Electrostatic protection transfer platform for thin film lithium niobate modulator chip

Abstract

The utility model relates to chip transfer equipment technical field especially thin film lithium niobate modulator chip's electrostatic protection transfer platform of kind. Its technical scheme includes the platform body, the upper of platform body is equipped with the placing plate, the upper of placing plate is equipped with a plurality of placing groove for placing chip, the inside of placing groove is equipped with the anti -static cushion for eliminating static and buffering, the upper of placing plate is equipped with a plurality of positioning structure for positioning chip, positioning structure is located the upper of placing groove, the upper of platform body is equipped with the protective cover, the utility model discloses through the setting of telescopic plate, rectangle slot, locating block and pressure plate, can realize the quick positioning to chip, prevent the damage of chip during transportation because of chip up and down jumping, still through the setting of internal thread and threaded rod, can realize the micro -adjustment to pressure plate, can prevent the damage of chip or the problem of not firm positioning of excessive pressure.

Description

Technical Field

[0001] This utility model relates to the field of chip transfer equipment technology, and in particular to an electrostatic protection transfer platform for thin-film lithium niobate modulator chips. Background Technology

[0002] With the rapid development of 5G, cloud computing, artificial intelligence, and the Internet of Things, data communication traffic is experiencing explosive growth, creating an urgent need for high-speed, low-power optical communication systems. Thin-film lithium niobate modulator chips, as a key component in the field of optical communication, have become one of the core devices for realizing high-speed optical links due to their significant advantages such as small size, wide bandwidth, and low power consumption. During the production, transportation, and use of thin-film lithium niobate modulator chips, static electricity has become a significant factor restricting their performance and reliability. Generally, an ion fan is placed above the transport platform to blow air onto the chip, neutralizing the static electricity on the chip surface and effectively preventing damage to the thin-film lithium niobate modulator chip.

[0003] Since the chip is placed directly in the placement slot, the vibration generated during transportation will cause the chip to bounce up and down, resulting in damage to the chip. In view of the above reasons, this application proposes an electrostatic protection transport platform for thin-film lithium niobate modulator chips. Utility Model Content

[0004] The purpose of this invention is to address the problems existing in the background technology by proposing an electrostatic protection transfer platform for thin-film lithium niobate modulator chips.

[0005] The technical solution of this utility model is as follows: an electrostatic protection transport platform for thin-film lithium niobate modulator chips, including a platform body, a placement plate above the platform body, a plurality of placement slots for placing chips above the placement plate, an antistatic buffer pad for eliminating static electricity and buffering in the placement slots, a plurality of positioning structures for positioning the chips above the placement plate, the positioning structures being located above the placement slots, and a protective cover above the platform body.

[0006] The positioning structure includes two mounting seats for installation, and telescopic plates for height adjustment are movably installed in the two mounting seats. A horizontal plate for installation is provided between the two telescopic plates. A pressure plate for positioning is movably installed below the horizontal plate. A silicone pad for cushioning is fixed at the bottom of the pressure plate.

[0007] Optionally, the mounting base has multiple rectangular slots on one side, and the telescopic plate has mounting holes on one side. A positioning block is movably disposed in the mounting hole, and the positioning block is adapted to the rectangular slots.

[0008] Optionally, an internally threaded sleeve is fixedly provided at the bottom of the horizontal plate, and a threaded rod is fixedly provided at the top of the pressure plate, the threaded rod and the internally threaded sleeve being compatible.

[0009] Optionally, a spring is fixedly installed inside the mounting hole, and the other end of the spring is fixedly connected to the positioning block, while the positioning block is movably connected to the mounting hole.

[0010] Optionally, the mounting base is provided with limiting grooves on both the front and back inner walls, and the telescopic plate is fixedly provided with limiting strips on both the front and back sides, with the limiting strips and limiting grooves being movably connected.

[0011] Optionally, the outer wall of the protective cover is provided with multiple ventilation slots, each of which is equipped with a filter screen. The protective cover is provided with an anti-static component, which includes an ion fan. An air inlet pipe is fixedly provided at the air inlet of the ion fan, and a filter cover for filtering dust is movably provided on the air inlet pipe.

[0012] Optionally, a connecting sleeve is fixedly provided at the bottom of the filter cover, two locking blocks are fixedly provided on the inner wall of the connecting sleeve, and two locking slots are provided on the outside of the air inlet pipe, with the locking blocks and locking slots being compatible.

[0013] Compared with the prior art, the present invention has the following beneficial technical effects:

[0014] 1. This utility model, through the setting of telescopic plate, rectangular groove, positioning block and pressure plate, can realize the rapid positioning of chip, and prevent chip damage caused by chip jumping up and down during transportation. In addition, through the setting of internal thread and threaded rod, it can realize the fine adjustment of pressure plate, which can prevent the chip from being damaged by excessive pressure or the problem of insecure positioning.

