A laser processing apparatus for frequency doubling cores

Abstract

This utility model discloses a laser processing device for frequency doubling chips, relating to the technical field of chip laser processing devices. The device includes a platform, with a platform base integrally formed at the upper end of the platform. A vertical support is provided on one side of the platform base, and the vertical support is an integral structure with the platform. A lifting guide groove is provided inside the vertical support, and a crossbeam plate is movably mounted inside the lifting guide groove. The device also includes a sliding guide groove, located inside the crossbeam plate, with a threaded screw inside the sliding guide groove. A screw slider is movably mounted on the screw, and a laser welding machine is located below the screw slider. This invention solves the problem that existing laser welding devices, while using a sliding clamping mechanism to facilitate the fixing and welding of chips of different sizes, only allow welding of one side of the chip's pins during the welding process due to the chip being fixed, thus affecting the efficiency of chip laser welding.

Description

Technical Field

[0001] This utility model relates to the field of chip laser processing equipment technology, specifically a laser processing equipment for frequency doubling cores. Background Technology

[0002] A frequency multiplier chip is an integrated circuit chip that multiplies the frequency of an input signal. It is mainly achieved by utilizing the nonlinear characteristics of electronic devices or phase-locked loop technology. During the manufacturing process, a laser welding device is needed to weld the pins and the chip together.

[0003] For example, announcement number CN109047973A (titled "A Laser Soft Soldering Processing Device for Chip Welding") includes a base, a cooling box, and a fixing frame. The cooling box is bolted to one end of the top of the base. A semiconductor cooling chip is mounted on one end of the cooling box via a mounting slot. A fiber optic obstacle finder is placed on one side of the cooling box via a foam limiting slot. A fan is installed inside the cooling box via a mounting bracket. A bearing is installed on the other side of the cooling box via a limiting slot. A motor mounting base is mounted on the other end of the top of the base via a mounting plate. A servo motor is mounted on the top of the motor mounting base. The servo motor's output... The output shaft and bearing are respectively bolted to the two ends of the fixed frame. The inner wall of the fixed frame is provided with a first slide rail on both sides. The two sides of the first slide rail are provided with an extrusion plate. The extrusion plate is provided with a limit groove on one side. The two ends of the fixed frame are connected to the first spring through the fixing block, and the other end of the first spring is fixed to the extrusion plate. The lower end of the fixed frame is bolted to the second slide rail, and the upper end of the second slide rail is provided with a sliding seat. A micro vibration motor is installed in the sliding seat. The output shaft of the micro vibration motor is connected to the vibration block through the second spring. The top of the refrigeration box is mounted with an exhaust fan through the mounting block.

[0004] The aforementioned laser welding device facilitates the welding of chips of different sizes by using a sliding clamping mechanism. However, since the chip is fixed during the welding process, only one side of the chip's pins can be welded, which affects the efficiency of the laser welding process. To address this, we provide a laser processing device for frequency doubling chips. Utility Model Content

[0005] The purpose of this invention is to provide a laser processing device for frequency doubling chips, in order to solve the problem mentioned in the background art that the existing laser welding device facilitates the welding of chips of different sizes by setting a sliding clamping mechanism, but during the welding process, because the chip is fixed, only one side of the chip's pins can be welded, which affects the efficiency of chip laser welding processing.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a laser processing device for frequency doubling cores, including a device table, an integrally formed platform base at the upper end of the device table, a vertical support on one side of the platform base, the vertical support and the device table being an integral structure, a lifting guide groove inside the vertical support, and a crossbeam plate being movably and vertically arranged inside the lifting guide groove.

[0007] Also includes:

[0008] A sliding guide groove is provided inside the crossbeam plate, and a threaded screw is provided inside the sliding guide groove. A screw slider is movably provided on the screw. A laser welding machine is provided below the screw slider. An electric push rod is provided at the rear end of the vertical support. The electric push rod is fixedly connected to the device platform by screws. The top of the piston rod of the electric push rod is welded to the crossbeam plate.

