Semiconductor dispensing apparatus and handler
By designing a reasonable layout of the material distribution channel and transfer channel in the semiconductor material distribution device, the problem of inaccurate material feeding was solved, enabling fast and accurate material distribution in a limited space, reducing equipment size and cost, and improving operational stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU VEGA TECH CO LTD
- Filing Date
- 2025-03-05
- Publication Date
- 2026-07-10
AI Technical Summary
Existing semiconductor material sorting devices and sorters are prone to collisions or failure to accurately enter designated material bins when conveying materials in limited spaces due to insufficient distance at the discharge port, and the size and cost of the equipment are also increased.
The material distribution channel and the transfer channel are respectively set on the shaft and the rotating part. By adjusting the inclination of the transfer channel and the position of the discharge port, the distance between the discharge port and the inlet port is increased, ensuring that the material accurately enters the material bucket in a limited space. At the same time, the pulley and synchronous belt drive assembly are used to achieve synchronous rotation, and the sliding mechanism stabilizes the position of the material bucket.
It enables rapid and accurate material distribution within a limited space, reduces equipment size and cost, improves conveying efficiency, and provides operational stability and safety.
Smart Images
Figure CN224475345U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor material sorting technology, and in particular to semiconductor material sorting device and sorting machine. Background Technology
[0002] Semiconductor sorting machines are highly automated devices used to perform electrical parameter testing, image resolution detection, and colorimetric testing on components such as chips, thereby classifying and selecting the chips. Their core function is to sort chips according to quality levels based on test results; for example, high-performance chips are classified as Grade 1, while lower-performance chips are classified as Grade 2 or defective.
[0003] After testing, the chips need to be loaded into different bins via a feeding device. This is typically driven by a servo motor, causing the outlet of the feeding channel to rotate between bins. When the outlet corresponds to a specific bin, the chip enters that bin. However, existing feeding channels usually have a channel machined within a rotating component, with the inlet and outlet located above the rotating component. The distance between the inlet and outlet is limited by the size of the rotating component. If the outlet distance is insufficient, the chip may collide with the bin wall during output, failing to fall into the designated bin and potentially causing damage. Therefore, the size of the rotating component needs to be increased. When the rotating component has pulleys or other parts, increasing its size necessitates increasing the size of these other parts, leading to an increase in the overall machine size and cost. Utility Model Content
[0004] One objective of this invention is to solve the existing technical problems by providing a semiconductor material distribution device that can solve the problem of material transportation in a limited space.
[0005] Another objective of this invention is to provide a semiconductor sorting machine that can solve the problem of material conveying in limited space.
[0006] To achieve the objectives of this utility model, the embodiments of this utility model adopt the following technical solutions:
[0007] A semiconductor dispensing device includes: a dispensing component, a driving component, and a material bin assembly disposed below the dispensing component. The material bin assembly includes a plurality of material bins. The driving component is connected to the dispensing component and drives the dispensing component to rotate around a rotation axis. The dispensing component includes a shaft portion and a rotating portion connected to the shaft portion. The shaft portion is provided with a dispensing channel, and the rotating portion is provided with a transfer channel. The transfer channel communicates with the dispensing channel and guides the material from the dispensing channel into the material bins.
[0008] In some embodiments, the inclination of the transfer channel is less than that of the material distribution channel.
[0009] In some embodiments, the material distribution channel has a first inlet and a first outlet connected to the first inlet, the first inlet being disposed on a rotation axis. The transfer channel has a second inlet and a second outlet connected to the second inlet, the second inlet being disposed corresponding to the first outlet, and the second outlet being disposed corresponding to the opening of the material barrel.
[0010] In some embodiments, the first feed port is located at the middle of the first end face of the shaft portion, the first discharge port is located at the edge of the second end face of the shaft portion, the second feed port is located at the upper end face of the rotating portion, and the second discharge port is located at the edge of the lower end face of the rotating portion.
[0011] In some embodiments, the size of the second inlet is greater than or equal to the size of the first outlet, the second outlet guides the material to the center position of the hopper, and when the second outlet rotates to the outlet position, the projection of the second outlet on the plane where the hopper opening is located is inside the opening.
[0012] In some embodiments, the drive assembly includes a pulley, which is sleeved on the shaft and limited by a rotating part. The pulley drives the shaft and the rotating part to rotate synchronously. The rotating part is detachably connected to one end of the shaft, and a mounting groove is formed between the rotating part and the shaft. The pulley is disposed in the mounting groove.
