Computing device

Abstract

The embodiment of the present application provides a kind of computing device, comprising: shell assembly, it is internally defined with cavity, shell assembly is equipped with with the air inlet and the air outlet that communicate with cavity;Computing module is set in the cavity;Fan, it is set in the cavity, for generating the airflow flowing from the air inlet to the air outlet, and airflow flows through computing module.According to the technology of the embodiment of the present application, shell assembly is equipped with with the air inlet and the air outlet that communicate with internal cavity, computing module and fan are integrated in shell assembly, fan can generate the flowing airflow from the air inlet to the air outlet, and airflow flows through computing module, improve the heat dissipation efficiency of computing module.In addition, the air outlet of shell assembly can be used for heating, improve energy utilization rate.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and more particularly to a computing device. Background Technology

[0002] To meet the heat dissipation requirements of high-performance computing devices, these devices are typically equipped with cooling modules to reduce their operating temperature and prevent hardware damage caused by overheating. However, current cooling modules for computing devices often have limited functionality and their design needs optimization. Utility Model Content

[0003] This application provides a computing device to solve or alleviate one or more technical problems in the prior art.

[0004] The computing device according to an embodiment of this application includes: a housing assembly having a cavity defined inside, the housing assembly having an air inlet and an air outlet communicating with the cavity; a computing module disposed within the cavity; and a fan disposed within the cavity for generating airflow from the air inlet to the air outlet, and the airflow passing through the computing module.

[0005] In one embodiment, the air outlet is located on the side of the housing assembly.

[0006] In one embodiment, the fan is positioned above the computing module, and the air outlet is located near the top of the housing assembly.

[0007] In one embodiment, the air inlet is located on the side of the housing assembly.

[0008] In one embodiment, the air inlet and air outlet are located on different sides of the housing assembly.

[0009] In one embodiment, the air inlet and air outlet are located on the same side of the housing assembly.

[0010] In one embodiment, the air inlet is located near the bottom of the housing assembly.

[0011] In one embodiment, the air inlet is located at the bottom of the housing assembly.

[0012] In one embodiment, the computing module includes a computing board and a heat dissipation structure, wherein the heat dissipation structure is thermally connected to the computing board.

[0013] In one implementation, the plane on which the computing board is located is set parallel to the vertical direction.

[0014] In one embodiment, the heat dissipation structure includes at least one heat dissipation fin group, which is disposed on at least one side of the computing board, and each heat dissipation fin group includes a plurality of heat dissipation fins spaced apart.

[0015] In one embodiment, a flow guide gap is defined between two adjacent heat dissipation fins in the heat dissipation fin assembly, and the flow guide gap extends in a direction parallel to the vertical direction.

[0016] In one embodiment, the ends of the heat dissipation fins in each heat dissipation fin group that are away from the computing board are spaced apart from the inner wall of the cavity.

[0017] In one embodiment, there are two heat dissipation fin groups, which are respectively disposed on opposite sides of the computing board.

[0018] In one embodiment, the heat dissipation structure further includes a plurality of support beams disposed at the bottom of the computing board, the plurality of support beams being spaced apart along a first direction, and each support beam being supported on the bottom wall of the cavity.

[0019] In one embodiment, the fan has an airflow inlet and an airflow outlet, with the airflow inlet located near the air inlet and the airflow outlet located near the air outlet; the airflow inlet direction and the airflow outlet direction form an angle.

[0020] In one embodiment, the fan includes a cross-flow fan, wherein the air inlet direction is perpendicular to the air outlet direction.

[0021] In one embodiment, it further includes: a power module disposed within the cavity, and a power fan disposed side-by-side with the computing module in a first direction of the housing assembly, wherein the airflow generated by the fan flows through the power module and the computing module.

[0022] In one embodiment, the power module has a plug interface, and the computing board of the computing module has a plug end, which is plugged into the plug interface to electrically connect the computing board and the power module.

[0023] In one embodiment, the housing assembly includes an inner housing, in which a computing module, a fan, and a power module are integrated.

[0024] In one embodiment, the housing assembly further includes an outer shell, the interior of which defines a cavity, and a first mounting opening is provided on one side of the outer shell in a first direction, through which the inner shell is slidably mounted in the cavity.

[0025] In one embodiment, the inner shell defines a receiving cavity inside, in which the computing module and the power module are arranged side by side along a first direction; the top of the inner shell defines a mounting groove, in which a fan is disposed.

[0026] In one embodiment, the top of the inner shell is provided with a first side baffle and a second side baffle, which are disposed opposite to each other in a second direction, and a mounting groove is defined between the first side baffle and the second side baffle.

[0027] In one embodiment, the first side baffle and the second side baffle respectively abut against the outer wall surface of the fan.

[0028] In one embodiment, the inner shell has two sidewalls arranged opposite each other in a second direction, and the inner wall surfaces of the two sidewalls are respectively provided with supporting ribs, and the two supporting ribs are respectively provided adjacent to the top of the inner shell; wherein, the mounting groove is defined by a first side baffle, a second side baffle and the two supporting ribs.

[0029] In one embodiment, the support rib is formed by protruding inward from the inner wall surface of the side wall, and the length direction of the support rib is parallel to the first direction.

[0030] In one embodiment, the two side walls of the inner shell are respectively provided with limiting flanges, which extend downward from the side walls in a direction toward the inner wall surface of the outer shell.

[0031] In one embodiment, the outer shell has two opposing inner wall surfaces respectively provided with stop members. The stop members extend upwardly from the inner wall surface of the outer shell in the direction toward the outer wall surface of the inner shell, and the stop members are located below the limiting folded edge.

[0032] In one embodiment, the bottom of the inner shell has a bottom opening area communicating with the receiving cavity, and the side of the inner shell has a side opening area communicating with the receiving cavity. The bottom opening area is correspondingly connected to the air inlet, and the side opening area is correspondingly connected to the air outlet.

[0033] In one embodiment, the housing assembly further includes a mounting side plate, which is detachably mounted to the first mounting opening for forming a closure of the first mounting opening.

[0034] In one embodiment, a snap-fit ​​protrusion is provided at the end of the fan adjacent to the first mounting opening, and a through first snap-fit ​​hole is provided on the mounting side plate, the first snap-fit ​​hole and the snap-fit ​​protrusion of the fan forming a snap-fit ​​engagement.

[0035] In one embodiment, the mounting side plate has a through-hole for cables to pass through, and the control module is located outside the receiving cavity of the inner shell.

[0036] In one embodiment, the housing has an extension extending in a first direction, the extension defining an installation space, and the installation space is adjacent to the inner housing in the first direction, the installation space being used to install a control module.

[0037] In one implementation, the top of the installation space is open.

[0038] In one embodiment, the housing has a second mounting opening on the other side in the first direction; the housing assembly also includes a cover side plate, which is detachably mounted to the second mounting opening to close the second mounting opening.

[0039] In one embodiment, the cover side plate and the control module are located on opposite sides of the housing in a first direction. The cover side plate is provided with a snap-fit ​​part, and the control module is provided with a snap-fit ​​mating part. In two computing devices arranged adjacent to each other along the first direction, the snap-fit ​​part of one computing device and the snap-fit ​​mating part of the other computing device form a snap-fit ​​mating.

[0040] In one embodiment, the system further includes a control module comprising a control box and a control circuit board. The control box has an internal mounting cavity defined therein. The control box is detachably mounted to the housing assembly. The control circuit board is disposed within the mounting cavity and is used to electrically connect to the computing module and the power module, respectively.

[0041] In one embodiment, the control box includes a housing and a side cover, the housing defining a mounting cavity and a lateral opening communicating with the mounting cavity, and the side cover being detachably mounted to the lateral opening.

[0042] In one embodiment, a through-hole is provided on the side cover plate for the power module cable to pass through and be electrically connected to the control circuit board.

[0043] In one embodiment, the end of the fan has a snap-fit ​​protrusion; the side cover plate also has a snap-fit ​​hole, the shape of which is adapted to the shape of the snap-fit ​​protrusion, and the snap-fit ​​hole is used to form a snap-fit ​​engagement with the snap-fit ​​protrusion.

[0044] In one embodiment, the side cover plate has a recessed portion formed in a direction toward the mounting cavity, the recessed portion defining a cable storage groove, and both a cable passage hole and a snap-fit ​​hole are provided in the recessed portion.

[0045] In one embodiment, a snap-fit ​​hole is provided on one side of the housing assembly adjacent to the control box, and a snap-fit ​​protrusion is provided on one side of the side cover plate adjacent to the housing assembly, the snap-fit ​​protrusion being used to form a snap-fit ​​engagement with the snap-fit ​​hole; or, a snap-fit ​​protrusion is provided on one side of the housing assembly adjacent to the control box, and a snap-fit ​​hole is provided on the side cover plate, the snap-fit ​​hole being used to form a snap-fit ​​engagement with the snap-fit ​​protrusion.

[0046] In one embodiment, the housing includes an upper shell and a lower shell, with the bottom of the upper shell connected to the top of the lower shell; wherein the upper shell is made of a transparent material.

[0047] In one embodiment, the control module further includes a display screen, which is disposed within the mounting cavity and electrically connected to the control circuit board, with the display area of ​​the display screen facing the upper shell.

[0048] In one embodiment, the outer wall of the control box of the control module is provided with a snap-fit ​​part, which is correspondingly provided with a snap-fit ​​part on the cover side plate of the housing assembly.

[0049] In one embodiment, the snap-fit ​​portion is a protruding structure and the snap-fit ​​mating portion is a groove structure; or, the snap-fit ​​portion is a groove structure and the snap-fit ​​mating portion is a protruding structure.

[0050] In one embodiment, the computing module's computing board includes a board body and multiple computing units, with the multiple computing units disposed on the side surface of the board body. The length direction of the board body is parallel to a first direction, and the width direction of the board body is parallel to the vertical direction.

[0051] In one embodiment, the ratio of the width dimension of the plate to the length dimension of the plate is less than or equal to 1 / 6.

[0052] In one embodiment, multiple computing units are disposed on the side surface of the plate, and the multiple computing units are arranged in at least one row, with the multiple computing units in each row arranged adjacent to each other along the length direction of the plate.

[0053] In one embodiment, multiple computing units are arranged in two rows, with the two rows of computing units spaced apart in the width direction of the plate.

[0054] In one implementation, the two rows of computing units are connected in series.

[0055] In one embodiment, the plate includes a first end and a second end disposed opposite to each other in its length direction, and the calculation units in the first row of calculation units adjacent to the second end and the calculation units in the second row of calculation units adjacent to the second end are electrically connected through a first conductive element.

[0056] In one embodiment, a plug-in terminal is provided at the first end of the board body, which is used to connect and cooperate with the plug interface of the power module.

[0057] In one embodiment, the computing units in the first row of computing units adjacent to the first end and the computing units in the second row of computing units adjacent to the first end are electrically connected to the plug-in terminal via a second conductive element.

[0058] In one embodiment, the width of the plate is greater than the width of the plug-in end.

[0059] In one embodiment, the plate is provided with a plurality of connection holes for fasteners to pass through in order to mount the heat dissipation structure onto the plate.

[0060] In one embodiment, multiple computing units are arranged in two rows, with the two rows of computing units spaced apart in the width direction of the plate; wherein, multiple connecting holes are arranged between the two rows of computing units, with the multiple connecting holes spaced apart along a first direction.

[0061] According to an embodiment of this application, the computing device has a housing assembly with an air inlet and an air outlet communicating with the internal cavity. The computing module and a fan are integrated into the housing assembly. The fan generates airflow from the air inlet to the air outlet, and the airflow passes through the computing module, improving the heat dissipation efficiency of the computing module. Furthermore, the hot air discharged from the air outlet of the housing assembly can be used for heating, thereby realizing the reuse of heat generated by the computing module and improving the energy utilization rate of the computing device.

[0062] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0063] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0064] Figure 1 An exemplary three-dimensional structural diagram of a computing device according to an embodiment of this application is provided.

[0065] Figure 2 An exploded structural diagram of a computing device according to an embodiment of this application is provided.

[0066] Figure 3 An exemplary exploded view of a computing device according to an embodiment of this application is provided after the outer casing has been removed.

[0067] Figure 4 A cross-sectional view of a computing device according to an embodiment of this application is provided as an example.

[0068] Figure 5A A bottom view of a computing device according to one embodiment of this application is provided as an example.

[0069] Figure 5B A bottom view of a computing device according to another embodiment of this application is provided as an example.

[0070] Figure 6A A schematic diagram of the air intake filter assembly of a computing device provided as an example of an embodiment of this application is shown.

[0071] Figure 6B A side view of the air inlet filter assembly of a computing device according to an embodiment of this application is provided as an example.

[0072] Figure 6CAn exploded view of the air intake filter assembly of a computing device according to an embodiment of this application is provided.

[0073] Figure 7 A partial structural schematic diagram of a computing device according to an embodiment of this application is provided.

[0074] Figure 8 A longitudinal cross-sectional view of a computing device according to an embodiment of this application is provided as an example.

[0075] Figure 9 A cross-sectional view of the inner casing of a computing device according to an embodiment of this application is provided as an example.

[0076] Figure 10 A side view of the power module and fan of a computing device according to an embodiment of this application is provided, which are integrated and mounted in the inner shell.

[0077] Figure 11A An exemplary three-dimensional structural diagram of a computing device according to an embodiment of this application is provided from one perspective.

[0078] Figure 11B An exemplary three-dimensional structural diagram of a computing device according to an embodiment of this application is provided from another perspective.

[0079] Figure 12 An exemplary assembly diagram of the control module and housing assembly of a computing device according to an embodiment of this application is provided.

[0080] Figure 13 An exploded view of the control module of a computing device according to an embodiment of this application is provided.

[0081] Figure 14 A three-dimensional structural diagram of the computing board of a computing device according to an embodiment of this application is provided.

[0082] Figure 15 An exemplary front view of the computing board of a computing device according to an embodiment of this application is provided.

[0083] Figure 16 An enlarged schematic diagram of a portion of the computing board of a computing device according to an embodiment of this application is provided as an example.

[0084] Explanation of reference numerals in the attached figures:

[0085] 1-Computing equipment;

[0086] 100 - Housing assembly; 100a - First sub-cavity; 100b - Second sub-cavity;

[0087] 10-Inner shell; 10a-Receiving cavity; 10b-Mounting groove; 111-First side baffle; 112-Second side baffle; 12-Side wall; 121-Supporting rib; 122-Limiting flange; 123-First limiting post; 13-Power supply decorative cover; 14-Wire passage area; 15-Positioning component;

[0088] 20-Outer shell; 20a-First mounting opening; 20b-Air outlet; 20c-Air inlet; 20c1-First air inlet; 20c2-Second air inlet; 211-Stop; 212-Second limiting post; 22-Air outlet baffle; 23-Air inlet baffle; 24-Air inlet filter assembly; 241-First locking plate; 242-Filter element; 243-Second locking plate; 244-Magnetic element; 245-Ventilation area; 25-Installation space;

[0089] 30 - Mounting side panel; 30a - First snap-fit ​​hole; 30b - Second snap-fit ​​hole; 30c - Cable guide hole;

[0090] 40 - Cover side panel; 41 - Snap-fit ​​part; 42 - First snap hook;

[0091] 50 - Support; 51 - Second hook; 52 - Elastic support pad; 53 - Fastening screw;

[0092] 60 - Wireless communication unit;

[0093] 70 - Ambient temperature detection unit;

[0094] 200 - Fan; 210 - Snap-fit ​​protrusion;

[0095] 300 - Power module; 301 - Power input unit; 302 - Switching unit; 303 - Socket;

[0096] 400 - Calculation Module;

[0097] 410-Computing board; 410a-Board body; 410a1-First end; 410a2-Second end; 410b-Computing unit; 4101-First row computing unit; 4102-First row computing unit; 411-Plug-in terminal; 411a-Positive terminal; 411b-Negative terminal; 412-Connecting hole; 413-First connector; 414-Second connector; 415-First conductive element; 416-Second conductive element; 416a-Positive conductive sheet; 416b-Negative conductive sheet; 417-Conductive busbar; 418-Temperature sensor; 419a-Spare connection terminal; 419b-Detection connection terminal;

[0098] 420 - Heat dissipation structure; 421 - Heat dissipation fins; 422 - Fastening screws; 430 - Support beam;

[0099] 500-Control Module;

[0100] 510 - Control box; 511 - Housing; 511a - Mounting cavity; 5111 - Upper housing; 5112 - Lower housing; 5113 - Positioning post; 512 - Side cover plate; 512a - Cable guide hole; 512b - Snap-fit ​​hole; 512c - Mounting hole; 5121 - Snap-fit ​​protrusion; 5122 - Recess; 513 - Snap-fit ​​mating part;

[0101] 520 - Display Screen;

[0102] 530 - Control circuit board; 530a - Positioning hole;

[0103] L1 - First direction; L2 - Second direction. Detailed Implementation

[0104] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0105] As computing device performance continues to improve, the heat generated by high-power computing components such as processors and integrated circuits is increasing. To meet the heat dissipation requirements of computing devices, they are typically equipped with cooling modules to reduce operating temperatures and prevent hardware damage due to overheating. In related technologies, computing devices often only have a single exhaust vent for the cooling module, resulting in limited airflow paths within the device, poor air circulation, and low heat dissipation efficiency. Furthermore, the cooling modules in these technologies often have limited functionality and their design needs optimization.

[0106] To address the aforementioned deficiencies in related technologies, this application provides a computing device. By creating an air inlet and an air outlet communicating with the internal cavity on a housing assembly, the computing module and a fan are integrated into the housing assembly. The fan generates airflow from the air inlet to the air outlet, which flows through the heat dissipation structure of the computing module to remove the heat generated by the module, thus cooling it. Furthermore, the hot air exhausted from the air outlet of the housing assembly can be used for heating, thereby enabling the reuse of heat generated by the computing module and improving the energy efficiency of the computing device.

[0107] The embodiments of this application will now be described in detail with reference to the accompanying drawings. It should be noted that in the drawings of this specification, L1 represents a first direction, which can be a direction parallel to the length direction of the housing assembly. The length direction of the housing assembly can be understood as a straight line extending from one end of the longest side of the housing assembly to the other end. L2 represents a second direction, which can be perpendicular to the first direction or parallel to the width direction of the housing assembly. The width direction of the housing assembly can be a direction perpendicular to the length direction of the housing assembly and lying in the same plane. The reference descriptions of the first direction L1 and the second direction L2 provided in the embodiments of this application are for ease of understanding and should not be construed as limiting the embodiments of this application.

[0108] Figure 1 An exemplary three-dimensional structural diagram of a computing device according to an embodiment of this application is provided. Figure 2 An exemplary exploded structural diagram of a computing device according to an embodiment of this application is provided. Figure 3 An exemplary schematic diagram of a computing device according to an embodiment of this application after removing its outer casing is provided. Figures 1 to 3 As shown, the computing device 1 provided in this embodiment includes a housing assembly 100, a computing module 400, and a fan 200. The housing assembly 100 has an internal cavity, and an air outlet 20b communicating with the cavity. The computing module 400 is disposed within the cavity. The fan 200 is disposed within the cavity and is used to generate airflow through the computing module 400, with the airflow exiting from the air outlet 20b.

[0109] Figure 4 An exemplary cross-sectional view of a computing device according to an embodiment of this application is provided. Figure 4 As shown, the housing assembly 100 also has an air inlet 20c communicating with the cavity. By providing the air inlet 20c and the air outlet 20b, an air duct is formed within the cavity. During the operation of the fan 200, the airflow flows in the air duct, that is, it flows in the direction from the air inlet 20c to the air outlet 20b.

[0110] See Figures 1 to 4 The interior of the housing assembly 100 defines a cavity for the computing device 1, which is connected to the outside of the computing device 1 via an air inlet 20c and an air outlet 20b. Functional modules such as the computing module 400, power supply module 300, and fan 200 can be integrated and arranged inside the cavity of the housing assembly 100, and are fixed and protected by the housing assembly 100.

[0111] According to the computing device 1 provided in the embodiments of this application, an air inlet 20c and an air outlet 20b communicating with the internal cavity are provided on the housing assembly 100. The computing module 400 and the fan 200 are integrated into the housing assembly 100. The fan 200 can generate airflow from the air inlet 20c to the air outlet 20b. During the airflow, the airflow passes through the computing module 400 to remove the heat generated by the computing module 400, thereby cooling the computing module 400. In addition, the hot air discharged from the air outlet 20b of the housing assembly 100 can be used for heating, thereby realizing the reuse of the heat generated by the computing module 400 and improving the energy utilization rate of the computing device 1.

