A photosensitive element, a sunlight sensor, and a vehicle air conditioning system

Abstract

This invention discloses a photosensitive element, a sunlight sensor, and a vehicle air conditioning system, including a photosensitive chip and a lead frame. The photosensitive chip is used to detect light intensity. The lead frame includes a first pin and a second pin respectively disposed on both sides of the photosensitive chip. Both the first pin and the second pin include a bent portion, which can be bent to adjust the angle of the photosensitive chip. This invention adjusts the angle of the photosensitive chip by bending the bent portion, making it consistent with the installation angle of the car windshield. By setting the bent portion on the lead, precise bending operations can be performed along the bent portion, effectively replacing the traditional angle base, simplifying the installation process, avoiding additional assembly steps, increasing flexibility, allowing adjustments according to different vehicle models and windshield angles, and also improving measurement accuracy.

Description

Technical Field

[0001] This utility model relates to the field of photosensitive components technology, specifically to a photosensitive element, a sunlight sensor, and a vehicle air conditioning system. Background Technology

[0002] With the rapid development of the automotive electronics industry, sunlight sensors have gradually become an indispensable component in modern automobiles. In recent years, sunlight sensors have been widely used in vehicles, and their main function is to sense the intensity of infrared thermal radiation in the solar spectrum. By collecting the signal strength provided by the sunlight sensor, the vehicle control system can intelligently realize the automatic control of the vehicle's air conditioning system, thereby providing a more comfortable in-vehicle environment for passengers based on external environmental conditions.

[0003] As the core component of a sunlight sensor, the performance and installation requirements of the photosensitive element are crucial. In order to directly detect the intensity of sunlight shining on the occupants of the vehicle and better reflect the perception of the human body surface, the photosensitive element must be installed at the same angle as the windshield of the car. This ensures that the sunlight sensor can collect sunlight information more accurately, thereby controlling the airflow from the air conditioning vents more precisely and further improving the comfort of the passengers.

[0004] However, the photosensitive elements of the single-channel sunlight sensors widely used in the market have some problems. The two pins of these photosensitive elements are usually set in parallel on the same side of the encapsulation. This structure means that in order to achieve the required installation angle, the element usually needs to be bent and fixed to a base with a specific angle first, and then the entire assembly is fixed on the PCB circuit board. The process is relatively complicated, which not only increases the processing cost, but also makes the installation process time-consuming and labor-intensive. Utility Model Content

[0005] To overcome at least one of the aforementioned drawbacks, this invention provides a photosensitive element, a sunlight sensor, and a vehicle air conditioning system. The objective of this invention can be achieved by employing the following technical solution:

[0006] A first aspect of this application provides a photosensitive element, comprising:

[0007] A photosensitive chip used to detect light intensity;

[0008] The lead frame includes a first pin and a second pin respectively disposed on both sides of the photosensitive chip. Both the first pin and the second pin are connected to the photosensitive chip. Both the first pin and the second pin include a bending portion, which can be bent to adjust the angle of the photosensitive chip.

[0009] In one possible implementation, the first pin includes:

[0010] The first connecting segment is inclined.

[0011] The first support section is vertically arranged.

[0012] The first curved portion, wherein the first connecting end of the first connecting segment is connected to the first support segment at an angle through the first curved portion.

[0013] In one possible implementation, the second pin includes:

[0014] The second connecting segment is inclined.

[0015] The second support section is vertically arranged.

[0016] The second curved portion, wherein the first connecting end of the second connecting segment is connected to the second support segment at an angle through the second curved portion.

[0017] In one possible implementation, the angle between the first connecting segment and the first supporting segment is 40°~70°, and the angle between the second connecting segment and the second supporting segment is 110°~140°.

[0018] In one possible implementation, the photosensitive chip is positioned facing the light-transmitting glass to detect the light intensity passing through the light-transmitting glass, and the angle between the photosensitive chip and the light-transmitting glass is no greater than 5°.