[0013] In some embodiments, the drive assembly includes a drive pulley and a timing belt, the pulley and the drive pulley being connected by the timing belt, and the drive pulley being connected to a servo motor.
[0014] In some embodiments, the material bucket assembly includes a slide and a base, with a plurality of material buckets disposed on the slide. When the slide is on the base, the slide is connected to the base via a sliding mechanism, and the slide is limited in the vertical and horizontal directions by the sliding mechanism.
[0015] In some embodiments, the sliding mechanism includes a track and a limiting groove, the track being disposed on a base and the limiting groove being disposed on a slide block, the limiting groove cooperating with the track.
[0016] In some embodiments, the side of the track is provided with a groove, and a plurality of grooves are spaced apart along the track extension direction. The slide is provided with a plurality of limiting mechanisms, which cooperate with the grooves to position the slide.
[0017] In some embodiments, the limiting mechanism is a ball-head plunger structure, and the limiting groove is a T-groove.
[0018] In some embodiments, the slide is configured corresponding to the sensor. When the slide is in the working position, it is within the sensing range of the sensor; when the slide is in the withdrawn position, it is outside the sensing range of the sensor.
[0019] In some embodiments, the base is provided with a support assembly, which includes a support plate. The support plate is vertically disposed on the base and is disposed opposite to the material bucket. The sensor is disposed on the support plate.
[0020] In some embodiments, the support assembly includes a plurality of support rods, which are vertically arranged on the base. The support rods have a material bucket inlet and outlet, which are arranged opposite to the support plate. The plurality of material buckets are pulled out or pushed in through the material bucket outlet.
[0021] In some embodiments, the hopper assembly includes a limiting sheet metal, a connecting plate, and a handle. A plurality of hoppers are disposed in the limiting sheet metal, which is mounted on a slide. The connecting plate is connected to the slide, and the handle is disposed on the connecting plate. The support assembly includes a mounting plate and a protective sheet metal. A dispensing assembly and a drive assembly are disposed on the mounting plate. The mounting plate is positioned above the support plate and the support rod. The protective sheet metal is disposed on the side of the mounting plate, shielding the drive assembly and the dispensing assembly.
[0022] A semiconductor sorting machine includes the aforementioned semiconductor sorting device.
[0023] The present invention has the following main advantages:
[0024] (1) The material distribution channel and the transfer channel are respectively set on the shaft and the rotating part. While maintaining the size of the shaft, the transfer channel can be adjusted as needed to increase the distance between the second discharge port and the first inlet port, ensuring that the material from the second discharge port can fall into the material bucket in a limited space; (2) The material distribution channel and the transfer channel are inclined, which can quickly export the material and distribute it quickly; (3) The material bucket will not derail when pulled on the base, and can provide feedback to the operator on the positioning. At the same time, the material bucket will not be pulled out due to vibration or other factors during the operation of the equipment. Other advantages of this utility model are described in the specific embodiments. Attached Figure Description
[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0026] Figure 1 This is a perspective view of the semiconductor material dispensing device provided in an embodiment of this utility model.
[0027] Figure 2 This is a schematic diagram of the material bucket being pulled out in an embodiment of this utility model.
[0028] Figure 3This is another schematic diagram of the semiconductor material sorting device provided in this embodiment of the present invention.
[0029] Figure 4 This is a schematic diagram of the material dispensing component provided in an embodiment of this utility model.
[0030] Figure 5 This is a top view of the material dispensing component provided in an embodiment of this utility model.
[0031] Figure 6 This is a utility model Figure 5 A schematic diagram of section AA.
[0032] Figure 7 This is an exploded view of the material distribution component provided in an embodiment of this utility model.
[0033] Figure 8 This is a schematic diagram of the second discharge port during material feeding provided in this embodiment of the utility model.
[0034] Figure 9 This is an exploded view of the support component provided in an embodiment of this utility model.
[0035] Figure 10 This is an exploded view of the material bucket assembly provided in this embodiment of the utility model.
[0036] Figure 11 This is a schematic diagram of the limiting mechanism provided in an embodiment of the present utility model.
[0037] Figure 12 This is a schematic diagram of the sliding mechanism provided in an embodiment of the present invention.