[0112] In one implementation, such as Figure 4 As shown, the air outlet 20b is located on the side of the housing assembly 100.

[0113] In this embodiment, the side of the housing assembly 100 refers to any side of the housing assembly 100 in the horizontal direction. For example, the air outlet 20b may be located on at least one of the front, rear, left, and right sides of the housing assembly 100.

[0114] In some examples, the number of air outlets 20b can be at least one, and all air outlets 20b can be provided only on one side of the housing assembly 100.

[0115] In other examples, there may be multiple air outlets 20b, and some air outlets 20b may be located on one side of the housing assembly, while others may be located on the opposite side of the housing assembly.

[0116] It should be noted that the above is only an exemplary description. The number and location of the air outlets 20b can be set by those skilled in the art according to the actual heating needs. For example, when the computing device 1 needs to discharge warm air in different directions to meet the heating needs of multiple directions, air outlets 20b can be opened on different sides of the housing assembly 100, and it is not limited to this.

[0117] It is understandable that, compared to placing the air outlet 20b on the top of the housing assembly 100, the computing device 1 of this application can effectively prevent external moisture or condensate generated at the air outlet 20b from entering the interior of the housing assembly 100 by placing the air outlet 20b on the side of the housing assembly 100, thereby reducing the probability of short circuits or damage to internal components and improving the safety and stability of the operation of the computing device 1.

[0118] It should also be noted that, in order to prevent high-temperature airflow from stagnating or forming eddies within the housing assembly 100, thus affecting the heat dissipation of the computing device 1, in some examples, see... Figure 4As shown, the location of the air outlet 20b can correspond to the location of the exhaust area of ​​the fan 200, and the opening size of the air outlet 20b can be set accordingly to the area of ​​the exhaust area of ​​the fan 200, so as to ensure that the airflow discharged by the fan 200 can be discharged from the inside of the housing assembly 100.

[0119] Regarding the relative position of the fan 200 and the computing module 400, the fan 200 can be positioned above the computing module 400. To ensure that the air outlet 20b corresponds to the air outlet direction of the fan 200, the air outlet 20b can be positioned near the top of the housing assembly 100. Positioning the air outlet 20b near the top of the housing assembly 100 can be understood as the distance between the air outlet 20b and the top of the housing assembly 100 being less than the distance between the air outlet 20b and the bottom of the housing assembly 100.

[0120] In some examples, the fan 200 and the computing module 400 are arranged vertically at intervals, with the fan 200 located directly above the computing module 400. The fan 200 is positioned adjacent to the top wall of the cavity of the housing assembly 100, and the computing module 400 is positioned adjacent to the bottom of the cavity of the housing assembly 100. An air outlet 20b is located on the side of the housing assembly and near the top, so that the air outlet 20b corresponds to the air outlet direction of the fan 200.

[0121] In other examples, the fan 200 and the computing module 400 are arranged vertically at intervals, with the fan 200 located diagonally above the computing module 400. An air outlet 20b is provided on the side of the housing assembly and near the top, so that the air outlet 20b corresponds to the air outlet direction of the fan 200.

[0122] In this specification, the vertical direction can be the same as the direction of gravity or height, i.e., the direction upward or downward perpendicular to the horizontal ground. It is understood that warmer air has a lower density than cooler air and generally rises. By adopting the above example, during the operation of the fan 200, an upward airflow path can be formed inside the housing assembly 100, which, in conjunction with the natural upward direction of the warmer air, makes it easier for the warm air flowing through the computing module 400 to be discharged, reducing heat recirculation inside the housing assembly 100 and improving the heat dissipation and heating efficiency of the computing device 1.

[0123] It should be noted that the above examples are merely illustrative descriptions and should not be construed as limiting this application. Regarding the relative positional relationship between the fan 200 and the computing module 400, in other examples of this application, they can also be arranged side by side in the horizontal direction. Those skilled in the art can flexibly set the arrangement according to the shape of the housing assembly 100 and the layout of the internal space.

[0124] In one embodiment, the fan 200 has an airflow inlet and an airflow outlet, with the airflow inlet located adjacent to the air inlet 20c and the airflow outlet 20b located adjacent to the air outlet. The airflow inlet direction and the airflow outlet direction form an angle.

[0125] For example, the fan 200 may be a cross-flow fan, with the air inlet direction perpendicular to the air outlet direction.

[0126] See in some examples Figure 4 A cross-flow fan 200 can be installed within the cavity of the housing assembly 100 and can be used to generate airflow from the air inlet 20c to the air outlet 20b. The air inlet direction and the air outlet direction can be perpendicular to each other. Specifically, the cross-flow fan can be equipped with a cylindrical impeller with internally arranged blades. A motor drives the impeller to rotate, causing airflow to enter from the air inlet and exit from the air outlet. During operation, the airflow generated by the cross-flow fan rises from the bottom of the housing assembly 100, flows through the computing module 400 and the power module 300 into the air inlet of the fan 200, and then is blown outwards from the air outlet to remove heat generated by the computing module 400 and the power module 300.

[0127] It is understandable that a cross-flow fan, also known as a tangential flow fan or cross-flow fan, is a type of fan with a special structure. Its working principle involves causing air inside the impeller to flow radially along the impeller. Through the action of the impeller, the airflow bends within the impeller and exits at both sides of the impeller. Cross-flow fans typically have a relatively long cylindrical impeller with a relatively small diameter. Because cross-flow fans offer advantages such as uniform airflow, low noise, and compact structure, using a cross-flow fan as the fan 200 can improve the uniformity of the warm air blown from the outlet 20b, reduce noise during the operation of the computing device 1, and also help reduce the overall size of the computing device 1, thus reducing its space occupation.

[0128] It should be noted that in other examples of this application, the fan 200 is not limited to a cross-flow fan, but may also be other types of fans such as axial flow fans, centrifugal fans, mixed flow fans, cross-flow fans or bladeless fans, to generate airflow from the air inlet 20c to the air outlet 20b.

[0129] In an embodiment where the fan 200 is positioned above the computing module 400, such as Figure 3 and Figure 4As shown, the cavity may include a first sub-cavity 100a and a second sub-cavity 100b that are connected to each other. The first sub-cavity 100a may be located on the upper side of the second sub-cavity 100b. The fan 200 may be disposed in the first sub-cavity 100a, and the computing module 400 may be disposed in the second sub-cavity 100b.

[0130] For example, see Figure 3 and Figure 4 The interior of the housing assembly 100 can adopt a frame structure, which defines a first sub-cavity 100a and a second sub-cavity 100b that are connected to each other. The first sub-cavity 100a can be located above the second sub-cavity 100b in the vertical direction, and the fan 200 can be arranged in the first sub-cavity 100a along a first direction L1. The second sub-cavity 100b can be located below the first sub-cavity 100a in the vertical direction, and the power module 300 and the computing module 400 can be electrically connected to each other and arranged adjacent to each other in the second sub-cavity 100b along the first direction L1.

[0131] In this embodiment, the location of the air outlet 20b can be set to correspond to the location of the exhaust area of ​​the fan 200, and its opening size can be set to correspond to the area of ​​the exhaust area of ​​the fan 200, so as to ensure that the airflow discharged by the fan 200 can be discharged from the inside of the housing assembly 100, and to avoid the high-temperature airflow from lingering or forming eddies in the housing assembly 100, thereby avoiding affecting the heat dissipation effect of the computing device 1.

[0132] In this embodiment of the application, in order to ensure that the airflow generated by the fan 200 can flow through the computing module 400 and the power module 300, it is necessary to determine the position of the air inlet 20c according to the arrangement of the computing module 400 and the power module 300 in the housing assembly 100 and the position of the air outlet 20b.

[0133] To utilize the principle of natural upward movement of warmer air, the fan 200 can be vertically positioned above the computing module 400 and the power module 300, and the air outlet 20b can be vertically positioned above the air inlet 20c. This allows the computing module 400 and the power module 300 to be vertically positioned above the air inlet 20c and below the air outlet 20b, ensuring that the airflow generated by the fan 200 flows through the computing module 400 and the power module 300 as it moves from the air inlet 20c to the air outlet 20b. During operation of the fan 200, the airflow direction at the air inlet 20c can be set towards the computing module 400 and the power module 300.

[0134] In some embodiments, see Figure 3 and Figure 4When the fan 200 is positioned above the computing module 400 and the power module 300, the air inlet 20c of the fan 200 can be located at the bottom of the housing assembly 100. During the operation of the fan 200, the airflow generated by the fan 200 can rise from the bottom of the housing assembly 100, flow through the second sub-cavity 100b where the computing module 400 and the power module 300 are installed, and then be blown to the outside of the housing assembly 100 through the first sub-cavity 100a where the fan 200 is installed, so as to remove the heat generated by the computing module 400 and the power module 300.

[0135] For example, the opening position of the air inlet 20c at the bottom of the housing assembly 100 can correspond to the installation position of the computing module 400, and its opening size can be designed to correspond to the size of the area to be cooled by the computing module 400, so as to ensure that the low temperature airflow can flow evenly through the area to be cooled by the computing module 400.

[0136] For example, the opening position of the air inlet 20c at the bottom of the housing assembly 100 can correspond to the installation position of the computing module 400 and the power module 300. Its opening size can be designed to correspond to the size of the heat dissipation area of ​​the computing module 400 and the heat dissipation area of ​​the power module 300, so as to ensure that the low temperature airflow can flow evenly through the heat dissipation area of ​​the computing module 400 and the heat dissipation area of ​​the power module 300.

[0137] In some embodiments, the air inlet 20c may be disposed on the side of the housing assembly 100, adjacent to the bottom of the housing assembly 100. The fact that the air inlet 20c is adjacent to the bottom of the housing assembly 100 can be understood as the distance between the air inlet 20c and the bottom of the housing assembly 100 being less than the distance between the air inlet 20c and the top of the housing assembly 100.

[0138] In some examples, there can be multiple air inlets 20c, each located at the bottom of the housing assembly 100. Multiple air inlets 20c can be located together at the bottom of the housing assembly 100 to increase air intake efficiency and ensure extended space on the sides of the housing assembly 100.

[0139] In some examples, there can be multiple air inlets 20c, which are respectively located on the side of the housing assembly 100 and near the bottom of the housing assembly 100 to ensure that the airflow can fully enter the housing assembly 100.

[0140] Furthermore, it should be noted that in the example where the air inlet 20c is located on the side of the housing assembly 100, the air inlet 20c and the air outlet 20b can be located on the same side or different sides of the housing assembly 100. For example, the air inlet 20c and the air outlet 20b can be located together on the front side of the housing assembly 100, with the air inlet 20c located below the air outlet 20b. For example, the air inlet 20c can be located on the rear side of the housing assembly 100, and the air outlet 20b can be located on the front side of the housing assembly 100, with the air inlet 20c located below the air outlet 20b in the vertical direction.

[0141] It should be noted that the above is merely an exemplary description and should not be construed as a limitation of this application. For example, in other examples of this application, there may be multiple air inlets 20c, some of which may be located at the bottom of the housing assembly 100, while others may be located on the side of the housing assembly. Those skilled in the art can flexibly configure the configuration according to the actual situation.

[0142] It should also be noted that, to ensure that an upward airflow can be generated inside the housing assembly 100 for heat dissipation and that the exhausted warm air meets the user's actual heating needs, the relative positions of the air inlet 20c and the air outlet 20b can be flexibly set to ensure the heat dissipation efficiency of the computing device 1 while meeting the user's actual heating requirements. For example, the air inlet direction of the housing assembly 100's air inlet 20c can be perpendicular to the air outlet direction of the air outlet 20b, that is, the preset angle between the air inlet direction of the housing assembly 100's air inlet 20c and the air outlet direction of the air outlet 20b can be 90 degrees. Of course, the examples of the relative positions of the air inlet 20c and the air outlet 20b are not limited to this.

[0143] In summary, by setting the relative positions of the air outlet 20b, air inlet 20c, and fan 200, the heat generated inside the equipment can be effectively discharged in accordance with the natural upward direction of hot air. Simultaneously, warm air can be discharged from the top of the housing assembly 100, meeting the user's heating needs.

[0144] Figure 5A An exemplary bottom view of a computing device according to one embodiment of this application is provided, such as... Figure 4 and Figure 5A As shown, in some examples, the air inlet 20c may be located at the bottom of the housing assembly 100. See also Figure 5AThe air inlet 20c may include a first air inlet 20c1 and a second air inlet 20c2. The first air inlet 20c1 and the second air inlet 20c2 are arranged side by side in the first direction L1. The opening position of the first air inlet 20c1 is directly opposite the position of the power module 300, and the opening position of the second air inlet 20c2 is directly opposite the position of the computing module 400. The number of the first air inlet 20c1 and the second air inlet 20c2 is at least one.

[0145] In one example, there is one first air inlet 20c1, and the opening area of ​​the first air inlet 20c1 is approximately the same as the cross-sectional area of ​​the power module 300. There can be multiple second air inlets 20c2, and the multiple second air inlets 20c2 can be arranged in at least one row along the first direction L1. Each row includes at least two second air inlets 20c2 arranged adjacent to each other along the first direction L1, and the sum of the opening areas of the multiple second air inlets 20c2 is similar to the cross-sectional area of ​​the calculation module 400.

[0146] In another example, there are multiple first air inlets 20c1, and the sum of the opening areas of the multiple first air inlets 20c1 is similar to the cross-sectional area of ​​the power module 300. There can be one second air inlet 20c2, and the opening area of ​​the second air inlet 20c2 is similar to the cross-sectional area of ​​the computing module 400.

[0147] It should be noted that the above is merely an exemplary description and should not be construed as a limitation of this application. In other examples of this application, the number of first air inlets 20c1 and second air inlets 20c2 can be multiple, and the arrangement of the multiple first air inlets 20c1 and multiple second air inlets 20c2 can be arbitrary, for introducing airflow to the power module 300 and the computing module 400 respectively.

[0148] Furthermore, this application embodiment does not specifically limit the shape of the air inlet 20c and the air outlet 20b; the opening shape of the air inlet 20c and the air outlet 20b can be circular, square, or other arbitrary geometric shapes. It should be noted that the above is merely illustrative and does not constitute a limitation on this application.

[0149] In some examples, such as Figure 2As shown, an air inlet baffle 23 and an air outlet baffle 22 can be installed at the air inlet 20c and air outlet 20b of the housing assembly 100, respectively. The air inlet baffle 23 and air outlet baffle 22 can be designed as a window structure with grilles or a louvered structure. The arrangement or tilt angle of the grilles and louvers can be fixed or flexibly adjusted to guide the airflow direction, thereby flexibly changing the air inlet and outlet directions of the housing assembly 100. This effectively optimizes the airflow path, improves heat dissipation efficiency, and meets the user's requirements for the warm air outlet angle, providing a better user experience.

[0150] In other examples, an air inlet guide structure or an air outlet guide structure may be provided inside the housing assembly 100 to guide airflow into or out at a predetermined angle. For example... Figure 9 As shown in this embodiment, the interior of the housing assembly 100 may be provided with a first side baffle 111 and a second side baffle 112 disposed opposite each other in the second direction L2. The first side baffle 111 and the second side baffle 112 can be streamlined or zigzag-shaped to coordinate with the exhaust direction of the fan 200, thereby guiding the high-temperature airflow that needs to be discharged from the housing assembly 100, thus improving the heat dissipation effect of the computing device 1, and simultaneously meeting the user's requirements for the air outlet angle in heating scenarios. Similarly, a guide vane can also be provided at the air inlet 20c of the housing assembly 100 to guide the airflow entering the housing assembly 100, allowing more low-temperature air to contact the heat source and optimizing the heat dissipation effect of the computing device 1.

[0151] In one implementation, such as Figure 5A As shown, the bottom wall of the internal cavity of the housing assembly 100 is also provided with an air inlet baffle 23. The air inlet baffle 23 has an air inlet grille, which defines a plurality of air inlet holes arranged in an array for filtering the air entering through the air inlet 20c.

[0152] In some examples, the air intake grille includes multiple ribs arranged horizontally and vertically. The ribs arranged horizontally are spaced apart vertically, and the ribs arranged vertically are spaced apart horizontally, so that the multiple ribs arranged horizontally and vertically together form the air intake grille. The multiple air intake holes defined by the air intake grille can be rectangular in shape.

[0153] In other examples, the air intake grille can be formed by creating multiple arrayed air intake holes on the air intake baffle 23. The shape of the air intake holes can be circular, elliptical, or other arbitrary geometric shapes.

[0154] It should be noted that the above is merely an exemplary description and should not be construed as a limitation of this application. In other examples of this application, the air inlet holes on the air inlet baffle 23 may also be in the form of a mixture of rectangular holes and circular (or elliptical) holes, for example in... Figure 5A In the example, at the first air inlet 20c1 corresponding to the power module 300, the air inlet hole on the air inlet baffle 23 can be circular, and at the second air inlet 20c2 corresponding to the computing module 400, the air inlet hole on the air inlet baffle 23 can be rectangular. Furthermore, those skilled in the art can flexibly set the arrangement, shape, and size of the air inlets on the air inlet baffle 23 according to actual conditions.

[0155] Figure 7 Exemplary partial structural diagrams of a computing device according to embodiments of this application are provided, such as... Figure 7 As shown, in one embodiment, the computing module 400 includes a computing board 410 and a heat dissipation structure 420, which is thermally connected to the computing board 410.

[0156] For example, the computing device 1 provided in this application embodiment can be applied to terminals such as high-performance data centers and server clusters to perform computing tasks. The computing board 410 can integrate multiple high-performance computing units, such as central processing units, graphics processing units, field-programmable gate arrays, and application-specific integrated circuits. The heat dissipation structure can be thermally connected to the computing board 410, and its material can be a metal with strong thermal conductivity, such as aluminum, copper, and silver. This application embodiment does not specifically limit this.

[0157] In this embodiment, the thermal connection between the heat dissipation structure 420 and the computing board 410 can be understood as the heat dissipation structure 420 being in contact with the computing board 410, or having a small gap between them, so that the heat dissipation structure 420 and the computing board 410 can exchange heat. During the operation of the computing board 410, the heat dissipation structure 420 absorbs the heat generated by the computing board 410 and conducts the heat to the cavity inside the housing assembly 100.

[0158] In some examples, the heat dissipation structure 420 can be made of aluminum to suit applications where weight control is critical.

[0159] In other examples, the heat dissipation structure 420 may be made of copper to achieve better heat dissipation performance.

[0160] It should be noted that the above-mentioned selection of materials for heat dissipation structure 420 is only an example and does not constitute a limitation on this application. Those skilled in the art can flexibly select the material of heat dissipation structure 420 according to actual conditions in order to achieve the heat dissipation function of computing board 410.

[0161] See in some examples Figure 7The plane containing the computing board 410 is set parallel to the vertical direction. It can be understood that, since the air inlet 20c is located below the air outlet 20b in the vertical direction, the airflow generated by the fan 200 during operation flows vertically from bottom to top from the air inlet 20c to the air outlet 20b. By setting the plane containing the computing board 410 parallel to the vertical direction, the wind resistance generated by the computing board 410 on the airflow can be reduced, ensuring the airflow velocity when passing over the computing board 410, thereby ensuring the cooling efficiency of the computing board 410.

[0162] In other examples, the plane containing the computing board 410 is parallel to the direction from the air inlet 20c to the air outlet 20b. This direction can be tilted relative to the vertical direction with a small angle, and the plane containing the computing board 410 is approximately in the same direction as the airflow from the air inlet 20c to the air outlet 20b.

[0163] The above example ensures efficient heat exchange between the airflow and the computing board 410, thereby improving the heat dissipation efficiency of the computing board 410.

[0164] In one implementation, continue to refer to Figure 7 As shown, the heat dissipation structure 420 includes at least one heat dissipation fin group, which is disposed on at least one side of the computing board 410. Each heat dissipation fin group includes a plurality of heat dissipation fins 421 arranged at intervals. A flow guiding gap can be defined between two adjacent heat dissipation fins 421 in each heat dissipation fin group, and the extension direction of the flow guiding gap can be parallel to the vertical direction.