[0019] In one possible implementation, it further includes:

[0020] An encapsulating colloid, which is transparent, covers the photosensitive chip, and the curved portion is located outside the encapsulating colloid.

[0021] In one possible implementation, the second connection end of the first connection segment is electrically connected to the photosensitive chip via a conductive material, and the second connection ends of the second connection segments are all electrically connected to the photosensitive chip via bonding leads, wherein the bonding leads and the conductive material are located within the encapsulation colloid.

[0022] A second aspect of this application provides a sunlight sensor, comprising a photosensitive element according to any one of the first aspects.

[0023] A third aspect of this application provides a vehicle air conditioning system, including the sunlight sensor of the second aspect.

[0024] The beneficial technical effects of this utility model are as follows: According to the present disclosure, the photosensitive element, sunlight sensor, and vehicle air conditioning system include a photosensitive chip and a lead frame. The first and second pins of the photosensitive element are respectively located on both sides of the photosensitive chip, and both include a bending portion. During installation, the bending portion can be bent to adjust the angle of the photosensitive chip so that it is consistent with the installation angle of the car windshield. By setting the bending portion on the lead wire, a precise bending operation can be performed along the bending portion, effectively replacing the traditional angle base, simplifying the installation process, avoiding additional assembly steps, increasing flexibility, allowing adjustment according to different vehicle models and windshield angles, and also improving measurement accuracy. Attached Figure Description

[0025] The following are given by way of example and without limitation in the accompanying drawings:

[0026] Figure 1 A schematic diagram of the structure of the photosensitive element provided in the embodiment is shown;

[0027] Figure 2 A structural perspective view of the photosensitive element provided in the embodiment is shown;

[0028] Figure 3 A schematic diagram of the internal structure of the photosensitive element provided in the embodiment is shown.

[0029] In the picture:

[0030] 1. Photosensitive chip; 2. First pin; 21. First connecting segment; 22. First supporting segment; 23. First bending portion; 3. Second pin; 31. Second connecting segment; 32. Second supporting segment; 33. Second bending portion; 4. Encapsulating colloid. Detailed Implementation

[0031] In the following detailed disclosure, these embodiments are fully described with reference to the accompanying drawings. In order to enable those skilled in the art to understand and clarify the technical solution of this utility model more clearly, the embodiments described below are not limited thereto. The present utility model will be further described in detail below with reference to the embodiments and the accompanying drawings.

[0032] In this utility model, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "install," "connect," "join," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "join" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0033] In the description of this utility model, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0034] The first aspect of this application, as Figures 1-3 As shown, a photosensitive element is provided, including a photosensitive chip 1 and a lead frame. The photosensitive chip 1 is used to detect light intensity. The lead frame includes a first pin 2 and a second pin 3 respectively disposed on both sides of the photosensitive chip 1. Both the first pin 2 and the second pin 3 are connected to the photosensitive chip 1. Both the first pin 2 and the second pin 3 include a bending portion, which can be bent to adjust the angle of the photosensitive chip 1.

[0035] The photosensitive element provided in this embodiment has a first pin 2 and a second pin 3 respectively disposed on both sides of the photosensitive chip 1, and both include a bending section. During installation, the bending section can be bent to adjust the angle of the photosensitive chip 1 so that it is consistent with the installation angle of the car windshield. By setting the bending part on the lead wire, a precise bending operation can be performed along the bending part, eliminating the need for additional angle base fixing parts, simplifying the installation process, avoiding additional assembly steps, reducing material costs and processing fees, and also reducing manual installation time and related labor costs, thereby improving production efficiency.

[0036] The photosensitive element provided in this embodiment has a bent portion on the pin, which provides greater installation flexibility, allowing adjustments according to different vehicle models and windshield angles. It also improves installation accuracy, ensuring that the photosensitive surface of the photosensitive element is precisely matched with the angle of the windshield, thereby improving the measurement accuracy of the sunlight sensor.