[0038] In the attached image:
[0039] 100. Material distribution assembly; 110. Material distribution channel; 111. First feed inlet; 112. First storage port; 120. Transfer channel; 121. Second feed inlet; 122. Second discharge port; 130. Shaft; 131. First end face; 132. Second end face; 140. Rotating part; 141. Upper end face; 142. Lower end face; 150. Mounting groove; 160. Screw; 200. Drive assembly; 210. Pulley; 220. Drive pulley; 230. Synchronous belt; 240. Servo 300. Motor; 301. Bucket assembly; 310. Connecting plate; 311. Bucket; 312. Opening; 313. Side wall; 314. Divider; 320. Slide; 321. Limiting mechanism; 330. Base; 340. Handle; 350. Track; 351. Groove; 360. Limiting groove; 370. Sensor; 390. Limiting sheet metal; 400. Support assembly; 401. Support plate; 402. Support rod; 403. Bucket outlet; 404. Mounting plate; 405. Through hole. Detailed Implementation
[0040] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments.
[0041] In this embodiment, "several" and "more than" refer to two or more. In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0042] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0043] Semiconductor sorting devices are used to sort semiconductor components. They can transport semiconductor components such as chips to different bins according to their different types, and realize sorted storage. They are usually used in semiconductor sorting machines. After the semiconductor sorting machine detects the semiconductor components, the sorting device sorts and stores the components in bins.
[0044] <Example 1>
[0045] like Figures 1 to 9As shown, this embodiment provides a semiconductor dispensing device comprising: a dispensing component 100, a driving component 200, and a material bin assembly 300 disposed below the dispensing component. After receiving components, the dispensing component 100 conveys the components to different material bins. The driving component 200 is connected to the dispensing component 100 and drives the dispensing component 100 to rotate around a rotation axis S, enabling the dispensing component 100 to deliver different components into different material bins. The material bin assembly 300 includes several material bins 310. This embodiment provides four material bins, designated 310a, 310b, 310c, and 310d. Different material bins 310 are used to store different types of components, thereby dispensing the components conveyed by the dispensing component 100. Those skilled in the art will understand that the number of material bins can be increased or decreased as needed. Each material bin 310 has an opening 311, with the opening direction facing the dispensing component. Components fall into the material bin through the opening 311. The material distribution assembly 100 includes a material distribution channel 110 and a transfer channel 120 connected to the material distribution channel 110. The material distribution channel 110 receives materials and conveys them to the transfer channel 120. Compared to a single channel, the two-section channel configuration allows for more flexible configuration of the position, shape, and other structures of the two sections according to the structure of the material distribution assembly, enabling rapid guidance of materials to the material bin within a limited space. The length and shape of the transfer channel and the material distribution channel can be adjusted according to the specific materials and conveying requirements; there are no restrictions here, as long as the materials can pass through.
[0046] Specifically, when the drive component 200 drives the material distribution component 100 to rotate, the material distribution channel 110 and the transfer channel 120 rotate synchronously, so that the transfer channel 120 selectively guides the material from the material distribution channel 110 into several material bins. That is, when the material needs to be transported to the material bin 310a, the transfer channel 120 is rotated to correspond with the material bin 310a, and then the material slides into the material bin 310a through the material distribution channel 110 and the transfer channel 120; when the material needs to be transported to the material bin 310c, the transfer channel 120 rotates to correspond with the material bin 310c. The material distribution channel 110 has a first inlet 111 and the transfer channel 120 has a second outlet 122. The distance between the first inlet 111 and the rotation axis X is smaller than the distance between the second outlet 122 and the rotation axis X. The second outlet 122 is farther away from the rotation axis X, so that the material can be conveyed downward through the material distribution channel 110 and the transfer channel 120 and be closer to the opening of the material bucket.
[0047] Furthermore, the inclination of the transfer channel 120 is less than that of the distribution channel 110. The larger inclination of the transfer channel 120 allows materials to be conveyed away from the rotation axis X within a limited space. Specifically, in conjunction with... Figure 4As shown, the axis M of the transfer channel 120 and the axis N of the distribution channel 110 are connected. The angle between axis M and the reference plane A is smaller than the angle between axis N and the reference plane A. Therefore, when descending the same height, the material can move to a position farther from the rotation axis S in the transfer channel 120. This allows the material to move further in limited space, avoiding situations where the material cannot fall into the hopper opening. In this embodiment, both the transfer channel 120 and the distribution channel 110 are inclined, allowing the material to slide within the channel to a discharge position away from the rotation axis.