[0165] For example, in each heat dissipation fin assembly, multiple heat dissipation fins 421 can be arranged side by side along the first direction L1, with any two adjacent heat dissipation fins spaced apart from each other. The heat dissipation fins 421 can be plate-shaped, and the plane containing the heat dissipation fins 421 is arranged parallel to the vertical direction. Thus, a flow guide gap can be defined between two adjacent heat dissipation fins 421. When the airflow flows through the heat dissipation fin assembly, it can pass quickly through the flow guide gap, which increases the contact area between the airflow and the heat dissipation fins 421 on the one hand, and ensures the airflow velocity on the other hand, thereby increasing the heat exchange efficiency between the airflow and the heat dissipation structure 420.

[0166] In some examples, the heat dissipation structure 420 may include a heat dissipation fin group disposed on the side of the computing board 410 where the computing unit is disposed, and the heat dissipation fin group may include a plurality of spaced heat dissipation fins 421.

[0167] In other examples, the heat dissipation structure 420 may include two heat dissipation fin groups, which may be respectively disposed on opposite sides of the computing board 410, and each heat dissipation fin group may include a plurality of heat dissipation fins 421 disposed at intervals.

[0168] In one example, the heat dissipation structure 420 may include two heat dissipation fin groups arranged parallel to each other along a first direction L1, thermally connected to the computing board 410. The two heat dissipation fin groups may be respectively disposed on opposite sides of the computing board 410 along a second direction L2, and each heat dissipation fin group may include multiple heat dissipation fins 421 spaced apart. The heat dissipation fins 421 may be made of metals with high thermal conductivity, such as aluminum, copper, and silver. The surface of the heat dissipation fins 421 may be treated, such as by coating with a thermally conductive coating or increasing surface roughness, to further improve heat dissipation efficiency. Furthermore, the thickness and spacing of the heat dissipation fins 421 can be designed by those skilled in the art according to specific heat dissipation requirements. This application embodiment does not impose specific limitations on the material, thickness, etc., of the heat dissipation fins 421, thereby ensuring heat dissipation performance.

[0169] In some examples, multiple heat dissipation fins 421 can be integrally formed with the computing board 410, or thermally connected to the computing board 410 by welding, so that the heat dissipation fins 421 and the computing board 410 become an integral structure without seams or interfaces, minimizing thermal resistance and improving heat conduction efficiency while forming a strong connection.

[0170] In other examples, multiple heat dissipation fins 421 can be plugged into the computing board 410 or bonded to one side of the computing board 410 along the first direction L1 by thermally conductive adhesive. This method can achieve flexible addition or removal of heat dissipation fins 421 and improve the scalability of the computing board 410.

[0171] In some other examples, such as Figure 7 As shown, the heat dissipation structure 420 may include two heat dissipation mounting plates installed on opposite sides of the computing board 410, with two heat dissipation fin assemblies respectively disposed on the two heat dissipation mounting plates. The two heat dissipation mounting plates are fixedly connected to the computing board 410 by fastening screws 422.

[0172] It should be noted that the above-described connection method between the heat sink fins 421 and the computing board 410 is only an example and does not constitute a limitation on this application. Those skilled in the art can flexibly set the connection method between the heat sink fins 421 and the computing board 410 according to the actual situation to achieve the thermal connection between the two.

[0173] For example, the ends of each heat dissipation fin 421 in each heat dissipation fin group that are away from the computing board 410 are spaced apart from the inner wall of the cavity.

[0174] Therefore, the ends of each heat dissipation fin 421 in each heat dissipation fin group that are away from the computing board 410 can be kept separate from the inner wall of the cavity to avoid the adverse effects of the heat dissipation fin 421 with high temperature contacting the inner wall of the housing assembly 100. At the same time, it can ensure that the airflow generated by the fan 200 can flow fully through the gap between the heat dissipation fin 421 and the inner wall of the housing assembly 100, thereby improving the heat dissipation efficiency.

[0175] For example, see Figure 7 The heat dissipation structure 420 may also include a plurality of support beams 430 disposed at the bottom of the computing board 410. The plurality of support beams 430 are spaced apart along the first direction L1, and each support beam 430 extends along the second direction L2. Each support beam 430 is supported on the bottom wall of the cavity.

[0176] Therefore, it can provide stable support for the installation of the computing module 400 in the cavity inside the housing assembly 100, and can also ensure that the heat dissipation structure 420 can be separated from the bottom wall of the cavity of the housing assembly 100, so as to avoid the adverse effects of the high-temperature heat dissipation fins 421 contacting the bottom wall of the housing assembly 100. At the same time, it can ensure that the airflow generated by the fan 200 can flow through the gap between the heat dissipation fins 421 and the inner wall of the housing assembly 100, thereby improving the heat dissipation efficiency.

[0177] Figure 8 An exemplary longitudinal cross-sectional view of a computing device according to an embodiment of this application is provided, such as... Figure 7 and Figure 8 As shown, in one embodiment, the computing device 1 provided in this application further includes a power module 300. The power module 300 is disposed inside the housing assembly 100. Exemplarily, as... Figure 4 As shown, the power module 300 can be disposed within the second sub-cavity 100b of the housing assembly 100.

[0178] In some examples, see further. Figure 7 and Figure 8 The power module 300 is arranged side by side with the computing module 400 in the first direction L1 of the housing assembly 100, and the airflow generated by the fan 200 can flow through the power module 300 and the computing module 400.

[0179] See Figure 3 The power module 300 can be electrically connected to the functional modules of the computing device 1, such as the computing module 400, the fan 200, and the control module 500. During the operation of the computing device 1, the power module 300 generates heat. To achieve better heat dissipation, the airflow generated by the fan 200 can flow through both the power module 300 and the computing module 400 simultaneously, ensuring that the heat dissipation airflow generated by the fan 200 can cover the heat source area of ​​the computing device 1, thereby achieving effective heat dissipation.

[0180] For example, such as Figure 5A and Figure 5B As shown, the power module 300 includes a power input unit 301 and a switch unit 302. The power input unit 301 may employ a three-phase input interface for electrical connection to a power plug. The switch unit 302 is used to enable or disable the computing device 1. The power input unit 301 and the switch unit 302 may be located at the bottom of the housing assembly 100.

[0181] Continue to refer to Figure 5A and Figure 5B As shown, the computing device 1 also includes a wireless communication unit 60 and an ambient temperature detection unit 70 electrically connected to the power module 300. A mounting area is provided at the bottom of the housing assembly 100 for mounting the wireless communication unit 60 and the ambient temperature detection unit 70. The wireless communication unit 60 can be a Bluetooth device or a wireless WIFI connection device, and the ambient temperature detection unit 70 can be a temperature sensor used to detect the ambient temperature of the environment in which the computing device 1 is located and feed the ambient temperature detection result back to the control module 500. The control module 500 can control the computing power of the computing module 400 and / or the rotation speed of the fan 200 based on the ambient temperature detection result.

[0182] For example, if the ambient temperature is below the temperature threshold, the control module 500 can control the fan 200 to increase its speed to improve the heat exchange efficiency between the airflow and the computing module 400, or the control module 500 can control the computing module 400 to increase its computing power to increase the heat output of the computing module 400, thereby increasing the outlet air temperature of the computing device 1 and thus improving the heating effect in low-temperature environments.

[0183] For example, see [link to previous article] Figure 5A and Figure 5B The power input unit 301, the switch unit 302, the wireless communication unit 60, the ambient temperature detection unit 70, and the air inlet 20c can be arranged at intervals on the bottom of the housing assembly 100.

[0184] like Figure 8 As shown, in one embodiment, the power module 300 may have a plug-in interface 303, and the computing board 410 may have a plug-in end 411. The plug-in end 411 may be plugged into the plug-in interface 303 to make the computing board 410 electrically connected to the power module 300.

[0185] For example, the power module 300 can be electrically connected to the computing board 410 of the computing module 400 through a standardized electrical connection interface to ensure the stability of power transmission.

[0186] Through the above implementation method, the computing board 410 and the power module 300 do not need to be connected by wires, which simplifies the connection method between the computing board 410 and the power module 300, improves the convenience of disassembly and assembly between the two, and facilitates subsequent inspection and maintenance.

[0187] Figure 9 An exemplary cross-sectional view of the inner casing of a computing device according to an embodiment of this application is provided. Figure 10 An exemplary side view of a computing device according to an embodiment of this application, showing the power module and fan integrated within the inner casing, is provided. Figure 2 , Figure 9 and Figure 10 As shown, in one embodiment, the housing assembly 100 may include an inner housing 10 and an outer housing 20. The computing module 400, the fan 200 and the power module 300 are integrated in the inner housing 10. The interior of the outer housing 20 may define a cavity. The outer housing 20 has a first mounting opening 20a on one side in the first direction L1. The inner housing 10 is slidably mounted in the cavity through the first mounting opening 20a.

[0188] For example, the inner casing 10 may adopt a frame structure to provide a mounting base for the components of the computing device 1 and to provide stable support for the overall structure of the computing device 1. The frame structure of the inner casing 10 may be provided with mounting brackets or mounting holes for fixing the various modules of the computing device 1.

[0189] In some examples, the computing module 400, power module 300, and fan 200 of computing device 1 can be integrated into the frame structure of the inner shell 10 by means of screw connection. With screw connection, the modules of computing device 1 are more securely fixed, ensuring that computing device 1 is not affected by vibration or impact during transportation.

[0190] In other examples, the computing module 400, power module 300, and fan 200 of computing device 1 can be integrated into the frame structure of the inner shell 10 via snap-fit ​​connections. With snap-fit ​​connections, the installation and removal of the modules of computing device 1 are more convenient, facilitating maintenance and module replacement.

[0191] It should be noted that the above is only an illustrative example. The embodiments of this application do not specifically limit the connection method between the functional modules of the computing device 1 and the inner shell 10. Those skilled in the art can flexibly choose other connection methods according to actual needs.

[0192] In the embodiments of this application, see Figure 2The outer casing 20 may have a first mounting opening 20a on one side in the first direction L1, and the first mounting opening 20a is connected to the internal cavity. The opening area of ​​the first mounting opening 20a is larger than the cross-sectional area of ​​the inner casing 10 after the power module 300, computing module 400 and fan 200 are integrated, so as to ensure that the inner casing 10, which integrates the power module 300, computing module 400 and fan 200, can slide into the interior of the outer casing 20 through the first mounting opening 20a.

[0193] For example, the cavity of the outer shell 20 can extend along the first direction L1, and the outer shape of the inner shell 10 also extends along the first direction L1. The size and shape of the inner shell 10 are adapted to the size and shape of the cavity of the outer shell 20 to ensure that the inner shell 10 after the computing device 1 is assembled can slide smoothly into and be completely stored inside the cavity to form an integral shell assembly 100.

[0194] For example, the cavity shape of the outer shell 20 can be designed as a cuboid, cube, or cylinder, etc. The outer shape of the inner shell 10 can be designed as a cuboid frame, cube frame, or cylinder, etc. The outer shape of the inner shell 10 is adapted to the cavity shape of the outer shell 20 so that the inner shell 10 can be accommodated in the cavity of the outer shell 20 and slide within the cavity along the first direction L1.

[0195] It should be noted that the examples of the cavity shape of the outer shell 20 and the external shape of the inner shell 10 described above are merely illustrative and should not be construed as limiting this application. The cavity shape of the outer shell 20 and the external shape of the inner shell 10 can be flexibly set according to actual conditions, and other installation methods for the inner shell 10 and outer shell 20 can be selected according to actual needs. The outer shell 20 provides external protection for the computing device 1, preventing damage to the functional modules of the computing device 1 from external environmental factors such as dust, moisture, and impact.

[0196] In this embodiment, the outer shell 20 and the inner shell 10 can be connected by a sliding structure to ensure that the inner shell 10 can slide smoothly within the outer shell 20.

[0197] In some examples, the inner shell 10 can slide into or out of the cavity of the outer shell 20 along a specific track or guide device. The outer wall of the inner shell 10 and the inner wall of the outer shell 20 can be provided with mutually cooperating sliding structures. The sliding structures may include devices such as slide rails and pulleys to guide the inner shell 10 to slide into or out of the cavity, ensuring a smooth and stable sliding process and realizing the installation and fixation of the inner shell 10 in the cavity of the outer shell 20.

[0198] In other examples, the outer wall of the inner shell 10 and the inner wall of the outer shell 20 may be provided with mutually cooperating limiting structures. The limiting structures may include limiting flanges, screw limiting posts, etc. By the cooperating contact between the outer wall of the inner shell 10 and the inner wall of the outer shell 20 through the limiting structures, the inner shell 10 can be firmly installed in the cavity of the outer shell 20, preventing the computing device 1 from falling off or shifting during operation or transportation.

[0199] It should be noted that the embodiments of this application do not specifically limit the sliding fit structure and limiting structure of the inner shell 10 and the outer shell 20. Those skilled in the art can flexibly set the specific form of the sliding structure according to actual needs.

[0200] In some embodiments, at least one limiting post is provided on the outer surface of the sidewall of the inner shell 10 and / or the inner surface of the sidewall of the outer shell 20. The limiting post on the sidewall of the inner shell 10 may form an abutting fit with the inner surface of the sidewall of the outer shell 20 or have a certain gap, and the limiting post on the sidewall of the outer shell 20 may form an abutting fit with the outer surface of the sidewall of the inner shell 10 or have a certain gap.

[0201] For example, such as Figure 3 and Figure 4 As shown, a first limiting post 123 extending along the first direction L1 and protruding toward the inner wall surface of the outer shell 20 may be provided on the side wall 12 of the inner shell 10. Figure 3 As shown, the outer shell 20 may have two opposing sidewalls on the second direction L2, each with a second limiting post 212 extending along the first direction L1 and protruding toward the outer wall surface of the inner shell. The inner shell 10 may have two first limiting posts 123, arranged in pairs along the second direction L2, and the outer shell 20 may have two second limiting posts 212, also arranged in pairs along the second direction L2. This application embodiment does not specifically limit the number or location of the first limiting posts 123 and the second limiting posts 212.

[0202] For example, the first limiting post 123 may protrude from the side wall 12 of the inner shell 10 and abut against the inner wall surface of the outer shell 20 in the second direction L2, or leave an appropriate gap between it and the inner wall surface of the outer shell 20 in the second direction L2. Similarly, the second limiting post 212 may protrude from the inner side wall of the outer shell 20 and abut against the side wall 12 of the inner shell 10, or leave an appropriate gap between it and the side wall 12 of the inner shell 10. After the inner shell 10 is installed in the cavity of the outer shell 20, the first limiting post 123 and the second limiting post 212 can simultaneously serve as limiting structures to limit the installation position of the inner shell 10 in the cavity of the outer shell 20, so that the inner shell 10 can be firmly installed in the cavity of the outer shell 20, preventing the computing device 1 from falling off or shifting during operation or transportation.

[0203] For example, the first limiting post 123 and the second limiting post 212 may have screw holes, which are provided through the first direction L1. The side plate installed at the first mounting opening 20a may have through holes corresponding to the screw hole positions. The through holes are used for screws to pass through so that the screws form a threaded connection with the screw holes, thereby fixing the side plate to the first mounting opening 20a to close the first mounting opening 20a.

[0204] In addition, see Figure 2 On the other side of the outer casing 20 opposite to the first mounting opening 20a, a second mounting opening (not shown in the figure) is also provided, which communicates with the cavity of the outer casing 20. Correspondingly, a side plate for closing the second mounting opening is also provided. The side plate may also be provided with a through hole corresponding to the position of the screw hole. The through hole is used for screws to pass through so that the screws form a threaded connection with the screw holes, thereby fixing the side plate to the second mounting opening.

[0205] For example, the frame of the inner shell 10 can be made of metal materials, such as aluminum alloy or steel. The metal frame of the inner shell 10 has good mechanical strength and thermal conductivity, which can provide stable support for the computing device 1 while working with the fan 200 of the computing device 1 to complete heat dissipation, thereby improving the heat dissipation efficiency of the computing device 1 during operation.

[0206] For example, the housing 20 can be made of a metallic material (such as aluminum alloy or steel) or a polymer material. When the housing 20 is made of a metallic material, it ensures that the housing 20 has good structural rigidity and a certain degree of thermal conductivity, thereby effectively protecting the internal components and aiding in heat dissipation. When the housing 20 is made of a polymer material, the computing device 1 can have a lighter weight and better durability, making it suitable for applications with high requirements for weight and durability.

[0207] It should be noted that the above examples of materials for the inner shell 10 and the outer shell 20 are merely illustrative and do not constitute a limitation on this application.

[0208] Through the above implementation method, the computing module 400, power supply module 300, fan 200, and other modules of computing device 1 are integrated and arranged in an inner and outer double-layer protective shell, improving the integration and scalability of computing device 1. The frame structure of the inner shell 10 and the cavity design of the outer shell 20 together provide good physical protection, ensuring the reliability of computing device 1 in various working environments. The sliding installation method allows for easy installation and disassembly of the inner shell 10, improving the ease of maintenance. The frame structure design of the inner shell 10 and the effective layout of the fan 200 enhance airflow and improve the heat dissipation efficiency of the computing module 400 and power supply module 300, achieving good heat dissipation within the limited space of computing device 1.

[0209] In one implementation, such as Figure 9 and Figure 10 As shown, the inner shell 10 may have a receiving cavity 10a inside, and the computing module 400 and the power module 300 may be arranged side by side in the receiving cavity 10a along the first direction L1; the top of the inner shell 10 is defined by a mounting groove 10b, and the fan 200 is disposed in the mounting groove 10b.

[0210] Exemplarily, the top of the inner shell 10 may define a mounting groove 10b, and the fan 200 may pass through the mounting groove 10b along the first direction L1. The interior of the inner shell 10 may define a receiving cavity 10a, and the power module 300 and the computing module 400 may be electrically connected to each other. The electrically connected power module 300 and computing module 400 may pass through the receiving cavity 10a of the inner shell 10 along the first direction L1. The power module 300 and computing module 400 may be electrically connected via gold fingers. This embodiment of the application does not specifically limit the connection method between the power module 300 and the computing module 400.

[0211] For example, the fan 200 can be installed on top of the computing module 400 and the power module 300, with its air inlet facing the top of the computing module 400 and the power module 300, and its air outlet perpendicular to the orientation of the air inlet. During the operation of the fan 200, the airflow generated by the fan 200 can rise from the bottom of the inner shell 10, flow through the computing module 400 and the power module 300 into the air inlet 20c of the fan 200, and then be blown out of the inner shell 10 through the air outlet 20b to remove the heat generated by the computing module 400 and the power module 300.

[0212] For example, such as Figure 2 As shown, the outer wall 12 of the inner shell 10 accommodating cavity 10a may also be provided with a power supply decorative cover 13. Exemplarily, the power supply decorative cover 13 may be disposed on the outer wall 12 of the inner shell 10 at a location corresponding to the mounting position of the power module 300 or computing module 400. The power supply decorative cover 13 may be a flexible structure used to cover and protect the cables passing beneath it. Specifically, the power supply decorative cover may be made of silicone, rubber, or other flexible polymer materials, capable of effectively absorbing external impacts and vibrations, effectively protecting the circuit board and other easily damaged components, and preventing them from being interfered with by the external environment.

[0213] It should be noted that, please continue to refer to Figure 2 The fan 200 may have a snap-fit ​​protrusion 210 at one end along the first direction L1, and the snap-fit ​​protrusion 210 may protrude from the frame of the inner shell 10 at one end along the first direction L1. The power module 300, the computing module 400 and the fan 200 may be fixed to the frame of the inner shell 10 by bolts to prevent the computing device 1 from falling off or shifting during operation or transportation.

[0214] Through the above-described embodiments, by defining a receiving cavity 10a inside the inner shell 10, the computing module 400 and the power module 300 can be effectively integrated into the compact space at the bottom of the fan 200, thereby allowing the heat dissipation airflow formed by the fan 200 to cover the heat source area of ​​the computing device 1. The mounting slot 10b at the top of the inner shell 10 provides a fixed position for the fan 200, enabling the fan 200 to operate stably and generate airflow that penetrates the internal space of the computing device 1, effectively removing heat.

[0215] The following reference Figure 4 , Figure 9 and Figure 10 The assembly process of the computing device 1 according to an embodiment of this application is described using a specific example. Figure 9 and Figure 10 As shown, after the power module 300 and computing module 400 are electrically connected, they can be installed inside the receiving cavity 10a of the inner shell 10; the fan 200 can be installed inside the mounting slot 10b of the inner shell 10, and then the fan 200 is electrically connected to the power module 300. This achieves integrated installation of the fan 200, power module 300, and computing module 400 on the inner shell 10. Then, as... Figure 4 As shown, the integrated setup includes a fan 200, a power supply module 300, and a computing module 400 (see [reference]). Figure 7 The computing module 400 and the power supply module 300 are arranged side by side in the L2 direction. Figure 4 The computing module 400 (not shown) and the inner shell 10 are inserted through the first mounting opening 10 of the outer shell 20 into the interior of the outer shell 20, thus completing the integrated installation of the various functional modules of the computing device 1 on the housing assembly 100.