[0037] In one possible implementation, such as Figure 3 As shown, the first pin 2 includes a first connecting section 21, a first supporting section 22 and a first bending section 23. The first connecting section 21 is inclined and the first supporting section 22 is vertical. The first connecting end of the first connecting section 21 is connected to the first supporting section 22 at an angle through the first bending section 23.

[0038] It is understandable that the installation angle of the photosensitive chip 1 can be precisely adjusted by setting the first bending part 23. The inclined design of the first connecting section 21 and the vertical setting of the first support section 22 form a natural angle reference. The angle can be adapted by simply bending the bending part without additional structural adjustments.

[0039] In one possible implementation, such as Figure 3As shown, the second pin 3 includes a second connecting section 31, a second supporting section 32, and a second bending portion 33. The second connecting section 31 is inclined, and the second supporting section 32 is vertical. The first connecting end of the second connecting section 31 is connected to the second supporting section 32 at an angle through the second bending portion 33.

[0040] Understandably, the connecting section and the support section form a rigid connection through the bending part, which ensures the mechanical strength of the overall structure while guaranteeing the adjustability of the angle. The three-section design effectively disperses the installation stress and avoids excessive stress on a single part.

[0041] The pins adopt a three-section configuration of connection section - bending section - support section. By adjusting the position of the bending section, the installation angle of photosensitive chip 1 can be precisely adjusted to adapt to different windshield tilt requirements. The tilt design of the connection section also shortens the bonding wire length and reduces signal transmission loss.

[0042] In one possible implementation, such as Figure 3 As shown, the angle between the first connecting segment 21 and the first supporting segment 22 is 40°~70°, that is, 40°≤α≤70°, and the angle between the second connecting segment 31 and the second supporting segment 32 is 110°~140°.

[0043] Understandably, when the photosensitive element is installed on the windshield, by adjusting the bending position and bending angle of the bending part, the installation angle with the windshield is kept consistent, that is, the photosensitive chip 1 is made as parallel as possible to the windshield. Compared with the traditional angle base, this greatly reduces the parallelism error between the photosensitive surface of the photosensitive chip 1 and the glass, allowing light to pass through the glass perpendicularly, reducing abnormal reflection and refraction of incident light at the glass interface, and improving detection performance.

[0044] In one possible implementation, the photosensitive chip 1 is positioned facing the light-transmitting glass to detect the light intensity passing through the light-transmitting glass, and the angle between the photosensitive chip 1 and the light-transmitting glass is no greater than 5°.

[0045] Specifically, when the parallelism error between the photosensitive surface of photosensitive chip 1 and the transparent glass is ≤5°, the incident light penetrates the glass almost perpendicularly, with an incident angle ≤5°. This significantly reduces Fresnel reflection, lowers reflection loss in the visible light band, improves optical signal reception efficiency, reduces multipath reflected light interference, and lowers ambient light intensity detection error.

[0046] In one possible implementation, such as Figure 2 and Figure 3 As shown, it also includes an encapsulating colloid 4, which is transparent and covers the photosensitive chip 1. The curved part is located outside the encapsulating colloid 4.

[0047] The transparent colloid is directly bonded to the photosensitive area of ​​the chip, forming a uniform dielectric layer to avoid reflection from the air interface. At the same time, the external bending part can avoid the interference of the incident light by the abrupt change in the refractive index of the colloid, ensuring that the light penetrates to the photosensitive surface at approximately perpendicular angles, while avoiding the risk of the colloid cracking.

[0048] The second connection end of the first connection segment 21 is electrically connected to the photosensitive chip 1 through a conductive material, and the second connection end of the second connection segment 31 is electrically connected to the photosensitive chip 1 through a bonding wire. The bonding wire and the conductive material are located inside the encapsulation colloid 4.

[0049] Understandably, the back electrode of photosensitive chip 1 is connected to the first pin 2 via a conductive material, and the pad of photosensitive chip 1 is connected to the second pin 3 via bonding leads (e.g., gold wire). This ensures reliable signal transmission and allows for the separation of power and signal transmission through different paths. The transparent encapsulating colloid 4 covering photosensitive chip 1 and bonding leads prevents external mechanical stress from directly acting on the solder joints and also prevents moisture, dust, and other impurities from corroding the bonding areas.