[0048] Furthermore, the material distribution channel 110 has a first inlet 111 and a first outlet 112 connected to the first inlet 111. The first inlet 111 is located on the rotation axis S, that is, the rotation axis S is the central axis of the first inlet. Therefore, when the material distribution assembly 100 rotates, the position of the first inlet 111 will not change with the rotation, ensuring that the material can stably enter the material distribution channel 110 through the first inlet 111. The transfer channel 120 has a second inlet 121 and a second outlet 122 connected to the second inlet 121. The second inlet 121 is correspondingly arranged with the first outlet 112, so that the material output from the first outlet 112 can enter the second inlet 121. The second outlet 122 is correspondingly arranged with the opening of the material bucket, and the material output from the second outlet 121 falls into the material bucket. Through the above technical solution, the second discharge port 122 is located away from the rotation axis S. When the second discharge port 122 rotates, it forms a circular trajectory. The openings of several material bins are arranged on the circular trajectory, so that the material output from the second discharge port 122 can fall into the material bins. If the distance between the second discharge port 122 and the rotation axis S is too small, that is, the diameter of the circular trajectory is small, the material may collide with the material bin or fall into other material bins after being output from the second discharge port 122. In this embodiment, the second discharge port 122 guides the material to the center position of the material bin 310, thereby ensuring that the material enters the corresponding material bin above whichever material the second discharge port 122 is located, and will not fall into other material bins. Both the material distribution channel and the transfer channel are straight-through channels, that is, the material moves in a straight line within the channel, thereby improving the conveying speed and efficiency.
[0049] Furthermore, the material distribution assembly 100 includes a shaft portion 130 and a rotating portion 140 connected to the shaft portion 130. A material distribution channel 110 is disposed in the shaft portion 130, and a transfer channel 120 is disposed in the rotating portion 140. By disposing of the material distribution channel 110 and the transfer channel 120 in two separate components, they can be processed separately during machining, reducing machining difficulty. A first feed port 111 is disposed in the middle of the first end face 131 of the shaft portion 130, a first discharge port 112 is disposed at the edge of the second end face 132 of the shaft portion 130, a second feed port 121 is disposed on the upper end face 141 of the rotating portion 140, and a second discharge port 122 is disposed at the edge of the lower end face 142 of the rotating portion 140. In this embodiment, the first and second discharge ports (hereinafter referred to as discharge ports) are located close to the edges of the second end face and the lower end face (hereinafter referred to as end face), respectively. This allows the discharge ports to be as far away from the rotation axis S as possible, minimizing the size of the shaft portion 130 and the rotating portion 140 while ensuring that the material falls into the material hopper, thereby reducing the overall volume of the material distribution device. Those skilled in the art will understand that "discharge port close to the edge" means that the discharge port is offset towards the side wall of the shaft portion and the side wall of the rotating portion while ensuring material output. This can be adjusted according to the structure of the parts, etc. In this embodiment, the edges of the discharge ports are located at the side walls of the shaft portion and the rotating portion.
[0050] like Figure 8 As shown, the material hopper 310 has side walls 312, and the side walls 312 of adjacent material hoppers 310 abut against each other to form a cross-shaped partition 313. Four openings 311 are separated by the partitions 313. When the material distribution assembly rotates, the second discharge port 122 rotates above the four openings 311. When the second discharge port 22 rotates to a certain opening 311, the projection of the second discharge port 22 onto the plane of the opening 311 of the material hopper is located within the opening 311. That is, the shape of the projection of the second discharge port 22 onto the plane of the opening 311 will not overlap with the side wall 312. Therefore, when the material falls from the second discharge port 22, it can avoid colliding with the side wall 312. The second discharge port 22 guides the material to the center position of the material hopper 310, that is, it moves the material as close to the center position of the material hopper as possible to avoid collision with the side wall, and it is not necessarily required that the material fall at the geometric center position of the material hopper 310. The size of the second feed inlet 121 is greater than or equal to the size of the first discharge outlet 112, so that the material can enter the second feed inlet 121 more conveniently. The material distribution channel and the transfer channel can be channels with variable cross sections or channels with equal inner diameters. The specific changes can be made according to the material distribution requirements without requiring creative effort.