[0216] In one implementation, such as Figure 9 and Figure 10 As shown, the top of the inner shell 10 may be provided with a first side baffle 111 and a second side baffle 112. The first side baffle 111 and the second side baffle 112 may be arranged opposite to each other in the second direction L2. An installation groove 10b may be defined between the first side baffle 111 and the second side baffle 112.

[0217] For example, the inner shell 10 can be a cuboid frame structure, and the second direction L2 can be perpendicular to the first direction L1 or parallel to the width direction of the inner shell 10. The width direction of the inner shell 10 can be perpendicular to its length direction and lie in the same plane. It should be noted that the application examples provided in this embodiment are for ease of understanding, and this embodiment does not specifically limit the specific direction of the second direction L2 or its positional relationship with the first direction L1.

[0218] The first side baffle 111 and the second side baffle 112 can be integrally formed with the frame of the inner shell 10 or fixed to the top of the inner shell 10 by fasteners. This application does not specifically limit the specific connection relationship between the first side baffle 111, the second side baffle 112 and the inner shell 10. A mounting groove 10b for mounting the fan 200 can be defined between the first side baffle 111 and the second side baffle 112 to ensure that the fan 200 can be stably installed in the groove.

[0219] In some examples, the first side baffle 111 and the second side baffle 112 may be made of metal and have elastic deformation capability, and the size of the mounting groove 10b formed between them may match the size of the fan 200 in the second direction L2. A damping pad may be provided between the fan 200 and the mounting groove 10b to reduce vibration and noise generated during operation of the fan 200.

[0220] In other examples, the first side baffle 111 and the second side baffle 112 can be designed in a streamlined or zigzag shape to match the air outlet direction of the fan 200, so as to guide the high-temperature airflow that needs to be discharged from the housing assembly 100, optimize the discharge path of the high-temperature airflow, and further optimize the heat dissipation effect of the computing device 1.

[0221] With this structural design, the fan 200 can be stably installed in the mounting slot 10b on the top of the inner shell 10, and can more effectively dissipate heat from the computing module 400 and the power module 300 during operation, ensuring that the device can maintain a stable temperature even when running under high load, thereby improving the overall performance and reliability of the computing device 1.

[0222] For example, such as Figure 3 As shown, the side wall of the inner shell 10 may have a wiring area 14 corresponding to the position of the power module 300. The wiring area 14 is provided through the side wall of the inner shell 10 to connect the mounting cavity 10a of the inner shell 10 and the external space. With this configuration, the wires of the power module 300 can extend through the wiring area 14, thereby facilitating the electrical connection of the power module 300 with other modules via wires.

[0223] For example, such as Figure 9 As shown, the bottom wall of the inner shell 10 may be provided with a positioning member 15, which forms a sliding fit with the bottom of the computing module 400. The positioning member 15 may adopt a groove-shaped structure, and the top of the groove-shaped structure has a sliding groove extending along the first direction L1. The bottom of the computing module 400 forms a sliding fit with the sliding groove, so as to position the computing module 400 during the process of sliding the computing module 400 into the receiving cavity 10a, thereby improving the assembly accuracy of the computing module 400 in the inner shell 10. In one embodiment, as... Figure 10 As shown, the first side baffle 111 and the second side baffle 112 can respectively abut against the outer wall surface of the fan 200.

[0224] For example, the first side baffle 111 and the second side baffle 112 may have elastic deformation capability to adapt to the assembly of fans 200 of different sizes. When the fan 200 is installed in the mounting groove 10b, one side of the outer wall surface of the fan 200 can be abutted against one of the side baffles, and then the fan 200 can be slid into the mounting groove 10b along the first direction L1, so that the other side of the fan 200 abuts against the other side baffle. To enhance the fixing effect, additional snap-fit ​​holes or screw holes can be provided on the first side baffle 111 and the second side baffle 112, and the fan 200 can be further secured by the snap-fit ​​or the bolt tightening.

[0225] In some examples, the first side baffle 111 and the second side baffle 112 can be made of metal. By closely abutting against the outer wall of the fan 200, the fan 200 can be fixed, preventing displacement and detachment that may occur during transportation. The side baffles can also conduct some of the heat from the fan 200, further improving the heat dissipation effect.

[0226] In other examples, the first side baffle 111 and the second side baffle 112 may be made of polymer materials, which enables the computing device 1 to have a lighter weight and good durability, making it suitable for application scenarios with high requirements for weight and durability.

[0227] It should be noted that the above examples of materials for the first side baffle 111 and the second side baffle 112 are merely illustrative and do not constitute a limitation on this application. For example, the first side baffle 111 and the second side baffle 112 can also be made of plastic material with good elastic deformation capability. Those skilled in the art can flexibly set them according to the actual situation.

[0228] In one implementation, such as Figure 9 and Figure 10 As shown, the inner shell 10 has two side walls 12 arranged opposite each other in the second direction L2. The inner wall surfaces of the two side walls 12 may be provided with supporting ribs 121, and the two supporting ribs 121 are respectively arranged adjacent to the top of the inner shell 10. The mounting groove 10b may be defined by the first side baffle 111, the second side baffle 112 and the two supporting ribs 121.

[0229] For example, the material of the supporting rib 121 can be a high-strength, high-temperature resistant material, such as aluminum alloy, stainless steel, or heat-resistant polymer material, which can have sufficient mechanical strength to support and fix the fan 200 and maintain stable performance in high-temperature environments. The cross-sectional shape of the supporting rib 121 can be designed as rectangular, circular, or other specific shapes to optimize its mechanical properties and structural stability. The supporting rib 121 can be fixed or connected to the side wall 12 of the inner shell 10 by welding, screw connection, or integral molding to ensure the strength and stability of the connection and prevent the fan 200 from loosening or falling off due to external forces.

[0230] In this embodiment, the inner wall surfaces of the two sidewalls 12 of the inner shell 10 in the second direction L2 can be respectively provided with supporting ribs 121. The receiving cavity 10a of the inner shell 10 can be defined by the two sidewalls 12 and the two supporting ribs 121 provided in opposite directions L2, and the computing module 400 and the power module 300 can be arranged in the receiving cavity 10a of the inner shell 10. Exemplarily, the two supporting ribs 121 can be respectively provided near the top of the inner shell 10, and a certain gap can be left between the supporting ribs 121 and the top of the computing module 400 to avoid the adverse effects caused by the top of the high-temperature computing module 400 contacting the housing assembly 100, while ensuring that the airflow generated by the fan 200 can fully flow through the computing module 400 and the power module 300, thereby improving the heat dissipation efficiency. In a specific example, the mounting groove 10b can be defined by the first side baffle 111, the second side baffle 112 and two supporting ribs 121. The outer wall surface of the fan 200 can abut against the first side baffle 111 and the second side baffle 112 respectively. At the same time, the bottom of the fan 200 can be supported by the two supporting ribs 121, so that the fan 200 can obtain a stable support point in the mounting groove 10b, and realize the assembly and fixation of the fan 200 in the mounting groove 10b.

[0231] For example, the support rib 121 can be formed by protruding inward from the inner wall of the side wall 12, and the length direction of the support rib 121 can be parallel to the first direction L1. For example, the fan 200 can be disposed in the mounting groove 10b along the first direction L1, and the side wall 12 of the mounting groove 10b can protrude inward to form the support rib 121, providing stable support for the bottom of the fan 200. At the same time, the length direction of the support rib 121 can be parallel to the first direction L1, ensuring that the support rib 121 provides continuous support for the fan 200, avoiding local stress concentration, and ensuring the stability of the fan 200 assembly.

[0232] In one implementation, such as Figure 9 and Figure 10 As shown, the two side walls 12 of the inner shell 10 can be respectively provided with limiting flanges 122, and the limiting flanges 122 can extend downward from the side walls 12 in the direction toward the inner wall surface of the outer shell 20.

[0233] like Figure 4 As shown, the outer shell 20 may be provided with two opposing inner wall surfaces in the second direction L2. The stop 211 extends upward from the inner wall surface of the outer shell 20 in the direction toward the outer wall surface of the inner shell 10, and the stop 211 may be located on the lower side of the limiting fold 122.

[0234] For example, the outer wall surfaces of the two side walls 12 of the inner shell 10 may be provided with limiting flanges 122 respectively. Specifically, the limiting flanges 122 may be provided at the top, middle or bottom of the side wall 12. This application does not limit the specific location of the limiting flanges 122 on the side wall 12 of the inner shell 10.

[0235] For example, see Figure 2 The limiting flange 122 may be provided on the side wall 12 and extend downwardly at an angle from the side wall 12 toward the inner wall surface of the outer casing 20. See also Figure 4 Stoppers 211 can be provided on the two inner wall surfaces of the outer shell 20 in the second direction L2 at the positions corresponding to the limiting flanges 122. The stoppers 211 can extend upward from the inner wall surface of the outer shell 20 in the direction toward the outer wall surface of the inner shell 10. The inclination angle of the stoppers 211 can match the inclination angle of the limiting flanges 122 to limit the installation position of the inner shell 10 in the outer shell 20.

[0236] For example, the shape and structure of the stop 211 can be configured according to the actual space within the cavity of the housing 20. See, for example, [link to relevant documentation]. Figure 4 The stop 211 can be bent once at its end near the inner wall of the outer shell 20, and the other end can continue to extend upward in the direction toward the outer wall of the inner shell 10. This bending structure can provide a clear locking point to ensure that when the inner shell 10 is slidably installed on the outer shell 20, the stop 211 can cooperate with the installation of the corresponding extension of the limiting fold 122.

[0237] For example, see [link to previous article] Figure 4 The limiting flange 122 of the inner shell 10 can abut against the stop member 211 of the outer shell 20 to improve the stability of the inner shell 10 installation. The limiting flange 122 of the inner shell 10 can also be kept separate from the stop member 211 of the outer shell 20 to avoid the adverse effects of the high-temperature inner shell 10 contacting the outer shell 20, while ensuring that the airflow generated by the fan 200 can flow fully through the gap between the inner shell 10 and the outer shell 20, thereby improving heat dissipation efficiency.

[0238] Understandably, during the sliding installation of the inner shell 10 into the outer shell 20, the limiting flange 122 of the inner shell 10 aligns with the stop 211 of the outer shell 20, providing a guiding function so that the inner shell 10 can smoothly slide into the outer shell 20. During the transport of the housing assembly 100, when the inner shell 10 moves vertically or horizontally due to bumps, the limiting flange 122 gradually approaches and eventually contacts the stop 211 because the inclined directions of the limiting flange 122 and the stop 211 are opposite. This allows the limiting flange 122 to accurately engage above the stop 211, preventing the inner shell 10 from shifting due to vibration or external forces during use. This design simplifies the installation process of the inner shell 10 and improves the overall structural stability and reliability of the device, thereby ensuring the normal operation and service life of the device.

[0239] In one implementation, such as Figure 4 As shown, the side wall of the outer casing 20 may have an air outlet 20b communicating with the cavity, and the bottom wall of the outer casing 20 may have an air inlet 20c communicating with the cavity. Exemplarily, the side wall 12 of the outer casing 20 along the second direction L2 may have an air outlet 20b communicating with the cavity, and one or more air outlets 20b communicating with the cavity may be opened on one or both sides of the outer casing 20 along the second direction L2. This embodiment does not impose specific limitations on this. When the fan 200 performs a heat dissipation task, airflow can enter the housing assembly 100 from the air inlet 20c on the bottom wall of the outer casing 20, and warm air generated by the computing module 400 can be blown out from the side wall of the outer casing 20.

[0240] For example, see [link to previous article] Figure 4 The bottom of the inner shell 10 may have a bottom opening area communicating with the receiving cavity 10a, and the side of the inner shell 10 may have a side opening area communicating with the receiving cavity 10a. The bottom opening area is correspondingly connected to the air inlet 20c, and the side opening area is correspondingly connected to the air outlet 20b.

[0241] In this embodiment, the cross-flow fan 200 can be arranged in the frame structure of the inner shell 10. Its specific location can be optimized based on the heat source distribution of the computing module 400 and the power module 300 to ensure optimal heat dissipation. The internal cavities of the housing assembly 100 can be interconnected. The inner shell 10 and the outer shell 20 can define a connected heat dissipation duct based on the heat source modules of the computing device 1. The airflow generated by the fan 200 can effectively pass through the duct, carrying away the heat generated by the computing module 400 and the power module 300 during operation. The bottom of the inner shell 10 can have a bottom opening area communicating with the receiving cavity 10a, and the sides of the inner shell 10 can have side opening areas communicating with the receiving cavity 10a. The bottom opening area can be correspondingly connected to the air inlet 20c of the outer shell 20, and the side opening area can be correspondingly connected to the air outlet 20b.

[0242] For example, see [link to previous article] Figure 4 The bottom and side opening areas of the inner shell 10 can be correspondingly set to the air inlet 20c and air outlet 20b of the fan 200. The size of the bottom and side opening areas of the inner shell 10 can be larger than the size of the air inlet 20c and air outlet 20b of the fan 200. The size of the air inlet 20c and air outlet 20b of the outer shell 20 can be correspondingly set to the size of the bottom and side opening areas of the inner shell 10. Specifically, the area of ​​the air inlet 20c and air outlet 20b of the outer shell 20 can be larger than the area of ​​the bottom and side opening areas of the inner shell 10.

[0243] It should be noted that the above examples do not constitute a limitation of this application. The outer shell 20 and the inner shell 10 are connected by open areas at the bottom and sides, allowing airflow. During the cooling process of the fan 200, the airflow can enter from the air inlet 20c of the outer shell 20, enter the receiving cavity 10a of the inner shell 10 through the bottom open area, carry away the heat generated by the operation of the computing module 400, and then be discharged through the side open areas of the inner shell 10 and finally from the air outlet 20b of the outer shell 20.

[0244] In this embodiment, multiple temperature sensors can be installed at key locations of the computing module 400 and power module 300 on the inner shell 10 and outer shell 20 to monitor the temperature of the computing module 400 and power module 300 in real time and provide feedback to the control module 500. The fan 200 can be connected to the control module of the computing device 1. The control module 500 can automatically adjust the speed of the fan 200 based on real-time temperature monitoring data to ensure that the computing device 1 maintains the optimal temperature under different workloads.

[0245] For example, Figure 5B An exemplary bottom view of a computing device according to another embodiment of this application is provided, such as Figure 5B As shown, an ambient temperature detection unit 70 can be installed at the bottom of the outer casing 20 to detect the ambient temperature of the environment in which the computing device 1 is located. The ambient temperature detection unit 70 is electrically connected to the control module 500 to transmit the ambient temperature detection result to the control module 500. The control module 500 can control the operating parameters of the fan 200 according to the ambient temperature detection result. For example, if the ambient temperature detection result is lower than the temperature threshold, the control module 500 can control the fan 200 to increase its speed to improve the heat exchange efficiency between the airflow and the computing module 400, or the control module 500 can control the computing module 400 to increase its computing power to increase the heat generation of the computing module 400, thereby increasing the outlet air temperature of the computing device 1 and thus improving the heating effect in low-temperature environments.

[0246] In one implementation, such as Figure 2As shown, an air outlet baffle 22 is detachably installed at the air outlet 20b of the housing 20, and an air outlet filter assembly (not shown in the figure) may be provided on the air outlet baffle 22; and / or, an air inlet baffle 23 is detachably installed at the air inlet 20c of the housing 20, and an air inlet filter assembly 24 may be provided on the air inlet baffle 23.

[0247] In the embodiments of this application, see Figure 2 To protect the internal components of the computing device 1 and ensure efficient airflow and air cleanliness, the outer shell 20 of the housing assembly 100 is detachably equipped with an air inlet baffle 23 or an air outlet baffle 22 at the air inlet 20c or air outlet 20b. An air inlet filter assembly 24 and an air outlet filter assembly (not shown in the figure) can be respectively installed on the air inlet baffle 23 and the air outlet baffle 22. Exemplarily, in terms of connection sequence, the air outlet baffle 22 and the air inlet baffle 23 can be installed first, and then the air inlet filter assembly 24 and the air outlet filter assembly can be fixed to the corresponding baffles.

[0248] For example, the inlet baffle 23 and the outlet baffle 22 can be designed as a window structure with grilles or a louvered structure. The arrangement or tilt angle of the grilles and louvers can be fixed or flexibly adjusted to guide the airflow and thus flexibly change the direction of the airflow. The materials of the inlet baffle 23, the outlet baffle 22, and the filter assembly can be selected from high-temperature resistant and corrosion-resistant metals or polymer materials to ensure stability and durability during long-term use.

[0249] For example, multiple temperature sensors can be installed at key locations such as the air inlet 20c and the air outlet 20b to detect the inlet air temperature at the air inlet 20c and the outlet air temperature at the air outlet 20b of the housing assembly 100 in real time, and feed this information back to the control module 500. In an application scenario where the computing device 1 is used as a heating device, the fan 200 and the computing module 400 can be connected to the control module 500 of the computing device 1. The control module 500 can automatically adjust the operating power of the computing module 400 and the speed of the fan 200 based on real-time temperature monitoring data to meet the corresponding heating requirements within the normal operating range of the computing device 1.

[0250] For example, an electric heating device can be installed at the air outlet 20b of the housing assembly 100 to supplement the heating with the exhaust warm air. A heat collection device such as a hot air guide pipe can be installed at the air outlet baffle 22 to concentrate the heat of the exhaust warm air for heating. An auxiliary fan can also be installed at the air outlet 20b to enhance the flow of hot air and ensure that the heat can be effectively transferred to the location that needs to be heated.

[0251] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art can install any form of airflow guiding structure or heating device at the air outlet 20b to optimize the airflow effect of the computing device 1 or increase the airflow temperature of the computing device 1.

[0252] In one implementation, such as Figure 5B As shown, an air inlet filter assembly 24 is provided at the air inlet 20c at the bottom of the housing assembly 100. The air inlet filter assembly 24 is detachably connected to the bottom of the housing assembly 100 and covers the air inlet 20c. The air inlet filter assembly 24 is used to filter the air entering the air inlet 20c.

[0253] Figure 6A An exemplary schematic diagram of the air inlet filter assembly of a computing device according to an embodiment of this application is provided. Figure 6B An exemplary side view of the air inlet filter assembly of a computing device according to an embodiment of this application is provided. Figure 6C An exploded structural diagram of the air inlet filter assembly of a computing device according to an embodiment of this application is provided. Exemplarily, as shown... Figures 6A to 6C As shown, the air inlet filter assembly 24 includes a first locking plate 241, a filter element 242, and a second locking plate 243 stacked in a direction away from the air inlet 20c. A compression space is formed between the first locking plate 241 and the second locking plate 243, and the filter element 242 is disposed in the compression space between the first locking plate 241 and the second locking plate 243.

[0254] In some examples, the air inlet filter assembly 24 can be detachably connected to the bottom of the housing assembly 100 via a snap-fit ​​structure. For example, the surface of the first snap-fit ​​plate 241 adjacent to the housing assembly 100 may be provided with multiple snap-fit ​​protrusions, and the surface of the bottom of the housing assembly 100 may be provided with multiple snap-fit ​​holes. The multiple snap-fit ​​protrusions are engaged in the multiple snap-fit ​​holes one by one to realize the installation of the air inlet filter assembly 24 on the bottom of the housing assembly 100.

[0255] In other examples, the air intake filter assembly 24 can be detachably connected to the bottom of the housing assembly 100 via magnetic attraction. For example, such as Figure 6C As shown, the air inlet filter assembly 24 may also include multiple magnetic elements 244, which are evenly distributed on the first locking plate 241 and / or the second locking plate 243. The housing assembly 100 may be made of metal, and the air inlet filter assembly 24 is magnetically attracted to the housing assembly 100 by the multiple magnetic elements 244, thereby achieving a detachable connection between the two.

[0256] It should be noted that the above is merely an exemplary description and should not be construed as a limitation on the embodiments of this application. In other examples of this application, the air inlet filter assembly 24 may also be detachably connected to the bottom of the housing assembly 100 by fasteners such as screws.

[0257] For example, the connection between the first locking plate 241 and the second locking plate 243 can be a detachable connection.

[0258] In some examples, the first snap-fit ​​plate 241 and the second snap-fit ​​plate 243 can be detachably connected by a snap-fit ​​structure.

