A reflow soldering apparatus for surface mount electronic components

Abstract

This utility model discloses a reflow soldering device for surface-mount electronic components, belonging to the technical field of PCB board soldering equipment. It includes a reflow soldering machine body and a docking platform. The docking platform is located at the discharge end of the reflow soldering machine body and includes a frame, conveyor rollers, a first drive mechanism, and a correction mechanism. The conveyor rollers are rotatably supported on the frame. The first drive mechanism is located on one side of the frame. The correction mechanism includes a fixed baffle, a movable baffle, a guide rail, a slide, and a second drive mechanism. The fixed baffle is located on the inner upper part of the frame, the guide rail is located inside the frame, and the slide is slidably mounted on the guide rail. The lower end of the movable baffle is connected to the slide, and the upper end of the movable baffle extends through the space between two adjacent conveyor rollers. The second drive mechanism is located inside the frame and is used to drive the movable baffle to move. The PCB board falling onto the docking platform is corrected under the combined action of the movable and fixed baffles, thereby ensuring that the PCB board can smoothly enter the feeding end of the next process.

Description

Technical Field

[0001] This utility model relates to the field of PCB board welding equipment technology, specifically to a reflow soldering device for chip electronic components. Background Technology

[0002] In the field of electronic component manufacturing, reflow soldering is a core step in surface mount technology (SMT), which involves soldering electronic components onto a bare PCB board. To improve work efficiency and reduce labor costs, automated production lines are generally used. Materials from the reflow soldering machine are transported to the inspection equipment conveyor line or the sorting equipment conveyor line. However, during the transfer of PCB boards during reflow soldering, vibration or differences in conveyor belt speed can cause the PCB boards to shift, preventing them from smoothly entering the next workstation's conveyor line. Utility Model Content

[0003] The purpose of this invention is to provide a reflow soldering device for surface-mount electronic components, which has a simple structure, is easy to use, and can effectively improve the above-mentioned problems.

[0004] The embodiments of this utility model are implemented as follows:

[0005] This utility model provides a reflow soldering device for surface-mount electronic components, including a reflow soldering machine body and a docking platform. The docking platform is disposed at the discharge end of the reflow soldering machine body. The docking platform includes a frame, conveying rollers, a first drive mechanism, and a correction mechanism. The conveying rollers are rotatably supported on the frame. There are multiple conveying rollers, which are distributed in parallel and spaced apart. The first drive mechanism is disposed on one side of the frame and is used to drive the conveying rollers to rotate. The correction mechanism includes a fixed baffle, a movable baffle, a guide rail, a slide, and a second drive mechanism. The fixed baffle is disposed on the inner side of the upper end of the frame. The guide rail is disposed inside the frame and located below the conveying rollers. The length direction of the guide rail is consistent with the axial direction of the conveying rollers. The slide is slidably disposed on the guide rail. The lower end of the movable baffle is connected to the slide, and the upper end of the movable baffle extends through the space between two adjacent conveying rollers. The second drive mechanism is disposed inside the frame and is used to drive the movable baffle to move.

[0006] Furthermore, the movable baffle includes a plate body and plate teeth, and there are multiple plate teeth. The multiple plate teeth are distributed at intervals along the length direction of the plate body. The plate body is connected to the slide block, and each plate tooth passes through a pair of adjacent conveyor rollers.

[0007] Furthermore, protective pads are provided on the upper end of the tooth near the fixed baffle and on the side of the fixed baffle near the movable baffle.

[0008] Furthermore, the second drive mechanism includes an electric push rod, which is fixed inside the frame, and the front end of the piston rod of the electric push rod is connected to the movable baffle.

[0009] Furthermore, the number of guide rails is at least two, and they are arranged in parallel at intervals.

[0010] Furthermore, the lower end of the support legs of the frame is provided with adjustable feet.

[0011] Furthermore, the first drive mechanism includes a first drive motor, pulleys, and a transmission belt. The first drive motor is located at one end of the outer side of the frame. There are multiple pulleys, one of which is located on the output shaft of the first drive motor, and the remaining pulleys are respectively located at one end of the conveyor roller. Each pulley corresponds to a conveyor roller. A transmission belt is provided between two adjacent pulleys. The pulley on the first drive motor is connected to a pulley on one of the conveyor rollers via the transmission belt.