[0051] Furthermore, the drive assembly 200 includes a pulley 210, which is sleeved on the shaft and limited by the rotating part 140 to prevent it from detaching from the shaft 130. The pulley 210 drives the shaft 130 and the rotating part 140 to rotate synchronously. The pulley 210 and the shaft 130 are separate, allowing the pulley 210 to use standard parts without the need for custom processing with the shaft, thus reducing costs. The rotating part 140 is detachably connected to one end of the shaft 130 for easy installation and limiting of the pulley 210. Specifically, the rotating part 140 and the shaft 130 are assembled and disassembled using several screws 160. A mounting groove 150 is formed between the rotating part 140 and the shaft 130, and the pulley 210 is disposed in the mounting groove 150. The drive assembly 200 includes a drive pulley 220 and a timing belt 230. The pulley 210 and the drive pulley 220 are connected by the timing belt 230. The drive pulley 220 is connected to a servo motor 240. The servo motor 240 drives the drive pulley 220 to rotate, which in turn drives the pulley 210 to rotate via the timing belt 230.
[0052] <Example 2>
[0053] In this embodiment, the parts that are the same as in Embodiment 1 are given the same reference numerals, and the same text descriptions are omitted.
[0054] like Figure 2 , Figures 9 to 12 As shown, compared to Embodiment 1, the semiconductor feeding device provided in this embodiment has the following structural design differences:
[0055] The material bucket assembly 300 includes a slide 320 and a base 330. A plurality of material buckets 310 are disposed on the slide 320. The slide 320 is connected to the base 330 via a sliding mechanism, allowing the slide 320 to slide on the base 330. Four material buckets 310 slide synchronously, enabling the four material buckets 310 to be in the pulled-out position (see [reference]). Figure 2 ) and work location (see Figure 1 Switching between the two positions. When the slide 320 is on the base 330, the slide 320 is limited in both the vertical and horizontal directions by the sliding mechanism to prevent the slide 320 from wobbling in the working position or falling off the base 330. When the system detects that the hopper is full, the hopper 310 is pulled out by holding the push-pull handle 340, and then the full hopper is emptied. After emptying the hopper, the hopper assembly needs to be pushed into the working position.
[0056] Furthermore, the sliding mechanism includes a track 350 and a limiting groove 360. The track 350 is disposed on the base 330, and the limiting groove 360 is disposed on the slide block 320. The limiting groove 360 cooperates with the track 350, thereby allowing the slide block 320 to slide along the track 350. In this embodiment, the limiting groove 360 is a T-shaped groove, that is, the cross-section is T-shaped. The track 350 is correspondingly disposed therewith, that is, the cross-section of the track 350 is also T-shaped. When the limiting groove 360 is on the track 350, it can restrict the left and right directions (see...). Figure 12 This design not only restricts the vertical movement of the material bucket but also prevents it from detaching from the track 350 when the user pulls it out. The track 350 has grooves 351 on its side, spaced apart along the track's extension direction. Each groove 351 is a vertically oriented strip. The slide block 320 has several limiting mechanisms 321 that cooperate with the grooves 351 to position the slide block 320. When the slide block 320 slides to the material bucket's working position, the limiting mechanisms 321 engage with the grooves 351 to position the slide block 320, preventing it from wobbling back and forth along the track. During operation, the material bucket assembly will not be abnormally pulled out due to equipment vibration or other reasons. In this embodiment, the grooves 351 are located on both sides of the track 350, with two grooves on each side. The number of limiting mechanisms 321 corresponds to the number of grooves. Of course, the number of grooves can be increased or decreased depending on the track length. When the material bucket needs to be removed, pull the handle 340 forcefully to separate the limiting mechanism 321 from the groove 351, thereby allowing the slide block 320 to slide out of the track. In this embodiment, the limiting mechanism 321 adopts a ball-head plunger structure, which includes a ball head and a plunger body connected to the ball head. The ball head corresponds to the groove and can be engaged or disengaged from the groove. A spring is provided in the plunger body to provide elastic force, so that the ball head can automatically return to its original position in the groove.