[0009] A support round base is welded to the upper end of the platform base, and a support shaft is rotatably provided at the upper end of the support round base. A chip placement frame is welded to the upper end of the support shaft, and pin placement slots are provided on the outer walls of the chip placement frame.

[0010] The corresponding perforated plate is welded to the outer wall of the support shaft, and a pin is inserted through the inside of the corresponding perforated plate.

[0011] Preferably, the pin slots are provided in four groups, with seven pin slots in each group. A screw hole plate is provided above the pin slots. The screw hole plate and the chip placement frame are an integral structure. A clamping screw is movably installed inside the screw hole plate.

[0012] Preferably, the upper surface of the support base is provided with four positioning holes, the arc between two adjacent positioning holes is ninety degrees, and the corresponding hole plate is positioned and connected to one positioning hole by a pin.

[0013] Preferably, the support circular seat is provided with a limiting groove inside, and a limiting disk is rotatably provided inside the limiting groove. The limiting disk and the support shaft are an integral structure.

[0014] Preferably, a servo motor is installed in a groove on one side of the sliding guide groove. The servo motor is fixedly connected to the crossbeam plate by screws, and the output shaft of the servo motor is connected to the threaded screw inside the sliding guide groove through a coupling.

[0015] Preferably, two connecting rods are provided between the lead screw slider and the laser welding machine, and the two ends of the connecting rods are welded to the lead screw slider and the laser welding machine, respectively.

[0016] Preferably, a power supply box is fixedly mounted on the front end face of the vertical support by screws, and the output end of the power supply box is electrically connected to the input end of the laser welding machine via a power cord.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] This invention improves the efficiency of frequency multiplier core welding by placing the frequency multiplier core inside the chip placement frame, then placing the chip pins into each pin slot, and finally rotating the clamping screw to lower and press the chip pins into the pin slots. A laser welding machine is then used to weld the connection between the chip pins and the frequency multiplier core. During each welding operation, the chip placement frame is rotated 90 degrees via the rotational connection between the support shaft and the carrier base, and positioned using pins installed in the positioning holes and corresponding perforated plates. After welding one side of the chip pins, the frame is rotated another 90 degrees until all four sides are welded. This overcomes the problem in existing laser welding devices where the sliding clamping mechanism allows for the fixing of chips of different sizes, but the fixed chip limits welding to only one side, thus affecting the efficiency of laser welding. Attached Figure Description

[0019] Figure 1 This is a front view of the structure of the laser processing device for frequency doubling core according to this utility model;

[0020] Figure 2 This is a rear view of the structure of the laser processing device for frequency doubling core according to the present invention;

[0021] Figure 3 This is a cross-sectional view of the internal structure of the chip placement frame of this utility model;

[0022] Figure 4 This is an enlarged schematic diagram of part A of the present invention;

[0023] In the diagram: 1. Device platform; 2. Support leg; 3. Vertical bracket; 4. Electric push rod; 5. Lifting guide groove; 6. Crossbeam plate; 7. Sliding guide groove; 8. Servo motor; 9. Lead screw and slider; 10. Laser welding machine; 11. Connecting rod; 12. Power supply box; 13. Platform base; 14. Loading round base; 15. Chip placement frame; 16. Support shaft; 17. Threaded lead screw; 18. Pin placement slot; 19. Limiting slot; 20. Limiting plate; 21. Positioning hole; 22. Corresponding hole plate; 23. Pin; 24. Screw hole plate; 25. Clamping screw. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0025] Please see Figure 1-4An embodiment of this utility model is provided: a laser processing device for frequency doubling core, including a device platform 1, a platform base 13 integrally formed on the upper end of the device platform 1, a vertical support 3 on one side of the platform base 13, the vertical support 3 and the device platform 1 are integrally formed, a lifting guide groove 5 is provided inside the vertical support 3, and a crossbeam plate 6 is movably and vertically arranged inside the lifting guide groove 5.

