Semiconductor temperature-controlled flow battery test mold

Abstract

The utility model relates to battery test technical field discloses a kind of semiconductor temperature control liquid flow battery test mould, temperature control component is fixed in the inside of box, the top of box is connected with top cover, and is locked fixed by fixed sheet and buckle, forms sealing structure, the test bottle card seat in the temperature control component stores battery electrolyte, and heat conduction plate accurately controls the temperature of electrolyte;The utility model realizes two-way temperature control by semiconductor refrigeration device and semiconductor heating sheet, provides accurate temperature control environment for liquid flow battery test, realizes the temperature outside liquid storage bottle or the temperature inside liquid storage bottle for testing by selection control, guarantees that stable, suitable liquid flow battery test temperature environment is formed in box.

Description

Technical Field

[0001] This utility model patent belongs to the field of battery testing technology, specifically relating to a semiconductor temperature-controlled flow battery testing mold. Background Technology

[0002] In the current era of booming new energy technologies, flow batteries have become one of the core technologies in the field of large-scale energy storage due to their significant advantages such as high energy density, long cycle life, high charge-discharge efficiency, and strong safety. During the research and development and performance testing of flow batteries, the temperature of the electrolyte has a decisive impact on the battery's electrochemical reaction rate, the stability of active materials, and overall cycle performance. Even small temperature fluctuations can lead to an imbalance in the battery's internal reaction kinetics, resulting in accelerated capacity decay, reduced charge-discharge efficiency, and even safety hazards.

[0003] However, existing flow battery testing equipment generally suffers from insufficient temperature control accuracy and limited temperature control range. Traditional temperature control methods often employ a single heating or cooling module, which is insufficient to meet the dynamic requirements of rapid temperature rise and fall and precise temperature maintenance during testing. While some devices are equipped with temperature control systems, the lack of effective thermal insulation design and optimized heat conduction structure leads to slow temperature control response, excessive energy consumption, and inability to withstand the corrosive effects of strong acids and alkalis in the electrolyte. Furthermore, existing devices have limitations in simulating test environments, making it difficult to construct a stable and reliable temperature control space. This fails to accurately reflect the performance of flow batteries in complex application scenarios, severely hindering the research and development and industrialization of flow battery technology. Therefore, there is an urgent need to develop a testing device with high-precision bidirectional temperature control capabilities, strong chemical resistance, and efficient heat dissipation and insulation performance to meet the stringent requirements of flow battery performance testing. Utility Model Content

[0004] The purpose of this invention is to provide a solution to the problems of insufficient temperature control accuracy and limited temperature control range that are common in existing flow battery testing equipment.

[0005] Based on the above concept, the technical solution adopted by this utility model is as follows:

[0006] A semiconductor temperature-controlled flow battery test mold includes a housing, a top cover, and a temperature control component;

[0007] The chamber is equipped with a temperature control component. The top of the chamber is connected to the top cover and is locked in place by fixing plates and buckles to form a sealed structure. The test bottle holder in the temperature control component stores the battery electrolyte, and the heat conduction plate precisely controls the temperature of the electrolyte.

[0008] Preferably, the upper part of the side of the box is provided with four buckles, two in a group, and the two groups of buckles are symmetrically distributed.

[0009] Preferably, the lower part of the side of the box is provided with two dustproof nets, which are also symmetrically distributed. Two cooling fans B are provided on the dustproof nets, respectively located on the left and right sides of the dustproof nets.

[0010] Preferably, the lower part of the side of the housing is provided with several holes, into which an integrated controller is inserted, and one end of the integrated controller is connected to two temperature sensors.

[0011] Preferably, the top cover includes a heat insulation plate, a fixing plate, and a through hole; the heat insulation plate consists of several pieces, and the heat insulation plate is provided with a through hole, the size of which is sufficient to accommodate the circuit of the temperature sensor; the fixing plate is disposed on the side of the top cover, and the number and position are consistent with the buckles on the upper side of the box body.

[0012] Preferably, the temperature control component includes a support plate, a heat-conducting plate, a test bottle holder, a semiconductor refrigeration device, and a semiconductor heating element.

[0013] Preferably, the support plate has several sets of test bottle holders inside, and the diameter of the test bottle holders is the same as that of the test bottles.

[0014] Preferably, a heat-conducting plate is fixedly connected to the bottom of the support plate, and several semiconductor cooling devices and semiconductor heating plates are arranged below the heat-conducting plate, with the semiconductor cooling devices and semiconductor heating plates placed crosswise.

