Improved solder resist ink press mark recovery board rack

Abstract

The utility model discloses improve the collection frame of solder resist ink pressure injury belongs to the collection frame technical field, this improve the collection frame of solder resist ink pressure injury, including bottom plate, the top surface of bottom plate is provided with the isolation component for placing and isolating PCB board, and the isolation component includes the rotatable holder of setting at the top surface of bottom plate, and a plurality of rotatable holders are along the length direction linear array arrangement of bottom plate, and the top end outer wall of rotatable holder is provided with first division cover, and the bottom of rotatable holder is provided with second division cover, and the outer wall of rotatable holder is provided with the sheath. The utility model discloses through setting first division cover, second division cover and the setting of sheath, form and maintain the fixed interval between PCB board and soften the contact point between rotatable holder and PCB board, reduce the risk that solder resist ink is pressed in the edge of PCB board and is scratched, and the risk of rubbing damage has reduced, has improved the yield and reliability of PCB board, has improved the operation efficiency and security of production circulation and the operation efficiency and security of logistics link simultaneously.

Description

Technical Field

[0001] This utility model belongs to the field of plate collection rack technology, specifically relating to a plate collection rack that improves the effect of solder resist ink pressure damage. Background Technology

[0002] A PCB rack is a specialized device used to hold and isolate PCBs that have undergone solder mask processing. It typically consists of a multi-layered partition structure that physically separates stacked PCBs to prevent them from coming into contact with each other. The partition assembly of the PCB rack must support the PCBs while minimizing pressure transmission between them to prevent the solder mask ink from being crushed or scratched during storage or transport due to compression or friction.

[0003] Traditional PCB stacking racks typically feature fixed partitions, with multiple partitions arranged in an evenly spaced array on the base plate, their edges directly contacting the PCBs. The partition surfaces are usually made of hard metal or plastic, lacking cushioning structures on the sides and corners. Some designs add simple support strips or side panels to the base plate, but the overall system still relies on a rigid frame to constrain the PCB stacking position.

[0004] Currently, the spacing between the partitions in the PCB receiving rack is fixed and cannot be adjusted, making it unsuitable for PCBs of different thicknesses or special specifications. This results in thin boards being prone to shaking and thick boards being subjected to overload. The rigid contact between the partition edges and the PCBs creates concentrated stress during transport vibrations, causing damage and scratches to the solder resist ink edges. Furthermore, the lack of a dynamic buffering mechanism exacerbates ink damage due to friction during board stacking and repositioning. The existing structure struggles to balance spatial flexibility with physical protection requirements, necessitating a solution to the ink damage problem caused by rigid support. Utility Model Content

[0005] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a plate collection rack that improves the solder resist ink pressure damage.

[0006] The technical solution adopted to solve the above technical problems is: to provide a board receiving frame for improving solder resist ink pressure damage, including a base plate, characterized in that the top surface of the base plate is provided with an isolation component for placing and isolating PCB boards, the isolation component includes a plurality of rotating frames disposed on the top surface of the base plate, the plurality of rotating frames are arranged in a linear array along the length direction of the base plate, a first partition sleeve is provided on the top outer wall of the rotating frame, a second partition sleeve is provided on the bottom end of the rotating frame, and a protective sleeve is provided on the outer wall of the rotating frame.

[0007] Furthermore, there are two of each of the first partition sleeve, the second partition sleeve, and the protective sleeve. The two first partition sleeves are fixedly fitted on the top outer wall of the rotating frame, the two second partition sleeves are fixedly fitted on the two corners at the bottom of the rotating frame, and the two protective sleeves are fixedly fitted on the outer walls of both sides of the rotating frame.

[0008] The above technical solution, by setting the first partition sleeve, the second partition sleeve and the protective sleeve, forms and maintains a fixed spacing between PCB boards and softens the contact points between the rotating frame and the PCB board, reducing the risk of solder resist ink being crushed, scratched and rubbed on the edge of the PCB board, improving the yield and reliability of the PCB board, and improving the operational efficiency and safety of the production flow and logistics links.

