Novel high-temperature high-pressure magnetic pump
By introducing a semiconductor heat dissipation mechanism and a cooling water tank into the high-temperature and high-pressure magnetic pump, the problem of magnetic rotor demagnetization under high-temperature conditions is solved, and the equipment can be stably operated and efficiently run under high-temperature and high-pressure conditions.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI QIAOXU MECHANICAL EQUIP CO LTD
- Filing Date
- 2025-08-20
- Publication Date
- 2026-06-26
AI Technical Summary
Existing high-temperature and high-pressure magnetic pumps are prone to demagnetization of the external or internal magnetic rotor in high-temperature environments, affecting the equipment's working efficiency and reliability, and lack effective heat dissipation mechanisms.
The system employs a semiconductor heat dissipation mechanism and a cooling water tank to circulate water and cool the key components of the high-temperature and high-pressure magnetic pump. It also promptly alerts staff to add water when needed to prevent overheating and demagnetization.
It effectively prevents demagnetization of the external or internal magnetic rotor, ensuring stable operation of the equipment under high temperature and high pressure, and improving work safety and reliability.
Smart Images
Figure CN224413894U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of liquid pump equipment technology, and in particular to a novel high-temperature and high-pressure magnetic pump. Background Technology
[0002] The high-temperature and high-pressure magnetic pump consists of a pump casing, impeller, and magnetic drive device. Its working principle is that the motor drives the outer magnetic rotor to rotate, and the outer magnetic rotor drives the inner magnetic rotor to rotate. The magnetic coupling device replaces the mechanical seal in the traditional pump, thereby driving the impeller to rotate and pump out the liquid. This design avoids the problem of mechanical seal failure in traditional pumps under high temperature and high pressure environments, greatly improving the safety and reliability of operation. It can operate stably in high temperature and high pressure environments above 300℃. Compared with traditional pumps, the high-temperature and high-pressure magnetic pump has many technical advantages: (1) High safety: The leak-free design avoids media leakage, especially suitable for the transportation of toxic, harmful or flammable and explosive media; (2) Superior high temperature and high pressure resistance: Made of high-performance materials, it can operate stably in high temperature and high pressure environments above 300℃; (3) Simple structure and low maintenance cost: Without mechanical seal, it reduces failures caused by seal wear and greatly reduces maintenance costs. It is widely used in petrochemical, pharmaceutical, metallurgical, nuclear power, environmental protection engineering, etc.
[0003] With the advancement of industrial technology, the functions of high-temperature and high-pressure magnetic pumps have also been developed. For example, the authorized patent in my country, patent number "20202246 3950.2," entitled "A High-Temperature and High-Pressure Magnetic Pump," states that "this makes the equipment difficult to move, thereby effectively reducing vibration and noise during operation. Furthermore, during installation, the insertion post simply slides down along the groove direction, and under the action of the compression spring, the post inserts into the conical groove, simplifying the installation process and making operation simple and convenient." As can be seen above, although the patent achieves its stated inventive purpose, it also has the following technical drawbacks due to structural limitations. When the equipment is used in high-temperature areas, the lack of a suitable heat dissipation mechanism means that the heat from the pumped liquid will act on the outer or inner magnetic rotor, potentially causing demagnetization. Due to the weakening of magnetism, the outer magnetic rotor may be unable to effectively drive the inner magnetic rotor to operate at full power, leading to reduced equipment efficiency and a failure to achieve a good performance ratio. Utility Model Content
[0004] To overcome the drawbacks of existing high-temperature and high-pressure magnetic pumps, which are limited by their structure and have the shortcomings described in the background art, this utility model provides a new type of high-temperature and high-pressure magnetic pump based on a high-temperature and high-pressure magnetic pump body. During operation, under the combined action of related structures, it does not require an external power mechanism. The high-temperature and high-pressure magnetic pump body provides power to the impeller inside the volute through the high-temperature and high-pressure magnetic pump body. The device has the advantages of compact structure and relatively low cost. The high-temperature and high-pressure magnetic pump body is cooled by a semiconductor heat dissipation mechanism and circulating water. When the heat dissipation water is low, it can promptly prompt the operator to add water, effectively preventing the demagnetization of the external or internal magnetic rotor caused by excessive temperature.