[0057] like Figure 2 and Figure 9 As shown, the slide 320 and sensor 370 are respectively configured. When the slide is in the working position, it is within the sensing range of the sensor; when the slide is in the withdrawn position, it is outside the sensing range of the sensor. Sensor 370 is used to sense the position of slide 320 to determine whether slide 320 is in the working or withdrawn position. Sensor 370 is electrically connected to the control module. When the material bucket is in the working position, sensor 370 sends a signal to the control module, and the equipment can be started; when the material bucket is in the withdrawn position, the equipment cannot be started. When the material bucket 310 is pushed along the track, the sensor senses that the material bucket has reached its position, and at the same time, the limit mechanism 321 is also engaged in the groove 351, which can provide feedback to the operator with a sense of arrival. Sensor 370 can be a position sensor such as a proximity switch.
[0058] Furthermore, a support assembly 400 is provided on the base 330. The support assembly 400 includes a support plate 401 and a support rod 402. The support plate 401 is vertically mounted on the base 330 and is positioned opposite to the material bucket 310. The sensor 370 is mounted on the support plate 401. Compared to being mounted on the base, the sensor 370 is positioned higher and has a wider coverage area, ensuring that the material bucket 310 always faces the sensor 370 during sliding, facilitating sensor detection and reducing the number of sensors required. In this embodiment, only one sensor is used. The support rod 402 is vertically mounted on the base 330, and a material bucket outlet 403 is formed between the support rods 402. The material bucket inlet / outlet 403 is positioned opposite to the support plate 401, allowing several material buckets to be pulled out or pushed in through the material bucket inlet / outlet 403. The two support rods 402 and the support plate 401 form a vertical support structure, enabling the material bucket to be accommodated within the support structure. The structure is stable and facilitates the entry and exit of the material bucket from one side. The support assembly 400 also includes a mounting plate 404 and a protective sheet metal 405. The material distribution assembly 100 and the drive assembly 200 are mounted on the mounting plate 404. The shaft 130 is disposed in the through hole 405 of the mounting plate 404, and a bearing 160 is provided on the shaft 130 to allow the shaft 130 to rotate flexibly. The mounting plate 404 is positioned above the support plate 401 and the support rod 402, and the protective sheet metal 405 is disposed on both sides of the mounting plate 404, shielding the drive assembly 200 and the material distribution assembly 100, thus providing a protective effect.
[0059] Furthermore, the material bucket assembly 300 includes a limiting sheet metal 390, a connecting upright plate 30, and a handle 340. Four material buckets are disposed within the limiting sheet metal 390 to limit their movement. The limiting sheet metal 390 is mounted on the slide block 320, allowing it to move synchronously with the slide block 320. The connecting upright plate 301 is connected to the slide block 320, and the handle 340 is disposed on the connecting upright plate 301. When the user holds the handle 340 and pushes or pulls, the connecting upright plate 301 positions the handle 340 at the top, approximately in the middle of the material bucket, for convenient use.
[0060] <Example 3>
[0061] In this embodiment, the parts that are the same as in Embodiments 1 and 2 are given the same reference numerals, and the same text descriptions are omitted.
[0062] Compared to Embodiments 1 and 2, this embodiment provides a semiconductor sorting machine, including the semiconductor dispensing devices of Embodiments 1 and 2. The semiconductor sorting machine achieves precise sorting and classification of components through steps such as testing, data acquisition, classification standard setting, sorting execution, marking and recording, quality control, and subsequent processing. The semiconductor sorting machine analyzes the test data of the components through a control system to determine which bin the chip should enter. The component acquired by the dispensing device (dispensing nozzle or dispensing gripper) moves above the shaft 130, and the dispensing device releases the component, causing it to fall into the first inlet 111. A servo motor controls the rotation of the dispensing component, aligning the second outlet with the designated bin, thus guiding the component into the bin.
[0063] In the above embodiments one to three, during the working process, depending on the different working environments, some of the technical implementation methods of embodiments one to three can be combined or replaced.
[0064] The technical principles of this utility model have been described above in conjunction with specific embodiments. However, it should be noted that these descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, other specific embodiments or equivalent substitutions of this utility model that can be conceived by those skilled in the art without creative effort will all fall within the scope of protection of this utility model.