[0015] 2. This utility model, through the setting of the ion fan, can neutralize the static electricity on the chip surface, effectively preventing static electricity from damaging the thin-film lithium niobate modulator chip. In addition, by setting the filter cover, it can purify the intake air, block dust in the air, and improve the cleanliness of the ion fan. Attached Figure Description

[0016] Figure 1 A three-dimensional structural schematic diagram of this utility model is provided;

[0017] Figure 2 A cross-sectional view of the present invention is provided;

[0018] Figure 3 A three-dimensional structural diagram of the present invention after removing the protective cover is provided;

[0019] Figure 4 A first-view separation schematic diagram of the positioning structure in this utility model is provided;

[0020] Figure 5 A second-view separation schematic diagram of the positioning structure in this utility model is provided;

[0021] Figure 6 A schematic diagram of the detachable structure of the antistatic component in this utility model is provided.

[0022] Figure label:

[0023] 1. The carrier body;

[0024] 2. Placement board;

[0025] 3. Anti-static cushioning pad;

[0026] 4. Positioning structure; 401. Mounting base; 402. Rectangular groove; 403. Telescopic plate; 404. Mounting hole; 405. Spring; 406. Positioning block; 407. Horizontal plate; 408. Internal threaded sleeve; 409. Threaded rod; 410. Pressure plate;

[0027] 5. Protective cover;

[0028] 6. Ventilation duct;

[0029] 7. Antistatic components; 701. Ionizing fan; 702. Air inlet duct; 703. Connecting sleeve; 704. Filter cover. Detailed Implementation

[0030] The technical solutions of this disclosure will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments.

[0031] The components of the embodiments of this disclosure, which are typically described and shown in the accompanying drawings, can be arranged and designed in a variety of different configurations. Therefore, the following detailed description of embodiments of this disclosure provided in the drawings is not intended to limit the scope of the claimed disclosure, but merely to illustrate selected embodiments of the disclosure.

[0032] Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this disclosure.

[0033] In the description of this disclosure, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0034] In the description of this disclosure, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure based on the specific circumstances.

[0035] Example

[0036] like Figure 1-6 As shown, the present invention proposes an electrostatic protection transport platform for a thin-film lithium niobate modulator chip, comprising a platform body 1, a placement plate 2 above the platform body 1, a plurality of placement slots for placing chips above the placement plate 2, and an antistatic buffer pad 3 for eliminating static electricity and buffering within the placement slots. The antistatic buffer pad 3 can prevent the chip from directly contacting the placement plate 2 and generating static electricity, and can also buffer the chip when it is subjected to vibration, protecting the chip from damage. A plurality of positioning structures 4 for positioning the chip are provided above the placement plate 2, and the positioning structures 4 are located above the placement slots. A protective cover 5 is provided above the platform body 1.

[0037] The positioning structure 4 includes two mounting seats 401 for installation. Telescopic plates 403 for height adjustment are movably installed within the two mounting seats 401. Limiting grooves are provided on the inner walls of both the front and back sides of the mounting seats 401. Limiting strips are fixedly provided on both the front and back sides of the telescopic plates 403, and the limiting strips are movably connected to the limiting grooves. Multiple rectangular slots 402 are provided on one side of the mounting seats 401, and mounting holes 404 are provided on one side of the telescopic plates 403. Positioning blocks 406 are movably installed within the mounting holes 404. Springs 405 are fixedly installed within the mounting holes 404, and the other end of the springs 405 is fixedly connected to the positioning blocks 406. The positioning blocks 406 are movably connected to the mounting holes 404. The 06 and rectangular slot 402 are compatible. A horizontal plate 407 for installation is provided between the two telescopic plates 403. A positioning pressure plate 410 is movably provided below the horizontal plate 407. An internal threaded sleeve 408 is fixedly provided at the bottom of the horizontal plate 407. A threaded rod 409 is fixedly provided at the top of the pressure plate 410. The threaded rod 409 and the internal threaded sleeve 408 are compatible. The setting of the threaded rod 409 and the internal threaded sleeve 408 can realize the fine adjustment of the position of the pressure plate 410, which is convenient for squeezing and positioning the chip. A silicone pad for buffering is fixedly provided at the bottom of the pressure plate 410. The silicone pad can play a buffering role and prevent the pressure plate 410 from applying too much force to the chip and causing damage to the chip.