[0009] Furthermore, several connecting bushings are fixed on the top surface of the base plate near the left and right sides, and a rotating shaft is fixed inside the rotating frame near the bottom end. The rotating shaft is rotatably connected to the two corresponding connecting bushings on the left and right sides.

[0010] The above technical solution, through the rotatable design of the rotating frame, can better fit the PCB board and can adapt the spacing according to the thickness of the PCB board to meet the placement requirements of different PCB board models.

[0011] Furthermore, support plates are fixed at both the front and rear ends of the base plate, and two buffer pads are fixed on the two sides of the support plates that are close to each other.

[0012] Through the above technical solution, the elastic buffer pad design on the inner side of the support plate provides necessary lateral constraints while transforming the hard contact between the rotating frame and the support plate into a flexible contact. This effectively absorbs lateral impact vibrations during transportation, prevents damage to the solder resist ink caused by plate displacement and friction, and protects the physical integrity of the plate edge.

[0013] Furthermore, two support strips are fixed between the two support plates, and a flexible support strip is also fixed between the two support plates and above the support strips.

[0014] The above technical solution provides basic rigid support for the bottom of the PCB board through the support strip, while the flexible support strip provides flexible contact for the bottom of the PCB board, absorbs vibration energy in the vertical direction, reduces the bounce amplitude of the PCB board, and prevents repeated collision damage.

[0015] Furthermore, the flexible support bar is inclined between the two support plates, and the angle between the flexible support bar and the top surface of the support bar is 5 to 10°.

[0016] The above technical solution uses the tilt angle of the flexible support strip to make the PCB board naturally tilt slightly after placement, and uses the component of gravity to make the boards stick together tightly, reducing the risk of the PCB board rotating due to external forces.

[0017] Furthermore, connecting plates are fixed at the middle of the front side and the rear side of the bottom of the base plate, and traveling wheels are fixed on the bottom surface of the connecting plates near the left and right sides. A push-pull bracket is fixed on one side of the connecting plate at the rear of the base plate.

[0018] The above technical solution, through the design of the wheels and push-pull frame, makes the entire PCB board receiving rack easy to move, reducing the risks of vibration, drops or rough handling caused by manual handling, and improving operational efficiency and safety.

[0019] The beneficial effects of this utility model are as follows:

[0020] By setting a first partition sleeve at the top and a second partition sleeve at the bottom of the rotating frame, a fixed distance is formed and maintained between the rotating frames when the PCB board is installed between them, avoiding clamping damage to the PCB board. The protective sleeves transform the hard contact point between the PCB board and the rotating frame into a multi-point flexible contact, greatly reducing ink pressure and scratches on the edges of the PCB board (especially the top and bottom corners) caused by stacking pressure or movement vibration.

[0021] The rotatable design of the rotating frame allows the first and second separator sleeves to adaptively and slightly adjust their angles when placing the PCB board, better conforming to the edge contour of the PCB board. This transforms the traditional rigid line / point contact into multi-point flexible contact, dispersing local pressure and further reducing the possibility of ink damage caused by hard scratches.

[0022] By setting the tilt angle of the flexible support strips, the PCB board is placed in a natural, slightly tilted posture. The component of gravity is used to keep the boards in close contact with each other, reducing the risk of the PCB board rotating due to external forces. Attached Figure Description

[0023] Figure 1 This is a three-dimensional structural diagram of the plate collection frame for improving solder resist ink pressure damage according to this utility model;

[0024] Figure 2 This is a three-dimensional structural diagram of the support strip and connecting plate of the plate receiving frame for improving solder resist ink pressure damage according to this utility model;

[0025] Figure 3 This is a three-dimensional structural diagram of the base plate of the plate receiving frame for improving solder resist ink pressure damage according to this utility model;

[0026] Figure 4 This is a three-dimensional structural diagram of the rotating frame of the plate receiving frame for improving solder resist ink pressure damage according to this utility model.