Claims
1. A semiconductor material dispensing device, characterized in that, include: The assembly includes a material dispensing component, a drive component, and a material bin assembly located below the material dispensing component. The material bin assembly includes several material bins. The drive component is connected to the material dispensing component and drives the material dispensing component to rotate around a rotation axis. The material dispensing component includes a shaft and a rotating part connected to the shaft. The shaft has a material dispensing channel, and the rotating part has a transfer channel. The transfer channel communicates with the material dispensing channel and guides the material from the material dispensing channel into the material bin. The inclination of the transfer channel is less than that of the material dispensing channel. When the drive component drives the material distribution component to rotate, the material distribution channel and the transfer channel rotate synchronously. The transfer channel selectively guides the materials from the material distribution channel into several material buckets.
2. The semiconductor feeding device according to claim 1, characterized in that, The material distribution channel has a first inlet and a first outlet connected to the first inlet. The first inlet is located on the rotation axis. The transfer channel has a second inlet and a second outlet connected to the second inlet. The second inlet is corresponding to the first outlet, and the second outlet is corresponding to the opening of the material barrel.
3. The semiconductor feeding device according to claim 2, characterized in that, The first feed inlet is located at the middle of the first end face of the shaft, the first discharge outlet is located at the edge of the second end face of the shaft, the second feed inlet is located at the upper end face of the rotating part, and the second discharge outlet is located at the edge of the lower end face of the rotating part.
4. The semiconductor feeding device according to claim 3, characterized in that, The size of the second inlet is greater than or equal to the size of the first outlet. The second outlet guides the material to the center of the barrel. When the second outlet rotates to the outlet position, the projection of the second outlet on the plane where the barrel opening is located is inside the opening.
5. The semiconductor feeding device according to claim 4, characterized in that, The drive assembly includes a pulley, which is sleeved on the shaft and limited by a rotating part. The pulley drives the shaft and the rotating part to rotate synchronously. The rotating part is detachably connected to one end of the shaft, and a mounting groove is formed between the rotating part and the shaft. The pulley is disposed in the mounting groove.
6. The semiconductor feeding device according to claim 5, characterized in that, The drive assembly includes a drive pulley and a timing belt. The pulley and the drive pulley are connected by the timing belt, and the drive pulley is connected to a servo motor.
7. The semiconductor dispensing apparatus according to any one of claims 1 to 6, characterized in that, The material bucket assembly includes a slide and a base. Several material buckets are arranged on the slide. When the slide is on the base, the slide is connected to the base through a sliding mechanism. The slide is limited in the vertical and horizontal directions by the sliding mechanism.
8. The semiconductor feeding device according to claim 7, characterized in that, The sliding mechanism includes a track and a limiting groove. The track is set on the base, and the limiting groove is set on the slide block. The limiting groove cooperates with the track.
9. The semiconductor feeding device according to claim 8, characterized in that, The track has grooves on its side, and several grooves are spaced apart along the track's extension direction. The slide is provided with several limiting mechanisms, which cooperate with the grooves to position the slide.
10. The semiconductor feeding device according to claim 9, characterized in that, The limiting mechanism is a ball-head plunger structure, and the limiting groove is a T-shaped groove.
11. The semiconductor dispensing apparatus according to claim 7, characterized in that, The slide block is configured to correspond to the sensor. When the slide block is in the working position, it is within the sensing range of the sensor; when the slide block is in the withdrawn position, it is outside the sensing range of the sensor.
12. The semiconductor dispensing apparatus according to claim 11, characterized in that, The base is provided with a support assembly, which includes a support plate. The support plate is vertically arranged on the base and is positioned opposite to the material bucket. The sensor is arranged on the support plate.
13. The semiconductor dispensing apparatus according to claim 12, characterized in that, The support assembly includes several support rods, which are vertically arranged on the base. There are material bucket inlets and outlets between the support rods. The material bucket inlets and outlets are arranged opposite to the support plate. Several material buckets are pulled out or pushed in through the material bucket outlets.
14. The semiconductor dispensing apparatus according to claim 13, characterized in that, The material bucket assembly includes a limiting sheet metal, a connecting plate, and a handle. Several material buckets are arranged in the limiting sheet metal, which is mounted on a slide. The connecting plate is connected to the slide, and the handle is mounted on the connecting plate. The support assembly includes a mounting plate and a protective sheet metal. A material distribution assembly and a drive assembly are mounted on the mounting plate. The mounting plate is positioned above the support plate and support rod. The protective sheet metal is located on the side of the mounting plate, shielding the drive assembly and the material distribution assembly.
15. A semiconductor sorting machine, characterized in that, Includes the semiconductor dispensing apparatus as described in any one of claims 1 to 14.