[0259] In other examples, the first locking plate 241 and the second locking plate 243 can be detachably connected by fasteners such as screws.

[0260] With this configuration, after the computing device 1 has been used for a period of time, the first locking plate 241 and the second locking plate 243 can be disassembled, and the filter element 242 sandwiched between them can be taken out for cleaning or replacement to ensure the filtration capacity of the air intake filter assembly 24.

[0261] It should be noted that the above description is merely exemplary and should not be construed as a limitation on the embodiments of this application. Regarding the connection method of the first locking plate 241 and the second locking plate 243, those skilled in the art can also employ other forms of detachable connection. Furthermore, the first locking plate 241 and the second locking plate 243 can also be connected using a non-detachable connection method, such as by ultrasonic welding.

[0262] For example, the filter element 242 may be made of filter cotton with a certain thickness, and the filter cotton has multiple tiny cavity structures inside, which are used to contain the trapped dust and other fine impurities during the air passage.

[0263] For example, see Figure 6A The first snap-fit ​​plate 241 and the second snap-fit ​​plate 243 each have multiple ventilation areas 245 that are hollowed out. The ventilation areas 245 are arranged through the thickness of the first snap-fit ​​plate 241 and the second snap-fit ​​plate 243 to connect the upper and lower surfaces of the first snap-fit ​​plate 241 and the second snap-fit ​​plate 243. The multiple ventilation areas 245 on the first snap-fit ​​plate 241 correspond one-to-one with the multiple ventilation areas 245 on the second snap-fit ​​plate 243. With this arrangement, air can sequentially pass through the multiple ventilation areas on the second snap-fit ​​plate 243, the filter element 242, and the multiple ventilation areas on the first snap-fit ​​plate 241 before entering the air inlet 20c.

[0264] In some examples, the cross-sectional shape of the ventilation area 245 on the first locking plate 241 and the second locking plate 243 can be a regular hexagon or a part of a regular hexagon.

[0265] In other examples, the cross-sectional shape of the ventilation area 245 on the first locking plate 241 and the second locking plate 243 may be a regular pentagon or a part of a regular pentagon.

[0266] In other examples, the cross-sectional shape of the ventilation area 245 on the first locking plate 241 and the second locking plate 243 may be triangular or a part of a triangle.

[0267] In other examples, the cross-sectional shape of the ventilation area 245 on the first locking plate 241 and the second locking plate 243 can be circular or elliptical.

[0268] It should be noted that the above is only an exemplary description. Regarding the cross-sectional shape of the ventilation area 245 on the first snap plate 241 and the second snap plate 243, the art can flexibly set it according to the actual situation. For example, any geometric shape such as a heptagon or an octagon can also be used.

[0269] For example, the first side surface of the first locking plate 241 adjacent to the second locking plate 243 can be configured as an uneven, non-planar surface, and the second side surface of the second locking plate 243 adjacent to the first locking plate 241 can also be configured as an uneven, non-planar surface. The shape of the first side surface of the first locking plate 241 matches the shape of the second side surface of the second locking plate 243, so that the filter element 242 pressed between the first locking plate 241 and the second locking plate 243 is uneven and non-flat. The filter element 242 has a similar thickness in different regions.

[0270] In some examples, the first side surface of the first locking plate 241 adjacent to the second locking plate 243 and the second side surface of the second locking plate 243 adjacent to the first locking plate 241 can be set to be wavy, so that the overall shape of the filter element 242 is wavy.

[0271] In other examples, the first side surface of the first locking plate 241 adjacent to the second locking plate 243 and the second side surface of the second locking plate 243 adjacent to the first locking plate 241 can be set as serrated so that the overall shape of the filter element 242 is serrated.

[0272] This configuration increases the surface area of ​​the filter element 242, thereby increasing the filtration area of ​​the filter element 242 for air and improving the filtration effect of the air intake filter assembly 24.

[0273] In one implementation, such as Figure 3As shown, the housing assembly 100 may further include a mounting side plate 30, which is detachably mounted to the first mounting opening 20a to close the first mounting opening 20a. The mounting side plate 30 may be made of a high-strength, corrosion-resistant material, such as aluminum alloy or stainless steel, to ensure its stability and durability during long-term use. The mounting side plate 30 is used to close the housing 20 of the housing assembly 100 after the inner housing 10 is slidably mounted to the cavity of the outer housing 20.

[0274] For example, the mounting side plate 30 may be provided with through holes corresponding to the positions of the first limiting post 123 and the second limiting post 212. When assembling the mounting side plate 30, screws can be passed through the through holes and tightened into the screw holes on the first limiting post 123 and the second limiting post 212 to achieve a firm connection between the inner shell 10 or the outer shell 20 and the mounting side plate 30. This bolt fixing method can further enhance the connection strength between the inner shell 10, the outer shell 20 and the mounting side plate 30.

[0275] In one implementation, such as Figure 3 As shown, the end of the fan 200 adjacent to the first mounting opening 20a may be provided with a snap-fit ​​protrusion 210, and the mounting side plate 30 may be provided with a through first snap-fit ​​hole 30a, which can be snap-fitted into the fan 200 with the snap-fit ​​protrusion 210.

[0276] For example, the fan 200 may have a snap-fit ​​protrusion 210 at its end adjacent to the first mounting opening 20a. After the fan 200 is disposed in the mounting groove 10b of the inner shell 10 along the first direction L1, one end of the snap-fit ​​protrusion 210 may protrude from the frame of the inner shell 10 along the first direction L1. After the inner shell 10 is slidably mounted in the cavity of the outer shell 20, the snap-fit ​​protrusion 210 may also correspondingly protrude from the end of the outer shell 20 adjacent to the first mounting opening 20a.

[0277] For example, the housing assembly 100 can be sealed by a mounting side plate 30 with a through-hole. Specifically, the snap-fit ​​protrusion 210 of the fan 200 can be aligned with the first snap-fit ​​hole 30a on the mounting side plate 30, and a certain pressure can be applied to insert the snap-fit ​​protrusion 210 into the first snap-fit ​​hole 30a to form a stable snap-fit ​​fit, ensuring that the fan 200 is securely fixed on the mounting side plate 30, while facilitating disassembly and maintenance.

[0278] In one implementation, such as Figure 3 As shown, the mounting side plate 30 may have a through-hole 30c, which can be used for cables connecting the control module 500 and the power module 300 to pass through. The control module 500 is located outside the receiving cavity 10a of the inner shell 10.

[0279] In this embodiment, the computing device 1 may further include a control module 500. Exemplarily, the control module 500 of the computing device 1 is a module that implements functions such as power control, temperature monitoring and management, and data communication. Components such as the power module 300, computing module 400, and heat dissipation module can be electrically connected to the control module 500 via cables, and the control module 500 performs system monitoring and task management.

[0280] In some examples, the control module 500 is used to automatically adjust the operating power of the computing module 400 and the speed of the fan 200 based on real-time temperature monitoring data, ensuring that the computing device 1 maintains the optimal temperature under different workloads. The mounting side plate 30 may have a cable pass-through hole 30c for the cables connecting the control module 500 and the power module 300 to pass through. The periphery of the cable pass-through hole 30c may be made of a soft material and insulated to prevent cable wear and short circuits.

[0281] In some examples, the wireless communication unit 60 of the control module 500 may be arranged on the bottom wall of the housing 20. Specifically, the communication module of the control module 500 may be a Bluetooth device or a wireless WIFI connection device, etc. In addition, the bottom wall of the housing 20 may also integrate a power input unit 301, a switch unit 302, an ambient temperature detection unit 70, etc., but this application embodiment does not specifically limit this.

[0282] Figure 13 An exploded view of the control module of a computing device according to an embodiment of this application is provided, such as... Figure 3 and Figure 13 As shown, the control module 500 may also include a control box 510. The control box 510 may have a snap-fit ​​protrusion 5121 on the side adjacent to the mounting side plate 30, and the mounting side plate 30 may have a through second snap-fit ​​hole 30b, and the snap-fit ​​protrusion 5121 and the second snap-fit ​​hole 30b form a snap-fit ​​engagement.

[0283] For example, see Figure 3 and Figure 13The control box 510 may have a snap-fit ​​protrusion 5121 on the side adjacent to the mounting side plate 30, and a corresponding through second snap-fit ​​hole 30b may be provided on the top of the mounting side plate 30. In this embodiment, the number, shape and position of the snap-fit ​​protrusion 5121 and the second snap-fit ​​hole 30b are not specifically limited. After the mounting side plate 30 is installed in the first mounting opening 20a of the housing 20, the snap-fit ​​protrusion 5121 of the control box 510 can be aligned with the second snap-fit ​​hole 30b on the mounting side plate 30. By applying a certain pressure, the snap-fit ​​protrusion 5121 is embedded into the second snap-fit ​​hole 30b to form a stable snap-fit ​​fit, ensuring that the control box 510 is securely fixed on the mounting side plate 30 and located in the mounting space extending from the housing 20 along the first direction L1, thereby completing the installation of the control module 500 of the computing device 1, while facilitating disassembly and maintenance.

[0284] Through the above-described implementation, the snap-fit ​​design between the mounting side plate 30 and the fan 200 and control module 500 ensures both stable installation of the fan 200 and control module 500 and facilitates disassembly and maintenance of the fan 200 and control module 500. The independent installation space design for the control module 500 provides sufficient installation space and also maintains physical isolation between the control module 500 and the receiving cavity 10a of the inner shell 10, facilitating maintenance and heat dissipation. The design of the cable routing hole 30c ensures neat cable routing, further improving the overall performance of the computing device 1.

[0285] In one implementation, such as Figure 2 and Figure 3 As shown, the outer casing 20 has a second mounting opening (not shown) on the other side in the first direction L1. The casing assembly 100 also includes a cover side plate 40, which is detachably mounted to the second mounting opening to close the second mounting opening. Exemplarily, the cover side plate 40 can be used to close the outer casing 20 of the casing assembly 100 after the inner casing 10 is slidably mounted to the cavity of the outer casing 20.

[0286] For example, see Figure 2 The cover side plate 40 can be provided with through holes corresponding to the positions of the second limiting post 212. When assembling the cover side plate 40, bolts can be passed through the through holes and tightened into the screw holes on the second limiting post 212 to achieve a firm connection between the outer shell 20 and the cover side plate 40. This bolt fixing method can further enhance the connection strength between the outer shell 20 and the cover side plate 40.

[0287] In this way, the computing device 1 provided in this application embodiment integrates the computing module 400, power supply module 300, fan 200, etc., within an inner and outer double-layer protective shell, thereby improving the integration of the computing device 1. Through a sliding installation method, the inner shell 10 can be easily installed and disassembled, improving the ease of maintenance of the device, while achieving good heat dissipation within the limited space of the computing device 1.

[0288] Figure 11A An exemplary three-dimensional structural diagram of a computing device according to an embodiment of this application is provided from one perspective. Figure 11B An exemplary three-dimensional structural diagram of a computing device according to an embodiment of this application is provided from one perspective, such as... Figure 11A and Figure 11B As shown, in one embodiment, the cover side plate 40 and the control module 500 are located on opposite sides of the housing 20 in the first direction L1. The cover side plate 40 is provided with a snap-fit ​​portion 41, and the control module 500 is provided with a snap-fit ​​mating portion 513. In two computing devices 1 arranged adjacent to each other along the first direction L1, the snap-fit ​​portion 41 of one computing device 1 and the snap-fit ​​mating portion 513 of the other computing device 1 form a snap-fit ​​mating.

[0289] In this embodiment, multiple computing devices 1 can be integrated to form a computing device cluster. Exemplarily, the multiple computing devices 1 can be arranged adjacently along a first direction L1, each computing device 1 having a first end and a second end in the first direction. The control module 500 of the computing device 1 is located at the first end, and the cover side plate 40 of the computing device 1 is located at the second end. In two adjacent computing devices 1, the second end of the first computing device is adjacent to the first end of the second computing device, and the snap-fit ​​portion 41 on the cover side plate 40 of the first computing device forms a snap-fit ​​engagement with the snap-fit ​​mating portion 513 on the control module 500 of the second computing device.

[0290] In some examples, the snap-fit ​​portion 41 may be formed by protruding outward from the outer side wall of the cover side plate 40, and the snap-fit ​​mating portion 513 may be formed by recessing inward from the outer side wall of the control module 500. Thus, the snap-fit ​​portion 41 can be inserted into the snap-fit ​​mating portion 513 to form a snap-fit.

[0291] In other examples, the snap-fit ​​portion 41 may be formed by an inward recess from the outer side wall of the cover side plate 40, and the snap-fit ​​mating portion 513 may be formed by an outward protrusion from the outer side wall of the control module 500. Thus, the snap-fit ​​mating portion 513 can be inserted into the snap-fit ​​portion 41 to form a snap-fit.

[0292] It should be noted that the above is merely an illustrative example and should not be construed as a limitation of this application. In other examples of this application, the latching portion 41 and the latching mating portion 513 can also adopt other arbitrary structures, which can be flexibly set by those skilled in the art according to actual conditions. For example, one of the latching portion 41 and the latching mating portion 513 can be a protruding structure, and the other can be a matching card hole structure. As another example, the latching portion 41 and the latching mating portion 513 can also be magnetic components with mutual magnetic attraction, and the two can be attracted to each other by magnetic force so that two adjacent computing devices 1 can be fixed relative to each other.

[0293] Furthermore, the number of snap-fit ​​parts 41 and snap-fit ​​mating parts 513 can be one or more sets correspondingly arranged, which can be flexibly configured according to the actual situation by those skilled in the art. For example, the number of snap-fit ​​parts 41 and snap-fit ​​mating parts 513 can each be one, with the snap-fit ​​part 41 disposed in the central area of ​​the cover side plate 40 and the snap-fit ​​mating part 513 disposed in the central area of ​​the control module 500. As another example, the number of snap-fit ​​parts 41 can be multiple, with multiple snap-fit ​​parts 41 arranged circumferentially adjacent to the outer periphery of the cover side plate 40, and the number of snap-fit ​​mating parts 513 can be multiple, with multiple snap-fit ​​mating parts 513 arranged circumferentially adjacent to the outer periphery of the control module 500.

[0294] Figure 12 An exemplary assembly diagram of the control module and housing assembly of a computing device according to an embodiment of this application is provided, such as... Figure 12 As shown, exemplarily, the cover side plate 40 is further provided with a plurality of first hooks 42, which are disposed on the inner sidewall of the cover side plate 40 and arranged circumferentially adjacent to the outer periphery of the cover side plate 40. The first hooks 42 are used to engage with the inner sidewall of the housing assembly 100 adjacent to the second mounting opening to ensure the connection and fastening of the cover side plate 40 at the second mounting opening.

[0295] In one implementation, such as Figure 1 and Figure 12 As shown, the housing assembly 100 also includes a plurality of supports 50 disposed at the bottom of the housing 20.

[0296] For example, the support 50 is detachably connected to the bottom of the housing 20.

[0297] In some examples, such as Figure 12 As shown, the top of the support 50 is provided with multiple second hooks 51, and the bottom of the housing 20 is provided with multiple slots (not shown in the figure). The multiple second hooks 51 and the multiple slots are engaged in a one-to-one manner to realize the detachable connection of the support 50 to the bottom of the housing 20.

[0298] In other examples, such as Figure 5BAs shown, the support 50 has a through hole for the fastening screw 53 to pass through, so that the fastening screw 53 and the screw hole (not shown in the figure) at the bottom of the housing 20 form a threaded connection, so as to realize the detachable connection of the support 50 at the bottom of the housing 20.

[0299] It should be noted that the above description is merely illustrative and should not be construed as limiting this application. Regarding the connection method between the support 50 and the bottom of the housing 20, those skilled in the art can flexibly configure it according to actual circumstances; for example, a detachable connection method combining a hook structure and fasteners can also be used.

[0300] For example, such as Figure 5B As shown, the bottom of the support 50 can also be provided with an elastic support pad 52, and the number of elastic support pads 52 can be multiple. With this configuration, the support 50 can contact the ground or other supporting surfaces through the elastic support pads 52, thereby providing a certain shock absorption effect for the computing device 1. As for the material of the elastic support pad 52, it can be any material with elastic properties such as rubber, and this embodiment does not make specific limitations on this.

[0301] In one implementation, such as Figure 12 As shown, the outer casing 20 may have an extension portion extending along a first direction L1, the extension portion defining an installation space 25, the installation space 25 being adjacent to the inner casing 10 in the first direction L1, and the installation space 25 being used to install the control module 500.

[0302] For example, see Figure 2 and Figure 12 The two side walls 12 of the outer casing 20 along the second direction L2 and the bottom wall of the outer casing 20 can extend outward along the first direction L1, and the extended portions can define an installation space 25 for installing the control module 500 of the computing device 1. The top of the installation space 25 can be opened. With this configuration, the control module 500 can be installed into the installation space 25 from above. When it is necessary to inspect or replace the control module 500, the module can be removed from the top for processing without disassembling other parts, simplifying the installation and maintenance process.

[0303] In one implementation, such as Figure 3 and Figure 13 As shown, the computing device 1 also includes a control module 500. The control module 500 may include a control box 510 and a control circuit board 530. The control box 510 may define a mounting cavity 511a inside, and the control box 510 is detachably mounted to the housing assembly 100 of the computing device 1. The control circuit board 530 may be disposed within the mounting cavity 511a, and the control circuit board 530 is used for electrical connection with the computing module 400 and the power module 300 within the housing assembly 100.

[0304] In this embodiment, the computing device 1 may include multiple functional modules such as a control module 500, a computing module 400, a power supply module 300, and a fan 200, as well as a housing assembly 100 integrating the aforementioned functional modules. The housing assembly 100 provides an installation base and external protection for the functional modules of the computing device 1.

[0305] For example, the computing module 400, power supply module 300, and fan 200 can be integrated inside the housing assembly 100. The housing assembly 100 defines a cavity and an air inlet and outlet communicating with the cavity. The fan 200 is disposed within the cavity to generate airflow from the air inlet to the air outlet. The airflow passes through the computing module 400 and power supply module 300, thereby carrying away the heat generated by the computing module 400 and power supply module 300 during operation, thus cooling the computing module 400 and power supply module 300. Simultaneously, the heated airflow forms warm air and flows out from the air outlet, which can be used to heat the external environment of the computing device 1, thereby effectively utilizing the heat generated by the computing module 400 and power supply module 300.

[0306] In this embodiment, the control circuit board 530 is electrically connected to the computing module 400, the power supply module 300, and the fan 200, respectively. The power supply module 300 supplies power to the control circuit board 530, the computing module 400, and the fan 200. The control circuit board 530 controls the operating parameters of the computing module 400 and the fan 200, such as controlling the computing frequency of the computing board 410 of the computing module 400 and the rotational speed of the fan 200.

[0307] For example, the control circuit board 530 can control the rotation speed of the fan 200 according to the computing frequency of the computing board 410. For instance, when the computing frequency of the computing board 410 increases, the rotation speed of the fan 200 is increased accordingly to increase the airflow velocity, thereby improving the heat dissipation efficiency of the computing board 410 when the increased computing frequency leads to increased heat generation; conversely, when the computing frequency of the computing board 410 decreases, the rotation speed of the fan 200 is decreased accordingly to decrease the airflow velocity, thereby reducing the heat dissipation efficiency of the computing board 410 when the decreased computing frequency leads to decreased heat generation, thus saving energy consumption of the computing device.

[0308] It should be noted that the above description of the control method of the control circuit board 530 is merely an exemplary description and should not be construed as a limitation of this application. Those skilled in the art can flexibly set the control method of the control circuit board 530 according to the actual situation.

[0309] In other examples of this application, the control circuit board 530 can also control the operating parameters of the computing module 400 and the fan 200 according to the external ambient temperature of the computing device 400. For example, when the external ambient temperature is lower than a preset temperature, the control circuit board 530 can increase the heat generation of the computing board 410 and the airflow velocity generated by the fan 200 by increasing the computing frequency of the computing board 410 and the rotation speed of the fan 200, thereby increasing the air volume and air temperature of the computing device 1, and thus improving the heating effect of the computing device 1.

[0310] In this embodiment, the control box 510 is detachably installed on the housing assembly 100 and located outside the cavity of the housing assembly 100. With this configuration, the control circuit board 530 does not occupy the internal space of the housing assembly 100, thereby isolating the control circuit board 530 from the computing module 400, the power module 300, and the fan 200.

[0311] In some examples, the control box 510 is detachably connected to the housing assembly 100 via screws or other types of fasteners.

