a fixture, and then applies pressure above the material using soft adhesive rollers to achieve bonding.

[0003] The existing flip-up laminating machine lacks a buffer device for its flipping bracket, which may cause it to collide with the base during flipping, thus increasing the probability of damage to the flipping bracket. It may also damage the substrate products on the flip-up laminating machine, reducing the bonding yield of the substrate products.

[0004] Therefore, in order to address the aforementioned technical problems, it is necessary to provide an automatic bonding device.

[0005] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0006] The purpose of this invention is to provide an automatic bonding device that can solve the problem of the lack of a buffer mechanism in the flipping bracket of the flipping bonding machine.

[0007] To achieve the above objectives, the technical solution provided by a specific embodiment of this utility model is as follows:

[0008] An automatic bonding device includes: a flip-plate bonding machine body, a flip bracket, an extension plate, and a pair of buffer mechanisms.

[0009] The main body of the flip-plate bonding machine is equipped with a fixed platform and a base. The flip-plate bracket is rotatably connected to the base, and the flip-plate bracket and the fixed platform cooperate to complete the bonding action. The extension plate is detachably installed at the end of the flip-plate bracket. A pair of buffer mechanisms are symmetrically installed on the extension plate, and the buffer mechanisms play a buffering role during the flip-plate bracket flipping to the bonding position.

[0010] In one or more embodiments of this utility model, a pair of insertion posts are fixedly connected to the side wall of the expansion plate, and rubber sleeves are provided on the outer side of the insertion posts.

[0011] In one or more embodiments of this utility model, the end face of the flip bracket is provided with a pair of engaging grooves, and the insertion post is inserted into the engaging grooves, which simplifies the connection between the expansion plate and the flip bracket and enables the separation of the expansion plate and the buffer mechanism from the flip bracket.

[0012] In one or more embodiments of this utility model, the extension plate is provided with a mounting surface. When the flip bracket is flipped to the fitting position, the mounting surface is in a horizontal state so that the buffer mechanism can contact the fixed platform, thereby playing a buffering role and reducing the impact of the flip bracket on the fixed platform.

[0013] In one or more embodiments of this utility model, the mounting surface is provided with a pair of storage slots, and a pair of buffer mechanisms are respectively installed in the pair of storage slots. The storage slots can accommodate the buffer mechanisms so that the flip bracket and the extension plate can be close to the fixing platform, reducing the obstruction of the buffer mechanisms to the substrate bonding and ensuring the film bonding effect of the substrate.

[0014] In one or more embodiments of this utility model, the buffer mechanism includes a mounting plate, a telescopic rod, and a contact seat. The mounting plate is connected to the inner wall of the storage groove by a pair of screws. The fixed end of the telescopic rod is connected to the mounting plate, and the contact seat is connected to the free end of the telescopic rod.

[0015] In one or more embodiments of this utility model, the cross-sectional areas of the mounting plate and the contact seat are both smaller than the opening area of ​​the receiving groove, so that the mounting plate and the contact seat can be retracted into the receiving groove, allowing the extension plate and the flip bracket to be close to the fixing platform, reducing the obstruction caused by the buffer mechanism during substrate bonding, and ensuring the film bonding effect of the substrate. The length of the fixed end of the telescopic rod is less than the depth of the receiving groove.

[0016] In one or more embodiments of this utility model, the buffer mechanism further includes a spring, which is disposed on the outside of the telescopic rod and between the mounting plate and the contact seat. When the contact seat contacts the fixed platform, the telescopic rod and the spring are compressed and contracted. The compressed spring exerts an elastic force on the mounting plate and the contact seat, thereby playing a buffering role.

[0017] In one or more embodiments of this utility model, a pair of rollers are rotatably connected to the contact seat. When the substrate is bonded, the static friction between the contact seat and the fixed platform can be converted into dynamic friction, thereby reducing the wear of the contact seat.

[0018] In one or more embodiments of this utility model, both the contact seat and the roller are made of elastic rubber, which can further improve the cushioning effect.

[0019] Compared with the prior art, the automatic bonding device of this utility model can optimize the flipping bracket structure of the flipping bonding machine, reduce the probability of the flipping bracket colliding with the base when flipping, thereby reducing the failure rate of the flipping bonding machine, while also ensuring the safety of the substrate product and the bonding effect of the substrate product. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a perspective view of an automatic bonding device in an unused state according to an embodiment of the present invention;

[0022] Figure 2 for Figure 1 Schematic diagram of the structure at point A in the middle;

[0023] Figure 3 This is a perspective view of an automatic bonding device in use according to an embodiment of the present invention;

[0024] Figure 4 This is a front view of an automatic bonding device in use according to an embodiment of the present invention;

[0025] Figure 5 This is a schematic diagram of the expansion plate portion in one embodiment of the present invention;

[0026] Figure 6 This is a perspective view of the buffer mechanism in one embodiment of the present invention.