[0012] The beneficial effects of this utility model are as follows:

[0013] The reflow soldering device for chip electronic components provided in this utility model has a simple structure and is easy to use. When the PCB board comes out from the discharge end of the main body of the reflow soldering machine, it falls onto the receiving table. The second drive mechanism can drive the movable baffle to move and work together with the fixed baffle to correct the PCB board, thereby ensuring that the PCB board can smoothly enter the feeding end of the next process and ensuring the smooth operation of the automated production line. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0015] Figure 1 A schematic diagram of the structure of the reflow soldering apparatus for chip electronic components provided in this embodiment of the utility model;

[0016] Figure 2 This is a structural diagram of the docking station;

[0017] Figure 3 This is a schematic diagram of the movable baffle.

[0018] In the diagram: 1-Reflow soldering machine body; 2-Connecting platform; 21-Frame; 22-Transfer roller; 23-First drive mechanism; 231-First drive motor; 232-Pulley; 233-Transmission belt; 24-Correction mechanism; 241-Fixed baffle; 242-Modible baffle; 2421-Plate body; 2422-Plate teeth; 243-Guide rail; 244-Slide; 245-Electric push rod; 25-Adjusting foot. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the present utility model and are not intended to limit the present utility model; that is, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The components of the embodiments of the present utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0020] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the utility model product is usually placed in during use, or the orientation or positional relationship that is commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0021] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; or they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] The present invention will be further described below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited to the following description.

[0023] refer to Figure 1 As shown, this utility model embodiment provides a reflow soldering apparatus for chip electronic components, including a reflow soldering machine body 1 and a docking station 2.

[0024] The main body 1 of the reflow soldering machine adopts existing technology, with one end being the feeding end and the other end being the discharging end.

[0025] The connecting platform 2 is located at the discharge end of the reflow soldering machine body 1.

[0026] refer to Figure 2 As shown, the connecting platform 2 includes a frame 21, a conveyor roller 22, a first drive mechanism 23, and a correction mechanism 24.

[0027] The frame 21 serves to support other components. Adjustable feet 25 are provided at the lower ends of the support legs of the frame 21, and these feet are threadedly connected to the support legs, facilitating the adjustment of the frame 21's stability. Conveyor rollers 22 are rotatably supported on the frame 21. The axial direction of the conveyor rollers 22 is consistent with the width direction of the frame 21. There are multiple conveyor rollers 22, which are distributed in parallel at intervals.

[0028] The first drive mechanism 23 includes a first drive motor 231, pulleys 232, and a transmission belt 233. The first drive motor 231 is located at one end of the outer side of the frame 21. There are multiple pulleys 232, one of which is located on the output shaft of the first drive motor 231. The remaining pulleys 232 are located at one end of the conveyor rollers 22 and can rotate synchronously. The pulleys 232 and the first drive motor 231 are located on the same side of the frame 21. The pulleys 232 and the conveyor rollers 22 correspond one-to-one. A transmission belt 233 is provided between two adjacent pulleys 232. The pulleys 232 on the first drive motor 231 are connected to the pulleys 232 on the conveyor rollers 22 at the end of the first drive motor 231 via the transmission belt 233. In this way, the first drive motor 231 can drive all the conveyor rollers 22 to rotate, thereby conveying the items falling on them.

[0029] The correction mechanism 24 includes a fixed baffle 241, a movable baffle 242, a guide rail 243, a slide block 244, and a second drive mechanism. The fixed baffle 241 is disposed on one side of the upper inner side of the frame 21. The guide rail 243 is disposed inside the frame 21 and located below the conveyor roller 22. The length direction of the guide rail 243 is consistent with the axial direction of the conveyor roller 22. There are at least two guide rails 243, which are arranged in parallel and spaced apart. The slide block 244 is slidably disposed on the guide rail 243. The number of slide blocks 244 is the same as the number of guide rails 243 and corresponds one-to-one.

[0030] refer to Figure 3As shown, the movable baffle 242 includes a plate body 2421 and plate teeth 2422. There are multiple plate teeth 2422, spaced apart along the length of the plate body 2421. The plate body 2421 is detachably connected to the slide block 244 for easy assembly and disassembly. The length of the plate body 2421 is aligned with the length of the frame 21. Each plate tooth 2422 passes through a pair of adjacent conveyor rollers 22, with its upper end higher than the horizontal level of the conveyor rollers 22. The second drive mechanism includes an electric push rod 245, which is fixed within the frame 21. The piston rod of the electric push rod 245 is connected to the movable baffle 242, and the electric push rod 245 drives the movable baffle 242 to slide along the length of the guide rail 243.