[0312] In other examples, the control box 510 and the housing assembly 100 can be detachably connected via a snap-fit ​​structure.

[0313] It should be noted that the above description of the detachable connection between the control box 510 and the housing assembly 100 is merely exemplary and should not be construed as a limitation of this application. Those skilled in the art can flexibly configure it according to actual circumstances. For example, in other examples of this application, the control box 510 and the housing assembly 100 can be detachably connected via magnetic components.

[0314] According to the embodiments of this application, the control module 500 includes a control box 510 for mounting the control circuit board 530. The control box 510 is detachably mounted on the housing assembly 100. On the one hand, this decouples the control circuit board 510 from other modules of the computing device 1, realizing a modular design of the control module 500. This facilitates subsequent maintenance and upgrades by users according to their needs, improving the scalability of the computing device 1. On the other hand, it achieves physical isolation between the control module 500 and other modules of the computing device 1, preventing the heat generated by the computing module 400 from adversely affecting the control circuit board 530. This helps improve the stability of the computing device 1's operation, reduces the space occupied by the housing assembly 100, thereby reducing the overall size of the housing assembly 100 and improving the integration of the computing device 1.

[0315] In some examples, the housing 511 of the control box 510 can be made of a metal material, such as aluminum alloy or steel. Using a metal material ensures that the control box 510 has high strength and effectively protects the internal components.

[0316] In other examples, the housing 511 of the control box 510 can be made of a polymer material, such as plastic or resin. Using a polymer material allows the control box 510 to have a lighter weight and lower cost, making it suitable for applications with high requirements for weight and cost control.

[0317] It should be noted that the material selection for the housing 511 of the control box 510 described above is only an example and does not constitute a limitation on this application. Those skilled in the art can make flexible settings according to the actual situation.

[0318] In this embodiment, the control circuit board 530 can be a printed circuit board (PCB). The control circuit board 530 can be electrically connected to the computing module 400 and power module 300 within the housing assembly 100 via a flexible printed circuit board (FPC) or other flexible cables. By using thin, flexible, and high-transmission-rate FPCs or other flexible cables, it can adapt to the complex layout of the modules inside the housing assembly 100, avoiding electrical connection failures caused by cable bending or stretching, and simplifying the wiring structure. The control circuit board 530 can be connected to the computing module 400 and power module 300 within the housing assembly 100 via standardized electrical connection interfaces.

[0319] For example, a vertical connector with a self-locking function can be further provided on the control circuit board 530. The cables extending from functional modules such as the computing module 400 and the power module 300 can communicate with the control circuit board 530 through gold fingers that are compatible with the vertical connector, so as to ensure stable and efficient signal transmission.

[0320] It should be noted that the above example of the electrical connection between the control circuit board 530 and the computing module 400 and the power module 300 is only for illustrative purposes and does not constitute a limitation on this application. Those skilled in the art can make flexible settings according to the actual situation.

[0321] In some examples, by setting reasonable control logic for the control circuit board 530, the operating parameters of each module of the computing module 400 can be dynamically adjusted according to the real-time load of the computing device 1, so that the fan 200 can be used as a cooling device for the computing device 1. The control module 500 can be electrically connected to the computing module 400, power module 300, and fan 200 within the housing assembly 100, and can be used to coordinate the various modules of the computing device 1 to achieve dynamic adjustment of the heat dissipation system. Specifically, multiple load detection modules, such as temperature sensors and current sensors, can be installed at key locations in the computing module 400 and power module 300 to monitor the load of the computing module 400 and power module 300 in real time and feed the data back to the control circuit board 530. When the detected load conditions, such as temperature or current, reach a set threshold, the control module 500 can adjust the speed of the fan 200 or activate additional cooling devices to improve heat dissipation efficiency. Conversely, when the load decreases, the control module 500 can send a signal to reduce the fan speed or temporarily shut down the air-cooling system, thereby saving energy and reducing noise. It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application.

[0322] In other examples, by setting appropriate control logic for the control circuit board 530, the computing module 400 and the fan 200 are used as heating devices, effectively utilizing the heat generated by the computing module 400 for heating while simultaneously dissipating heat from the computing device 1. It should be noted that the control module 500 can be electrically connected to the computing module 400, power module 300, and fan 200 within the housing assembly 100, and can be used to execute an intelligent heating system that coordinates the various modules of the computing device 1 to achieve the heating function. Figure 1 As shown, the airflow generated by the fan 200 can flow through the computing module 400 to form warm air, which can be discharged through the air outlet 20b of the outer shell 20 of the housing assembly 100 for heating. Specifically, the air inlet 20c of the housing assembly 100 can be opened on the bottom wall of the outer shell 20, and the air outlet 20b can be opened on the side wall of the outer shell 20. Multiple temperature sensors can be installed at key locations of the air inlet 20c and the air outlet 20b of the housing assembly 100 to detect the air inlet temperature at the air inlet 20c and the air outlet temperature at the air outlet 20b of the housing assembly 100 in real time, and feed the data back to the control module 500. In the application scenario where the computing device 1 is used as a heating device, the fan 200, the computing module 400, and the power module 300 can be connected to the control module 500 of the control module 500. The control module 500 can automatically adjust the operating power of the computing module 400 and the speed of the fan 200, or control the power supply, according to the specified temperature requirements input by the user and real-time temperature monitoring data, so as to meet the corresponding heating needs within the normal operating range of the computing device 1.

[0323] For example, if the outlet air temperature does not reach the user-specified temperature, the control module 500 can appropriately increase the computing load within the normal operating range of the computing device 1, or reduce the fan speed 200, or temporarily shut down the air-cooling system, thereby meeting the user's heating needs. If the outlet air temperature is higher than the user-specified temperature, the control module 500 can appropriately reduce the computing load within the normal operating range of the computing device 1, or increase the fan speed 200, thereby meeting the user's temperature requirements. In other examples, when the user has no heating needs, the ambient temperature is low, and the computing load is small, the control module 500 can send a signal to reduce the fan speed or temporarily shut down the air-cooling system, thereby reducing energy consumption and improving energy efficiency.

[0324] In some specific examples, an electric heating device may be installed at the air outlet 20b of the housing assembly 100 to supplement the heating with the exhaust warm air.

[0325] In other specific examples, a heat collection device such as a hot air guide duct can be installed at the air outlet 20b to concentrate the heat of the discharged warm air for heating. An auxiliary fan can also be installed at the air outlet 20b to enhance the flow of hot air and ensure that the heat can be effectively transferred to the location that needs to be heated.

[0326] It should be noted that the heating methods and structures described above are merely illustrative examples and do not constitute a limitation on this application.

[0327] In this way, the control module 500 for computing device 1 in this embodiment of the application can be electrically connected to other functional modules of computing device 1, and can dynamically adjust the heat dissipation system according to the real-time load of other functional modules and the user's heating needs, so as to achieve heating while ensuring the stable operation of computing device 1.

[0328] In one implementation, such as Figure 13 As shown, the control box 510 may include a housing 511 and a side cover 512. The housing 511 may define a mounting cavity 511a and a lateral opening communicating with the mounting cavity 511a. The side cover 512 is detachably mounted to the lateral opening.

[0329] Exemplarily, the control box 510 is detachably mounted on the exterior of the inner shell 10 of the housing assembly 100 along the first direction L1. The inner shell 10 of the housing assembly 100 may be a cuboid frame structure, and the first direction L1 may be a direction parallel to the length direction of the inner shell 10, wherein the length direction of the inner shell 10 can be understood as a straight line extending from one end of the longest side of the inner shell 10 to the other end. The control box 510 may include a housing 511 and a side cover plate 512. The interior of the housing 511 may define a mounting cavity 511a, and the control circuit board 530 may be mounted in the mounting cavity 511a of the housing 511. The housing 511 may have a lateral opening on one side along the first direction L1, and the side cover plate 512 is detachably mounted to the lateral opening to close the control box 510. It should be noted that the above description of the structure and direction of the inner shell 10 is merely exemplary and does not constitute a limitation of this application.

[0330] For example, the housing 511 may be provided with a plurality of positioning posts 5113 extending in the direction toward the side cover plate 512, and the plurality of positioning posts 5113 may be symmetrically arranged on both sides along the second direction L2. The control circuit board 530 may be provided with a plurality of positioning holes 530a corresponding one-to-one with the plurality of positioning posts 5113, and the positioning holes 530a may be used for the positioning posts 5113 to pass through. The cross-sectional shape of the positioning holes 530a may be circular or elliptical.

[0331] For example, the number of positioning posts 5113 can be four, and they can be respectively arranged adjacent to the four apex corners of the control circuit board 530. The control circuit board 530 can have four positioning holes 530a, each corresponding to one of the four positioning posts 5113, for the corresponding positioning posts 5113 to pass through, thereby achieving the installation and fixation of the control circuit board 530 relative to the housing 511. The side cover plate 512 can have multiple mounting holes 512c, each corresponding to one of the positioning posts 5113. During the installation of the side cover plate 512 onto the housing 511, the positioning posts 5113 can be inserted into the mounting holes 512c to achieve the overall installation and sealing of the control box.

[0332] Through the above implementation method, a detachable connection between the housing 511 and the side cover plate 512 is achieved, and the ease of disassembly and assembly between the two is improved.

[0333] In one implementation, such as Figure 13 As shown, a through-hole 512a may be provided on the side cover plate 512. The through-hole 512a can be used for the cable of the power module 300 to pass through and be electrically connected to the control circuit board 530. The size and shape of the through-hole 512a can be optimized according to the actual application requirements, and this embodiment does not impose specific limitations.

[0334] In some examples, the inner periphery of the wire hole 512a can be rounded, such as circular or elliptical. This design avoids sharp edges on the inner periphery of the wire hole 512, thus reducing wear on the cable and providing some protection for it.

[0335] In other examples, the inner periphery of the wire hole 512a may be provided with a soft material and insulated to prevent cable abrasion or short circuit.

[0336] In some other examples, a dustproof gasket may also be attached to the inner periphery of the wire hole 512a to prevent dust from entering the interior of the housing 511 and to protect the safety and reliability of the internal electronic components.

[0337] It should be noted that the above is merely an exemplary description and should not be construed as a limitation on the embodiments of this application. To avoid damage to the cable caused by the cable guide hole 512a, those skilled in the art can flexibly configure the inner periphery of the cable guide hole 512a according to the actual situation.

[0338] In one implementation, such as Figure 2 and Figure 13 As shown, the computing device 1 may also include a fan 200 disposed on the housing assembly 100, and the end of the fan 200 may have a snap-fit ​​protrusion 210. A snap-fit ​​hole 512b may also be provided on the side cover plate 512, the shape of which may be adapted to the shape of the snap-fit ​​protrusion 210 for forming a snap-fit ​​engagement with the snap-fit ​​protrusion 210.

[0339] For example, after the fan 200 is mounted on the housing assembly 100 along the first direction L1, the snap-fit ​​protrusion 210 of the fan 200 may protrude from one side of the housing assembly 100 along the first direction L1. The snap-fit ​​hole 512b on the side cover plate 512 can be aligned with the snap-fit ​​protrusion 210 at the end of the fan 200, and a certain pressure can be applied to insert the snap-fit ​​protrusion 210 into the snap-fit ​​hole 512b to form a stable snap-fit ​​fit, ensuring that the control module 500 is securely mounted on the housing assembly 100, while facilitating subsequent disassembly and maintenance of the control module 500.

[0340] In some examples, the snap-fit ​​protrusion 210 can be circular or elliptical in shape, and the snap-fit ​​hole 512b can be circular or elliptical in shape to match the snap-fit ​​protrusion 210.

[0341] In other examples, the shape of the snap-fit ​​protrusion 210 can be polygonal, such as a triangle or a quadrilateral, and the shape of the snap-fit ​​hole 512b can be a circle or an ellipse that matches the snap-fit ​​protrusion 210.

[0342] It should be noted that the shapes of the snap-fit ​​hole 512b and the snap-fit ​​protrusion 210 described above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art can flexibly set the shapes of the snap-fit ​​hole 512b and the snap-fit ​​protrusion 210 according to actual conditions to achieve the function of plugging and mating.

[0343] In one implementation, such as Figure 13 As shown, the side cover plate 512 may have a recessed portion 5122, which may be recessed in the direction toward the mounting cavity 511a. The recessed portion 5122 may define a cable storage groove, and a cable passage hole 512a and a snap-fit ​​hole 512b may be provided in the recessed portion 5122.

[0344] By way of example, the recess 5122 may be formed by a portion of the side cover 512 adjacent to the central region in the direction toward the mounting cavity 511a. The side of the cable storage groove defined by the recess 5122 away from the mounting cavity 511a forms an opening, and the mounting side plate 30 of the housing assembly 100 is used to close the opening so that the cable storage groove forms a relatively closed space.

[0345] Through the above implementation method, the cable storage tray can provide extra space for organizing and storing cables, making the cables more neat and orderly during the wiring process.

[0346] In one implementation, such as Figure 3 and Figure 13 As shown, a snap hole 30b may be provided on one side of the housing assembly 100 adjacent to the control box 510, and a snap-fit ​​protrusion 5121 may be provided on one side of the side cover plate 512 adjacent to the housing assembly 100. The snap-fit ​​protrusion 5121 can be used to form a snap-fit ​​engagement with the snap hole 30b; or, a snap-fit ​​protrusion may be provided on one side of the housing assembly 100 adjacent to the control box 510, and a snap hole may be provided on the side cover plate 512. The snap hole is used to form a snap-fit ​​engagement with the snap-fit ​​protrusion.

[0347] For example, when a snap-fit ​​hole 30b is provided on the side of the housing assembly 100 adjacent to the control box 510, and the side cover plate 512 is provided with a snap-fit ​​protrusion 5121, the snap-fit ​​protrusion 5121 of the control box 510 can be aligned with the snap-fit ​​hole 30b on the side of the housing assembly 100 adjacent to the control box 510, and a certain pressure is applied to insert the snap-fit ​​protrusion 5121 into the snap-fit ​​hole 30b to form a stable snap-fit ​​engagement. This application embodiment does not specifically limit the number, shape, or location of the snap-fit ​​holes 30b and the snap-fit ​​protrusions 5121.

[0348] Through the above implementation method, it can be ensured that the control module 500 is stably fixed on the housing assembly 100, and at the same time, it is convenient to disassemble and maintain the control module 500 in the future.

[0349] In one embodiment, the housing 511 may include an upper housing 5111 and a lower housing 5112, the bottom of the upper housing 5111 may be connected to the top of the lower housing 5112; wherein, the material of the upper housing 5111 may be a transparent material.

[0350] For example, part or all of the upper shell 5111 may be made of a transparent material, specifically tempered glass, plastic, etc., so that at least a portion of the upper shell 5111 allows light to pass through to form a transparent upper shell.

[0351] In one implementation, such as Figure 13 As shown, the control module 500 may also include a display screen 520, which may be disposed in the mounting cavity 511a and electrically connected to the control circuit board 530. The display area of ​​the display screen 520 is positioned directly opposite the upper shell 5111.

[0352] For example, the housing 511 of the control box 510 may include an upper housing 5111 and a lower housing 5112. The control module 500 may also include a display screen 520, which may be disposed within the mounting cavity 511a and electrically connected to the control circuit board 530. The transparent upper housing 5111 may be positioned directly opposite the display area of ​​the display screen 520 to display the operating information of the control module 500.

[0353] In this embodiment, the display screen 520 may be an LED display screen or an LCD display screen, etc. This embodiment does not specifically limit the type of display screen 520, and those skilled in the art can flexibly set it according to the actual situation.

[0354] Through the above implementation method, the display screen 520 can be electrically connected to the control circuit board 530 through a flexible printed circuit board, which can adapt to the compact installation space in the control box 510, while ensuring stable and efficient signal transmission.

[0355] In one implementation, see Figure 12 The housing assembly 100 provides an installation space 25 for the control module 500. The bottom of the installation space 25 can be formed by the bottom wall and side wall of the housing 20 to provide support for the installation of the control module 500. The top of the installation space can be opened to cooperate with the transparent upper shell 5111 of the control box 510 to display the working information of the control module 500. This setting can increase the visibility and aesthetics of the control module 500.

[0356] In this way, the control module 500 of the computing device 1 provided in this application embodiment is detachably installed in the housing assembly 100 of the computing device 1, realizing the modularity of the system control of the computing device 1, which is beneficial for users to maintain and upgrade according to their needs in the future, and improves the scalability of the computing device 1.

[0357] Figure 11A An exemplary three-dimensional structural diagram of a computing device according to an embodiment of this application is provided from one perspective. Figure 11B An exemplary three-dimensional structural diagram of a computing device according to an embodiment of this application is provided from one perspective, such as... Figure 11A and Figure 11B As shown, in one embodiment, the outer side wall of the control box 510 of the control module 500 is provided with a snap-fit ​​part 513, which is correspondingly provided with a snap-fit ​​part 41 on the cover side plate 40 of the housing assembly 100.

[0358] For example, the cover side plate 40 and the control module 500 are located on opposite sides of the housing 20 in the first direction L1, respectively. The cover side plate 40 is provided with a snap-fit ​​portion 41, and the outer side wall of the control box 510 is provided with a snap-fit ​​mating portion 513. In two computing devices 1 arranged adjacent to each other along the first direction L1, the snap-fit ​​portion 41 of one computing device 1 and the snap-fit ​​mating portion 513 of the other computing device 1 form a snap-fit ​​mating.

[0359] In this embodiment, multiple computing devices 1 can be integrated to form a computing device cluster. Exemplarily, the multiple computing devices 1 can be arranged adjacently along a first direction L1, each computing device 1 having a first end and a second end in the first direction. The control module 500 of the computing device 1 is located at the first end, and the cover side plate 40 of the computing device 1 is located at the second end. In two adjacent computing devices 1, the second end of the first computing device is adjacent to the first end of the second computing device, and the snap-fit ​​portion 41 on the cover side plate 40 of the first computing device forms a snap-fit ​​engagement with the snap-fit ​​mating portion 513 on the control box 510 of the second computing device.

[0360] In some examples, the snap-fit ​​portion 41 may protrude outward from the outer side wall of the cover side plate 40 to form a protruding structure, and the snap-fit ​​mating portion 513 may be recessed inward from the outer side wall of the control box 510 to form a groove structure. Thus, the snap-fit ​​portion 41 can be inserted into the snap-fit ​​mating portion 513 to form a snap-fit ​​engagement.

[0361] In other examples, the snap-fit ​​portion 41 may be recessed inward from the outer side wall of the cover side plate 40 to form a groove structure, and the snap-fit ​​mating portion 513 may protrude outward from the outer side wall of the control module 500 to form a protrusion structure. Thus, the snap-fit ​​mating portion 513 can be inserted into the snap-fit ​​portion 41 to form a snap-fit.

[0362] It should be noted that the above is merely an illustrative example and should not be construed as a limitation of this application. In other examples of this application, the latching portion 41 and the latching mating portion 513 can also adopt other arbitrary structures, which can be flexibly set by those skilled in the art according to actual conditions. For example, one of the latching portion 41 and the latching mating portion 513 can be a protruding structure, and the other can be a matching card hole structure. As another example, the latching portion 41 and the latching mating portion 513 can also be magnetic components with mutual magnetic attraction, and the two can be attracted to each other by magnetic force so that two adjacent computing devices 1 can be fixed relative to each other.

[0363] Furthermore, the number of snap-fit ​​parts 41 and snap-fit ​​mating parts 513 can be one or more sets correspondingly arranged, which can be flexibly configured according to the actual situation by those skilled in the art. For example, the number of snap-fit ​​parts 41 and snap-fit ​​mating parts 513 can each be one, with the snap-fit ​​part 41 disposed in the central area of ​​the cover side plate 40 and the snap-fit ​​mating part 513 disposed in the central area of ​​the control box 510. As another example, the number of snap-fit ​​parts 41 can be multiple, with multiple snap-fit ​​parts 41 arranged circumferentially adjacent to the outer periphery of the cover side plate 40, and the number of snap-fit ​​mating parts 513 can be multiple, with multiple snap-fit ​​mating parts 513 arranged circumferentially adjacent to the outer periphery of the control box 510.

[0364] Figure 14 An exemplary three-dimensional structural diagram of the computing board of a computing device according to an embodiment of this application is provided. Figure 15 An exemplary front view of the computing board of a computing device according to an embodiment of this application is provided, such as... Figure 14 and Figure 15 As shown, in one embodiment, the computing board 410 of the computing module 100 includes a board body 410a and a plurality of computing units 410b. The plurality of computing units 410b are disposed on the side surface of the board body 410a. The length direction of the board body 410a is parallel to the first direction L1, and the width direction of the board body is parallel to the vertical direction. The vertical direction can be a direction perpendicular to the first direction L1 and the second direction L2, respectively.