[0015] Preferably, the semiconductor cooling device includes a semiconductor cooling chip, a heat sink, a support shell, and a cooling fan A; the lower part of the semiconductor cooling chip is attached to the heat sink, the heat sink is disposed inside the support shell, and the cooling fan A is fixed to the bottom of the support shell through bolt holes.

[0016] Preferably, the height of the semiconductor cooling chip on the heat sink is higher than the upper surface of the support shell.

[0017] Preferably, the cooling fan A, the thermoelectric cooler, and the thermoelectric heater are all electrically connected to the interior of the integrated controller via power lines.

[0018] Preferably, one of the temperature sensors is connected to the inner surface of the test bottle holder, and the other is placed in the electrolyte in the test bottle holder.

[0019] Optionally, the housing may be made of any one of polystyrene, polyurethane, and polypropylene.

[0020] The beneficial effects of this utility model are as follows:

[0021] 1. This utility model achieves bidirectional temperature control through a semiconductor cooling device and a semiconductor heating element, providing a precise temperature control environment for flow battery testing, and enabling the selection and control of either the temperature outside the liquid storage bottle or the temperature inside the liquid storage bottle for testing.

[0022] 2. The enclosure of this utility model is made of heat-insulating and corrosion-resistant materials, which have excellent chemical corrosion resistance. At the same time, it works with heat insulation boards to perform heat preservation functions, ensuring a stable and suitable temperature environment for flow battery testing inside the enclosure. Attached Figure Description

[0023] Figure 1 This is an overall structural diagram of the present invention;

[0024] Figure 2 This is a schematic diagram of the outer structure of this utility model;

[0025] Figure 3 This is a structural diagram of the temperature control component of this utility model;

[0026] Figure 4 This is a diagram of the heat-conducting plate and the cooling and heating structure of this utility model;

[0027] Figure 5 This is a structural diagram of the semiconductor refrigeration chip of this utility model;

[0028] Figure 6 This is a structural diagram of the support shell of this utility model;

[0029] Figure 7 This is a schematic diagram of the cooling fan A of this utility model;

[0030] In the diagram: 1. Housing 1, 11. Buckle 12, 12. Dustproof net 13, 13. Cooling fan B1, 14. Integrated controller 15, 15. Temperature sensor 16, 16. Top cover 2, 21. Heat insulation plate 21, 22. Fixing plate 22, 23. Through hole 23, 3. Temperature control component 3, 31. Support plate 31, 32. Heat conduction plate 32, 33. Test bottle holder 33, 34. Semiconductor cooling device 34, 341. Semiconductor cooling chip 342, 343. Support shell 343, 344. Cooling fan A344 and semiconductor heating element 35. Detailed Implementation

[0031] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0032] like Figures 1 to 7 As shown, this utility model includes a housing 1, a top cover 2, and a temperature control component 3;

[0033] The temperature control component 3 is fixedly installed inside the box 1. The top of the box 1 is connected to the top cover 2 and is locked and fixed by the fixing piece 22 and the buckle 11 to form a sealed structure. The test bottle holder 33 in the temperature control component 3 stores the battery electrolyte, and the heat conduction plate 32 precisely controls the temperature of the electrolyte.

[0034] In this embodiment, the semiconductor cooling chip 341 is fixed on the layered heat sink 342. The layered heat sink 342 has a large surface area, which can achieve the effect of rapid heat dissipation. The heat sink 342 is placed inside the support shell 343. At this time, the upper surface of the semiconductor cooling chip 341 is still higher than the upper surface of the support shell 343. The cooling fan A344 is fixed to the lower part of the support shell 343 by bolts to form a semiconductor cooling device 34.

[0035] In this embodiment, the semiconductor cooling device 34 and the semiconductor heating element 35 are distributed crosswise on the lower surface of the heat-conducting plate 32. Several heat-conducting plates 32 with semiconductor cooling devices 34 and semiconductor heating elements 35 attached are placed together. The upper surface of the heat-conducting plate 32 is fixed together with the support plate 31 to form the temperature control component 3. The cooling fan A344, the semiconductor cooling element 341 and the semiconductor heating element 35 are all electrically connected to the inside of the integrated controller 14 through power lines.

[0036] In this embodiment, the temperature control component 3 is fixed in the housing 1. The bottom of the housing 1 is cooled by a fan B13 to blow out the heat conducted by the semiconductor cooling device 34. At the same time, one sensing wire of the temperature sensor 15 is connected to the test bottle holder 33, and the other sensing wire is placed in the electrolyte through the through hole 23 on the top cover 2 to monitor the temperature of the electrolyte in real time.