[0027] Reference numerals: 1. Base plate; 2. Rotating frame; 201. First partition sleeve; 202. Second partition sleeve; 203. Protective sleeve; 3. Connecting bushing; 301. Rotating shaft; 4. Support plate; 401. Buffer pad; 5. Support bar; 501. Flexible support bar; 6. Connecting plate; 601. Traveling wheel; 602. Push-pull frame. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0029] like Figure 1-4 As shown, the board receiving rack for improving solder resist ink damage in this embodiment includes a base plate 1. The top surface of the base plate 1 is provided with an isolation assembly for placing and isolating PCB boards. The isolation assembly includes several rotating frames 2 disposed on the top surface of the base plate 1. The rotating frames 2 are arranged in a linear array along the length of the base plate 1. Two first partition sleeves 201 are provided on the top outer wall of each rotating frame 2, and the two first partition sleeves 201 are fixedly fitted onto the top outer wall of the rotating frame 2. Two second partition sleeves 202 are provided at the bottom end of each rotating frame 2, and the two second partition sleeves 202 are fixedly fitted onto the two corners at the bottom end of the rotating frame 2. By providing first partition sleeves 201 at the top and second partition sleeves 202 at the bottom of the rotating frames 2, when the PCB boards are installed between the rotating frames 2, a space is formed between the rotating frames 2 to maintain the PCB boards. The fixed spacing between the two sides of the rotating frame 2 avoids the pressure damage to the PCB board. The outer wall of the rotating frame 2 is provided with two protective sleeves 203. The two protective sleeves 203 are fixedly fitted on the outer walls of the two sides of the rotating frame 2. The setting of the protective sleeves 203 transforms the hard contact point between the PCB board and the rotating frame 2 into a multi-point flexible contact, which greatly reduces the ink pressure and scratches caused by stacking pressure or movement vibration on the edges of the PCB board, especially the top and bottom corners. Several connecting bushings 3 are fixed on the top surface of the base plate 1 near the left and right sides. The rotating frame 2 is fixed with a rotating shaft 301 near the bottom. The rotating shaft 301 is rotatably connected to the two corresponding left and right connecting bushings 3. Through the rotatable design of the rotating frame 2, it can better fit the PCB board and can adapt the spacing according to the thickness of the PCB board to meet the placement requirements of different types of PCB boards.

[0030] Support plates 4 are fixed at both ends of the base plate 1. Two buffer pads 401 are fixed on the sides of the two support plates 4 that are close to each other. The elastic buffer pads 401 are designed to provide necessary lateral restraint for the rotating frame 2 while transforming the hard contact between the rotating frame 2 and the support plate 4 into a flexible contact. This effectively absorbs lateral impact vibration during transportation, prevents damage to the solder resist ink caused by board displacement and friction, and protects the physical integrity of the board edges. Two support bars 5 are fixed between the two support plates 4. The support bars 5 provide basic rigid support for the bottom of the PCB board. A flexible support bar 501 is also fixed between the two support plates 4 and above the support bars 5. The flexible support bar 501 provides flexible contact for the bottom of the PCB board, absorbs vertical vibration energy, reduces the PCB board bounce amplitude, and prevents repeated vibrations. To prevent collision damage, the flexible support bar 501 is inclined between the two support plates 4. The angle between the flexible support bar 501 and the top surface of the support bar 5 is 5 to 10°. The inclination angle of the flexible support bar 501 makes the PCB board naturally tilted after placement. The gravity component makes the boards stick to each other tightly, reducing the risk of the PCB board rotating due to external force. The bottom of the base plate 1 is fixed with connecting plates 6 at the middle of the front side and the rear side. The bottom surface of the connecting plate 6 is fixed with wheels 601 near the left and right sides. A push-pull bracket 602 is fixed on one side of the connecting plate 6 at the rear of the base plate 1. The design of the wheels 601 and the push-pull bracket 602 makes the entire board receiving rack full of PCB boards easy to move, reducing the risk of vibration, drop or rough operation caused by manual handling, and improving operation efficiency and safety.