[0365] In this embodiment, the computing board 410 can be a hardware device or module for providing computing power, and can be applied to fields such as high-performance computing (HPC), artificial intelligence (AI) training, and data centers. The board body 410a can be a printed circuit board. The computing unit can be at least one of a CPU (Central Processing Unit) chip, a GPU (Graphics Processing Unit) chip, an FPGA (Field Programmable Gate Array) chip, an ASIC (Application-Specific Integrated Circuit) chip, an NPU (Neural Processing Unit) chip, and a TPU (Tensor Processing Unit) chip.

[0366] For example, the computing units 410b used in the computing board 410 are the same.

[0367] In some examples, the computing board 410 may employ multiple computing units 410b of the same model.

[0368] In other examples, the computing board 410 may employ multiple computing units 410b of the same size.

[0369] In other examples, the computing board 410 may employ multiple computing units 410b of the same specifications.

[0370] In other examples, the computing board 410 may employ multiple computing units 410b with the same functionality.

[0371] It should be noted that the above is only an exemplary description. In other examples of this application, multiple computing units 410b with the same model, size, specifications and functions may also be used.

[0372] For example, the shape of the plate 410a can be rectangular. The length direction of the plate 410a refers to the extension direction of the longer side edge, and the width direction refers to the extension direction of the shorter side edge. The plane containing the plate 410a can be perpendicular to the second direction L2, the length direction of the plate 410a can be parallel to the first direction L1, and the width direction of the plate 410a can be parallel to the vertical direction. Here, the first direction L1 can be the length direction of the housing assembly 100, the second direction L2 can be the width direction of the housing assembly 100, and the vertical direction can be a direction perpendicular to both the first direction L1 and the second direction L2.

[0373] It should be noted that by arranging the plate 410a with its length parallel to the first direction L1 and its width parallel to the vertical direction inside the housing assembly 100, the internal space of the housing assembly 100 can be fully utilized. This reduces the space occupied by the plate 410a while maximizing its area, thereby increasing the area of ​​the computing unit 410b and consequently increasing the number of computing units 410b, thus improving the computing performance of the computing board 410. Furthermore, by arranging the plane of the computing board parallel to the vertical direction, the wind resistance generated by the computing board 410 on the airflow from the air inlet 20c to the air outlet 20b can be reduced during the operation of the fan 200, ensuring a high airflow velocity when passing over the computing board 410, thereby ensuring efficient cooling of the computing board 410.

[0374] In one embodiment, the ratio of the width dimension of the plate 410a to the length dimension of the plate 410a is less than or equal to 1 / 6.

[0375] It is understood that the width dimension of plate 410a refers to the dimension of plate 410a in its width direction, and the length dimension of plate 410a refers to the dimension of plate 410a in its length direction. The specific values ​​of the width and length dimensions of plate 410a, as well as their ratio, can be set according to the overall shape and size of the housing assembly 100 and the shape and size of its internal cavities.

[0376] For example, such as Figure 1As shown, the overall shape of the housing assembly 100 can be generally cuboid, with its length in the first direction L1 being greater than its height in the vertical direction. Correspondingly, the internal cavity of the housing assembly 100 can also be generally cuboid, with its length in the first direction L1 being greater than its height in the vertical direction. To maximize the use of the internal cavity space of the housing assembly 100, in this embodiment, the length direction of the plate 410a can be set to be parallel to the first direction L1, and the width direction of the plate 410a can be set to be parallel to the vertical direction, with the length dimension of the plate 410a being greater than its width dimension. The ratio of the width dimension to the length dimension of the plate 410a can be set to be less than or equal to 1 / 6.

[0377] In some examples, the ratio of the width dimension of plate 410a to its length dimension can be set to 1 / 6, that is, the aspect ratio of plate 410a is 6.

[0378] In other examples, the ratio of the width dimension of plate 410a to its length dimension can be set to 1 / 8, that is, the aspect ratio of plate 410a is 8.

[0379] In some other examples, the ratio of the width dimension of plate 410a to its length dimension can be set to 1 / 10, that is, the aspect ratio of plate 410a is 10.

[0380] It should be noted that the above is merely an exemplary description and should not be construed as a limitation of this application. Regarding the length, width, and ratio of the plate 410a, those skilled in the art can make corresponding settings based on the cavity shape and size of the housing assembly 100 to improve the space utilization of the plate 410a within the internal cavity of the housing assembly 100.

[0381] In one implementation, such as Figure 14 and Figure 15 As shown, multiple computing units 410b are disposed on the side surface of the plate 410a. The multiple computing units 410b are arranged in at least one row, and the multiple computing units 410b in each row are arranged adjacent to each other along the length direction of the plate 410a.

[0382] It should be noted that, since the length of the plate 410a is greater than its width, on the side surface of the plate 410a with its limited area, in order to maximize the number of computing units 410b, the row direction of multiple computing units 410b arranged in rows can be parallel to the length direction of the plate. This arrangement can maximize the number of computing units 410b in each row.

[0383] In some examples, multiple computing units 410b can be arranged in a row, with the multiple computing units 410b in the row arranged adjacent to each other in a direction parallel to the length direction of the plate 410a.

[0384] In a specific example, the multiple computing units 410b in this row can be centrally positioned along the width of the plate 410a, such that the distance between each computing unit 410b in the row and the two side edges of the plate 410a extending along the length direction are equal. This arrangement allows the heat generated by the computing units 410b during operation to be evenly distributed to both sides of the plate 410a along its width, thereby improving the temperature uniformity of the plate 410a and preventing localized heat concentration.

[0385] In another specific example, the multiple calculation units in the row can also be non-centered in the width direction of the plate 410a, so that the distance between each calculation unit 410b in the row and the two side edges of the plate 410a extending in the length direction are not equal. For example, the distance between each calculation unit 410b in the row and the upper side edge of the plate 410a extending in the length direction is greater than the distance between each calculation unit 410b and the lower side edge of the plate 410a extending in the length direction. As another example, the distance between each calculation unit 410b in the row and the upper side edge of the plate 410a extending in the length direction is less than the distance between each calculation unit 410b and the lower side edge of the plate 410a extending in the length direction.

[0386] It should be noted that the above is merely an exemplary description and should not be construed as a limitation of this application. In other examples of this application, multiple computing units 410b may also be arranged in columns on the plate 410a, with the column direction parallel to the width direction of the plate 410a.

[0387] In one implementation, such as Figure 14 and Figure 15 As shown, multiple computing units 410b are arranged in two rows. In each row, multiple computing units are arranged adjacent to each other in a direction parallel to the length direction of the plate 410a. The two rows of computing units are spaced apart in the width direction of the plate 410a.

[0388] In some examples, the two rows of computing units are symmetrically arranged about the centerline in the width direction of the plate 410a, so that the distance between the two rows of computing units and the side edge of the plate 410a on their respective adjacent sides is equal. This arrangement allows the two rows of computing units to be evenly distributed on the plate 410a, thereby improving the temperature uniformity of the computing board 410.

[0389] In other examples, the two rows of calculation units are arranged asymmetrically about the centerline in the width direction of the plate 410a. Specifically, the distance between the first row of calculation units 4101 adjacent to the upper edge of the plate 410a and the upper edge of the plate 410a is greater than the distance between the second row of calculation units 4102 adjacent to the lower edge of the plate 410a and the lower edge of the plate 410a. It should be noted that during the upward flow of air from the air inlet 20c to the air outlet 20b, the airflow has a better cooling effect on the second row of computing units 4102 located upstream of the airflow than on the first row of computing units 4101 located downstream of the airflow. By setting the distance between the first row of computing units 4101 and the upper edge of the board 410a to be greater than the distance between the second row of computing units 4102 and the lower edge of the board 410b, the board 410a can reserve a larger heat dissipation space for the first row of computing units 4101 than for the second row of computing units 4102. This balances the cooling capacity of the two rows of computing units, making the cooling capacity of the two rows of computing units as consistent as possible, thereby improving the temperature uniformity of the computing board 410.

[0390] It should be noted that the above description is merely illustrative and should not be construed as limiting this application. In other examples of this application, the plurality of computing units 410b may also be arranged in two columns, with the plurality of computing units in each column arranged adjacently along a direction parallel to the width direction of the plate 410a, and the two columns of computing units spaced apart along the length direction of the plate 410a. Furthermore, the two columns of computing units may be arranged symmetrically or asymmetrically about the centerline along the length direction of the plate 410a.

[0391] In the embodiments of this application, the number of calculation units 410b included in the two rows of calculation units may be equal or unequal.

[0392] In some examples, the number of calculation units 410b included in the first row of calculation units 4101 adjacent to the upper edge of plate 410a is equal to the number of calculation units 410b included in the second row of calculation units 4102 adjacent to the lower edge of plate 410a.

[0393] In other examples, the number of computational units 410b included in the first row of computational units 4101 adjacent to the upper side of the plate 410a is greater than the number of computational units 410b included in the second row of computational units 4102 adjacent to the lower edge of the plate 410a. Furthermore, the spacing between any two adjacent computational units 410b in the first row of computational units 4101 is less than the spacing between any two adjacent computational units 410b in the second row of computational units 4102.

[0394] In some further examples, the number of computational units 410b included in the first row of computational units 4101 adjacent to the upper side of the plate 410a is less than the number of computational units 410b included in the second row of computational units 4102 adjacent to the lower edge of the plate 410a. Furthermore, the distance between any two adjacent computational units 410b in the first row of computational units 4101 is greater than the distance between any two adjacent computational units 410b in the second row of computational units 4102.

[0395] In a specific example, the ratio of the width to the length of the plate 410a can be 1 / 8. The two rows of computational units can be arranged symmetrically about the centerline along the width direction of the plate. The number of computational units 410b included in the first row of computational units 4101 can be equal to the number of computational units 410b included in the second row of computational units 4102, and both can be 33. The spacing between any two adjacent computational units 410b in the first row of computational units 4101 is equal to the spacing between any two adjacent computational units 410b in the second row of computational units 4102.

[0396] It should be noted that the above description is merely exemplary and should not be construed as a limitation of this application. The number of rows of computing units 410b on the plate 410a and the number of computing units 410b in each row can be flexibly set by those skilled in the art based on the size of the computing units 410b and the size of the plate 410a.

[0397] In one implementation, the two rows of computing units are connected in series.

[0398] In this embodiment, the plurality of calculation units 410b in the first row calculation unit 4101 can be connected in series, and the plurality of calculation units 410b in the second row calculation unit 4102 can be connected in series. Furthermore, the first row calculation unit 4101 and the second row calculation unit 4102 can be connected in parallel or in series.

[0399] For example, the computing board 410 may also include a conductive bar 417, which may be disposed on the surface of the board body 410a. The number of conductive bars 417 may be two, and the two conductive bars 417 are respectively disposed with two rows of computing units. Each conductive bar 417 may extend along the length direction of the board body 410a.

[0400] In some examples, the busbar 417 can be a single structural component, and multiple computing units 410b in each row of computing units are electrically connected to the busbar 417 via pads so that the multiple computing units 410b in each row of computing units are connected in series.

[0401] In other examples, the conductive bar 417 may include a plurality of conductive sheets arranged adjacent to each other along the length of the plate 410a. In each row of computing units, any two adjacent computing units 410b are electrically connected through the conductive sheets, so that the plurality of computing units 410b in each row of computing units are connected in series.

[0402] In some examples, the material of the busbar 417 can be copper, and the busbar 417 can specifically be a copper busbar.

[0403] In other examples, the material of the busbar 417 may be aluminum, specifically an aluminum busbar.

[0404] In some other examples, the material of busbar 417 may be silver, and busbar 417 may specifically be a silver busbar.

[0405] It should be noted that the above is merely an exemplary description and should not be construed as a limitation of this application. Regarding the material selection for the conductive busbar 417, those skilled in the art can use any type of conductive material currently known or in the future, such as gold, platinum, or conductive polymers with conductive properties.

[0406] In one embodiment, the plate 410a includes a first end 410a1 and a second end 410a2 disposed opposite to each other in its length direction. The calculation unit 410b of the first row calculation unit 4101 adjacent to the second end 410a2 and the calculation unit 410b of the second row calculation unit 4102 adjacent to the second end 410a2 are electrically connected through a first conductive member 415.

[0407] In some examples, the first conductive element 415 can be an integral structural component. The computing units in the first row computing unit 4101 adjacent to the second end 410a2 and the computing units in the second row computing unit 4102 adjacent to the second end 410a2 are respectively electrically connected to the first conductive element 415, thereby connecting the first row computing unit 4101 and the second row computing unit 4102 in series.

[0408] In other examples, the first conductive element 415 may include a plurality of conductive units arranged adjacent to each other along the width direction of the plate 410a. The plurality of conductive units are electrically connected in sequence through conductive lines on the plate 410a. The calculation unit 410b of the first row calculation unit 4101 adjacent to the second end 410a2 is electrically connected to the conductive sheet of the plurality of conductive sheets adjacent to the upper edge of the plate 410a. The calculation unit 410b of the second row calculation unit 4102 adjacent to the second end 410a2 is electrically connected to the conductive sheet of the plurality of conductive sheets adjacent to the lower edge of the plate 410a, thereby connecting the first row calculation unit 4101 and the second row calculation unit 4102 in series.

[0409] For example, the material of the first conductive element 415 may be copper, aluminum or silver.

[0410] It should be noted that the above is only an exemplary description. Regarding the material selection of the first conductive element 415, those skilled in the art can use any type of conductive material that is currently known or will be known in the future, such as gold, platinum, or conductive polymers with conductive properties.

[0411] In one implementation, such as Figure 15 As shown, the first end 410a1 of the board body 410a is provided with a plug end 411, which is used to plug and cooperate with the plug interface of the power module 300.

[0412] Through the above implementation method, the computing board 410 and the power module 300 do not need to be connected by wires, which simplifies the connection method between the computing board 410 and the power module 300, improves the convenience of disassembly and assembly between the two, and facilitates subsequent inspection and maintenance.

[0413] In one embodiment, the calculation unit in the first row calculation unit 4101 adjacent to the first end 410a1 and the calculation unit in the second row calculation unit 4102 adjacent to the first end 410a1 are electrically connected to the plug-in terminal through the second conductive member 416.

[0414] For example, the plug-in terminal 411 may include a positive terminal 411a and a negative terminal 411b, and the second conductive element 416 may include a positive conductive element 416a and a negative conductive element 416b. The positive conductive element 416a is electrically connected to the positive terminal 411a, and the negative conductive element 416b is electrically connected to the negative terminal 411b.

[0415] In some examples, the positive terminal 411a is positioned near the upper edge of the plate 410a, and the negative terminal 411b is positioned near the lower edge of the plate 410a. The positive conductive element 416a is positioned near the upper edge of the plate 410a, and the negative conductive element 416b is positioned near the lower edge of the plate 410a. The positive conductive element 416a is electrically connected to the positive terminal 411a and to the calculation unit 410b of the first row calculation unit 4101, which is adjacent to the first end 410a1. The negative conductive element 416b is electrically connected to the negative terminal 411b and to the calculation unit 410b of the second row calculation unit 4102, which is adjacent to the first end 410a1. With this configuration, the current direction can flow from the calculation unit 410b near the first end 410a1 of the first row calculation unit 4101 to the calculation unit 410b near the second end 410a2, and then from the calculation unit near the second end 410a2 of the second row calculation unit 4102 to the calculation unit 410b near the first end 410a1.

[0416] In other examples, the negative terminal 411b is positioned near the upper edge of the plate 410a, and the positive terminal 411a is positioned near the lower edge of the plate 410a. The negative conductive element 416b is positioned near the upper edge of the plate 410a, and the positive conductive element 416a is positioned near the lower edge of the plate 410a. The positive conductive element 416a is electrically connected to the positive terminal 411a and to the calculation unit 410b of the second row calculation unit 4102, which is adjacent to the first end 410a1. The negative conductive element 416b is electrically connected to the negative terminal 411b and to the calculation unit 410b of the first row calculation unit 4101, which is adjacent to the first end 410a1. With this configuration, the current can flow from the calculation unit 410b near the first end 410a1 of the second row calculation unit 4102 to the calculation unit 410b near the second end 410a2, and then from the calculation unit 410b near the second end 410a2 of the first row calculation unit 4101 to the calculation unit 410b near the first end 410a1.

[0417] For example, the material of the second conductive element 416 may be copper, aluminum or silver.

[0418] It should be noted that the above is only an exemplary description. Regarding the material selection of the first conductive element 415, those skilled in the art can use any type of conductive material that is currently known or will be known in the future, such as gold, platinum, or conductive polymers with conductive properties.

[0419] Figure 16 An exemplary enlarged schematic diagram of a portion of the computing board of a computing device according to an embodiment of this application is provided, such as... Figure 16 As shown, exemplarily, the positive terminal 411a and the positive conductive element 416a can be electrically connected via a conductive bus 417. The conductive bus 417 can be an integral structural component; alternatively, the conductive bus 417 can include multiple conductive sheets connected sequentially, with gaps between adjacent conductive sheets, and electrically connected via traces on the plate 410a.

[0420] In one implementation, such as Figure 16 As shown, the plug-in terminal 411 is also provided with a spare connection terminal 419a.

[0421] For example, the spare connection terminal 419a may be disposed between the positive terminal 411a and the negative terminal 411b. The dimension of the spare connection terminal 419a in the first direction L1 is greater than or equal to the dimensions of the positive terminal 411a and the negative terminal 411b in the first direction L1.

[0422] It should be noted that the spare connection terminal 419a is electrically insulated from the positive terminal 411a, negative terminal 411b, positive conductive component 416a, negative conductive component 416b, computing unit 410b, and other components on the board 410a. That is, the spare connection terminal 419a is not conductive to any component on the board 410a. The spare connection terminal 419a is used to act as a backup connection terminal in case of damage or failure of either the positive terminal 411a or the negative terminal 411b, by electrically connecting to either one.

[0423] This configuration improves the ease of maintenance of the computing board 410 in case of malfunction.

[0424] In one implementation, such as Figure 16 As shown, the plug-in terminal 411 is also provided with a detection connection terminal 419b.

[0425] For example, the detection connection terminal 419b is disposed between the positive terminal 411a and the negative terminal 411b. The detection connection terminal 419b is arranged side by side and spaced apart from the spare terminal.

[0426] The distance between the edge of the first end 410a1 of the adjacent plate 410a of the detection connection terminal 419b and the edge of the plate 410a at the first end 410a1 is greater than the distance between the edges of the first end 410a1 of the adjacent plate 410a of the positive terminal 411a and the negative terminal 411b. In other words, the edge of the first end 410a1 of the adjacent plate 410a of the detection connection terminal 419b is located further away from the edge of the plate 410a at the first end 410a1 than the edges of the first end 410a1 of the adjacent plate 410a of the positive terminal 411a and the negative terminal 411b.

[0427] The distance between the edge of the first end 410a1 of the detection connection terminal 419b, which is away from the plate 410a, and the edge of the plate 410a at the first end 410a1, is equal to the distance between the edges of the first ends 410a1 of the positive and negative terminals 411b, which are away from the plate 410a, and the edges of the plate 410a at the first end 410a1, respectively. In other words, the edge of the first end 410a1 of the detection connection terminal 419b, which is away from the plate 410a, is flush with the edges of the first ends 410a1 of the positive and negative terminals 411b, respectively.

[0428] For example, the power module 300 has a terminal corresponding to the detection connection terminal 419b in its connector 303. When the connector 411 is not fully inserted into the power module 300's connector 303 and the detection connection terminal 419b does not make electrical contact with the terminal in the connector 303, the detection connection terminal 419b outputs a first-level signal. When the connector 411 is fully inserted into the power module 300's connector 303 and the detection connection terminal 419b makes electrical contact with the corresponding terminal in the power module 300's connector 303, the detection connection terminal 419b outputs a second-level signal. One of the first-level signal and the second-level signal can be a low-level signal, and the other can be a high-level signal.

[0429] Therefore, based on the level signal output by the detection connection terminal 419b, it can be determined whether the plug-in terminal 411 of the computing board 410 is properly plugged into the plug-in interface 303 of the power module 300, thereby realizing the detection of whether the computing board 410 and the power module are properly assembled.

