An integrated camera module

Abstract

The utility model relates to camera technical field discloses an integral type camera module, including chip subassembly, chip subassembly includes circuit board, image sensor, support and light filter, image sensor is located on the upper end of circuit board, support is located on the upper end of image sensor, and support lower extreme is located in the non -photosensitive area of image sensor, the one end away from circuit board of support is provided with the mounting groove, light filter is located in the mounting groove, the lower end of support is provided with annular groove, the one end away from circuit board of support is provided with the through -hole of the intercommunication of annular groove, the one end away from circuit board of support is provided with the exhaust hole of the intercommunication of annular groove, through the through -hole injects the glue in annular groove to fixed mounting on the upper end of image sensor with support;Through setting up support in the non -photosensitive area of image sensor, avoid the support to occupy the placing space of circuit board component, improve the space utilization of circuit board to reduce the volume in the X / Y direction of circuit board, and then reduce the volume of camera module.

Description

Technical Field

[0001] This utility model relates to the field of camera technology, specifically to an integrated camera module. Background Technology

[0002] The prior art discloses a camera module (publication number: CN205081864U), including a lens assembly, an infrared filter, a circuit board, and a chip. The lens assembly includes a lens, a motor, and a bracket. The lens is installed inside the motor, and the motor is installed on the upper side of the bracket. The infrared filter is partially housed in the bracket and located below the lens. The circuit board has a through hole for the infrared filter to pass through. The circuit board is installed on the lower side of the bracket and is fitted over the infrared filter. A first substrate with a light-transmitting hole is provided on the lower side of the circuit board. The chip is located on the lower side of the first substrate and below the light-transmitting hole. The circuit board is electrically connected to the first substrate, and the first substrate is electrically connected to the chip. This camera module can effectively reduce the overall height, enabling ultra-thin handheld terminals such as mobile phones.

[0003] However, the existing bracket is directly mounted on the top of the circuit board, which occupies the installation space on the top of the circuit board. This reduces the area on the circuit board that can be used to place other components, resulting in an increase in the size of the camera module in the X / Y direction. This is not conducive to the development of camera modules towards miniaturization and thinness. To address this issue, we propose an integrated camera module to solve the above problems. Utility Model Content

[0004] The present invention aims to provide an integrated camera module to solve the problem that the bracket occupies the installation space at the top of the circuit board, which compresses the area on the circuit board that can be used to place other components, resulting in an increase in the size of the camera module in the X / Y direction.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: an integrated camera module, including a chip assembly, the chip assembly including a circuit board, an image sensor, a bracket, and a filter, the image sensor being disposed on the upper end of the circuit board, the bracket being disposed on the upper end of the image sensor, and the lower end of the bracket being located in the non-photosensitive area of ​​the image sensor, a mounting groove being provided at the end of the bracket away from the circuit board, the filter being disposed in the mounting groove, an annular groove being provided at the lower end of the bracket, a through hole communicating with the annular groove being provided at the end of the bracket away from the circuit board, and a vent hole communicating with the annular groove being provided at the end of the bracket away from the circuit board, and glue being injected into the annular groove through the through hole, thereby fixing the bracket to the upper end of the image sensor.

[0006] The beneficial effects of this solution are as follows: By placing the bracket in the non-photosensitive area of ​​the image sensor, the bracket avoids occupying the space of the circuit board components, improving the space utilization of the circuit board, thereby reducing the volume of the circuit board in the X / Y direction, and thus reducing the volume of the camera module. At the same time, the bracket, filter and image sensor are combined in an integrated assembly method, reducing the space occupied by each component in the traditional module, further reducing the overall volume of the module. Then, glue is evenly filled into the annular groove through the through hole, thereby forming an annular sealing glue layer between the bracket and the image sensor, which fixes the bracket and the image sensor and prevents the bracket and the image sensor from shifting. The vent can effectively expel the air in the annular groove, avoiding the problem of weak adhesion caused by air bubbles, improving the structural stability of the module under vibration, impact and other environments, and reducing the risk of detachment.

[0007] Preferably, as an improvement, the through holes are rectangular, and the inner walls of the through holes are provided with steel sheets.

[0008] The beneficial effects are as follows: when injecting glue into the annular groove through the through hole, the steel sheet can guide the glue flow more evenly, avoid glue adhering to the inner wall of the through hole, make the glue filling process in the annular groove more stable, reduce local accumulation or insufficient filling, ensure the uniformity of glue distribution, and thus enhance the firmness of the bracket and image sensor.

[0009] Preferably, as an improvement, the annular groove is set to a rectangle, and the outer wall of the end of the bracket that contacts the image sensor is wrapped with a buffer sleeve, and both buffer sleeves are set to U-shape.