[0031] The working principle of this embodiment is as follows: the PCB board is placed on the isolation component on the top surface of the base plate 1 and supported and isolated by the rotating frame 2 arranged in a linear array. The weight of the PCB board drives the rotating frame 2 to rotate slightly around the rotating shaft 301 in the connecting bushing 3, so that the first separating sleeve 201 and the second separating sleeve 202 between adjacent parts abut against each other, so that the two rotating frames 2 leave a gap to avoid excessive pressure on the PCB board. The rotating frames at the front and back of the board collection frame are elastically squeezed by the buffer pad 401 on the inner side of the support plate 4, which restricts horizontal displacement. The bottom surface of the PCB board is attached to the flexible support strip 501 and is set at an inclination of 5-10° above the support strip 5 to form a stable tilt angle. The board collection frame is pulled by the push-pull frame 602 and moved by the traveling wheels 601 at the bottom of the connecting plate 6.

[0032] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the scope of protection of the present utility model.

Claims

1. A plate receiving rack for improving solder resist ink damage, comprising a base plate (1), characterized in that, The top surface of the base plate (1) is provided with an isolation component for placing and isolating the PCB board; The isolation assembly includes several rotating frames (2) disposed on the top surface of the base plate (1). The several rotating frames (2) are arranged in a straight array along the length direction of the base plate (1). The top outer wall of the rotating frame (2) is provided with a first partition sleeve (201), the bottom end of the rotating frame (2) is provided with a second partition sleeve (202), and the outer wall of the rotating frame (2) is provided with a protective sleeve (203).

2. The plate collection rack for improving solder resist ink pressure damage according to claim 1, characterized in that, Two of each of the first partition sleeve (201), the second partition sleeve (202), and the protective sleeve (203) are provided. The two first partition sleeves (201) are fixedly fitted on the top outer wall of the rotating frame (2), the two second partition sleeves (202) are fixedly fitted on the two corners at the bottom of the rotating frame (2), and the two protective sleeves (203) are fixedly fitted on the outer walls of both sides of the rotating frame (2).

3. The plate collection frame for improving solder resist ink pressure marks according to claim 2, characterized in that, Several connecting bushings (3) are fixed on the top surface of the base plate (1) near the left and right sides. A rotating shaft (301) is fixed inside the rotating frame (2) near the bottom. The rotating shaft (301) is rotatably connected to the two corresponding connecting bushings (3) on the left and right sides.

4. The plate collection rack for improving solder resist ink damage according to claim 3, characterized in that, The base plate (1) is fixed with support plates (4) at both the front and rear ends, and two buffer pads (401) are fixed on the two sides of the two support plates (4) that are close to each other.

5. The plate collection rack for improving solder resist ink pressure marks according to claim 4, characterized in that, Two support bars (5) are fixed between the two support plates (4), and a flexible support bar (501) is also fixed between the two support plates (4) and above the support bars (5).

6. The plate collection rack for improving solder resist ink damage according to claim 5, characterized in that, The flexible support bar (501) is inclined between the two support plates (4), and the angle between the top surface of the flexible support bar (501) and the support bar (5) is 5 to 10°.

7. The plate collection rack for improving solder resist ink damage according to claim 6, characterized in that, A connecting plate (6) is fixed at the middle of the front side and the rear side of the bottom plate (1). A walking wheel (601) is fixed on the bottom surface of the connecting plate (6) near the left and right sides. A push-pull bracket (602) is fixed on one side of the connecting plate (6) at the rear side of the bottom plate (1).

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