[0430] In one implementation, such as Figure 15 As shown, the width of plate 410a is greater than the width of plug end 411.

[0431] For example, the plug-in end 411 extends outward from the side edge of the first end 410a1 of the plate body 410a, and the two side edges of the plug-in end 411 disposed opposite to each other in the width direction have a cross section difference with the two side edges of the plate body 410a in the width direction.

[0432] It should be noted that the plug-in terminal 411 is used for electrical connection with the plug interface 303 of the power module 300. Since the plug interface 303 of the power module 300 adopts a standardized electrical connection interface, the width of the plug-in terminal 411 needs to be set accordingly based on the standardized electrical connection interface. By setting the width of the board body 410a to be larger than the width of the plug-in terminal 411, the board body 410a can have a larger heat dissipation area in its width direction, thereby improving the heat dissipation capacity of the board body 410a itself.

[0433] In one embodiment, the plate 410a is provided with a plurality of connection holes 412 for fasteners to pass through in order to mount the heat dissipation structure 420 onto the plate 410a.

[0434] For example, multiple computing units 410b are arranged in two rows, with the two rows of computing units 410b spaced apart in the width direction of the plate 410a. Multiple connecting holes 412 are arranged between the two rows of computing units, with the multiple connecting holes 412 spaced apart along a first direction L1.

[0435] In some examples, multiple connection holes 412 may be arranged along the centerline of the plate 410a in the width direction. The multiple connection holes 412 are arranged at equal intervals.

[0436] In the embodiments of this application, such as Figure 7 As shown, the heat dissipation structure 420 is thermally connected to the computing board 410. For example, the heat dissipation structure 420 is in contact with the computing board 410, or there is a small gap between them, so that the heat dissipation structure 420 and the computing board 410 can exchange heat. During the operation of the computing board 410, the heat dissipation structure 420 absorbs the heat generated by the computing board 410 and conducts the heat to the cavity inside the housing assembly 100.

[0437] For example, the heat dissipation structure 420 may include a heat sink and heat dissipation fins disposed on the heat sink. There may be two pairs of heat sinks and heat dissipation fins, with each pair disposed on opposite sides of the plate 410a. Each heat dissipation fin group includes a plurality of spaced-apart heat dissipation fins 421. The heat sink has a plurality of through holes corresponding one-to-one with a plurality of connection holes 412. Fasteners pass through the through holes and connect to the corresponding connection holes 412 to fix the heat sink to the surface of the plate 410a.

[0438] For example, a flow guide gap may be defined between two adjacent heat dissipation fins 421 in each heat dissipation fin group, and the extension direction of the flow guide gap may be set parallel to the vertical direction.

[0439] For example, in each heat dissipation fin assembly, multiple heat dissipation fins 421 can be arranged side by side along the first direction L1, with any two adjacent heat dissipation fins spaced apart from each other. The heat dissipation fins 421 can be plate-shaped, and the plane containing the heat dissipation fins 421 is arranged parallel to the vertical direction. Thus, a flow guide gap can be defined between two adjacent heat dissipation fins 421. When the airflow flows through the heat dissipation fin assembly, it can pass quickly through the flow guide gap, which increases the contact area between the airflow and the heat dissipation fins 421 on the one hand, and ensures the airflow velocity on the other hand, thereby increasing the heat exchange efficiency between the airflow and the heat dissipation structure 420.

[0440] In some examples, the heat dissipation structure 420 may include a heat dissipation fin group disposed on the side surface of the computing board 410 on which computing units are disposed, and the heat dissipation fin group may include a plurality of spaced heat dissipation fins 421.

[0441] In other examples, the heat dissipation structure 420 may include two heat dissipation fin groups, which may be respectively disposed on opposite sides of the computing board 410, and each heat dissipation fin group may include a plurality of heat dissipation fins 421 disposed at intervals.

[0442] In a specific example, the heat dissipation structure 420 may include two heat dissipation fin groups arranged parallel to each other along a first direction L1, which are thermally connected to the computing board 410. The two heat dissipation fin groups may be respectively disposed on opposite sides of the computing board 410 along a second direction L2, and each heat dissipation fin group may include multiple heat dissipation fins 421 spaced apart. The heat dissipation fins 421 may be made of metals with high thermal conductivity, such as aluminum, copper, and silver. The surface of the heat dissipation fins 421 may be treated, such as by coating with a thermally conductive coating or increasing surface roughness, to further improve heat dissipation efficiency. Furthermore, the thickness and spacing of the heat dissipation fins 421 can be designed by those skilled in the art according to specific heat dissipation requirements. This application embodiment does not impose specific limitations on the material, thickness, etc., of the heat dissipation fins 421, thereby ensuring heat dissipation performance.

[0443] In one implementation, such as Figures 14 to 16 As shown, the computing board 410 also includes a first connector 413, which is used for data line communication connection with the control circuit board 530.

[0444] In this embodiment, the control circuit board 530 sends computing tasks and data to be processed to the computing board 410 via a data line. After receiving the computing tasks and data to be processed through the first connector 413, the computing board 410 performs calculations step by step. The processing order of the multiple computing units 410b is arranged in the opposite direction to the series connection of the power transmission.

[0445] For example, the first connector 413 may be disposed adjacent to the first end 410a1 of the plate 410a. The first connector 413 may be located between the positive conductive element 416a and the negative conductive element 416b.

[0446] This configuration can shorten the distance between the first connector 413 and the plug end 411, thereby shortening the wiring length between the first connector 413 and the plug end 411.

[0447] In some examples, the first connector 413 may be centrally located between the positive conductive element 416a and the negative conductive element 416b.

[0448] In other examples, the first connector 413 may be disposed between the positive conductive element 416a and the negative conductive element 416b, with the first connector 413 disposed adjacent to the positive conductive element 416a.

[0449] In some other examples, the first connector 413 may be disposed between the positive conductive element 416a and the negative conductive element 416b, with the first connector 413 disposed adjacent to the negative conductive element 416b.

[0450] It should be noted that the above is only an exemplary description. The specific location of the first connector 413 on the board 410a can be flexibly set by those skilled in the art according to the actual situation.

[0451] In one implementation, such as Figures 14 to 16 As shown, the computing board 410 also includes a second connector 414, which is used for electrical cable connection with the temperature detection unit of the computing device 1.

[0452] In this embodiment of the application, the temperature detection unit of the computing device 1 can be multiple and distributed at different locations of the computing device 1.

[0453] In some examples, the bottom of the housing assembly 100 of the computing device 1 may be provided with an ambient temperature detection unit 70 for detecting the ambient temperature of the environment in which the computing device 1 is located.

[0454] In other examples, a temperature detection unit may be provided at the air inlet 20c and / or air outlet 20b of the computing device 1 to detect the air inlet temperature and / or air outlet temperature of the computing device 1.

[0455] In some further examples, the computing board 410 of computing device 1 may also be equipped with a temperature detection unit for detecting the temperature of the computing board 410 during operation. For example, such as Figure 14 As shown, the computing board 410 also includes a temperature sensor 418, which can be set at the center of the board 410a so that the temperature value detected by the temperature sensor 418 matches the average temperature of the board 410a.

[0456] It should be noted that the above description is merely illustrative and should not be construed as limiting this application. In other examples of this application, those skilled in the art can flexibly set the location of the temperature detection unit according to actual conditions. For example, the temperature detection unit can be set at the bottom of the housing assembly 100, the air inlet 20c, the air outlet 20b, and multiple locations within the computing board 410. Furthermore, the temperature detection unit can also be set in other locations of the computing device, such as inside the control module 500.

[0457] In some examples, the computing board 410 can power the temperature detection unit via a cable connected to the second connector 414.

[0458] In other examples, the computing board 410 can not only power the temperature detection unit through the cable connected to the second connector 414, but also receive temperature detection results from the temperature detection unit through the cable connected to the second connector 414, and transmit the temperature detection results to the control module 500 of the computing device 1.

[0459] For example, the control module 500 controls the operating parameters of the computing board 410 and the fan 200 based on the temperature detection results. For instance, if the temperature detected by the ambient temperature detection unit 70 is lower than the corresponding temperature threshold, the control module 500 can control the computing board 410 to increase its operating frequency or control the fan 200 to increase its speed, thereby raising the temperature of the warm air discharged from the air outlet 20b. Conversely, if the temperature of the temperature sensor 418 is higher than the corresponding temperature threshold, the control module 500 can control the computing board 410 to decrease its operating frequency or control the fan 200 to increase its speed, thereby reducing the heat generated by the computing board 410 or improving the cooling effect of the fan 200 on the computing board 410.

[0460] Other configurations of the computing device in the above embodiments can be derived from various technical solutions now and in the future known to those skilled in the art, and will not be described in detail here.

[0461] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0462] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0463] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0464] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0465] It should be noted that although the steps of the method in this application are described in a specific order in the accompanying drawings, this does not require or imply that these steps must be performed in that specific order, or that all the steps shown must be performed to achieve the desired result. Additional or alternative steps may be omitted, multiple steps may be combined into one step, and / or one step may be broken down into multiple steps. The above drawings are merely illustrative of the processes included in the method according to exemplary embodiments of this application and are not intended to be limiting. It is readily understood that the processes shown in the above drawings do not indicate or limit the temporal order of these processes. Furthermore, it is readily understood that these processes may be performed synchronously or asynchronously in multiple modules, for example.

[0466] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0467] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A computing device, characterized in that, include: A housing assembly having an internal cavity, the housing assembly having an air inlet and an air outlet communicating with the cavity; The computing module is located within the cavity; A fan, disposed within the cavity, is used to generate airflow from the air inlet to the air outlet, and the airflow passes through the computing module; The fan has an airflow inlet and an airflow outlet. The airflow inlet is located near the air inlet, and the airflow outlet is located near the air outlet. The airflow inlet direction and the airflow outlet direction form an angle.

2. The computing device according to claim 1, characterized in that, The air outlet is located on the side of the housing assembly.

3. The computing device according to claim 2, characterized in that, The fan is located on the upper side of the computing module, and the air outlet is located near the top of the housing assembly.

4. The computing device according to claim 3, characterized in that, The air inlet is located on the side of the housing assembly.

5. The computing device according to claim 4, characterized in that, The air inlet and the air outlet are located on different sides of the housing assembly.

6. The computing device according to claim 4, characterized in that, The air inlet and the air outlet are located on the same side of the housing assembly.

7. The computing device according to claim 4, characterized in that, The air inlet is located near the bottom of the housing assembly.

8. The computing device according to claim 3, characterized in that, The air inlet is located at the bottom of the housing assembly.

9. The computing device according to claim 1, characterized in that, The computing module includes a computing board and a heat dissipation structure, and the heat dissipation structure is thermally connected to the computing board.

10. The computing device according to claim 9, characterized in that, The plane containing the computing board is set parallel to the vertical direction.

11. The computing device according to claim 10, characterized in that, The heat dissipation structure includes at least one heat dissipation fin group, which is disposed on at least one side of the computing board, and each heat dissipation fin group includes a plurality of heat dissipation fins spaced apart.

12. The computing device according to claim 11, characterized in that, A flow guiding gap is defined between two adjacent heat dissipation fins in the heat dissipation fin assembly, and the extension direction of the flow guiding gap is set parallel to the vertical direction.

13. The computing device according to claim 11, characterized in that, The ends of the heat dissipation fins in each heat dissipation fin group that are away from the computing board are spaced apart from the inner wall of the cavity.

14. The computing device according to claim 11, characterized in that, The number of heat dissipation fin groups is two, and the two heat dissipation fin groups are respectively arranged on opposite sides of the computing board.

15. The computing device according to claim 9, characterized in that, The heat dissipation structure also includes a plurality of support beams disposed at the bottom of the computing board, the plurality of support beams being spaced apart along a first direction, and each support beam being supported on the bottom wall of the cavity.

16. The computing device according to claim 15, characterized in that, The fan includes a cross-flow fan, and the air inlet direction of the airflow inlet is perpendicular to the air outlet direction of the airflow outlet.

17. The computing device according to claim 1, characterized in that, Also includes: A power module is disposed within the cavity. A fan is arranged side by side with the computing module in a first direction of the housing assembly. The airflow generated by the fan flows through the power module and the computing module.

18. The computing device according to claim 17, characterized in that, The power module has a plug interface, and the computing board of the computing module has a plug-in end. The plug-in end is plugged into the plug interface to make the computing board electrically connected to the power module.

19. The computing device according to any one of claims 1 to 18, characterized in that, The housing assembly includes an inner shell, and the computing module, the fan, and the power module are integrated within the inner shell.

20. The computing device according to claim 19, characterized in that, The housing assembly further includes an outer shell, the interior of which defines the cavity, and a first mounting opening is provided on one side of the outer shell in a first direction, through which the inner shell is slidably mounted in the cavity.

21. The computing device according to claim 20, characterized in that, The inner shell has a cavity defined inside, and the computing module and the power module are arranged side by side in the cavity along the first direction; the top of the inner shell has a mounting groove, and the fan is disposed in the mounting groove.

22. The computing device according to claim 21, characterized in that, The top of the inner shell is provided with a first side baffle and a second side baffle, which are arranged opposite to each other in a second direction, and the mounting groove is defined between the first side baffle and the second side baffle.

23. The computing device according to claim 22, characterized in that, The first side baffle and the second side baffle respectively abut against the outer wall surface of the fan.

24. The computing device according to claim 22, characterized in that, The inner shell has two sidewalls arranged opposite each other in the second direction, and the inner wall surfaces of the two sidewalls are respectively provided with supporting ribs, and the two supporting ribs are respectively arranged adjacent to the top of the inner shell; wherein, the mounting groove is defined by the first side baffle, the second side baffle and the two supporting ribs.

25. The computing device according to claim 24, characterized in that, The supporting rib is formed by protruding inward from the inner wall surface of the side wall, and the length direction of the supporting rib is parallel to the first direction.

26. The computing device according to claim 25, characterized in that, The inner shell has two side walls with limiting flanges, which extend downwards from the side walls toward the inner wall surface of the outer shell.

27. The computing device according to claim 26, characterized in that, The outer shell has two opposing inner wall surfaces respectively provided with stop members. The stop members extend upwardly from the inner wall surface of the outer shell in the direction toward the outer wall surface of the inner shell, and the stop members are located below the limiting fold.

28. The computing device according to claim 21, characterized in that, The bottom of the inner shell has a bottom opening area communicating with the receiving cavity, and the side of the inner shell has a side opening area communicating with the receiving cavity. The bottom opening area is correspondingly connected to the air inlet, and the side opening area is correspondingly connected to the air outlet.

29. The computing device according to claim 20, characterized in that, The housing assembly also includes: A mounting side plate is detachably mounted to the first mounting opening to form a closure of the first mounting opening.

30. The computing device according to claim 29, characterized in that, The end of the fan adjacent to the first mounting opening is provided with a snap-fit ​​protrusion, and the mounting side plate is provided with a through first snap-fit ​​hole, which forms a snap-fit ​​engagement with the snap-fit ​​protrusion of the fan.

31. The computing device according to claim 29, characterized in that, The mounting side plate has a through-hole for cables to pass through, and the control module is located outside the housing cavity of the inner shell.

32. The computing device according to claim 31, characterized in that, The outer casing has an extension portion extending along a first direction, the extension portion defining an installation space, and the installation space is adjacent to the inner casing in the first direction, the installation space being used to install the control module.

33. The computing device according to claim 32, characterized in that, The top of the installation space is open.

34. The computing device according to claim 20, characterized in that, The housing has a second mounting opening on the other side in the first direction; the housing assembly also includes a cover side plate, which is detachably mounted to the second mounting opening to close the second mounting opening.

35. The computing device according to claim 34, characterized in that, The cover side plate and the control module are respectively located on opposite sides of the outer shell in the first direction. The cover side plate is provided with a snap-fit ​​part, and the control module is provided with a snap-fit ​​mating part. In two computing devices arranged adjacent to each other along the first direction, the snap-fit ​​part of one computing device and the snap-fit ​​mating part of the other computing device form a snap-fit ​​mating.

36. The computing device according to any one of claims 1 to 18, characterized in that, Also includes: The control module includes a control box and a control circuit board. The control box has an internal mounting cavity and is detachably mounted to the housing assembly. The control circuit board is disposed within the mounting cavity and is used to electrically connect to the computing module and the power module, respectively.

37. The computing device according to claim 36, characterized in that, The control box includes a housing and a side cover, the housing defining the mounting cavity and a lateral opening communicating with the mounting cavity, and the side cover being detachably mounted to the lateral opening.

38. The computing device according to claim 37, characterized in that, The side cover plate has a through-hole for the cable of the power module to pass through and be electrically connected to the control circuit board.

39. The computing device according to claim 38, characterized in that, The end of the fan has a snap-fit ​​protrusion; the side cover plate also has a snap-fit ​​hole, the shape of which is adapted to the shape of the snap-fit ​​protrusion, and the snap-fit ​​hole is used to form a snap-fit ​​engagement with the snap-fit ​​protrusion.

40. The computing device according to claim 39, characterized in that, The side cover plate has a recessed portion, which is recessed in the direction toward the mounting cavity. The recessed portion defines a cable storage groove, and the cable passage hole and the snap-fit ​​hole are both provided in the recessed portion.

41. The computing device according to claim 37, characterized in that, A snap-fit ​​hole is provided on the side of the housing assembly adjacent to the control box, and a snap-fit ​​protrusion is provided on the side of the side cover plate adjacent to the housing assembly. The snap-fit ​​protrusion is used to form a snap-fit ​​engagement with the snap-fit ​​hole; or, The housing assembly has a snap-fit ​​protrusion on one side adjacent to the control box, and the side cover has a snap-fit ​​hole for engaging with the snap-fit ​​protrusion.

42. The computing device according to claim 37, characterized in that, The housing includes an upper shell and a lower shell, with the bottom of the upper shell connected to the top of the lower shell; wherein the upper shell is made of a transparent material.

43. The computing device according to claim 42, characterized in that, The control module also includes a display screen, which is disposed in the mounting cavity and electrically connected to the control circuit board. The display area of ​​the display screen is positioned directly opposite the upper shell.

44. The computing device according to claim 36, characterized in that, The outer wall of the control box of the control module is provided with a snap-fit ​​part, which is correspondingly provided with a snap-fit ​​part on the cover side plate of the housing assembly.

45. The computing device according to claim 44, characterized in that, The snap-fit ​​portion is a protruding structure, and the snap-fit ​​mating portion is a groove structure; or, the snap-fit ​​portion is a groove structure, and the snap-fit ​​mating portion is a protruding structure.

46. ​​The computing device according to any one of claims 1 to 18, characterized in that, The computing module's computing board includes a board body and multiple computing units. The multiple computing units are disposed on the side surface of the board body. The length direction of the board body is parallel to a first direction, and the width direction of the board body is parallel to the vertical direction.

47. The computing device according to claim 46, characterized in that, The ratio of the width dimension of the plate to the length dimension of the plate is less than or equal to 1 / 6.

48. The computing device according to claim 46, characterized in that, The plurality of computing units are disposed on the side surface of the plate, and the plurality of computing units are arranged in at least one row, with the plurality of computing units in each row arranged adjacent to each other along the length direction of the plate.

49. The computing device according to claim 46, characterized in that, The plurality of computing units are arranged in two rows, with the two rows of computing units spaced apart in the width direction of the plate.

50. The computing device according to claim 49, characterized in that, The computing units described in the two rows are connected in series.

51. The computing device according to claim 50, characterized in that, The plate includes a first end and a second end disposed opposite to each other in its length direction. The calculation unit in the first row of calculation units adjacent to the second end and the calculation unit in the second row of calculation units adjacent to the second end are electrically connected through a first conductive element.

52. The computing device according to claim 51, characterized in that, The first end of the board is provided with a plug-in end, which is used to connect and cooperate with the plug interface of the power module.

53. The computing device according to claim 52, characterized in that, The calculation units in the first row of calculation units adjacent to the first end and the calculation units in the second row of calculation units adjacent to the first end are electrically connected to the plug-in terminal through a second conductive element.

54. The computing device according to claim 52, characterized in that, The width of the plate is greater than the width of the plug-in end.

55. The computing device according to claim 46, characterized in that, The plate is provided with multiple connection holes for fasteners to pass through in order to install the heat dissipation structure onto the plate.

56. The computing device according to claim 55, characterized in that, The plurality of computing units are arranged in two rows, with the two rows of computing units spaced apart in the width direction of the plate; wherein, the plurality of connecting holes are arranged between the two rows of computing units, with the plurality of connecting holes spaced apart along a first direction.

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