[0031] Of course, the second drive mechanism can also be a hydraulic cylinder or a pneumatic cylinder.

[0032] Protective pads are provided on the upper end of the tooth 2422 near the fixed baffle 241 and on the side of the fixed baffle near the movable baffle. The protective pads protect the items.

[0033] The working principle of the reflow soldering device for chip electronic components provided in this embodiment of the invention is as follows:

[0034] After the PCB board is mounted, it is fed into the reflow soldering machine body 1 from the feed end. After being preheated, heated and cooled by the reflow soldering machine body 1, the electronic components are firmly soldered onto the PCB board. Then it is output from the discharge end of the reflow soldering machine body 1 and falls onto the receiving table 2. Since the PCB board is not oriented correctly when it falls onto the receiving table 2, it cannot be accurately transferred into the receiving machine. At this time, the electric push rod 245 drives the movable baffle 242 to slide toward the fixed baffle 241, and then corrects the PCB board. This ensures that the PCB board can smoothly enter the testing or sorting equipment.

[0035] The above description is merely a preferred embodiment of this utility model and does not constitute any limitation on this utility model. Any person skilled in the art can make many possible variations and modifications to the technical solution of this utility model, or modify it into equivalent embodiments, without departing from the scope of the technical solution of this utility model. Therefore, any modifications, equivalent changes, and alterations made to the above embodiments based on the technology of this utility model without departing from the scope of the technical solution of this utility model shall fall within the protection scope of this technical solution.

Claims

1. A reflow soldering apparatus for surface-mount electronic components, characterized in that: The reflow soldering machine includes a main body and a connecting platform. The connecting platform is located at the discharge end of the main body and includes a frame, conveyor rollers, a first drive mechanism, and a correction mechanism. The conveyor rollers are rotatably supported on the frame, and there are multiple conveyor rollers arranged in parallel and spaced apart. The first drive mechanism is located on one side of the frame and is used to drive the conveyor rollers to rotate. The correction mechanism includes a fixed baffle, a movable baffle, a guide rail, a slide, and a second drive mechanism. The fixed baffle is located on the inner side of the upper end of the frame. The guide rail is located inside the frame and below the conveyor rollers, with its length direction aligned with the axis of the conveyor rollers. The slide is slidably mounted on the guide rail. The lower end of the movable baffle is connected to the slide, and the upper end of the movable baffle extends through the space between two adjacent conveyor rollers. The second drive mechanism is located inside the frame and is used to drive the movable baffle to move.

2. The reflow soldering apparatus for surface-mount electronic components according to claim 1, characterized in that: The movable baffle includes a plate body and plate teeth. There are multiple plate teeth, which are spaced apart along the length of the plate body. The plate body is connected to the slide block, and each plate tooth passes through a pair of adjacent conveyor rollers.

3. The reflow soldering apparatus for surface-mount electronic components according to claim 2, characterized in that: Protective pads are provided on the upper end of the toothed plate near the fixed baffle and on the side of the fixed baffle near the movable baffle.

4. The reflow soldering apparatus for surface-mount electronic components according to claim 1, characterized in that: The second drive mechanism includes an electric push rod, which is fixed inside the frame, and the front end of the piston rod of the electric push rod is connected to the movable baffle.

5. The reflow soldering apparatus for surface-mount electronic components according to claim 1, characterized in that: The number of guide rails is at least two, and they are arranged in parallel with a gap between them.

6. The reflow soldering apparatus for surface-mount electronic components according to claim 1, characterized in that: The frame is equipped with adjustable feet at the lower end of its support legs.

7. The reflow soldering apparatus for surface-mount electronic components according to claim 1, characterized in that: The first drive mechanism includes a first drive motor, pulleys, and a transmission belt. The first drive motor is located at one end of the outer side of the frame. There are multiple pulleys, one of which is located on the output shaft of the first drive motor, and the remaining pulleys are respectively located at one end of the conveyor roller. Each pulley corresponds to a conveyor roller. A transmission belt is provided between two adjacent pulleys. The pulley on the first drive motor is connected to a pulley on one of the conveyor rollers via the transmission belt.

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