[0037] Detailed implementation methods and principles:

[0038] In use, the semiconductor temperature-controlled flow battery test mold first places the storage bottle inside the test bottle holder 33. Then, each integrated controller 14 is connected to two temperature sensors 15. One temperature sensor 15 is placed inside the storage bottle, while the other temperature sensor 15 is placed outside the storage bottle. The integrated controller 14 then controls the semiconductor cooling chip 341 and the semiconductor heating chip 35 to heat or cool. Heat is conducted using the heat conduction plate 32, and the integrated controller 14 precisely adjusts the temperature. Through bidirectional temperature control, a precise temperature control environment is provided for flow battery testing, allowing for the selection of either the temperature outside or inside the storage bottle for testing. In addition, the housing 1 is made of heat-insulating and corrosion-resistant material, possessing excellent chemical corrosion resistance. It also works in conjunction with the heat insulation plate 21 to provide heat insulation, ensuring a stable and suitable temperature environment for flow battery testing within the housing 1.

[0039] As is known from common technical knowledge, this utility model can be implemented through other embodiments that do not depart from its spirit or essential characteristics. Therefore, the disclosed embodiments described above are merely illustrative in all respects and are not the only ones. All modifications within the scope of this utility model or its equivalents are included in this utility model.

Claims

1. A test mold for a semiconductor temperature-controlled flow battery, characterized in that, Includes a housing (1), a top cover (2), and a temperature control component (3); The box (1) is equipped with a temperature control component (3) inside. The top of the box (1) is connected to the top cover (2) and is locked and fixed by a fixing piece (22) and a buckle (11) to form a sealed structure. The test bottle holder (33) in the temperature control component (3) stores the battery electrolyte, and the heat conduction plate (32) precisely controls the temperature of the electrolyte.

2. The semiconductor temperature-controlled flow battery test mold according to claim 1, characterized in that, The upper part of the side of the box (1) is provided with 4 buckles (11), two in a group, and symmetrically distributed.

3. The semiconductor temperature-controlled flow battery test mold according to claim 1, characterized in that, The lower part of the side of the box (1) is provided with two dustproof nets (12) which are symmetrically distributed. Two cooling fans B (13) are provided on the dustproof nets (12) respectively, which are located on the left and right sides of the dustproof nets (12).

4. The semiconductor temperature-controlled flow battery test mold according to claim 1, characterized in that, The lower part of the side of the box (1) is also provided with several holes (16). An integrated controller (14) is inserted into the holes (16). One end of the integrated controller (14) is connected to two temperature sensors (15). One of the temperature sensors (15) is connected to the test bottle holder (33), and the other is set in the electrolyte in the test bottle holder (33) through the through hole (23).

5. A semiconductor temperature-controlled flow battery test mold according to claim 1, characterized in that, The top cover (2) includes a heat insulation plate (21), a fixing piece (22) and a through hole (23); the heat insulation plate (21) consists of several pieces, and the heat insulation plate (21) is provided with a through hole (23); the fixing piece (22) is set on the side of the top cover (2), and the number and position are consistent with the buckle (11) on the upper side of the box body (1).

6. The semiconductor temperature-controlled flow battery test mold according to claim 1, characterized in that, The temperature control component (3) includes a support plate (31), a heat-conducting plate (32), a test bottle holder (33), a semiconductor cooling device (34), and a semiconductor heating element (35); The support plate (31) has several sets of test bottle holders (33) inside. A heat-conducting plate (32) is fixedly connected to the bottom of the support plate (31). Several semiconductor cooling devices (34) and semiconductor heating plates (35) are provided below the heat-conducting plate (32). The semiconductor cooling devices (34) and semiconductor heating plates (35) are placed crosswise.

7. A semiconductor temperature-controlled flow battery test mold according to claim 6, characterized in that, The semiconductor cooling device (34) includes a semiconductor cooling chip (341), a heat sink (342), a support shell (343), and a cooling fan A (344); The lower part of the semiconductor cooling chip (341) is attached to the heat sink (342), the heat sink (342) is disposed inside the support shell (343), and the cooling fan A (344) is fixed to the bottom of the support shell (343) through bolt holes.

8. A semiconductor temperature-controlled flow battery test mold according to claim 7, characterized in that, The cooling fan A (344), the semiconductor cooling chip (341), and the semiconductor heating chip (35) are all electrically connected to the interior of the integrated controller (14) via power lines.

9. A semiconductor temperature-controlled flow battery test mold according to claim 1, characterized in that, The material of the box (1) is any one of polystyrene, polyurethane and polypropylene.

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