[0038] The outer wall of the protective cover 5 is provided with multiple ventilation slots 6, each containing a filter screen. The protective cover 5 is equipped with an anti-static component 7, which includes an ion fan 701. The ion fan 7 generates ion wind that can neutralize the static electricity on the chip surface, effectively preventing static electricity from damaging the thin-film lithium niobate modulator chip, improving the electrostatic protection capability during chip transport, and reducing the chip damage rate caused by static electricity. An air inlet pipe 702 is fixedly provided at the air inlet of the ion fan 701. A filter cover 704 for filtering dust is movably provided on the air inlet pipe 702. A connecting sleeve 703 is fixedly provided at the bottom of the filter cover 704. Two locking blocks are fixedly provided on the inner wall of the connecting sleeve 703. Two locking slots are provided on the outside of the air inlet pipe 702. The locking blocks and locking slots are compatible. The setting of the locking blocks and locking slots can realize the quick installation and removal of the filter cover 704, which is convenient for subsequent cleaning.

[0039] In this embodiment, after the chip is placed on top of the anti-static buffer pad 3, two positioning blocks 406 are simultaneously pressed to retract into the mounting hole 404. Then, the horizontal plate 407 is pressed down, causing the threaded rod 409 and the pressure plate 410 to move downwards. When the positioning block 406 moves to the position of the next rectangular slot 402, the spring 405 causes the positioning block 406 to reset and pop out from the rectangular slot 402, thus positioning the telescopic plate 403. Once the silicone pad is in contact with the chip, the adjustment of the height of the telescopic plate 403 can be stopped. If the silicone pad at the bottom of the pressure plate 410... When the distance between the rubber pad and the chip is less than the distance between adjacent rectangular slots 402, the threaded rod 409 can be rotated to adjust the height of the pressure plate 410, which serves the purpose of fine adjustment of the height of the pressure plate 410. This not only prevents excessive pressure from damaging the chip, but also prevents the problem of insecure positioning. Then, the ion fan 701 is started. The ion fan 701 draws in the outside air and blows it onto the chip surface, which neutralizes the static electricity on the chip surface. The filter cover 704 can purify the drawn-in air, block dust in the air, and improve the cleanliness of the ion air.

[0040] The above specific embodiments are merely several optional embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. An electrostatic protection transport platform for a thin-film lithium niobate modulator chip, comprising a platform body (1), characterized in that: The stage body (1) is provided with a placement plate (2) above it. The placement plate (2) is provided with a plurality of placement slots for placing chips above it. The placement slots are provided with antistatic buffer pads (3) for eliminating static electricity and buffering. The placement plate (2) is provided with a plurality of positioning structures (4) for positioning chips above it. The positioning structures (4) are located above the placement slots. The stage body (1) is provided with a protective cover (5) above it. The positioning structure (4) includes two mounting bases (401) for installation. The two mounting bases (401) are movably provided with telescopic plates (403) for height adjustment. The two telescopic plates (403) are provided with the same horizontal plate (407) for installation. The horizontal plate (407) is movably provided with a pressure plate (410) for positioning below it. The bottom of the pressure plate (410) is fixedly provided with a silicone pad for cushioning.

2. The electrostatic protection transport platform for a thin-film lithium niobate modulator chip according to claim 1, characterized in that, The mounting base (401) has multiple rectangular grooves (402) on one side, and the telescopic plate (403) has mounting holes (404) on one side. A positioning block (406) is movably installed in the mounting hole (404), and the positioning block (406) is adapted to the rectangular grooves (402).

3. The electrostatic protection transport platform for a thin-film lithium niobate modulator chip according to claim 1, characterized in that, The bottom of the horizontal plate (407) is fixedly provided with an internal threaded sleeve (408), and the top of the pressure plate (410) is fixedly provided with a threaded rod (409), which is compatible with the internal threaded sleeve (408).

4. The electrostatic protection transport platform for a thin-film lithium niobate modulator chip according to claim 2, characterized in that, A spring (405) is fixedly installed inside the mounting hole (404). The other end of the spring (405) is fixedly connected to the positioning block (406). The positioning block (406) is movably connected to the mounting hole (404).

5. The electrostatic protection transport platform for a thin-film lithium niobate modulator chip according to claim 1, characterized in that, The mounting base (401) has a limiting groove on both the front and back inner walls, and the telescopic plate (403) has a limiting strip fixedly installed on both the front and back sides, with the limiting strip and the limiting groove being movably connected.

6. The electrostatic protection transport platform for a thin-film lithium niobate modulator chip according to claim 1, characterized in that, The outer wall of the protective cover (5) is provided with a plurality of ventilation slots (6), and each of the plurality of ventilation slots (6) is provided with a filter screen. The protective cover (5) is provided with an antistatic component (7), which includes an ion fan (701). An air inlet pipe (702) is fixedly provided at the air inlet of the ion fan (701), and a filter cover (704) for filtering dust is movably provided on the air inlet pipe (702).

7. The electrostatic protection transport platform for a thin-film lithium niobate modulator chip according to claim 6, characterized in that, The bottom of the filter cover (704) is fixedly provided with a connecting sleeve (703), and the inner wall of the connecting sleeve (703) is fixedly provided with two locking blocks. The outside of the air inlet pipe (702) is provided with two locking slots, and the locking blocks and locking slots are compatible.

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