[0010] The beneficial effects are as follows: Compared with other shapes such as circles, the rectangular annular groove has a more regular transition at the corners. When injecting glue, the glue can flow more smoothly along the straight edges of the rectangle, reducing flow dead corners caused by irregular shapes. This makes the glue filling in the annular groove faster and more evenly. The U-shaped buffer sleeve can better match the shape of the lower end of the bracket, thus tightly wrapping the bracket, reducing the assembly gap between the two, preventing dust, moisture and other impurities from entering the module, playing a certain role in sealing and protection, which helps maintain a clean environment inside the module and ensures the normal operation of the camera. At the same time, the U-shaped buffer sleeve can also effectively absorb and buffer energy when the camera module is subjected to external vibration or impact, reducing rigid collisions between the bracket and the image sensor, thereby protecting the image sensor and other precision components from damage, and improving the module's drop resistance and service life.

[0011] Preferably, as an improvement, the vent is located on the side of the bracket away from the through hole.

[0012] The beneficial effects are as follows: when the glue is injected into the annular groove through the through hole, the air in the annular groove will be gradually pushed away from the through hole by the glue and eventually discharged smoothly through the vent hole. This avoids the problem of air being trapped by the glue due to improper vent hole position, forming air bubbles, and ensures that the glue can fully fill the annular groove, further enhancing the bonding strength between the bracket and the image sensor.

[0013] Preferably, as an improvement, the adhesive is set to HD adhesive.

[0014] Preferably, as an improvement, it also includes a camera assembly, which includes a motor and a lens, the lens being disposed within the motor, the motor being disposed on the upper end of the circuit board, and the motor and lens covering the image sensor and the bracket. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the integrated camera module according to an embodiment of the present invention;

[0016] Figure 2 This is a three-dimensional structural diagram of the circuit board according to an embodiment of the present invention;

[0017] Figure 3 This is a partial cross-sectional view of the support structure according to an embodiment of the present invention;

[0018] Figure 4 for Figure 3 A magnified schematic diagram of the local structure at point A;

[0019] Figure 5 This is a three-dimensional structural diagram of the bracket according to an embodiment of the present utility model. Detailed Implementation

[0020] The following detailed description illustrates the specific implementation method:

[0021] The reference numerals in the accompanying drawings include: circuit board 1, image sensor 2, bracket 3, filter 4, mounting groove 5, annular groove 6, buffer sleeve 7, through hole 8, steel sheet 9, vent hole 10, lens 11, and motor 12.

[0022] Example

[0023] The basic implementation examples are as follows: Figures 1-5 As shown, Figure 1 The integrated camera module shown includes a chip component, such as... Figure 2 The chip assembly shown includes a circuit board 1, an image sensor 2, a bracket 3, and a filter 4. The image sensor 2 is fixedly mounted on the upper end of the circuit board 1 and electrically connected to the circuit board 1, as shown below. Figure 2 and Figure 3 The bracket 3 shown is located at the top of the image sensor 2, as... Figure 3The bracket 3 shown has a mounting groove 5 at the middle of its upper end. The filter 4 is fixedly installed in the mounting groove 5 with adhesive, specifically LA adhesive. Figure 4 and Figure 5 The bracket 3 shown has an annular groove 6 at its lower end. The cross-section of the annular groove 6 is rectangular. Compared with other shapes such as circles, the rectangular annular groove 6 has more regular edge transitions. When injecting glue, the glue can flow more smoothly along the straight edges of the rectangle, reducing flow dead corners caused by irregular shapes. This makes the glue filling in the annular groove 6 faster and more even. The outer walls of the support legs on both sides of the lower end of the bracket 3 located in the annular groove 6 are all wrapped with buffer sleeves 7, and each buffer sleeve 7 is U-shaped. The lower end of the buffer sleeve 7 is in contact with the non-photosensitive area of ​​the image sensor 2. The U-shaped buffer sleeve 7 better matches the shape of the lower support leg of the bracket 3, reducing the assembly gap between the bracket 3 and the buffer sleeve 7. This prevents dust, moisture, and other impurities from entering the module, providing a certain degree of sealing and protection. This helps maintain a clean environment inside the module, ensuring the normal operation of the camera. Simultaneously, the U-shaped buffer sleeve 7 effectively absorbs and buffers energy when the camera module is subjected to external vibrations or impacts, reducing rigid collisions between the bracket 3 and the image sensor 2. This protects precision components such as the image sensor 2 from damage, improving the module's drop resistance and lifespan. Figure 3 The bracket 3 shown has a vertical through hole 8 on the upper right side, communicating with the annular groove 6. The cross-section of the through hole 8 is rectangular. Alternatively, the lower end of the through hole 8 can be flared, meaning the two side walls of the lower end of the through hole 8 expand along the length of the annular groove 6, thus guiding the adhesive and facilitating its flow within the annular groove 6 to both sides of the through hole 8. Steel plates 9 are fixedly installed on the inner walls of the through hole 8. Alternatively, the steel plates 9 can be embedded in a mold, and the bracket 3 can be integrally formed by injection molding. The bracket 3 has a vertical vent hole 10 on the upper left side, communicating with the annular groove 6. The vent hole 10 is cylindrical. Adhesive, specifically HD adhesive, is injected into the annular groove 6 through the through hole 8. Model: FH8636L. With the help of steel sheet 9, it can guide the flow of glue more evenly, avoid glue adhering to the inner wall of through hole 8, make the filling process of glue in annular groove 6 more stable, reduce local accumulation or insufficient filling, ensure the uniformity of glue distribution, and thus enhance the firmness of the bracket 3 and image sensor 2. While the glue is injected into annular groove 6, the air in annular groove 6 will be gradually pushed away from the through hole 8 by the glue, and finally smoothly discharged through vent hole 10. This avoids the problem of air being trapped by glue due to improper position of vent hole 10 and forming air bubbles, ensuring that the glue can fully fill annular groove 6, thereby fixing bracket 3 to the upper end of image sensor 2.