[0026] Also includes:

[0027] The sliding guide groove 7 is set inside the crossbeam plate 6, and the sliding guide groove 7 is provided with a threaded screw 17. A screw slider 9 is movably set on the screw 17. A laser welding machine 10 is set below the screw slider 9. An electric push rod 4 is set at the rear end of the vertical support 3. The electric push rod 4 is fixedly connected to the device platform 1 by screws. The top of the piston rod of the electric push rod 4 is welded to the crossbeam plate 6.

[0028] The support round base 14 is welded to the upper end of the platform base 13, and the upper end of the support round base 14 is rotatably provided with a support shaft 16. The upper end of the support shaft 16 is welded to a chip placement frame 15, and pin placement slots 18 are provided on the outer walls of the chip placement frame 15.

[0029] The corresponding perforated plate 22 is welded to the outer wall of the support shaft 16, and a pin 23 is inserted through the inside of the corresponding perforated plate 22.

[0030] In use, the frequency multiplier core is placed inside the chip placement frame 15, and then the chip pins are placed into each pin slot 18. The clamping screw 25 is then rotated to descend, clamping the chip pins into the pin slots 18. The connection between the chip pins and the frequency multiplier core is then welded using a laser welding machine 10 (the chip placement frame is at a 40-50 degree angle in the diagram). During each welding operation, the chip placement frame is rotated 90 degrees via the rotational connection between the support shaft 16 and the support base 14, and the connection is established through the positioning holes 21 and... The pins 23 are installed in the corresponding hole plate 22 for positioning. After each chip pin on one side is welded, the plate rotates 90 degrees until all pins on all four sides are welded. This improves the efficiency of welding the frequency multiplier core. The electric push rod 4 drives the crossbeam plate 6 to move up and down, so that the laser welding machine 10 can move up and down. The servo motor 8 drives the threaded screw 17 to rotate, so that the screw slider 9 and the laser welding machine 10 slide horizontally along the sliding guide groove 7, which assists the laser welding machine 10 in welding multiple chip pins.

[0031] Please see Figure 1 and Figure 4The pin placement slots 18 are arranged in four groups, with seven pin placement slots in each group. A screw hole plate 24 is positioned above each pin placement slot 18. The screw hole plate 24 is an integral structure with the chip placement frame 15. A clamping screw 25 is movably installed inside the screw hole plate 24. After the chip pins are placed in the pin placement slots 18, the clamping screw 25 is rotated to clamp and fix the chip pins. Please refer to [link / reference]. Figure 1 and Figure 4 The upper surface of the support base 14 has four positioning holes 21. The distance between two adjacent positioning holes 21 is 90 degrees. The corresponding hole plate 22 is positioned and connected to one positioning hole 21 by a pin 23. The four positioning holes 21 on the upper surface of the support base 14 facilitate positioning of the chip placement frame 15 after each 90-degree rotation. Please refer to [link / reference]. Figure 4 The support round base 14 has a limiting groove 19 inside, and a limiting disk 20 is rotatably mounted inside the limiting groove 19. The limiting disk 20 and the support shaft 16 are an integral structure. The limiting groove 19 inside the support round base 14 facilitates the rotation of the limiting disk 20 and prevents the support shaft 16 from detaching from the support round base 14. Please refer to [link / reference]. Figure 1 and Figure 2 A servo motor 8 is installed in a groove on one side of the sliding guide groove 7. The servo motor 8 is fixedly connected to the crossbeam plate 6 by screws. The output shaft of the servo motor 8 is connected to the threaded screw 17 inside the sliding guide groove 7 via a coupling. The servo motor 8 installed in the groove on one side of the sliding guide groove 7 drives the threaded screw 17 to move forward and backward. Please refer to [link to relevant documentation]. Figure 1 Two connecting rods 11 are provided between the lead screw slider 9 and the laser welding machine 10. The two ends of the connecting rods 11 are welded to the lead screw slider 9 and the laser welding machine 10 respectively. The two connecting rods 11 between the lead screw slider 9 and the laser welding machine 10 serve to fix and connect the lead screw slider 9 and the laser welding machine 10. Please refer to [link / reference]. Figure 1 A power supply box 12 is fixedly mounted on the front end of the vertical bracket 3 by screws. The output end of the power supply box 12 is electrically connected to the input end of the laser welding machine 10 through a power cord. The power supply box 12 fixedly mounted on the front end of the vertical bracket 3 by screws serves to supply power to the laser welding machine 10.