[0005] The technical solution adopted by this utility model to solve its technical problem is:
[0006] A novel high-temperature and high-pressure magnetic pump includes a high-temperature and high-pressure magnetic pump body, a semiconductor refrigeration mechanism, a heat dissipation tank, a water level switch, an alarm, a base plate, and a circulation mechanism. The rear end of the motor housing of the high-temperature and high-pressure magnetic pump has an opening. The circulation mechanism includes a volute, an impeller, and a shaft. An outlet pipe and an inlet pipe are fixedly installed at the upper and rear ends of the volute, respectively. The shaft is laterally rotatable within the volute. The impeller is fixedly installed on the rear side of the shaft, and its rotation is located within the volute. The front side of the shaft and the rear side of the motor shaft of the high-temperature and high-pressure magnetic pump body are fixedly installed together. The high-temperature and high-pressure magnetic pump body, volute, and heat dissipation tank are fixedly installed on the base plate. The semiconductor refrigeration mechanism is fixedly installed on one end of the outer side of the heat dissipation tank. A hollow heat dissipation shell is fixedly installed on the outer shell of the outer magnetic rotor and inner magnetic rotor of the high-temperature and high-pressure magnetic pump body. An inlet pipe A and an outlet pipe A are fixedly installed on the upper and lower ends of the heat dissipation shell, respectively. An outlet pipe B and an inlet pipe B are fixedly installed on the lower front and upper front ends of the heat dissipation tank, respectively. One side of the outlet pipe of the volute is fixedly connected to one side of the inlet pipe A of the heat dissipation shell, and one side of the outlet pipe A of the heat dissipation shell is fixedly connected to one side of the inlet pipe B of the heat dissipation tank. One end of the outlet pipe B of the heat dissipation tank is fixedly connected to one side of the inlet pipe of the volute. The water level switch is fixedly installed inside the heat dissipation tank. The alarm is installed inside the electrical control box, and the other end of the water level switch is electrically connected to one end of the alarm's power input.
[0007] Furthermore, the heat dissipation shell and the heat dissipation water tank are filled with water.
[0008] Furthermore, the heat dissipation tank is made of metal, and heat dissipation fins are fixedly installed on the outer ends of the heat dissipation tank.
[0009] Furthermore, the water level switch is a float-type normally closed contact buoyancy switch.
[0010] Furthermore, the outer diameter of the impeller is smaller than the inner diameter of the volute.
[0011] Furthermore, the lower end of the cooling water tank is higher than the height of the volute.
[0012] Compared with the prior art, the advantages of this utility model are as follows: This new model is based on a high-temperature and high-pressure magnetic pump body and has all the functions of a common high-temperature and high-pressure magnetic pump. During operation, the high-temperature and high-pressure magnetic pump body provides power to the impeller inside the volute. Since no external power mechanism is required, the overall equipment has the advantages of compact structure and relatively low cost. The semiconductor heat dissipation mechanism, heat dissipation tank, and circulating water are used to dissipate heat from the key parts of the high-temperature and high-pressure magnetic pump body, namely the external magnetic rotor or the internal magnetic rotor. When the water in the heat dissipation tank is low, an alarm can be triggered in time to prompt the staff to add water, effectively preventing the problem of demagnetization of the external magnetic rotor or the internal magnetic rotor caused by excessive temperature. The high-temperature and high-pressure magnetic pump body can work normally and stably. Attached Figure Description
[0013] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model.
[0015] Figure 2 This is a partial structural schematic diagram of the present invention.