[0027] Explanation of key figure labels:

[0028] 1-Main body of the flip-plate bonding machine, 101-Fixed platform, 102-Base, 2-Flip bracket, 3-Extension plate, 301-Insert post, 302-Storage slot, 4-Buffer mechanism, 401-Mounting plate, 402-Telescopic rod, 403-Contact seat, 404-Spring, 405-Roller. Detailed Implementation

[0029] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0030] like Figures 1 to 6 As shown, an automatic bonding device according to one embodiment of the present invention includes a flip-plate bonding machine body 1, a flip-plate bracket 2, an extension plate 3, and a pair of buffer mechanisms 4. A fixed platform 101 and a base 102 are mounted on the flip-plate bonding machine body 1. The flip-plate bracket 2 is rotatably connected to the base 102, and the flip-plate bracket 2 and the fixed platform 101 cooperate to complete the substrate bonding action. The extension plate 3 is detachably mounted on the end of the flip-plate bracket 2. A pair of buffer mechanisms 4 are symmetrically mounted on the extension plate 3, and the buffer mechanisms 4 serve a buffering function during the flip-plate bracket 2 flipping to the bonding position.

[0031] The soft substrate is placed on the fixed platform 101, and the hard substrate is placed on the flipping bracket 2. The flipping bracket 2 is controlled to flip, completing the bonding of the substrates. During the process of flipping the bracket 2 to the bonding position, the buffer mechanism 4 can contact the fixed platform 101, and the buffer is completed by the contraction of the buffer mechanism 4, so that the flipping bracket 2 is not likely to collide with the fixed platform 101, thereby reducing the failure rate of the flipping bonding machine body 1, while also ensuring the safety of the substrate products and ensuring the bonding effect of the substrate products.

[0032] like Figures 1 to 6 As shown, a pair of insertion posts 301 are fixedly connected to the side wall of the expansion plate 3, and rubber sleeves are fitted on the outer side of the insertion posts 301. A pair of engaging grooves are provided on the end face of the flip bracket 2, and the insertion posts 301 are inserted into the engaging grooves. This application can fix the expansion plate 3 and the flip bracket 2 by inserting the insertion posts 301 into the engaging grooves, thereby simplifying the connection method between the expansion plate 3 and the flip bracket 2 and facilitating the separation of the expansion plate 3 and the flip bracket 2.

[0033] The expansion plate 3 has a mounting surface. When the flip bracket 2 is flipped to the fitting position, the mounting surface is in a horizontal state. Figure 4 The state shown is such that the buffer mechanism 4 can contact the fixed platform 101, thereby playing a buffering role and reducing the impact of the flipping bracket 2 on the fixed platform 101.

[0034] In addition, the mounting surface is provided with a pair of storage slots 302, and a pair of buffer mechanisms 4 are respectively installed in the pair of storage slots 302. The storage slots 302 can accommodate the buffer mechanisms 4 so that the flip bracket 2 and the extension plate 3 can be close to the fixing platform 101, reducing the obstruction of the buffer mechanisms 4 to the substrate bonding and ensuring the film bonding effect of the substrate.

[0035] like Figures 1 to 6 As shown, the buffer mechanism 4 includes a mounting plate 401, a telescopic rod 402, and a contact seat 403. The mounting plate 401 is connected to the inner wall of the receiving groove 302 by a pair of screws. The fixed end of the telescopic rod 402 is connected to the mounting plate 401, and the contact seat 403 is connected to the free end of the telescopic rod 402. During the process of flipping the tray 2 to the bonding position, the contact seat 403 can contact the fixed table 101 and retract the telescopic rod 402. The retraction of the telescopic rod 402 can complete the buffering, making it less likely for the flipping tray 2 to collide with the fixed table 101, thereby reducing the failure rate of the flipping bonding machine body 1, and also ensuring the safety of the substrate product and the bonding effect of the substrate product.

[0036] Preferably, the cross-sectional areas of the mounting plate 401 and the contact seat 403 are both smaller than the opening area of ​​the storage groove 302, and the length of the fixed end of the telescopic rod 402 is smaller than the depth of the storage groove 302. When the telescopic rod 402 continues to retract, the mounting plate 401 and the contact seat 403 can be retracted into the storage groove 302, thereby allowing the extension plate 3 and the flip bracket 2 to be close to the fixed platform 101, reducing the obstruction caused by the buffer mechanism 4 when bonding the substrate, and ensuring the film bonding effect of the substrate.