[0032] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A laser processing device for frequency doubling core, comprising a device table (1), a platform base (13) integrally formed on the upper end of the device table (1), a vertical support (3) provided on one side of the platform base (13), the vertical support (3) and the device table (1) being an integral structure, a lifting guide groove (5) provided inside the vertical support (3), and a crossbeam plate (6) movably lifted inside the lifting guide groove (5). characterized in that Also includes: The sliding guide groove (7) is located inside the crossbeam plate (6), and a threaded screw (17) is provided inside the sliding guide groove (7). A screw slider (9) is movably provided on the screw (17). A laser welding machine (10) is provided below the screw slider (9). An electric push rod (4) is provided at the rear end of the vertical support (3). The electric push rod (4) is fixedly connected to the device platform (1) by screws. The top position of the piston rod of the electric push rod (4) is welded to the crossbeam plate (6). The support round base (14) is welded to the upper end of the platform base (13), and the upper end of the support round base (14) is rotatably provided with a support shaft (16). The upper end of the support shaft (16) is welded with a chip placement frame (15), and pin placement slots (18) are provided on the outer walls of the chip placement frame (15). The corresponding perforated plate (22) is welded to the outer wall of the support shaft (16), and a pin (23) is inserted through the interior of the corresponding perforated plate (22).

2. The laser processing apparatus for a frequency multiplication core according to claim 1, characterized by: The pin slots (18) are provided in four groups, and each group of pin slots (18) is provided with seven pins. A screw hole plate (24) is provided above the pin slots (18). The screw hole plate (24) and the chip placement frame (15) are an integral structure. A clamping screw (25) is provided inside the screw hole plate (24).

3. The laser processing apparatus for a frequency multiplication core according to claim 1, wherein: The upper surface of the support round base (14) is provided with four positioning holes (21), the arc between two adjacent positioning holes (21) is ninety degrees, and the corresponding hole plate (22) is positioned and connected to one positioning hole (21) by a pin (23).

4. The laser processing apparatus for a frequency multiplication core according to claim 1, wherein: The support round seat (14) is provided with a limiting groove (19) inside, and a limiting disk (20) is provided inside the limiting groove (19) for rotation. The limiting disk (20) and the support shaft (16) are an integral structure.

5. The laser processing apparatus for a frequency multiplication core according to claim 1, wherein: A servo motor (8) is provided in a groove on one side of the sliding guide groove (7). The servo motor (8) is fixedly connected to the crossbeam plate (6) by screws. The output shaft of the servo motor (8) is connected to the threaded screw (17) inside the sliding guide groove (7) through a coupling.

6. The laser processing apparatus for a frequency multiplication core according to claim 1, wherein: Two connecting rods (11) are provided between the lead screw slider (9) and the laser welding machine (10), and the two ends of the connecting rods (11) are welded to the lead screw slider (9) and the laser welding machine (10) respectively.

7. The laser processing apparatus for a frequency multiplication core according to claim 1, wherein: A power supply box (12) is fixedly mounted on the front end face of the vertical support (3) by screws. The output end of the power supply box (12) is electrically connected to the input end of the laser welding machine (10) through a power line.

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