[0016] Figure 3 This is the circuit diagram of this utility model. Detailed Implementation
[0017] Figure 1 , 2As shown in Figure 3, the novel high-temperature and high-pressure magnetic pump includes a high-temperature and high-pressure magnetic pump body M, a power switch K, a power module T1, a semiconductor cooling mechanism B, a heat dissipation tank 1, a water level switch S, an alarm BX, a base plate 2, and a circulation mechanism. The high-temperature and high-pressure magnetic pump M has an opening in the middle of the rear end of its motor housing, and a bearing 3 is fixedly installed inside the opening. The circulation mechanism (requiring very low power to avoid excessive load on the high-temperature and high-pressure magnetic pump body M) includes a volute 41, an impeller 42, a bearing A43, and a shaft 44. The upper end and the middle of the rear end of the volute 41 are respectively fixedly installed with… The pump has an outlet pipe and an inlet pipe. The front and rear ends of the volute 41 each have a shaft hole. The outer rings of two bearings A43 are fixedly installed in the two shaft holes. The shaft 44 is laterally fixedly installed in the inner rings of bearings 3 and A43, with its front and rear ends located within the motor rear housing and the volute 41, respectively. The impeller 42 is fixedly installed on the rear side of the shaft 44 and rotates within the volute 41. The front side of the shaft 44 and the rear side of the motor shaft of the high-temperature, high-pressure magnetic pump body M are concentrically fixed together. The high-temperature, high-pressure magnetic pump body M, the volute 41, and the cooling water tank 1 are respectively... The heat exchange tank 1 is fixedly installed on the base plate 2 from front to back. There is a mounting groove (without heat sink fins) in the middle of the right outer side of the heat exchange tank 1. The semiconductor cooling mechanism B is fixedly installed on the right outer side of the heat exchange tank 1, with the cold end of the semiconductor cooling mechanism B contacting the right outer side of the heat exchange tank 1 and the hot end located at the rear end. A hollow heat dissipation shell 5 is sealed on the outer side of the outer and inner magnetic rotor shells of the high-temperature, high-pressure magnetic pump body. An inlet pipe A and an outlet pipe A are fixedly installed on the upper and lower ends of the heat dissipation shell 5 respectively (the inlet pipe A and outlet pipe A are interconnected with the inside of the heat dissipation shell). The heat dissipation... A water outlet pipe B and a water inlet pipe B are fixedly installed at the middle of the lower front end and the middle of the upper end of the water tank 1, respectively. The water outlet pipe of the volute 41 and the water inlet pipe A of the heat dissipation shell 5 are connected by a pipe. The water outlet pipe A of the heat dissipation shell 5 and the water inlet pipe B of the heat dissipation tank 1 are fixedly connected by a pipe. One end of the water outlet pipe B of the heat dissipation tank 1 and the water inlet pipe of the volute 41 are connected by a pipe. The water level switch S is fixedly installed in the middle of the left end inside the heat dissipation tank 1. The power switch K, the power module T1, and the alarm BX are installed on the circuit board inside the electrical control box 6 of the high temperature and high pressure magnetic pump body.
[0018] Figure 1 , 2As shown in Figure 3, the heat sink 5 and the water tank 1 are filled with water (five-sixths full). The water tank 1 is made of copper, and multiple finned heat sinks 101 are fixedly installed on its outer edges. The water level switch S is a float-type normally closed contact buoyancy switch, and the distance between the float of the water level switch S and the lower end of the water tank 1 is [not specified]. The outer diameter of the impeller 42 is smaller than the inner diameter of the volute 41. The lower end of the water tank 1 is higher than the height of the volute 41. A water seal is installed between the inner and outer rings of the bearing A43 on both sides (to prevent leakage). The two poles of the 220V AC power supply and the power input terminals 1 and 2 of the power module T1 are connected by wires, and are connected in series with the power switch K and the power input terminal of the high-temperature and high-pressure magnetic pump body M by wires. The positive terminal 3 of the power output terminal of the power module T1 is connected to the semiconductor refrigeration mechanism B and one end of the water level switch S by wires. The other end of the water level switch S is connected to the positive power input terminal of the alarm BX by wires. The negative terminal 4 of the power output terminal of the power module T1 is connected to the negative power input terminal of the semiconductor refrigeration mechanism B and the alarm BX by wires. Figure 3 In the middle, the power module T1 is a finished product of AC 220V power supply to DC 12V power module (1KW); the high temperature and high pressure magnetic pump body MM has a power of 3KW (working voltage 220V, or a high pressure magnetic centrifugal pump body M with a power supply voltage of 380V can be used); the semiconductor cooling mechanism B has a working voltage of DC 12V and a power of 100W; the alarm BX is a finished product of active continuous sound alarm with model OF12V.