[0024] It also includes a camera assembly, which includes a motor 12 and a lens 11. The lens 11 is fixedly installed inside the motor 12. The motor 12 is fixedly installed on the upper end of the circuit board 1 with glue. Here, the glue is set to AA glue. The cooperation between the motor 12 and the lens 11 covers the image sensor 2 and the bracket 3.

[0025] The specific implementation process is as follows:

[0026] During installation, the operator first fixes the image sensor 2 to the upper part of the circuit board 1, then fixes the filter 4 to the mounting groove 5 of the bracket 3 with glue. Next, each buffer sleeve 7 is placed on both sides of the annular groove 6 at the lower end of the bracket 3. Then, the bracket 3 is placed on top of the image sensor 2, with the buffer sleeve 7 at the lower end of the bracket 3 in contact with the non-photosensitive area of ​​the image sensor 2 to prevent the bracket 3 from interfering with the normal operation of the image sensor 2. Finally, glue is injected into the annular groove 6 through the through hole 8 to completely fill the annular groove 6, thereby fixing the bracket 3 on top of the non-photosensitive area of ​​the image sensor 2. This avoids the bracket 3 occupying the space for the components on the circuit board 1, improves the space utilization of the circuit board 1, and reduces the volume of the circuit board 1 in the X / Y direction, thus reducing the volume of the camera module. Then, the lens 11 is installed in the motor 12, and the motor 12 is fixed on the upper part of the circuit board 1, thus completing the assembly of the integrated camera module.

[0027] The above descriptions are merely embodiments of this utility model. Commonly known technical solutions and / or characteristics are not described in detail here. It should be noted that those skilled in the art can make various modifications and improvements without departing from the technical solution of this utility model. These modifications and improvements should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. An integrated camera module, characterized in that: The device includes a chip assembly, which comprises a circuit board, an image sensor, a bracket, and a filter. The image sensor is located on the upper end of the circuit board, and the bracket is located on the upper end of the image sensor, with the lower end of the bracket located in the non-photosensitive area of ​​the image sensor. A mounting groove is formed at the end of the bracket away from the circuit board, and the filter is placed in the mounting groove. An annular groove is formed at the lower end of the bracket, and a through hole connected to the annular groove is formed at the end of the bracket away from the circuit board. A vent hole connected to the annular groove is formed at the end of the bracket away from the circuit board. Glue is injected into the annular groove through the through hole to fix the bracket to the upper end of the image sensor.

2. The integrated camera module according to claim 1, characterized in that: The through holes are rectangular, and the inner walls of the through holes are all lined with steel plates.

3. The integrated camera module according to claim 2, characterized in that: The annular groove is rectangular, and the outer wall of the end of the bracket that contacts the image sensor is covered with a buffer sleeve, and both buffer sleeves are U-shaped.

4. The integrated camera module according to claim 3, characterized in that: The vent is located on the side of the bracket away from the through hole.

5. The integrated camera module according to claim 4, characterized in that: The adhesive is set to HD adhesive.

6. The integrated camera module according to claim 5, characterized in that: It also includes a camera assembly, which includes a motor and a lens. The lens is located inside the motor, which is located on the top of the circuit board. The motor and lens cover the image sensor and the bracket.

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