[0050] A second aspect of this application provides a sunlight sensor, comprising a photosensitive element according to any one of the first aspects.

[0051] Understandably, sunlight sensors provide environmental perception accuracy through photosensitive elements, becoming a core sensing unit for intelligent vehicles and automated systems. They can quickly and accurately detect changes in sunlight intensity and transmit this information to the air conditioning controller to maintain a stable interior temperature and improve the comfort of passengers.

[0052] A third aspect of this application provides a vehicle air conditioning system, including the sunlight sensor of the second aspect.

[0053] Understandably, by using a sunlight sensor to detect solar radiation intensity in real time, the vehicle's air conditioning system automatically adjusts the air conditioning outlet temperature and airflow. For example, it increases cooling capacity under strong sunlight and reduces power under weak sunlight to counteract the localized temperature rise caused by direct sunlight. It can also control multiple areas independently. For instance, by setting up dual-channel sunlight sensors to detect the difference in sunlight intensity between the driver's seat and the passenger seat, it can independently adjust the air outlet parameters on both sides to solve the problem of uneven temperature caused by different angles of the sun.

[0054] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0055] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

[0056] In view of the detailed description above, these and other changes can be made to these embodiments. This written description includes embodiments of the best mode disclosed in this utility model. The patent scope of this utility model is defined by the claims, which are not limited by this disclosure. The protection scope of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope disclosed in this utility model, based on the technical solution and concept of this utility model, are within the protection scope of this utility model.

Claims

1. A photosensitive element, characterized by, include: A photosensitive chip (1) is used to detect light intensity; The lead frame includes a first pin (2) and a second pin (3) respectively disposed at both ends of the photosensitive chip (1). The first pin (2) and the second pin (3) are both connected to the photosensitive chip (1). The first pin (2) and the second pin (3) both include a bending portion. The bending portion can be bent to adjust the angle of the photosensitive chip (1). The first pin (2) includes a first connecting segment (21) and a first supporting segment (22). The angle between the first connecting segment (21) and the first supporting segment (22) is 40°~70°. The second pin (3) includes a second connecting segment (31) and a second supporting segment (32). The angle between the second connecting segment (31) and the second supporting segment (32) is 110°~140°.

2. The photosensitive element according to claim 1, characterized by The first pin (2) also includes: The first curved portion (23) and the first connecting end of the first connecting segment (21) are connected at an angle to the first supporting segment (22) through the first curved portion (23). The first connecting segment (21) is inclined and the first supporting segment (22) is vertical.

3. The photosensitive element according to claim 2, characterized by The second pin (3) also includes: The second curved section (33) has its first connecting end connected to the second support section (32) at an angle through the second curved section (33). The second connecting section (31) is inclined and the second support section (32) is vertical.

4. The photosensitive element according to claim 1, characterized by The photosensitive chip (1) is positioned facing the light-transmitting glass to detect the light intensity passing through the light-transmitting glass, and the angle between the photosensitive chip (1) and the light-transmitting glass is no greater than 5°.

5. The photosensitive element according to claim 3 or 4, characterized by Also includes: The encapsulating colloid (4) is transparent and covers the photosensitive chip (1), with the curved portion located outside the encapsulating colloid (4).

6. The photosensitive element according to claim 5, characterized by The second connection end of the first connection segment (21) is electrically connected to the photosensitive chip (1) through a conductive material. The second connection ends of the second connection segment (31) are all electrically connected to the photosensitive chip (1) through bonding leads. The bonding leads and the conductive material are located inside the encapsulation colloid (4).

7. A sunlight sensor, characterized by Includes the photosensitive element as described in any one of claims 1-6.

8. A vehicle air conditioning system characterised in that, Includes the sunlight sensor as described in claim 7.

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