[0019] Figure 1 , 2As shown in Figure 3, this novel magnetic pump body M, based on a high-temperature and high-pressure magnetic pump, possesses all the functions of a conventional high-temperature and high-pressure magnetic pump M. During operation, a motor drives the outer magnetic rotor to rotate, which in turn drives the inner magnetic rotor. A magnetic coupling device replaces the mechanical seal in traditional pumps, thereby driving the pump impeller to rotate and pump out the liquid. This avoids the problem of mechanical seal failure in traditional pumps under high-temperature and high-pressure environments, improving operational safety and reliability. It can operate stably in high-temperature and high-pressure environments above 300℃. Since the above is existing mature technology, this application will not elaborate on the working principle of the high-temperature and high-pressure magnetic pump body M. In this novel, 220V power enters the power input terminal of the power module T1. Pins 3 and 4 of the power module T1 output a stable 12V DC power supply, which enters the power input terminals of the semiconductor cooling mechanism B and the liquid level switch S. The semiconductor cooling mechanism B, when energized, dissipates heat from the cooling water tank and the water inside (the finned heat sink improves the heat dissipation effect). After the high-temperature and high-pressure magnetic pump body M is powered on, its motor shaft drives the shaft 44 to rotate, which in turn drives the impeller 42 to rotate. As a result, the impeller 42 inside the volute continuously draws water from the water tank 1 and pumps it into the heat dissipation shell 5, absorbing heat from the outer and inner magnetic rotor shells of the high-temperature and high-pressure magnetic pump M. Consequently, the temperature of the outer and inner magnetic rotors decreases. After absorbing heat, the water flows back into the water tank 1, where the water tank, finned heat sink 101, and semiconductor cooling mechanism B dissipate heat. After cooling, the water again enters the heat dissipation shell 5 through the impeller, further cooling the outer and inner magnetic rotors. This continuous cycle ensures that the outer and inner magnetic rotors are kept in a relatively low-temperature mode, reducing the likelihood of demagnetization due to excessively high temperatures.
[0020] Figure 1 , 2 As shown in Figure 3, when the water level in the tank is above half full, the float of the water level switch S rises to a relatively high position, and the two internal contacts are open. Therefore, the alarm BX will not be energized and will not sound, indicating that there is plenty of water in the tank and no additional water needs to be added. When the water level in the tank is below half full, the float of the water level switch S rises to a relatively low position, and the two internal contacts are closed. Therefore, the alarm BX will be energized and will sound, indicating that there is little water in the tank. Upon hearing the alarm, staff can add water promptly, ensuring the required cooling water supply.
[0021] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model.
[0022] Furthermore, it should be understood that although this specification describes the embodiments, the embodiments do not necessarily contain only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in the embodiments can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A new type of high-temperature and high-pressure magnetic pump, comprising a high-temperature and high-pressure magnetic pump body, a semiconductor refrigeration mechanism, a heat dissipation water tank, a water level switch, an alarm, a bottom plate, and a circulating mechanism; characterized in that, The high-temperature, high-pressure magnetic pump has an opening at the rear end of the motor housing. The circulation mechanism includes a volute, an impeller, and a shaft. A water outlet pipe and a water inlet pipe are fixedly installed at the upper and rear ends of the volute, respectively. The shaft is laterally rotatable within the volute. The impeller is fixedly installed on the rear side of the shaft, and its rotation is within the volute. The front side of the shaft and the rear side of the motor shaft of the high-temperature, high-pressure magnetic pump body are fixedly installed together. The high-temperature, high-pressure magnetic pump body, volute, and cooling water tank are fixedly installed on a base plate. A semiconductor cooling mechanism is fixedly installed on one end of the cooling water tank. The outer and inner magnetic rotor housings of the high-temperature, high-pressure magnetic pump body are located on the outer side of the casing. A hollow heat dissipation shell is fixedly installed, with an inlet pipe A and an outlet pipe A fixedly installed at the upper and lower ends of the heat dissipation shell, respectively. An outlet pipe B and an inlet pipe B are fixedly installed at the lower front and upper front ends of the heat dissipation tank, respectively. One side of the outlet pipe of the volute is fixedly connected to one side of the inlet pipe A of the heat dissipation shell, and one side of the outlet pipe A of the heat dissipation shell is fixedly connected to one side of the inlet pipe B of the heat dissipation tank. One end of the outlet pipe B of the heat dissipation tank is fixedly connected to one side of the inlet pipe of the volute. A water level switch is fixedly installed inside the heat dissipation tank. An alarm is installed inside the electrical control box, with the other end of the water level switch electrically connected to one power input end of the alarm.
2. The novel high temperature and high pressure magnetic drive pump according to claim 1, characterized in that, The heat sink and water tank are filled with water.
3. The novel high temperature and high pressure magnetic drive pump of claim 1, wherein, The cooling water tank is made of metal, and heat sinks are fixedly installed on the outer ends of the cooling water tank.
4. The novel high temperature and high pressure magnetic drive pump of claim 1, wherein, The water level switch is a float-type normally closed contact buoyancy switch.
5. The novel high temperature and high pressure magnetic drive pump of claim 1, wherein, The outer diameter of the impeller is smaller than the inner diameter of the volute.
6. The novel high temperature high pressure magnetic drive pump of claim 1, wherein, The lower end of the cooling water tank is higher than the height of the volute.