[0037] The buffer mechanism 4 also includes a spring 404, which is located on the outside of the telescopic rod 402 and between the mounting plate 401 and the contact seat 403. Figure 6 The position is shown. When the contact seat 403 contacts the fixed table 101, the telescopic rod 402 and the spring 404 are compressed and contracted. The compressed spring 404 exerts an elastic force on the mounting plate 401 and the contact seat 403, which increases the moving resistance of the contact seat 403 and plays a buffering role, making it less likely for the flip bracket 2 to collide with the fixed table 101. This reduces the failure rate of the flip plate bonding machine body 1 and also ensures the safety of the substrate product and the bonding effect of the substrate product.

[0038] In addition, a pair of rollers 405 are rotatably connected to the contact seat 403. When the substrate is bonded, the static friction between the contact seat 403 and the fixed table 101 can be converted into dynamic friction, thereby reducing the wear of the contact seat 403.

[0039] Preferably, both the contact seat 403 and the roller 405 are made of elastic rubber, which can further improve the cushioning effect.

[0040] In practical use, the soft substrate is placed on the fixed platform 101, and the hard substrate is placed on the flip bracket 2. The flip bracket 2 is controlled to flip, and the substrate is bonded together.

[0041] During the process of flipping the bracket 2 to the bonding position, the contact seat 403 can first flip the bracket 2 to contact the fixed table 101. As the flipping bracket 2 continues to flip, the telescopic rod 402 and the spring 404 are compressed and contracted, and the telescopic rod 402 moves in the opposite direction to the receiving groove 302. The compressed spring 404 has an elastic force on the mounting plate 401 and the contact seat 403, which can increase the movement resistance of the contact seat 403, thereby playing a buffering role and making it less likely for the flipping bracket 2 to collide with the fixed table 101. This can reduce the failure rate of the flipping plate bonding machine body 1, and at the same time ensure the safety of the substrate product and the bonding effect of the substrate product.

[0042] Meanwhile, by storing the contact seat 403 in the storage groove 302, the expansion plate 3 and the flip bracket 2 can be placed close to the fixed platform 101, reducing the obstruction caused by the buffer mechanism 4 when bonding the substrate and ensuring the film bonding effect of the substrate.

[0043] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0044] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An automatic bonding device, characterized in that, include: The main body of the flip-plate laminating machine is equipped with a fixed platform and a base; The flip bracket is rotatably connected to the base, and the flip bracket and the fixed platform cooperate with each other to complete the fitting action; An extension plate, which can be detachably installed at the end of the flip-up bracket; A pair of buffer mechanisms are symmetrically mounted on the extension plate. During the process of flipping the bracket to the fitting position, the buffer mechanisms are used to provide a buffering effect.

2. The automatic bonding device according to claim 1, characterized in that, A pair of insertion posts are fixedly connected to the side wall of the expansion plate, and rubber sleeves are fitted on the outside of the insertion posts.

3. The automatic bonding device according to claim 2, characterized in that, The flip bracket end face is provided with a pair of engaging grooves, and the insertion post is inserted into the engaging grooves.

4. The automatic bonding device according to claim 2, characterized in that, The expansion plate has a mounting surface, which is horizontal when the flip bracket is flipped to the fitting position.

5. An automatic bonding device according to claim 4, characterized in that, The mounting surface is provided with a pair of storage slots, and the pair of buffer mechanisms are respectively installed in the pair of storage slots.

6. An automatic bonding device according to claim 5, characterized in that, The buffer mechanism includes a mounting plate, a telescopic rod, and a contact seat. The mounting plate is connected to the inner wall of the storage groove by a pair of screws. The fixed end of the telescopic rod is connected to the mounting plate, and the contact seat is connected to the free end of the telescopic rod.

7. An automatic bonding device according to claim 6, characterized in that, The cross-sectional area of ​​the mounting plate and the contact seat is smaller than the opening area of ​​the storage groove, and the length of the fixed end of the telescopic rod is smaller than the depth of the storage groove.

8. An automatic bonding device according to claim 6, characterized in that, The buffer mechanism also includes a spring, which is located on the outside of the telescopic rod and between the mounting plate and the contact seat.

9. An automatic bonding device according to claim 8, characterized in that, A pair of rollers are rotatably connected to the contact seat.

10. An automatic bonding device according to claim 9, characterized in that, Both the contact seat and the roller are made of elastic rubber.

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